CN204136253U - Predeformation electroplating diamond wire saw - Google Patents
Predeformation electroplating diamond wire saw Download PDFInfo
- Publication number
- CN204136253U CN204136253U CN201420549670.4U CN201420549670U CN204136253U CN 204136253 U CN204136253 U CN 204136253U CN 201420549670 U CN201420549670 U CN 201420549670U CN 204136253 U CN204136253 U CN 204136253U
- Authority
- CN
- China
- Prior art keywords
- predeformation
- wire saw
- bus
- diamond
- metal wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a kind of predeformation electroplating diamond wire saw, it comprises bus (1) and is plated on the diamond abrasive grain (2) on bus surface, it is characterized in that described bus (1) comprises the metal wire (1.1) of vertical bar type, metal wire (1.1) comprises spaced toothed segment and smooth section, and metal wire (1.1) surface of toothed segment is provided with the annular chip pocket (1.2) of uniform intervals layout.This predeformation electroplating diamond wire saw has good toughness, the life-span is long, cutting efficiency is high advantage.
Description
Technical field
The utility model relates to a kind of predeformation electroplating diamond wire saw.
Background technology
At present, wire sawing technology is mainly used in the hard brittle materials such as cutting silicon wafer, crystal, jewel, pottery, has good development prospect.Scroll saw is divided into free abrasive wire saw and fixed-abrasive wire saw two kinds, free abrasive wire saw cutting is a kind of limit cutting edge to the cutting mode of steel wire supply with abrasive water, the shortcoming that this technique exists: easily cause that silicon chip top layer is difficult to control compared with dark damage layer, surface roughness and surface figure accuracy, cutting efficiency is low, abrasive material consumption is large, operating environment is severe.For overcoming the above problems, fixed-abrasive wire saw cutting technique has developed gradually, its preparation method comprises resinoid bond curing technology and electroplating technology, and the former adopts single resin bed to hold diamond, and the latter adopts single nickel coating or nickel alloy coating to hold diamond.Adopt diamond fretsaw prepared by resinoid bond curing technology and electroplating technology, resin bonding agent diamond scroll saw has the advantages such as cost is low, preparation speed is fast, but it is wear-resisting and heat resistance is poor, abrasive material hold is lower.Electroplating diamond wire saw is cemented on steel wire matrix by diadust composite electric plating method, has heat-resisting and wearability is high, joint-cutting is narrow, cutting surface figure accuracy advantages of higher.But, the shortcoming that electroplating diamond wire saw cutting technique exists is: 1, with linear pattern and single wire as matrix, wire has two or more defect and residual tension, causes thus in cutting process, the unexpected fracture of electroplating diamond wire saw; 2, along with the increase of processing number of times, chip is attached to diamond surface, adds the wearing and tearing of diamond abrasive grain self and the reason such as to come off, causes diamond fretsaw cutting performance to decline gradually; 3, cost is high, production efficiency is low.Therefore seek a kind of good toughness, the life-span is long, predeformation electroplating diamond wire saw that cutting efficiency is high is particularly important.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of good toughness, the life-span is long, predeformation electroplating diamond wire saw that cutting efficiency is high.
The purpose of this utility model is achieved in that
A kind of predeformation electroplating diamond wire saw, it comprises bus and is plated on the diamond abrasive grain on bus surface, described bus comprises the metal wire of vertical bar type, metal wire comprises spaced toothed segment and smooth section, and the metal line surface of toothed segment is provided with the annular chip pocket of uniform intervals layout.
Preferred as one, the density of the diamond abrasive grain at the annular chip pocket place in toothed segment is less than all the other places.
Compared with prior art, the beneficial effects of the utility model are:
The more traditional scroll saw of the utility model predeformation electroplating diamond wire saw sectional area reduces, and breaking load declines; Owing to there being chip pocket, promoting the inflow of working fluid, improve chip resistance ability, therefore maximum about 2 times of reaching traditional scroll saw of cutting efficiency; Its cutting accuracy and traditional scroll saw there is no difference, but greatly strengthen cutting efficiency.Therefore this predeformation electroplating diamond wire saw has good toughness, the life-span is long, cutting efficiency is high advantage.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model predeformation electroplating diamond wire saw.
Fig. 2 is the A place partial enlarged drawing of Fig. 1.
Wherein:
Bus 1, metal wire 1.1, annular chip pocket 1.2
Diamond abrasive grain 2.
Detailed description of the invention
See Fig. 1 and Fig. 2, a kind of predeformation electroplating diamond wire saw that the utility model relates to, it comprises bus 1 and is plated on the diamond abrasive grain 2 on bus surface, described bus 1 comprises the metal wire 1.1 of vertical bar type, metal wire 1.1 comprises spaced toothed segment and smooth section, metal wire 1.1 surface of toothed segment is provided with the annular chip pocket 1.2 of uniform intervals layout, annular chip pocket 1.2 is that metal wire 1.1 inwardly compresses the groove shrinking predeformation and formed, diamond abrasive grain 2 is plated on the outer surface of toothed segment and smooth section, the density of the diamond abrasive grain 2 at annular chip pocket 1.2 place in toothed segment is less than all the other places.
Operation principle:
In order to solve problem in background technology and shortcoming, improve cutting performance and the service life of diamond fretsaw, implementing method is the shape changing bus, by columned for original vertical bar bus, be pre-processed into the S shape at thickness interval,, then carry out high/low temperature process, prepare and have that wearability is good, the diamond fretsaw of the advantage such as mechanical property and cutting performance excellence, long service life.
Object reduces the hardness of bus, increases its toughness.Made by the more traditional scroll saw of predeformation electroplating diamond wire saw sectional area out reduce, breaking load declines; Owing to there being chip pocket, promoting the inflow of working fluid, improve chip resistance ability, therefore maximum about 2 times of reaching traditional scroll saw of cutting efficiency; Its cutting accuracy and traditional scroll saw there is no difference, but greatly strengthen cutting efficiency.
Claims (2)
1. a predeformation electroplating diamond wire saw, it comprises bus (1) and is plated on the diamond abrasive grain (2) on bus surface, it is characterized in that described bus (1) comprises the metal wire (1.1) of vertical bar type, metal wire (1.1) comprises spaced toothed segment and smooth section, and metal wire (1.1) surface of toothed segment is provided with the annular chip pocket (1.2) of uniform intervals layout.
2. a kind of predeformation electroplating diamond wire saw according to claim 1, is characterized in that the density of the diamond abrasive grain (2) at annular chip pocket (1.2) place in toothed segment is less than all the other places.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420549670.4U CN204136253U (en) | 2014-09-24 | 2014-09-24 | Predeformation electroplating diamond wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420549670.4U CN204136253U (en) | 2014-09-24 | 2014-09-24 | Predeformation electroplating diamond wire saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204136253U true CN204136253U (en) | 2015-02-04 |
Family
ID=52412967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420549670.4U Expired - Fee Related CN204136253U (en) | 2014-09-24 | 2014-09-24 | Predeformation electroplating diamond wire saw |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204136253U (en) |
-
2014
- 2014-09-24 CN CN201420549670.4U patent/CN204136253U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20180924 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |