CN204143485U

CN204143485U - A kind of resistant to elevated temperatures RFID

Info

Publication number: CN204143485U
Application number: CN201420673590.XU
Authority: CN
Inventors: 袁建和
Original assignee: BEIJING HOMEKA HOUSEHOLD PRODUCT Co Ltd
Current assignee: BEIJING HOMEKA HOUSEHOLD PRODUCT Co Ltd
Priority date: 2014-11-07
Filing date: 2014-11-07
Publication date: 2015-02-04
Anticipated expiration: 2024-11-07

Abstract

The utility model discloses a kind of resistant to elevated temperatures RFID, comprise the Inlay containing RFID electronic chip, the described Inlay containing RFID electronic chip is folded to be adhesively fixed with the U.S. paper of Du Pont's promise of rubberised layer by two panels and forms RFID, the utility model structure is simple, easy to make, owing to employing resistant to elevated temperatures silica gel adhesive, and before bonding, what a RFID electronic chip placement mark silica gel adhesive is carved, very easily the Inlay containing RFID electronic chip face can be attached on the U.S. paper of Du Pont's promise, even if accomplish also to cause damage to RFID electronic chip when high temperature deformation, improve the availability of RFID under high temperature.

Description

A kind of resistant to elevated temperatures RFID

Technical field

The utility model relates to a kind of resistant to elevated temperatures RFID.

Background technology

RFID radio electronic label, identifies programmable code because it has and by dual-mode antenna, has the high advantage of false proof degree compared with traditional bar code label.The structure that current most of electronic tag all adopts ABS engineering plastics to encapsulate, RFID radio frequency chip is directly bonded in ABS engineering plastics, it is no problem to use at normal temperatures, but when being applied in some special places, such as, pyroprocessing section on plant produced line, RFID radio electronic label can hang on centre part, in high temperature environments, because its ABS engineering plastics encapsulating material is direct and the two-sided fixed bonding of RFID radio frequency chip, along with temperature raises, therefore ABS engineering plastics will drawdown deformation, RFID radio frequency chip is drawdown deformation thereupon also, RFID radio frequency chip is caused to damage, therefore need to overcome prior art Problems existing.

Summary of the invention

The utility model object is to provide a kind of resistant to elevated temperatures RFID, is a kind of RFID that can use under 200 DEG C to 300 DEG C environment.

To achieve these goals, scheme of the present utility model is: a kind of resistant to elevated temperatures RFID, comprise the Inlay containing RFID electronic chip, the described Inlay containing RFID electronic chip is folded to be adhesively fixed with the U.S. paper of Du Pont's promise of rubberised layer by two panels and forms RFID.

Scheme is further: described rubberised layer is silica gel adhesive, silica gel adhesive is coated on a face of the U.S. paper of two panels Du Pont promise, the thickness of silicone rubber adhesive equals the thickness of the Inlay containing RFID electronic chip, the silicone rubber adhesive layer of the U.S. paper of the first Du Pont promise in described two panels is provided with one with long containing RFID electronic chip Inlay, wide measure-alike localized prints, be placed in the marking containing RFID electronic chip Inlay, the U.S. paper tape of second Du Pont's promise in described two panels has the face of silicone rubber adhesive to be buckled on the U.S. paper of first Du Pont promise, to be clipped in the middle fixing containing RFID electronic chip Inlay by hot pressing.

Scheme is further: the U.S. paper of first Du Pont promise and second U.S. paper of Du Pont's promise are joined together to form the U.S. paper of Du Pont's promise of a complete surface coating, are distinguished between the U.S. paper of first Du Pont promise and the second U.S. paper of Du Pont's promise by indentation line.

Scheme is further: described indentation line is stamp-like perforation strapping wires, and the U.S. paper of described first Du Pont promise and the second U.S. paper of Du Pont's promise are respectively arranged with corresponding square perforation.

The beneficial effects of the utility model are: structure is simple, easy to make, owing to employing resistant to elevated temperatures silica gel adhesive, and what a silica gel adhesive is carved before bonding contain RFID electronic chip Inlay and place mark, very easily a face containing RFID electronic chip Inlay directly can be attached on the U.S. paper of Du Pont's promise, its advantage is that high temperature deformation is little, even and if accomplish also to cause damage to RFID electronic chip when high temperature deformation, improve the availability of RFID under high temperature.

Below in conjunction with drawings and Examples, the utility model is described in detail.

Accompanying drawing explanation

Fig. 1 is the utility model structural representation.

Fig. 2 is the bonding front structural representation of the utility model.

Embodiment

A kind of resistant to elevated temperatures RFID, see Fig. 1 and Fig. 2, described electronic tag comprises containing RFID electronic chip Inlay1, containing the flexible circuit sheet that RFID electronic chip Inlay is with P.e.c., describedly folded to be adhesively fixed by the two panels paper with rubberised layer 2 form RFID containing RFID electronic chip Inlay, the U.S. paper of Zhi Shi Du Pont promise of gluing; The U.S. paper of Du Pont's promise of two panels gluing is called first 3 and second 4.

