CN204074110U - Chamber semiconductor refrigerating module - Google Patents
Chamber semiconductor refrigerating module Download PDFInfo
- Publication number
- CN204074110U CN204074110U CN201420368583.9U CN201420368583U CN204074110U CN 204074110 U CN204074110 U CN 204074110U CN 201420368583 U CN201420368583 U CN 201420368583U CN 204074110 U CN204074110 U CN 204074110U
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- case
- gusset
- chamber
- fan
- semiconductor
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- Expired - Fee Related
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Abstract
The utility model discloses a kind of chamber semiconductor refrigerating module, thus make the structure of chamber comparatively simple, compact, volume can be less, and there is not the risk that refrigrant leakage causes fault, later stage working service work is simple, in addition consume energy lower, it comprises semiconductor cooler, semiconductor cooler is connected with gusset (3), gusset (3) is for being connected with the test casing (1) of chamber, heat-insulating and sealing circle (4) is provided with between gusset (3) and test casing (1), the part that semiconductor cooler is positioned at gusset (3) front is cold junction, the part being positioned at gusset (3) rear of semiconductor cooler is hot junction, cold junction and hot junction are equipped with heat exchange fin, case and fan (5), fan (5) is arranged on the front of case, the part that the two ends, left and right of case and case are used for provided with fan (5) is the opening of ventilation, the case being positioned at cold junction is the first case (6), and the case being positioned at hot junction is the second case (7).
Description
Technical field
The utility model relates to chamber technical field, is specifically a kind of chamber semiconductor refrigerating module.
Background technology
Current chamber is widely used in the test to product, especially medicine, because medicine test period is longer, be generally half a year or 1 year, require during this that chamber can normally work, therefore require that chamber stability and reliability will be got well, but, current chamber generally adopts the refrigeration system comprising compressor to freeze, owing to also comprising cold-producing medium, condenser, the structure such as evaporimeter and connecting line, so the structure of current chamber is comparatively complicated, compact not, volume is larger, and there is the risk that refrigrant leakage causes fault, later stage working service work is complicated, in addition consume energy higher.
Utility model content
The technical problems to be solved in the utility model is, a kind of chamber semiconductor refrigerating module is provided, thus makes that the structure of chamber is comparatively simple, compact, volume can be less, and there is not the risk that refrigrant leakage causes fault, later stage working service work is simple, consumes energy in addition lower.
The technical solution of the utility model is, the utility model chamber semiconductor refrigerating module, it comprises semiconductor cooler, semiconductor cooler and link of boards, gusset be used for chamber test casing be connected, gusset and test casing between be provided with heat-insulating and sealing circle, the part being positioned at gusset front of semiconductor cooler is cold junction, the part being positioned at gusset rear of semiconductor cooler is hot junction, cold junction and hot junction are equipped with heat exchange fin, case and fan, fan is arranged on the front of case, the part that the two ends, left and right of case and case are used for provided with fan is the opening of ventilation, the case being positioned at cold junction is the first case, and the case being positioned at hot junction is the second case.
After adopting said structure, the utility model compared with prior art, have the following advantages: the application's structure is simple, by gusset and chamber test casing be connected to be arranged in chamber by semiconductor refrigerating module, be applicable to chamber be installed and uses, and heat exchange fin, the setting of case and fan, and fan is arranged on the front of case, the part that the two ends, left and right of case and case are used for provided with fan is the opening of ventilation, the air channel that these passages are formed, namely wind sucks from the two ends, left and right of case, after fin heat exchange, discharge from fan, greatly can improve heat exchange efficiency and heat exchange uniformity, reduce energy consumption, meet refrigeration requirement, make the application's refrigeration performance good, efficiency is high, the application can be good at realizing the requirement of chamber refrigeration, the structure that prior art adopts compressor can be substituted completely, the application is due to without the need to structures such as compressors, and rational deployment, the structure of the chamber of employing the application can be made comparatively simple, compact, volume can be less, volume can be accomplished desktop uses, and there is not the risk that refrigrant leakage causes fault, later stage working service work is simple, in addition the use of semiconductor cooler makes power consumption lower, be applicable to Long-Time Service.
As improvement, semiconductor cooler is two, two semiconductor coolers be set up in parallel up and down and with same link of boards, the cold junction of two semiconductor coolers shares first case, the hot junction of two semiconductor coolers shares second case, like this, two semiconductor coolers can take turns to operate, namely during a job, another stops, or when a fault, another can also normally work, final guarantee test case maintains isoperibol in long term test process, can not interrupt and bring loss to user, simultaneously, be set up in parallel heat exchange when two semiconductor coolers can be made to take turns to operate up and down still even, and heat exchange efficiency is high.
As improvement, the fan on the first case is two, and symmetrical distribution drawing close to centre; Fan on second case is one, and arranges between two parties, and like this, when two semiconductor coolers can be made to take turns to operate, heat exchange is still even, and heat exchange efficiency is high.
Accompanying drawing explanation
Fig. 1 is the front view of the utility model chamber semiconductor refrigerating module.
Fig. 2 is the top view of the utility model chamber semiconductor refrigerating module.
Fig. 3 is the Facad structure schematic diagram adopting chamber of the present utility model.
Fig. 4 is the structure schematic diagram adopting chamber of the present utility model.
Shown in figure, 1, test casing, 2, the back side, 3, gusset, 4, heat-insulating and sealing circle, 5, fan, the 6, first case, the 7, second case.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail.
