CN204090293U - A kind of wired circuit wiring board - Google Patents
A kind of wired circuit wiring board Download PDFInfo
- Publication number
- CN204090293U CN204090293U CN201420530780.6U CN201420530780U CN204090293U CN 204090293 U CN204090293 U CN 204090293U CN 201420530780 U CN201420530780 U CN 201420530780U CN 204090293 U CN204090293 U CN 204090293U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- base material
- wiring circuit
- pad
- dot matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000011159 matrix material Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011810 insulating material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 2
- 239000011190 CEM-3 Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000002932 luster Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of wired circuit wiring board, the wiring of many, dot matrix wiring board LED luminous zone and multiple pad are combined into overall figure, and circle or the combination of oval wired circuit is formed in luminous zone, described circle or the combination of oval wired circuit hide the base material of dot matrix wiring board LED luminous zone, are formed and substitute the wired circuit of base material as refractive body using luminous zone wiring and multiple pad.First the wiring of many, dot matrix wiring board LED luminous zone and multiple pad are combined into overall figure by the utility model, circle or the combination of oval wired circuit is formed in luminous zone, hide the base material of dot matrix wiring board LED luminous zone, formed and substitute the wired circuit of base material as refractive body using luminous zone wiring, pad, after such process, solve a difficult problem for substrate color difference.
Description
Technical Field
The utility model discloses be suitable for dot matrix circuit board LED to send out the wiring circuit that light zone wiring, pad replaced the substrate reflection of light.
Background
In the current LED industry (including all PCB manufacturing industries), the LED luminous area of the dot matrix circuit board adopts a white CEM-3 substrate of the circuit board as a reflector. The white CEM-3 base material has high cost and poor color consistency, which leads to high cost and high reject ratio of the dot matrix circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model discloses solve the technical problem that prior art exists, provide a wiring circuit that is suitable for dot matrix circuit board LED to send out light zone wiring, the pad replaces the substrate reflection of light.
The utility model provides a technical scheme as follows that above-mentioned technical problem took:
a dot matrix circuit board LED light-emitting area is combined into an integral pattern through a plurality of wires and a plurality of bonding pads, a circular or oval wiring circuit combination is formed in the light-emitting area, the circular or oval wiring circuit combination covers a base material of the dot matrix circuit board LED light-emitting area, and a wiring circuit which uses the light-emitting area and the bonding pads to replace the base material to serve as a reflector is formed.
Further, it is preferable that the circular or elliptical wiring circuit combination specifically includes:
the LED anode bonding pad comprises an LED anode bonding pad (1), a first cathode bonding pad (3) and a second cathode bonding pad (4), wherein the LED anode bonding pad (1) is in a semicircular or semi-elliptical pattern, the first cathode bonding pad (3) and the second cathode bonding pad (4) are respectively in an 1/4 circular or semi-elliptical pattern, a first connecting wire (3) is arranged between the LED anode bonding pad (1) and the first cathode bonding pad (3), and a second connecting wire (5) is arranged between the LED anode bonding pad (1) and the second cathode bonding pad (4).
The substrate is made of an insulating material.
The base material is white, yellow, black or natural light base material.
The utility model discloses at first send out many wirings of light zone of dot matrix circuit board LED and a plurality of pad group one-tenth whole figure, send out light zone formation circular or oval wiring circuit combination, cover the substrate that dot matrix circuit board LED sent out light zone, form with sending out light zone wiring, pad replacement substrate as the wiring circuit of reflector, handle the back like this, solved the difficult problem of substrate colour difference.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The present invention will be described in detail with reference to the accompanying drawings so that the above advantages of the present invention can be more clearly understood. Wherein,
FIG. 1 is a schematic structural diagram of a circuit board with a nickel-palladium alloy plating layer in the prior art;
fig. 2 is a schematic structural diagram of a nickel-palladium alloy plating layer circuit board of the present invention.
Detailed Description
The following detailed description will be made with reference to the accompanying drawings and examples, so as to solve the technical problems by applying technical means to the present invention, and to fully understand and implement the technical effects of the present invention. It should be noted that, as long as no conflict is formed, the embodiments and the features in the embodiments of the present invention may be combined with each other, and the technical solutions formed are all within the scope of the present invention.
