CN204206177U - A kind of microminiaturized transceiver module - Google Patents
A kind of microminiaturized transceiver module Download PDFInfo
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- CN204206177U CN204206177U CN201420748609.2U CN201420748609U CN204206177U CN 204206177 U CN204206177 U CN 204206177U CN 201420748609 U CN201420748609 U CN 201420748609U CN 204206177 U CN204206177 U CN 204206177U
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- balance amplifier
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Abstract
The utility model discloses a kind of microminiaturized transceiver module, comprising: AGC receives module and ALC emitting mould train; AGC receives module and comprises the first balance amplifier, the first microstrip filter, the first electrically controlled attenuator, the second balance amplifier, the first coupler and the first direct current treatment circuit; ALC emitting mould train comprises the second electrically controlled attenuator, the 3rd balance amplifier, the second microstrip filter, the 4th balance amplifier, the second coupler and the second direct current treatment circuit; First balance amplifier, the second balance amplifier, the 3rd balance amplifier, the 4th balance amplifier, the first microstrip filter, the second microstrip filter, the first electrically controlled attenuator, the second electrically controlled attenuator, the first coupler and the second coupler are arranged on a ceramic substrate.This microminiaturized transceiver module is integrated on circuit with the form of distributed constant, reduces and uses peripheral components, make whole transmitting-receiving subassembly integrated level higher, greatly reduce the volume of transceiver.
Description
Technical field
The utility model relates to mobile communication technology field, particularly, relates to a kind of microminiaturized transceiver module.
Background technology
Receiver is when Received signal strength, and its input end signal level may in very large range change, and the power output of receiver changes with the size of extraneous signal, and therefore the output of receiver there will be strong and weak very greatly different signal power.If desired in so wide scope, keep receiving equipment Linear Amplifer, the unsaturated distortion of signal, then need the gain controlling receiver, make the level that output signal keeps suitable, to ensure that receiver normally works.And adjusting with signal strength signal intensity of amplifying circuit can be made by AGC (Automatic Gain Control, automatic growth control) circuit Gain Automaticly.The efficient combination that agc circuit utilizes Linear Amplifer and compression to amplify adjusts output signal.When weak signal inputs, linear amplifier circuit work, ensures the intensity of output signal; When input signal reaches some strength, start compression amplifying circuit, output amplitude is reduced.That is, AGC function can by changing the amplitude of the automatic ride gain of input and output compression factor.
ALC (Automatic Level Control, auto level control) circuit, be change for due to device itself, environment causes working point change etc., the circuit of the stable level added in circuit.Within the specific limits, the level that alc circuit corrects skew automatically gets back to the numerical value of requirement.Such as power alc circuit, require to export certain power, because device causes multiplication factor to change by cold heating, power departs from requirement, this change of alc circuit automatic sensing, and the parameter in adjustment loop, makes power maintain regime values.
Realizing in the utility model process, utility model people finds that in prior art, at least there are the following problems: existing transceiver module all adopts thick-film technique to realize, complex circuit designs, and cost is high, and gain is low, noise large, be not suitable for miniaturization, microminiaturized microwave radio circuit.
Utility model content
The utility model is large in order to overcome transceiver volume in prior art, is not suitable for the defect of miniature microwave radio circuit, according to an aspect of the present utility model, proposes a kind of microminiaturized transceiver module.
The microminiaturized transceiver module of the one that the utility model embodiment provides, comprising: AGC receives module and ALC emitting mould train; AGC receives module and comprises the first balance amplifier, the first microstrip filter, the first electrically controlled attenuator, the second balance amplifier, the first coupler and the first direct current treatment circuit; The input of the first balance amplifier is the input that AGC receives module, and output is connected with the input of the first electrically controlled attenuator by the first microstrip filter; The output of the first electrically controlled attenuator is connected with the input of the first coupler by the second balance amplifier; The coupled output of the first coupler is connected with the control end of the first electrically controlled attenuator by the first direct current treatment circuit; The main output of the first coupler is the output that AGC receives module;
ALC emitting mould train comprises the second electrically controlled attenuator, the 3rd balance amplifier, the second microstrip filter, the 4th balance amplifier, the second coupler and the second direct current treatment circuit; The input of the second electrically controlled attenuator is the input of ALC emitting mould train, and the output of the second electrically controlled attenuator is connected with the input of the 3rd balance amplifier; The output of the 3rd balance amplifier is connected by the input of the second microstrip filter with the 4th balance amplifier, and the output of the 4th balance amplifier is connected with the input of the second coupler; The coupled output of the second coupler is connected with the control end of the second electrically controlled attenuator by the second direct current treatment circuit, and the main output of the second coupling circuit is the output of ALC emitting mould train;
First balance amplifier, the second balance amplifier, the 3rd balance amplifier, the 4th balance amplifier, the first microstrip filter, the second microstrip filter, the first electrically controlled attenuator, the second electrically controlled attenuator, the first coupler and the second coupler are arranged on a ceramic substrate.