In embodiment, described rubberised layer is silica gel adhesive, and silica gel adhesive is coated on a face of the U.S. paper of two panels Du Pont promise, and the thickness of silica gel adhesive (such as D05RTV silica gel adhesive) coating equals the thickness containing RFID electronic chip Inlay, bonding process as shown in Figure 2, on the surface of silica gel adhesive with the release protection sheet of one deck, by carving one with long containing RFID electronic chip Inlay on release protection sheet, wide measure-alike localized prints, the silicone rubber adhesive layer of the U.S. paper of the first Du Pont promise in described two panels is formed one with long containing RFID electronic chip Inlay, wide measure-alike mark 301, to place in the markers containing RFID electronic chip Inlay, take release protection sheet, the U.S. paper tape of second Du Pont's promise in described two panels has the face of silicone rubber adhesive to be buckled on the U.S. paper of first Du Pont promise, to be clipped in the middle fixing containing RFID electronic chip Inlay by hot pressing.

Or by the localized prints groove on release protection sheet; the groove that formation one is measure-alike with RFID electronic chip Inlay length and width on the silicone rubber adhesive layer of the U.S. paper of first Du Pont promise; take release protection sheet; a face containing RFID electronic chip Inlay is directly attached on the U.S. paper of Du Pont's promise; the U.S. paper tape of second Du Pont's promise in described two panels has the face of silica gel adhesive to be buckled on the U.S. paper of first Du Pont promise, is clipped in the middle fixing by hot pressing by RFID electronic chip.

In embodiment, the U.S. paper of first Du Pont promise and the second U.S. paper of Du Pont's promise are joined together to form the U.S. paper of Du Pont's promise, are distinguished between the U.S. paper of first Du Pont promise and the second U.S. paper of Du Pont's promise by indentation line 5.

In embodiment, described indentation line is stamp-like perforation strapping wires, and the U.S. paper of described first Du Pont promise and the second U.S. paper of Du Pont's promise are respectively arranged with corresponding square perforation 6.First RFID electronic chip is put in mark or groove during making, then will be clipped in the middle of two panels paper containing RFID electronic chip Inlay with indentation line doubling, to be sticked together formation electronic tag through glue hot melt of heating, on the intermediate product that the square perforation formed after doubling facilitates electronic tag to hang on a production line.

The present embodiment label is owing to selecting the U.S. paper of resistant to elevated temperatures Du Pont promise as label paper, the U.S. paper of promise is at 230 DEG C, 50 minutes, in the heatproof test of 10 circulations, except the slight yellowing of paper surface, other physical indexs keep bonds well agent, conventional propylene acids pressure sensitive adhesives is used instead silicone rubber adhesive in embodiment, this kind of adhesive is in 200 DEG C to 300 DEG C temperature tests, substantially do not change, bond effect is good, and product appearance is also comparatively attractive in appearance, this product adopts the fixing mode of intermediate course to produce, protect very well RFID electronic chip (INLAY) at high temperature there is not deformation, make INLAY after high temperature test, can normally use.

Claims

1. a resistant to elevated temperatures RFID, comprise the flexible circuit sheet containing RFID electronic chip, it is characterized in that, the described flexible circuit sheet containing RFID electronic chip is folded to be adhesively fixed with the U.S. paper of Du Pont's promise of rubberised layer by two panels and forms RFID.

2. the resistant to elevated temperatures RFID of one according to claim 1, it is characterized in that, described rubberised layer is silica gel adhesive, silica gel adhesive is coated on a face of the U.S. paper of two panels Du Pont promise, the thickness of silica gel adhesive equals the thickness of the flexible circuit sheet containing RFID electronic chip, the silica gel adhesive layer of the U.S. paper of the first Du Pont promise in described two panels is provided with one with containing RFID electronic chip flexible circuit length of a film, wide measure-alike localized prints, flexible circuit sheet containing RFID electronic chip is placed in the marking, the U.S. paper tape of second Du Pont's promise in described two panels has the face of silica gel adhesive to be buckled on the U.S. paper of first Du Pont promise, by hot pressing, RFID electronic chip is clipped in the middle fixing.

3. the resistant to elevated temperatures RFID of one according to claim 2, it is characterized in that, the U.S. paper of first Du Pont promise and second U.S. paper of Du Pont's promise are joined together to form the U.S. paper of Du Pont's promise of a complete surface coating, are distinguished between the U.S. paper of first Du Pont promise and the second U.S. paper of Du Pont's promise by indentation line.

4. the resistant to elevated temperatures RFID of one according to claim 3, is characterized in that, described indentation line is stamp-like perforation strapping wires, and the U.S. paper of described first Du Pont promise and the second U.S. paper of Du Pont's promise are respectively arranged with corresponding square perforation.