The utility model discloses a be suitable for dot matrix circuit board LED to send out wiring, pad and replace the wiring circuit of substrate reflection of light, send out many wirings and a plurality of pad of light zone of dot matrix circuit board LED and make up into whole figure, send out light zone formation circular or oval wiring circuit combination, cover the substrate that dot matrix circuit board LED sent out light zone, form with sending out light zone wiring, pad and replace the substrate as the wiring circuit of reflector body.
After the treatment, the problem of color difference of the white CEM-3 base material is solved; besides, the base material can be easily made of insulating materials with any color and substance component, such as yellow, black and natural color, and the cost of the dot matrix circuit board can be reduced by more than 20%. Meanwhile, the wiring circuit of the metal coating has consistent color and luster, the photoelectric performance of the LED is better met, and the lighting effect is greatly improved.
Specifically, the wiring circuit board combines a plurality of wirings and a plurality of bonding pads in a light emitting area of a dot matrix circuit board LED into an integral pattern, and forms a circular or oval wiring circuit combination in the light emitting area, wherein the circular or oval wiring circuit combination covers a base material in the light emitting area of the dot matrix circuit board LED, and forms a wiring circuit which uses the wiring in the light emitting area and the bonding pads to replace the base material as a reflector.
As shown in fig. 1, the circular or elliptical wiring circuit combination specifically includes:
LED positive pole pad 1, first cathode pad 3, second cathode pad 4, wherein, LED positive pole pad 1 is a semi-circular or semi-ellipse shape pattern, first cathode pad 3, second cathode pad 4 are 1/4 circle or semi-ellipse shape pattern respectively, and are equipped with first connecting wire 3 between LED positive pole pad 1 and the first cathode pad 3, be equipped with second connecting wire 5 between LED positive pole pad 1 and the second cathode pad 4, the substrate takes insulating material preparation.
Wherein the base material is white, yellow, black or natural light base material.
The technical solution of the present invention will be further specifically described by the following examples.
A wiring circuit production method of a wiring board, comprising:
the method comprises the following steps: combining a plurality of wires and a plurality of bonding pads in a light emitting area of the dot matrix circuit board LED into an integral pattern;
step two: and forming a circular or oval wiring circuit combination in the light emitting area, covering the white base material of the light emitting area of the dot matrix circuit board LED, and forming a wiring circuit with the light emitting area wiring and a plurality of bonding pads as a reflector instead of the base material.
Wherein the circular or elliptical wiring circuit combination specifically comprises:
the LED anode pad comprises an LED anode pad 1, a first cathode pad 3 and a second cathode pad 4, wherein the LED anode pad 1 is in a semicircular or semi-elliptical pattern, the first cathode pad 3 and the second cathode pad 4 are in 1/4 circular or semi-elliptical patterns respectively, a first connecting wire 3 is arranged between the LED anode pad 1 and the first cathode pad 3, and a second connecting wire 5 is arranged between the LED anode pad 1 and the second cathode pad 4.
The substrate is made of an insulating material. The base material is white, yellow, black or natural light base material.
Example 1: a wiring circuit suitable for wiring in a light emitting area of a dot matrix circuit board LED and reflecting light by replacing a base material with a pad is characterized in that a plurality of wirings and a plurality of pads in the light emitting area of the dot matrix circuit board LED are combined into an integral pattern, a circular or oval wiring circuit combination is formed in the light emitting area, a white base material in the light emitting area of the dot matrix circuit board LED is covered, and a wiring circuit with the wiring in the light emitting area and the pad as a reflector is formed. After the treatment, the problem of color difference of the white CEM-3 base material is solved; besides, the base material can be easily made of insulating materials with any color and substance component, such as yellow, black and natural color, and the cost of the dot matrix circuit board can be reduced by more than 20%. Meanwhile, the wiring circuit of the metal coating has consistent color and luster, the photoelectric performance of the LED is better met, and the lighting effect is greatly improved.
Example 2: a wiring circuit suitable for wiring in a light emitting area of a dot matrix circuit board LED and reflecting light by replacing a base material with a pad is characterized in that a plurality of wirings and a plurality of pads in the light emitting area of the dot matrix circuit board LED are combined into an integral pattern, a circular or oval wiring circuit combination is formed in the light emitting area, the yellow base material in the light emitting area of the dot matrix circuit board LED is covered, and a wiring circuit with the wiring in the light emitting area and the pad as a reflector is formed. After the treatment, the problem of color difference of the white CEM-3 base material is solved; besides, the base material can be easily made of insulating materials with any color and substance component, such as yellow, black and natural color, and the cost of the dot matrix circuit board can be reduced by more than 20%. Meanwhile, the wiring circuit of the metal coating has consistent color and luster, the photoelectric performance of the LED is better met, and the lighting effect is greatly improved.