In technique scheme, the first electrically controlled attenuator and the second electrically controlled attenuator are matching type PIN diode electrically-tuned attenuator; Electrically controlled attenuator comprises: offset line, N number of PIN diode and two series resistances that transmission line and transmission line are drawn; The quarter-wave N number of Nodes in interval connects the positive pole of a PIN diode respectively in the same way on the transmission line, and the minus earth of PIN diode; Wherein, two PIN diode of both sides are connected ground connection after a series resistance respectively; Wherein, 2≤N≤6.
In technique scheme, the first microstrip filter and the second microstrip filter are interdigitated broadband filter or micro-band elliptic function filter.
In technique scheme, first balance amplifier, the second balance amplifier, the 3rd balance amplifier, the 4th balance amplifier are the balance amplifier that structure is identical, comprising: a 3dB quadrature bridge, the 2nd 3dB quadrature bridge, IC amplifying device, the first resistance and the second resistance; The coupled end of the one 3dB quadrature bridge is connected with two inputs of IC amplifying device respectively with straight-through end; The coupled end of the 2nd 3dB quadrature bridge is connected with two outputs of IC amplifying device respectively with straight-through end; The isolation end of the one 3dB quadrature bridge is by ground connection after the first resistance, and the isolation end of the 2nd 3dB quadrature bridge is by ground connection after the second resistance; The input of the one 3dB quadrature bridge is the input of balance amplifier, and the output of the 2nd 3dB quadrature bridge is the output of balance amplifier.
In technique scheme, a 3dB quadrature bridge and the 2nd 3dB quadrature bridge are the bending Lange electric bridge of S type.
In technique scheme, the peripheral circuit of IC amplifying device and a 3dB quadrature bridge, the 2nd 3dB quadrature bridge are made on a ceramic substrate by the trickle band thin-film technique of ultra micro.
In technique scheme, the wedge bonding of IC amplifying device is fixing on a ceramic substrate.
In technique scheme, first balance amplifier, the second balance amplifier, the 3rd balance amplifier, the 4th balance amplifier, the first microstrip filter, the second microstrip filter, the first electrically controlled attenuator, the second electrically controlled attenuator, the first coupler and the second coupler are made on a ceramic substrate by the trickle band thin-film technique of ultra micro, and the dielectric constant of this ceramic substrate is greater than 3.5.
In technique scheme, ceramic substrate is the aluminum oxide ceramic substrate of dielectric constant 9.9, thickness 0.5mm.
The microminiaturized transceiver module of the one that the utility model embodiment provides, AGC receives module and has the advantages such as low noise, High Linear, high-gain; ALC emitting mould train has the advantages such as power output is high, High Linear, high-gain; And microstrip filter plays frequency-selecting effect, the interference of spurious frequency can be suppressed; Adopt electrically controlled attenuator to be conducive to protection IC device, avoid large-signal to the impact of device; Balance amplifying circuit is easy to and miscellaneous part cascade.Modular circuit in microminiaturized transceiver module adopts the trickle band thin-film technique of ultra micro to be fabricated on ceramic substrate, the wedge bonding of IC amplifying device is fixed on a ceramic substrate, circuit consistency is good, circuit precision can reach micron order, and device can be integrated on circuit with the form of distributed constant, reduces using peripheral components as far as possible, make whole transmitting-receiving subassembly more concentrated, integrated level is high, greatly reduces the volume of transceiver, is suitable as microminiaturized wireless communication front end circuit element.
Other features and advantages of the utility model will be set forth in the following description, and, partly become apparent from specification, or understand by implementing the utility model.The purpose of this utility model and other advantages realize by structure specifically noted in write specification, claims and accompanying drawing and obtain.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Accompanying drawing explanation
Accompanying drawing is used to provide further understanding of the present utility model, and forms a part for specification, is used from explanation the utility model, does not form restriction of the present utility model with embodiment one of the present utility model.In the accompanying drawings:
Fig. 1 is the structure chart of microminiaturized transceiver module in the utility model embodiment;
Fig. 2 is the circuit diagram of matching type PIN diode electrically-tuned attenuator in the utility model embodiment;
Fig. 3 is the circuit theory diagrams of interdigitated broadband filter in the utility model embodiment;
Fig. 4 is the structure chart of balance amplifier in the utility model embodiment;
Fig. 5 is the overall structure domain of microminiaturized transceiver module in embodiment one;
Fig. 6 is the structure domain of balance amplifier in embodiment one;
Fig. 7 is the Lange electric bridge that in embodiment one, S type is bending;
Fig. 8 is the structure domain of the first microstrip filter in embodiment one;
Fig. 9 is the structure domain of the first electrically controlled attenuator in embodiment one;
Figure 10 is the structure domain of the first coupler in embodiment one;
Figure 11 is the structure domain of the first direct current treatment circuit in embodiment one.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail, but is to be understood that protection range of the present utility model not by the restriction of embodiment.
According to the utility model embodiment, provide a kind of microminiaturized transceiver module, Fig. 1 is the structure chart of this microminiaturized transceiver module, and it specifically comprises: AGC receives module 10 and ALC emitting mould train 20.
Wherein, AGC reception module 10 comprises the first balance amplifier BP1, the first microstrip filter LPF1, the first electrically controlled attenuator EAT1, the second balance amplifier BP2, the first coupler CP1 and the first direct current treatment circuit 101.
Concrete, the input of the first balance amplifier BP1 is the input that AGC receives module 10, for receiving the outside radiofrequency signal sent; Output is connected with the input of the first electrically controlled attenuator EAT1 by the first microstrip filter LPF1; The output of the first electrically controlled attenuator EAT1 is connected with the input of the first coupler CP1 by the second balance amplifier BP2; The coupled output of the first coupler CP1 is connected with the control end of the first electrically controlled attenuator EAT1 by the first direct current treatment circuit 101; The main output of the first coupler CP1 is the output that AGC receives module 10, for the radiofrequency signal after output processing.
ALC emitting mould train 20 comprises the second electrically controlled attenuator EAT2, the 3rd balance amplifier BP3, the second microstrip filter LPF2, the 4th balance amplifier BP4, the second coupler CP2 and the second direct current treatment circuit 201.
The input of the second electrically controlled attenuator EAT2 is the input of ALC emitting mould train 20, for receiving the outside radiofrequency signal sent; The output of the second electrically controlled attenuator EAT2 is connected with the input of the 3rd balance amplifier BP3; The output of the 3rd balance amplifier BP3 is connected with the input of the 4th balance amplifier BP4 by the second microstrip filter LPF2, and the output of the 4th balance amplifier BP4 is connected with the input of the second coupler CP2; The coupled output of the second coupler CP2 is connected by the control end of the second direct current treatment circuit 201 with the second electrically controlled attenuator EAT2, and the main output of the second coupling circuit is the output of ALC emitting mould train 20, for the radiofrequency signal after output processing.
Wherein, the first balance amplifier BP1, the second balance amplifier BP2, the 3rd balance amplifier BP3, the 4th balance amplifier BP4, the first microstrip filter LPF1, the second microstrip filter LPF2, the first electrically controlled attenuator EAT1, the second electrically controlled attenuator EAT2, the first coupler CP1 and the second coupler CP2 are made on a ceramic substrate by the trickle band thin-film technique of ultra micro.
In the utility model embodiment, the main output of coupler is the terminal for exporting main path signal, and coupled output is the terminal for exporting coupled signal.
Preferably, the first electrically controlled attenuator EAT1 is identical with the second electrically controlled attenuator EAT2 structure, is matching type PIN diode electrically-tuned attenuator; Electrically controlled attenuator comprises: offset line, N number of PIN diode and two series resistances that transmission line and transmission line are drawn; The quarter-wave N number of Nodes in interval connects the positive pole of a PIN diode respectively in the same way on the transmission line, and the minus earth of PIN diode; Wherein, two PIN diode of both sides are connected ground connection after a series resistance respectively; Wherein, 2≤N≤6.
Fig. 2 in the utility model embodiment is for N=3, electrically controlled attenuator comprises 3 PIN diode D1, D2, D3,3 PIN diode are connected with transmission line MS respectively at three node J1, J2, J3 places, and two the PIN diode D1 and D3 being positioned at both sides connect with series resistance R1 and R2.Wherein, the terminal A in Fig. 2 is the input of electrically controlled attenuator, and terminal B is output, and end points C is control end.Adopt the matching type PIN diode electrically-tuned attenuator be made up of 3 diodes, only need to adopt small voltage, small area analysis just can control this electrically controlled attenuator, and attenuation can reach 18dB, digital control needs can be realized, and then can system stability be ensured.
Preferably, the first microstrip filter LPF1 and the second microstrip filter LPF2 is interdigitated broadband filter or micro-band elliptic function filter; Wherein, the relative bandwidth of interdigitated broadband filter is wider.In the utility model embodiment, the circuit theory diagrams of interdigitated broadband filter are shown in Figure 3, interdigitated broadband filter is made up of the parallel coupled line of λ/4, and open-end/short circuit is alternate with each other, this interdigitated broadband filter has good geometrical symmetry, and this symmetry has good phase place and delay character.In addition, this microstrip bandpass filter has good selectivity, product has good input and output standing-wave ratio, circuit is easy to and front stage circuits cascading, adopt ultra tiny microstrip circuit, circuit consistency is good, compact conformation, volume is little, makes microwave low-waveband submicron microstrip filter have high selectivity and high integration.
Preferably, first balance amplifier BP1, the second balance amplifier BP2, the 3rd balance amplifier BP3, the 4th balance amplifier BP4 are the balance amplifier that structure is identical, as shown in Figure 4, this balance amplifier specifically comprises: a 3dB quadrature bridge B1, the 2nd 3dB quadrature bridge B2, IC amplifying device PA, the first resistance R1 and the second resistance R2.
Concrete, the coupled end OH of a 3dB quadrature bridge B1 is connected with two input S1 with S2 of IC amplifying device PA respectively with straight-through end ZT; The coupled end OH of the 2nd 3dB quadrature bridge B2 is connected with two output C1 with C2 of IC amplifying device PA respectively with straight-through end ZT; The isolation end ISO of the one 3dB quadrature bridge B1 is by ground connection after the first resistance R1, and the isolation end ISO of the 2nd 3dB quadrature bridge B2 is by ground connection after the second resistance R2; The input in of the one 3dB quadrature bridge B1 is the input of balance amplifier, and the output out of the 2nd 3dB quadrature bridge B2 is the output of balance amplifier.
Wherein, the peripheral circuit of IC amplifying device PA and a 3dB quadrature bridge, the 2nd 3dB quadrature bridge are made on a ceramic substrate by the trickle band thin-film technique of ultra micro, IC amplifying device PA wedge bonding is fixed on this ceramic substrate, and the dielectric constant of this ceramic substrate is greater than 3.5.
The microminiaturized transceiver module of the one that the utility model embodiment provides, AGC receives module and has the advantages such as low noise, High Linear, high-gain; ALC emitting mould train has the advantages such as power output is high, High Linear, high-gain; And microstrip filter plays frequency-selecting effect, the interference of spurious frequency can be suppressed; Adopt electrically controlled attenuator to be conducive to protection IC device, avoid large-signal to the impact of device; Balance amplifying circuit is easy to and miscellaneous part cascade.Modular circuit in microminiaturized transceiver module adopts the trickle band thin-film technique of ultra micro to be fabricated on ceramic substrate, the wedge bonding of IC amplifying device fixed on a ceramic substrate, circuit consistency is good, and integrated level is high, volume is little, is suitable as microminiaturized wireless communication front end circuit element.
The structure of this microminiaturized transceiver module is introduced below by a detailed embodiment.
