CN204187584U - A kind of cooling mechanism of LED - Google Patents
A kind of cooling mechanism of LED Download PDFInfo
- Publication number
- CN204187584U CN204187584U CN201420706087.XU CN201420706087U CN204187584U CN 204187584 U CN204187584 U CN 204187584U CN 201420706087 U CN201420706087 U CN 201420706087U CN 204187584 U CN204187584 U CN 204187584U
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- cylinder
- dissipating cylinder
- cooling mechanism
- heat
- led
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a kind of cooling mechanism of LED, belongs to field of mechanical technique.It solve existing cooling mechanism complex structure, packaging efficiency be low, production cost comparatively high-technology problem.The cooling mechanism of this LED, this mechanism driving power and for LED chip is installed substrate between, mechanism also comprises connecting cylinder, interior heat-dissipating cylinder and outer heat-dissipating cylinder, connecting cylinder cylindrically and connecting cylinder internal cavity for installing driving power, the both sides of connecting cylinder axially have the positioned edge of linearly projection along it, substrate is positioned at connecting cylinder upper end and securing member is through at substrate is connected with connecting cylinder by substrate with in positioned edge, interior heat-dissipating cylinder inner circumferential is evenly equipped with some radiating fins in lengthy motion picture shape projection, spacing between adjacent two radiating fins and the width of positioned edge match and positioned edge between adjacent two radiating fins, outer heat-dissipating cylinder is enclosed within outside interior heat-dissipating cylinder.The utility model has assembles advantage that is quick, good heat dissipation effect.
Description
Technical field
The utility model belongs to field of mechanical technique, relates to a kind of cooling mechanism, particularly a kind of cooling mechanism of LED.
Background technology
The solid-state semiconductor devices of LED to be a kind of can be by electric energy conversion visible ray, it directly can be converted into light electricity.LED has that luminous efficiency is high, power saving and life-span long feature, and therefore, its application is more and more extensive.Because LED is when luminescence, the temperature of himself can constantly raise, and in the illumination work continued, if the heat that LED produces can not exhale in time, will cause the damage of LED, so the heat dissipation problem of LED perplexs us always.
Through retrieval, as Chinese patent literature discloses a kind of cooling mechanism [patent No.: ZL 201020590429.8 of LED lamp; Authorization Notice No.: CN 202709058U].The cooling mechanism of this LED lamp, be arranged between lamp holder and LED aluminium base, and be fixedly connected with LED aluminium base with lamp holder respectively, it is characterized in that, comprise cylindrical heat-radiating device, be arranged on cylindrical heat-radiating device front end heat radiation pressing plate, be loaded on heat radiation pressing plate front end the base plate for installing LED aluminium base; Described cylindrical heat-radiating device surrounding is the radiating fin circumferentially evenly arranged; Thermal conductive silicon rubber cushion is provided with between described cylindrical heat-radiating device and heat radiation pressing plate.
Although cooling mechanism is lightweight disclosed in this patent, good heat dissipation effect, this cooling mechanism complex structure, packaging efficiency is low, production cost is higher, and therefore, the cooling mechanism designing a kind of LED is necessary.
Summary of the invention
The purpose of this utility model there are the problems referred to above for existing technology, proposes a kind of cooling mechanism of LED, and this cooling mechanism has assembles feature that is quick, good heat dissipation effect.
The purpose of this utility model realizes by following technical proposal: a kind of cooling mechanism of LED, this mechanism driving power and for LED chip is installed substrate between, it is characterized in that, mechanism also comprises connecting cylinder, interior heat-dissipating cylinder and outer heat-dissipating cylinder, above-mentioned connecting cylinder cylindrically and connecting cylinder internal cavity for installing above-mentioned driving power, the both sides of described connecting cylinder axially have the positioned edge of linearly projection along it, aforesaid substrate is positioned at connecting cylinder upper end and securing member is through at substrate is connected with connecting cylinder by substrate with in positioned edge, described interior heat-dissipating cylinder inner circumferential is evenly equipped with some radiating fins in lengthy motion picture shape projection, spacing between above-mentioned adjacent two radiating fins and the width of positioned edge match and positioned edge between adjacent two radiating fins, above-mentioned outer heat-dissipating cylinder is enclosed within outside interior heat-dissipating cylinder.