Example 3: a wiring circuit suitable for wiring in a light emitting area of a dot matrix circuit board LED and reflecting light by replacing a base material with a pad is characterized in that a plurality of wirings and a plurality of pads in the light emitting area of the dot matrix circuit board LED are combined into an integral pattern, a circular or oval wiring circuit combination is formed in the light emitting area, a black base material in the light emitting area of the dot matrix circuit board LED is covered, and a wiring circuit using the wirings in the light emitting area and the pad as a reflector is formed. After the treatment, the problem of color difference of the white CEM-3 base material is solved; besides, the base material can be easily made of insulating materials with any color and substance component, such as yellow, black and natural color, and the cost of the dot matrix circuit board can be reduced by more than 20%. Meanwhile, the wiring circuit of the metal coating has consistent color and luster, the photoelectric performance of the LED is better met, and the lighting effect is greatly improved.
Example 4: a wiring circuit suitable for wiring in a light emitting area of a dot matrix circuit board LED and reflecting light by replacing a base material with a pad is characterized in that a plurality of wirings and a plurality of pads in the light emitting area of the dot matrix circuit board LED are combined into an integral pattern, a circular or oval wiring circuit combination is formed in the light emitting area, the natural color base material in the light emitting area of the dot matrix circuit board LED is covered, and a wiring circuit with the light emitting area wirings and the pad as a reflector is formed. After the treatment, the problem of color difference of the white CEM-3 base material is solved; besides, the base material can be easily made of insulating materials with any color and substance component, such as yellow, black and natural color, and the cost of the dot matrix circuit board can be reduced by more than 20%. Meanwhile, the wiring circuit of the metal coating has consistent color and luster, the photoelectric performance of the LED is better met, and the lighting effect is greatly improved.
Finally, it should be noted that the above embodiments are merely representative examples of the present invention. Obviously, the technical solution of the present invention is not limited to the above-described embodiments, and many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the invention should be considered as within the scope of the invention.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The wiring circuit board is characterized in that a plurality of wires and a plurality of bonding pads are combined into an integral pattern in a light emitting area of a dot matrix circuit board LED, a circular or oval wiring circuit combination is formed in the light emitting area, a base material in the light emitting area of the dot matrix circuit board LED is covered by the circular or oval wiring circuit combination, and a wiring circuit which uses the light emitting area and the bonding pads to replace the base material as a reflector is formed.
2. The wiring circuit board of claim 1, wherein the circular or elliptical wiring circuit combination specifically comprises:
the LED anode bonding pad comprises an LED anode bonding pad (1), a first cathode bonding pad (3) and a second cathode bonding pad (4), wherein the LED anode bonding pad (1) is in a semicircular or semi-elliptical pattern, the first cathode bonding pad (3) and the second cathode bonding pad (4) are respectively in an 1/4 circular or semi-elliptical pattern, a first connecting wire (3) is arranged between the LED anode bonding pad (1) and the first cathode bonding pad (3), and a second connecting wire (5) is arranged between the LED anode bonding pad (1) and the second cathode bonding pad (4).
3. The wiring circuit board according to claim 1 or 2, wherein said base material is made of an insulating material.
4. The wiring circuit board according to claim 1 or 2, wherein the substrate is a white, yellow, black or natural light substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420530780.6U CN204090293U (en) | 2014-09-16 | 2014-09-16 | A kind of wired circuit wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420530780.6U CN204090293U (en) | 2014-09-16 | 2014-09-16 | A kind of wired circuit wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204090293U true CN204090293U (en) | 2015-01-07 |
Family
ID=52182956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420530780.6U Expired - Fee Related CN204090293U (en) | 2014-09-16 | 2014-09-16 | A kind of wired circuit wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204090293U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363699A (en) * | 2014-09-16 | 2015-02-18 | 陈然 | Wiring circuit board and production method |
-
2014
- 2014-09-16 CN CN201420530780.6U patent/CN204090293U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104363699A (en) * | 2014-09-16 | 2015-02-18 | 陈然 | Wiring circuit board and production method |
| CN104363699B (en) * | 2014-09-16 | 2019-05-24 | 陈然 | A kind of wired circuit wiring board and production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20160916 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |