CN204122927U - 激光加工装置 - Google Patents
激光加工装置 Download PDFInfo
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- CN204122927U CN204122927U CN201420430597.9U CN201420430597U CN204122927U CN 204122927 U CN204122927 U CN 204122927U CN 201420430597 U CN201420430597 U CN 201420430597U CN 204122927 U CN204122927 U CN 204122927U
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Description
Din | Dout | 差值 | |
传统装置 | 50um | 20um | 30um |
本装置 | 50um | 49.5um | 0.5um |
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CN201420430597.9U CN204122927U (zh) | 2014-07-31 | 2014-07-31 | 激光加工装置 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104162741A (zh) * | 2014-07-31 | 2014-11-26 | 北京万恒镭特机电设备有限公司 | 激光加工装置及其方法 |
CN106312331A (zh) * | 2016-09-29 | 2017-01-11 | 长春理工大学 | 基于道威棱镜的激光打小孔装置及方法 |
CN112475638A (zh) * | 2020-10-15 | 2021-03-12 | 西安中科微精光子制造科技有限公司 | 一种基于轴锥透镜的激光微孔加工系统和方法 |
CN112975171A (zh) * | 2021-03-25 | 2021-06-18 | 清华大学 | 一种超快激光微孔旋切加工装置 |
CN112992665A (zh) * | 2020-05-22 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | 巨量转移装置、系统及其控制方法 |
CN114101900A (zh) * | 2021-12-31 | 2022-03-01 | 华中科技大学 | 一种激光扫描光学系统 |
KR102520228B1 (ko) * | 2023-01-31 | 2023-04-10 | 주식회사 티프렌즈 | 줌 렌즈를 활용한 레이저 드릴 장치 |
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2014
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104162741A (zh) * | 2014-07-31 | 2014-11-26 | 北京万恒镭特机电设备有限公司 | 激光加工装置及其方法 |
CN104162741B (zh) * | 2014-07-31 | 2016-06-01 | 北京万恒镭特机电设备有限公司 | 激光加工装置及其方法 |
CN106312331A (zh) * | 2016-09-29 | 2017-01-11 | 长春理工大学 | 基于道威棱镜的激光打小孔装置及方法 |
CN112992665A (zh) * | 2020-05-22 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | 巨量转移装置、系统及其控制方法 |
CN112475638A (zh) * | 2020-10-15 | 2021-03-12 | 西安中科微精光子制造科技有限公司 | 一种基于轴锥透镜的激光微孔加工系统和方法 |
CN112475638B (zh) * | 2020-10-15 | 2022-07-12 | 西安中科微精光子科技股份有限公司 | 一种基于轴锥透镜的激光微孔加工系统和方法 |
CN112975171A (zh) * | 2021-03-25 | 2021-06-18 | 清华大学 | 一种超快激光微孔旋切加工装置 |
CN114101900A (zh) * | 2021-12-31 | 2022-03-01 | 华中科技大学 | 一种激光扫描光学系统 |
CN114101900B (zh) * | 2021-12-31 | 2023-03-10 | 华中科技大学 | 一种激光扫描光学系统 |
KR102520228B1 (ko) * | 2023-01-31 | 2023-04-10 | 주식회사 티프렌즈 | 줌 렌즈를 활용한 레이저 드릴 장치 |
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Address after: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing Patentee after: Beijing Zhongke Radium Electronics Co., Ltd. Address before: 100176 Beijing Economic and Technological Development Zone, 1st Floor C, No. 14 Building, 156 Jinghai Fourth Road, Beijing Patentee before: BEIJING WANHENG LEITE MECHANICAL AND ELECTRICAL EQUIPMENT CO., LTD. |
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Denomination of utility model: Laser processing method and laser processing device Effective date of registration: 20190213 Granted publication date: 20150128 Pledgee: Beijing Zhongke micro Intellectual Property Service Co., Ltd. Pledgor: Beijing Zhongke Radium Electronics Co., Ltd. Registration number: 2019990000122 |
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Date of cancellation: 20220614 Granted publication date: 20150128 Pledgee: Beijing Zhongke Micro Intellectual Property Service Co.,Ltd. Pledgor: BEIJING ZHONGKE LEITE ELECTRONICS Co.,Ltd. Registration number: 2019990000122 |