Driving power is put into connecting cylinder by operator, interior heat-dissipating cylinder is enclosed within outside connecting cylinder, substrate is placed on connecting cylinder, securing member is penetrated in the positioned edge of substrate and connecting cylinder, screw securing member substrate and connecting cylinder are fixed together, outer heat-dissipating cylinder is enclosed within outside interior heat-dissipating cylinder, completes assembling operation; LED chip is installed and uses the heat produced, be first delivered on interior heat-dissipating cylinder, then be delivered on outer heat-dissipating cylinder, finally reject heat in air, good heat dissipation effect.
Described outer heat-dissipating cylinder upper end, higher than interior heat-dissipating cylinder upper end, forms the interior stair-stepping Connection Block for locating LED glass lamp shade between described outer heat-dissipating cylinder upper end and interior heat-dissipating cylinder upper end.
Adopt above structure, can enable a LED glass lamp shade rapid-assembling, location fast, reliably.
Described interior heat-dissipating cylinder upper end, higher than outer heat-dissipating cylinder upper end, forms the outer stair-stepping Connection Block for locating LED glass lamp shade between described outer heat-dissipating cylinder upper end and interior heat-dissipating cylinder upper end.
Adopt above structure, can enable a LED glass lamp shade rapid-assembling, location fast, reliably.
Described interior heat-dissipating cylinder and radiating fin are integral type structure.
Adopt above structure, the whole structure of heat radiation can be improved, rational in infrastructure.
Described positioned edge upper end has recessed connecting hole, and described fastener portion is positioned at connection hole.
Adopting above structure, by screwing in connecting hole by securing member, connecting cylinder and substrate can be fixed together, location is reliable, convenient.
Described securing member is screw.
Described securing member is rivet.
The both sides of described positioned edge all have the approaching face seamlessly transitted.
Adopt above structure, can conveniently be enclosed within connecting cylinder by interior heat-dissipating cylinder, guide effect be good.
Described approaching face is the cambered surface of positioned edge both sides arc and approaching face cross section semicircular in shape.
Adopt above structure, in convenient, heat-dissipating cylinder is enclosed within connecting cylinder, meanwhile, can reduce its distribution of force uneven, easy to process.
Described approaching face is the inclined-plane of positioned edge both sides inclination and the cross section of approaching face is tip-angled shape.
Adopt above structure, in convenient, heat-dissipating cylinder is enclosed within connecting cylinder, meanwhile, can reduce its distribution of force uneven, easy to process.
Compared with prior art, the cooling mechanism of this LED has the following advantages:
1, the utility model is by being enclosed within outside connecting cylinder by interior heat-dissipating cylinder, is placed on by substrate on connecting cylinder, is enclosed within by outer heat-dissipating cylinder outside interior heat-dissipating cylinder, can completes assembling operation, and assembling fast; LED uses the heat produced, and is first delivered on interior heat-dissipating cylinder, then is delivered on outer heat-dissipating cylinder, finally reject heat in air, good heat dissipation effect.
2, the both sides of positioned edge all have approaching face, adopt this structure, and can conveniently be enclosed within connecting cylinder by interior heat-dissipating cylinder, guide effect be good.
3, positioned edge upper end has connecting hole, and fastener portion is positioned at connection hole, adopts this structure, by screwing in connecting hole by securing member, connecting cylinder and substrate can be fixed together, and location is reliable, convenient.
Accompanying drawing explanation
Fig. 1 is exploded perspective view of the present utility model.
Fig. 2 is the perspective view of connecting cylinder in the utility model.
Fig. 3 is the perspective view that the utility model removes part.
In figure, 1, driving power; 2, connecting cylinder; 2a, positioned edge; 2a1, connecting hole; 3, interior heat-dissipating cylinder; 3a, radiating fin; 4, substrate; 5, securing member; 6, LED glass lamp shade; 7, outer heat-dissipating cylinder.
Detailed description of the invention
Be below specific embodiment of the utility model and by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiments.
As shown in Figure 1, Figure 2, Figure 3 shows, the cooling mechanism of this LED, this mechanism driving power 1 and for LED chip is installed substrate 4 between, in the present embodiment, substrate 4 is wiring board; Mechanism also comprises connecting cylinder 2, interior heat-dissipating cylinder 3 and outer heat-dissipating cylinder 7, connecting cylinder 2 cylindrically and connecting cylinder 2 internal cavity for installing driving power 1, the both sides of connecting cylinder 2 axially have the positioned edge 2a of linearly projection along it, substrate 4 is positioned at connecting cylinder 2 upper end and securing member 5 is through at substrate 4 is connected with connecting cylinder 2 by substrate 4 with on positioned edge 2a, interior heat-dissipating cylinder 3 inner circumferential is evenly equipped with some radiating fin 3a in lengthy motion picture shape projection, in the present embodiment, the quantity of radiating fin 3a is 20; Interior heat-dissipating cylinder 3 is integral type structure with radiating fin 3a, adopts this structure, can improve the whole structure of heat radiation, rational in infrastructure; Spacing between adjacent two radiating fin 3a and the width of positioned edge 2a match and positioned edge 2a between adjacent two radiating fin 3a, outer heat-dissipating cylinder 7 is enclosed within outside interior heat-dissipating cylinder 3.
As shown in Figure 1, Figure 3, outer heat-dissipating cylinder 7 upper end is higher than interior heat-dissipating cylinder 3 upper end, and the stair-stepping Connection Block for locating LED glass lamp shade 6 in being formed between outer heat-dissipating cylinder 7 upper end and interior heat-dissipating cylinder 3 upper end, adopts this structure, can make a LED glass lamp shade 6 can rapid-assembling, location fast, reliable.
According to actual conditions, also this kind of embodiment can be adopted, that is: interior heat-dissipating cylinder 3 upper end is higher than outer heat-dissipating cylinder 7 upper end, the outer stair-stepping Connection Block for locating LED glass lamp shade 6 is formed between outer heat-dissipating cylinder 7 upper end and interior heat-dissipating cylinder 3 upper end, adopt this structure, can make a LED glass lamp shade 6 can rapid-assembling, location fast, reliable.
As shown in Figure 1 and Figure 2, positioned edge 2a upper end has recessed connecting hole 2a1, and securing member 5 part is positioned at connecting hole 2a1 place, adopts this structure, by screwing in connecting hole 2a1 by securing member 5, connecting cylinder 2 and substrate 4 can be fixed together, and location is reliable, convenient.
As shown in Figure 1, securing member 5 is screw.
According to actual conditions, also can adopt this kind of embodiment, that is: securing member 5 is rivet.
The both sides of positioned edge 2a all have the approaching face seamlessly transitted, and adopt this structure, and can conveniently be enclosed within connecting cylinder 2 by interior heat-dissipating cylinder 3, guide effect be good.
Approaching face is the cambered surface of positioned edge 2a both sides arc and approaching face cross section semicircular in shape, adopts this structure, and in convenient, heat-dissipating cylinder 3 is enclosed within connecting cylinder 2, meanwhile, can reduce its distribution of force uneven, easy to process.
According to actual conditions, also can adopt this kind of embodiment, that is: approaching face be positioned edge 2a both sides tilt inclined-plane and the cross section of approaching face is tip-angled shape, adopt this structure, in convenient, heat-dissipating cylinder 3 is enclosed within connecting cylinder 2, simultaneously, its distribution of force can be reduced uneven, easy to process.
Driving power 1 is put into connecting cylinder 2 by operator, interior heat-dissipating cylinder 3 is enclosed within outside connecting cylinder 2, substrate 4 is placed on connecting cylinder 2, securing member 5 is penetrated in the positioned edge 2a of substrate 4 and connecting cylinder 2, screw securing member 5 substrate 4 and connecting cylinder 2 are fixed together, outer heat-dissipating cylinder 7 is enclosed within outside interior heat-dissipating cylinder 3, completes assembling operation; LED chip is installed and uses the heat produced, be first delivered on interior heat-dissipating cylinder 3, then be delivered on outer heat-dissipating cylinder 7, finally reject heat in air.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.