Embodiment one
In embodiment one, adopt ultra micro trickle band thin-film technique to be made on ceramic substrate by microminiaturized transceiver module, the aluminum oxide ceramic substrate of dielectric constant 9.9, thickness 0.5mm specifically selected by this ceramic substrate.The overall structure domain of this microminiaturized transceiver module is shown in Figure 5, and plate wherein with holes is ground plate, specifically shown in Figure 5.Below various piece is described in detail.
In embodiment one, the structure chart of balance amplifier is shown in Figure 6, and the microminiaturized transceiver module that embodiment one provides is totally four balance amplifiers, only marks out the first balance amplifier CP1 in Figure 5.
Wherein, in embodiment one, the 3dB quadrature bridge in balance amplifier and the 2nd 3dB quadrature bridge are the bending Lange electric bridge of S type, and frequency is higher, and the volume on bridge road is less.The structure chart of this Lange electric bridge is specifically shown in Figure 7.By carrying out the bending process of S type to Lange electric bridge, be conducive to the volume reducing whole circuit, the size of the Lange electric bridge after bending process can reduce half.
In addition, the structure chart of the microstrip filter in embodiment one, electrically controlled attenuator, coupler and direct current treatment circuit is respectively see Fig. 8-Figure 11.Wherein, Fig. 8-Figure 11 is respectively the enlarged drawing of the first microstrip filter LPF1, the first electrically controlled attenuator EAT1, the first coupler CP1 and the first direct current treatment circuit 101 in Figure 5.Because the structure of other assemblies is identical with the structure of said modules, so place is not described in detail.
In embodiment one, modular circuit adopts the trickle band thin-film technique of ultra micro to be fabricated on ceramic substrate, and the wedge bonding of IC amplifying device fixed on a ceramic substrate, circuit consistency is good, and integrated level is high, and volume is little, is suitable as microminiaturized wireless communication front end circuit element.
The microminiaturized transceiver module of the one that the utility model embodiment provides, AGC receives module and has the advantages such as low noise, High Linear, high-gain; ALC emitting mould train has the advantages such as power output is high, High Linear, high-gain; And microstrip filter plays frequency-selecting effect, the interference of spurious frequency can be suppressed; Adopt electrically controlled attenuator to be conducive to protection IC device, avoid large-signal to the impact of device; Balance amplifying circuit is easy to and miscellaneous part cascade.Modular circuit in microminiaturized transceiver module adopts the trickle band thin-film technique of ultra micro to be fabricated on ceramic substrate, the wedge bonding of IC amplifying device is fixed on a ceramic substrate, circuit consistency is good, circuit precision can reach micron order, and device can be integrated on circuit with the form of distributed constant, reduces using peripheral components as far as possible, make whole transmitting-receiving subassembly more concentrated, integrated level is high, greatly reduces the volume of transceiver, is suitable as microminiaturized wireless communication front end circuit element.
The utility model can have multiple multi-form embodiment; above for Fig. 1-Figure 11 by reference to the accompanying drawings to the technical solution of the utility model explanation for example; this does not also mean that the instantiation that the utility model is applied can only be confined in specific flow process or example structure; those of ordinary skill in the art should understand; specific embodiments provided above is some examples in multiple its preferred usage, and the execution mode of any embodiment the utility model claim all should within technical solutions of the utility model scope required for protection.
Last it is noted that the foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, although be described in detail the utility model with reference to previous embodiment, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (9)
1. a microminiaturized transceiver module, is characterized in that, comprising: AGC receives module and ALC emitting mould train;
Described AGC receives module and comprises the first balance amplifier, the first microstrip filter, the first electrically controlled attenuator, the second balance amplifier, the first coupler and the first direct current treatment circuit;
The input of described first balance amplifier is the input that described AGC receives module, and output is connected with the input of described first electrically controlled attenuator by described first microstrip filter; The output of described first electrically controlled attenuator is connected with the input of described first coupler by described second balance amplifier; The coupled output of described first coupler is connected with the control end of described first electrically controlled attenuator by described first direct current treatment circuit; The main output of described first coupler is the output that described AGC receives module;
Described ALC emitting mould train comprises the second electrically controlled attenuator, the 3rd balance amplifier, the second microstrip filter, the 4th balance amplifier, the second coupler and the second direct current treatment circuit;
The input of described second electrically controlled attenuator is the input of described ALC emitting mould train, and the output of described second electrically controlled attenuator is connected with the input of described 3rd balance amplifier; The output of described 3rd balance amplifier is connected by the input of described second microstrip filter with described 4th balance amplifier, and the output of described 4th balance amplifier is connected with the input of described second coupler; The coupled output of described second coupler is connected with the control end of described second electrically controlled attenuator by described second direct current treatment circuit, and the main output of described second coupling circuit is the output of described ALC emitting mould train;
Described first balance amplifier, the second balance amplifier, the 3rd balance amplifier, the 4th balance amplifier, the first microstrip filter, the second microstrip filter, the first electrically controlled attenuator, the second electrically controlled attenuator, the first coupler and the second coupler are arranged on a ceramic substrate.
2. microminiaturized transceiver module according to claim 1, is characterized in that, described first electrically controlled attenuator and described second electrically controlled attenuator are matching type PIN diode electrically-tuned attenuator;
Described electrically controlled attenuator comprises: offset line, N number of PIN diode and two series resistances that transmission line and described transmission line are drawn; On described transmission line, the quarter-wave N number of Nodes in interval connects the positive pole of a PIN diode respectively in the same way, and the minus earth of PIN diode; Wherein, two PIN diode of both sides are connected ground connection after a described series resistance respectively;
Wherein, 2≤N≤6.
3. microminiaturized transceiver module according to claim 1, is characterized in that, described first microstrip filter and the second microstrip filter are interdigitated broadband filter or micro-band elliptic function filter.
4. according to the arbitrary described microminiaturized transceiver module of claim 1-3, it is characterized in that, described first balance amplifier, the second balance amplifier, the 3rd balance amplifier, the 4th balance amplifier are the balance amplifier that structure is identical, comprising: a 3dB quadrature bridge, the 2nd 3dB quadrature bridge, IC amplifying device, the first resistance and the second resistance;
The coupled end of a described 3dB quadrature bridge is connected with two inputs of described IC amplifying device respectively with straight-through end; The coupled end of described 2nd 3dB quadrature bridge is connected with two outputs of described IC amplifying device respectively with straight-through end;
The isolation end of a described 3dB quadrature bridge is by ground connection after the first resistance, and the isolation end of described 2nd 3dB quadrature bridge is by ground connection after the second resistance;
The input of a described 3dB quadrature bridge is the input of described balance amplifier, and the output of described 2nd 3dB quadrature bridge is the output of described balance amplifier.
5. microminiaturized transceiver module according to claim 4, is characterized in that, a described 3dB quadrature bridge and described 2nd 3dB quadrature bridge are the bending Lange electric bridge of S type.
6. microminiaturized transceiver module according to claim 4, is characterized in that, the peripheral circuit of described IC amplifying device and a described 3dB quadrature bridge, described 2nd 3dB quadrature bridge are made on a ceramic substrate by the trickle band thin-film technique of ultra micro.
7. microminiaturized transceiver module according to claim 6, is characterized in that, the wedge bonding of described IC amplifying device is fixing on a ceramic substrate.
8. according to the arbitrary described microminiaturized transceiver module of claim 1-3, it is characterized in that, described first balance amplifier, the second balance amplifier, the 3rd balance amplifier, the 4th balance amplifier, the first microstrip filter, the second microstrip filter, the first electrically controlled attenuator, the second electrically controlled attenuator, the first coupler and the second coupler are made on a ceramic substrate by the trickle band thin-film technique of ultra micro, and the dielectric constant of described ceramic substrate is greater than 3.5.
9. microminiaturized transceiver module according to claim 8, is characterized in that, described ceramic substrate is the aluminum oxide ceramic substrate of dielectric constant 9.9, thickness 0.5mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420748609.2U CN204206177U (en) | 2014-12-02 | 2014-12-02 | A kind of microminiaturized transceiver module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420748609.2U CN204206177U (en) | 2014-12-02 | 2014-12-02 | A kind of microminiaturized transceiver module |
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| CN204206177U true CN204206177U (en) | 2015-03-11 |
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