The utility model chamber semiconductor refrigerating module, it comprises semiconductor cooler, semiconductor cooler is connected with gusset 3, gusset 3 is for being connected with the test casing 1 of chamber, heat-insulating and sealing circle 4 is provided with between gusset 3 and test casing 1, the part being positioned at gusset 3 front of semiconductor cooler is cold junction, the part being positioned at gusset 3 rear of semiconductor cooler is hot junction, cold junction and hot junction are equipped with heat exchange fin, case and fan 5, fan 5 is arranged on the front of case, the part that the two ends, left and right of case and case are used for provided with fan 5 is the opening of ventilation, the case being positioned at cold junction is the first case 6, and the case being positioned at hot junction is the second case 7.
Semiconductor cooler is two, and two semiconductor coolers are set up in parallel up and down and are connected with same gusset 3, and the cold junction of two semiconductor coolers shares shared second case 7 in hot junction of first case 6, two semiconductor coolers.
Fan 5 on first case 6 is two, and symmetrical distribution drawing close to centre; Fan 5 on second case 7 is one, and arranges between two parties
The cold junction of semiconductor cooler is positioned at after test casing, the hot junction of semiconductor cooler is positioned at the position corresponding with going up cold junction installation position below, the test outside back side of casing 12, namely semiconductor cooler is installed to overall after on gusset 3 is coaxial elements, as shown in Figure 2, coaxial elements is symmetrical, symmetrical up and down, like this, only need offer one for installing the installing hole of semiconductor cooler on test casing 1 backboard, not only structure is simple, and be convenient to test casing 1 seal, reduce because of install semiconductor cooler may cause inside and outside disclosure risk.
Semiconductor cooler and heat exchange fin adopt prior art, do not add and repeat.
Fig. 3 and 4 (baffle plate is removed) is depicted as a kind of chamber adopting the utility model chamber semiconductor refrigerating module, it comprises test casing 1, temperature-humidity sensor is located in test casing 1, baffle plate is installed below in test casing 1, in interval below and between baffle plate, active cycle fan, heater, semiconductor refrigerating module, humidifier are sequentially installed from top to bottom, on baffle plate, the position of corresponding active cycle fan is provided with air inlet, and baffle plate bottom is provided with air outlet; Active cycle fan, heater, semiconductor refrigerating module, humidifier, temperature-humidity sensor are all electrically connected with control unit.
The electric control structure that the switch of semiconductor refrigerating module and adjustment adopt is prior art, namely control unit comprises controller, driver, controller is the Hpc55 controller of Suntow (remarkable ability) and the control software design that carries thereof, Hpc55 controller control and drive system (such as contactor) controls the switch of active cycle fan, heater, semiconductor cooler, fan, humidifier, the control software design that also can adopt the controller of other companies of market and carry.
When temperature reaches requirement, then close refrigerator or heater, when temperature is on the low side, then heater, when temperature drift, then closes heater and opens semiconductor cooler.
Claims (3)
1. a chamber semiconductor refrigerating module, it comprises semiconductor cooler, it is characterized in that, semiconductor cooler is connected with gusset (3), gusset (3) is for being connected with the test casing (1) of chamber, heat-insulating and sealing circle (4) is provided with between gusset (3) and test casing (1), the part being positioned at gusset (3) front of semiconductor cooler is cold junction, the part being positioned at gusset (3) rear of semiconductor cooler is hot junction, cold junction and hot junction are equipped with heat exchange fin, case and fan (5), fan (5) is arranged on the front of case, the part that the two ends, left and right of case and case are used for provided with fan (5) is the opening of ventilation, the case being positioned at cold junction is the first case (6), and the case being positioned at hot junction is the second case (7).
2. chamber semiconductor refrigerating module according to claim 1, it is characterized in that, semiconductor cooler is two, two semiconductor coolers are set up in parallel up and down and are connected with same gusset (3), the cold junction of two semiconductor coolers shares first case (6), and the hot junction of two semiconductor coolers shares second case (7).
3. chamber semiconductor refrigerating module according to claim 2, is characterized in that, the fan (5) on the first case (6) is two, and symmetrical distribution drawing close to centre; Fan (5) on second case (7) is one, and arranges between two parties.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420368583.9U CN204074110U (en) | 2014-07-04 | 2014-07-04 | Chamber semiconductor refrigerating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420368583.9U CN204074110U (en) | 2014-07-04 | 2014-07-04 | Chamber semiconductor refrigerating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204074110U true CN204074110U (en) | 2015-01-07 |
Family
ID=52166876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420368583.9U Expired - Fee Related CN204074110U (en) | 2014-07-04 | 2014-07-04 | Chamber semiconductor refrigerating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204074110U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104665742A (en) * | 2015-03-05 | 2015-06-03 | 佛山市顺德区美的洗涤电器制造有限公司 | Drying and dehumidifying structure for dish-washing machine and dish-washing machine |
| CN109976415A (en) * | 2017-12-27 | 2019-07-05 | 中国科学院长春光学精密机械与物理研究所 | A kind of temperature range control system of infrared optical system |
-
2014
- 2014-07-04 CN CN201420368583.9U patent/CN204074110U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104665742A (en) * | 2015-03-05 | 2015-06-03 | 佛山市顺德区美的洗涤电器制造有限公司 | Drying and dehumidifying structure for dish-washing machine and dish-washing machine |
| CN109976415A (en) * | 2017-12-27 | 2019-07-05 | 中国科学院长春光学精密机械与物理研究所 | A kind of temperature range control system of infrared optical system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150107 Termination date: 20150704 |
|
| EXPY | Termination of patent right or utility model |