CN204135553U - Be applied to the blow device of laser annealing apparatus - Google Patents
Be applied to the blow device of laser annealing apparatus Download PDFInfo
- Publication number
- CN204135553U CN204135553U CN201320818003.7U CN201320818003U CN204135553U CN 204135553 U CN204135553 U CN 204135553U CN 201320818003 U CN201320818003 U CN 201320818003U CN 204135553 U CN204135553 U CN 204135553U
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- CN
- China
- Prior art keywords
- laser annealing
- work stage
- annealing apparatus
- blow device
- metal ion
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of blow device being applied to laser annealing apparatus, be arranged on around laser annealing apparatus work stage upper area, comprise more than one group air flow chamber.The utility model by arranging one or more groups air flow chamber above laser annealing apparatus work stage, clean gas is blown to work stage, the metal ion that silicon chip is separated out is blown away in time, metal ion deposition simultaneously in prevention air is in work stage, thus under the prerequisite not affecting laser annealing apparatus service efficiency and effect, achieve the effective control to work stage metal ion, avoid the impact of metal ion on device performance.
Description
Technical field
The utility model relates to IC manufacturing field, particularly relates to silicon chip back side laser annealing field, more particularly, relates to a kind of blow device being applied to laser annealing apparatus.
Background technology
At IGBT(insulated gate bipolar transistor) etc. in technique, need the step of silicon chip back side being carried out to laser annealing, to realize the activation to back metal ion.Due to laser annealing be silicon chip back side down, and silicon chip has now completed the technique in front road substantially, and therefore part metals can cruelly facing on the direction of work stage, and these metal ions by air borne, work stage can produce deposition.Meanwhile, the trace metal ion in air also easily can deposit in work stage along with the increase of time.Owing to being a condition of high temperature during laser annealing, and front againsts work stage, and these metal ions be originally deposited in work stage easily enter into device by protective layer under high temperature action, affect the performance of device, even cause the inefficacy of function.
Metal ion can be taken away by the mode of running control wafer, but the mode of running control wafer both increased the effective rate of utilization that process costs also affects equipment.By making work stage constantly be kept in motion, these metal ions also can be made not easily to deposit in work stage, but work stage is constantly kept in motion and is unfavorable for equipment itself.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of blow device being applied to laser annealing apparatus, and it effectively can control metal ion deposition in work stage.
For solving the problems of the technologies described above, the blow device being applied to laser annealing apparatus of the present utility model, is arranged on around laser annealing apparatus work stage upper area, comprises more than one group air flow chamber.
The utility model by arranging blow device above laser annealing apparatus work stage, blow away the metal ion in work stage, metal ion deposition simultaneously in prevention air is in work stage, under the prerequisite not affecting laser annealing apparatus service efficiency and effect, achieve the effective control to work stage metal ion and improvement, avoid the impact of metal ion on device performance.
Accompanying drawing explanation
Fig. 1 is the structural representation of the work stage of the laser annealing apparatus being with blow device of the present utility model.
Fig. 2 ~ Fig. 5 is the air flow chamber structural representation of blow device of the present utility model.
Detailed description of the invention
Understand more specifically for having technology contents of the present utility model, feature and effect, now by reference to the accompanying drawings, details are as follows:
As shown in Figure 1, the blow device being applied to laser annealing apparatus of the present utility model, is arranged on around work stage upper area, can form the air flow chamber composition of certain air-flow primarily of more than one group.The position height of blow device and the distance to work stage adjustable.Blow device only can comprise one group of one-way gas flow chamber (see figure 2), also can comprise two groups of two-way airflow chamber (see figure 3)s, or comprises many group multi-directional airflow chambeies (see figure 4); Also air flow chamber can be designed to annular (see figure 5).
Blow device can be designed to associated apparatus with laser annealing apparatus, that is: when laser annealing starts, the automatic closed gas flow of blow device, to avoid, because localized hyperthermia causes airflow fluctuation above silicon chip, causing air refraction to change, affecting annealing effect; After laser annealing terminates, blow device opens air-flow automatically, pure gas (such as air or N2 etc.) is blown to work stage, and above work stage, form the air-flow (air-flow wind speed and intensity adjustable) of certain speed, the metal ion of separating out in silicon chip is blown away in time, and the trace metal ion in air is not easily deposited in work stage, with holding workpiece platform not by the pollution of metal ion.
Table 1 with or without use blow device, on the impact of work stage metal ion quantity
Data as can be seen from table 1 relatively, (namely add air-flow) after adding blow device of the present utility model, and in work stage, metal ion quantity can be significantly improved.
Claims (3)
1. be applied to the blow device of laser annealing apparatus, it is characterized in that, be arranged on around laser annealing apparatus work stage upper area, comprise more than one group air flow chamber.
2. blow device according to claim 1, is characterized in that, described air flow chamber ringwise.
3. blow device according to claim 1 and 2, is characterized in that, described blow device and laser annealing apparatus are associated, when laser annealing starts, and the automatic closed gas flow of blow device; After laser annealing terminates, blow device opens air-flow automatically, blows pure gas to laser annealing apparatus work stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320818003.7U CN204135553U (en) | 2013-12-12 | 2013-12-12 | Be applied to the blow device of laser annealing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320818003.7U CN204135553U (en) | 2013-12-12 | 2013-12-12 | Be applied to the blow device of laser annealing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204135553U true CN204135553U (en) | 2015-02-04 |
Family
ID=52412270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320818003.7U Expired - Fee Related CN204135553U (en) | 2013-12-12 | 2013-12-12 | Be applied to the blow device of laser annealing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204135553U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355579A (en) * | 2015-12-11 | 2016-02-24 | 清华大学 | Non-enclosed argon protection workpiece stage |
-
2013
- 2013-12-12 CN CN201320818003.7U patent/CN204135553U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355579A (en) * | 2015-12-11 | 2016-02-24 | 清华大学 | Non-enclosed argon protection workpiece stage |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150204 Termination date: 20151212 |
|
| EXPY | Termination of patent right or utility model |