Claims (10)
1. the cooling mechanism of a LED, this mechanism be positioned at driving power (1) and for LED chip is installed substrate (4) between, it is characterized in that, mechanism also comprises connecting cylinder (2), interior heat-dissipating cylinder (3) and outer heat-dissipating cylinder (7), above-mentioned connecting cylinder (2) cylindrically and connecting cylinder (2) internal cavity for installing above-mentioned driving power (1), the both sides of described connecting cylinder (2) axially have the positioned edge (2a) of linearly projection along it, aforesaid substrate (4) is positioned at connecting cylinder (2) upper end and securing member (5) is through at substrate (4) is connected with connecting cylinder (2) by substrate (4) with in positioned edge (2a), described interior heat-dissipating cylinder (3) inner circumferential is evenly equipped with some radiating fins (3a) in lengthy motion picture shape projection, spacing between above-mentioned adjacent two radiating fins (3a) and the width of positioned edge (2a) match and positioned edge (2a) is positioned between adjacent two radiating fins (3a), above-mentioned outer heat-dissipating cylinder (7) is enclosed within interior heat-dissipating cylinder (3) outside.
2. the cooling mechanism of LED according to claim 1, it is characterized in that, described outer heat-dissipating cylinder (7) upper end, higher than interior heat-dissipating cylinder (3) upper end, forms the interior stair-stepping Connection Block for locating LED glass lamp shade (6) between described outer heat-dissipating cylinder (7) upper end and interior heat-dissipating cylinder (3) upper end.
3. the cooling mechanism of LED according to claim 1, it is characterized in that, described interior heat-dissipating cylinder (3) upper end, higher than outer heat-dissipating cylinder (7) upper end, forms the outer stair-stepping Connection Block for locating LED glass lamp shade (6) between described outer heat-dissipating cylinder (7) upper end and interior heat-dissipating cylinder (3) upper end.
4. the cooling mechanism of LED according to claim 1, is characterized in that, described interior heat-dissipating cylinder (3) and radiating fin (3a) are integral type structure.
5. the cooling mechanism of LED according to claim 1, it is characterized in that, described positioned edge (2a) upper end has recessed connecting hole (2a1), and described securing member (5) part is positioned at connecting hole (2a1) place.
6. the cooling mechanism of LED according to claim 4, is characterized in that, described securing member (5) is screw.
7. the cooling mechanism of LED according to claim 4, is characterized in that, described securing member (5) is rivet.
8. the cooling mechanism of LED according to claim 1, is characterized in that, the both sides of described positioned edge (2a) all have the approaching face seamlessly transitted.
9. the cooling mechanism of LED according to claim 8, is characterized in that, described approaching face is the cambered surface of positioned edge (2a) both sides arc and approaching face cross section semicircular in shape.
10. the cooling mechanism of LED according to claim 8, is characterized in that, described approaching face is the inclined-plane of positioned edge (2a) both sides inclination and the cross section of approaching face is tip-angled shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420706087.XU CN204187584U (en) | 2014-11-21 | 2014-11-21 | A kind of cooling mechanism of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420706087.XU CN204187584U (en) | 2014-11-21 | 2014-11-21 | A kind of cooling mechanism of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204187584U true CN204187584U (en) | 2015-03-04 |
Family
ID=52619582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420706087.XU Expired - Fee Related CN204187584U (en) | 2014-11-21 | 2014-11-21 | A kind of cooling mechanism of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204187584U (en) |
-
2014
- 2014-11-21 CN CN201420706087.XU patent/CN204187584U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Jiaxing City, Zhejiang province 314419 Haining city Zhejiang Haining warp knitting industrial park Yuen Road No. 1002 Building No. 1 Patentee after: Zhejiang Future Lighting Co., Ltd. Address before: Jiaxing City, Zhejiang province 314419 Haining city Zhejiang Haining warp knitting industrial park Yuen Road No. 1002 Building No. 1 Patentee before: HAINING FUTURE LIGHRTING CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150304 Termination date: 20181121 |