CN204074094U - Semiconductor refrigerating constant temperature humidity chamber - Google Patents

Semiconductor refrigerating constant temperature humidity chamber Download PDF

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Publication number
CN204074094U
CN204074094U CN201420372683.9U CN201420372683U CN204074094U CN 204074094 U CN204074094 U CN 204074094U CN 201420372683 U CN201420372683 U CN 201420372683U CN 204074094 U CN204074094 U CN 204074094U
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CN
China
Prior art keywords
semiconductor
constant temperature
humidity chamber
test casing
temperature humidity
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420372683.9U
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Chinese (zh)
Inventor
王伟
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NINGBO EDESON INSTRUMENT Co Ltd
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NINGBO EDESON INSTRUMENT Co Ltd
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Priority to CN201420372683.9U priority Critical patent/CN204074094U/en
Application granted granted Critical
Publication of CN204074094U publication Critical patent/CN204074094U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of structure comparatively simple, compact, volume can be less, and there is not the risk that refrigrant leakage causes fault, later stage working service work is simple, in addition the semiconductor refrigerating constant temperature humidity chamber consuming energy lower, it comprises test casing (1), temperature, humidity sensor is located in test casing (1), after in test casing (1), (2) are provided with baffle plate (3), in interval below between (2) and baffle plate (3), active cycle fan (4) is sequentially installed from top to bottom, heater, semiconductor cooler, humidifier, the position of the upper corresponding active cycle fan (4) of baffle plate (3) is provided with air inlet (5), baffle plate (3) bottom is provided with air outlet (6), active cycle fan (4), heater, semiconductor cooler, humidifier, temperature-humidity sensor are all electrically connected with control unit.

Description

Semiconductor refrigerating constant temperature humidity chamber
Technical field
The utility model relates to chamber technical field, is specifically a kind of semiconductor refrigerating constant temperature humidity chamber.
Background technology
Current constant temperature humidity chamber is widely used in the test to product, especially medicine, because medicine test period is longer, be generally half a year or 1 year, require during this that constant temperature humidity chamber can normally work, therefore require that constant temperature humidity chamber stability and reliability will be got well, but, current constant temperature humidity chamber generally adopts the refrigeration system comprising compressor to freeze, owing to also comprising cold-producing medium, condenser, the structure such as evaporimeter and connecting line, so current constant temperature humidity chamber structure is comparatively complicated, compact not, volume is larger, and there is the risk that refrigrant leakage causes fault, later stage working service work is complicated, in addition consume energy higher.
Utility model content
The technical problems to be solved in the utility model is, there is provided that a kind of structure is comparatively simple, compact, volume can be less, and there is not the risk that refrigrant leakage causes fault, later stage working service work is simple, the semiconductor refrigerating constant temperature humidity chamber consuming energy lower in addition.
The technical solution of the utility model is, the utility model semiconductor refrigerating constant temperature humidity chamber, it comprises test casing, temperature-humidity sensor is located in test casing, baffle plate is installed below in test casing, sequentially be provided with active cycle fan, heater, semiconductor cooler, humidifier from top to bottom in interval below and between baffle plate, on baffle plate, the position of corresponding active cycle fan is provided with air inlet, and baffle plate bottom is provided with air outlet; Active cycle fan, heater, semiconductor cooler, humidifier, temperature-humidity sensor are all electrically connected with control unit.
After adopting said structure, the utility model compared with prior art, have the following advantages: from overall plan, the application adopts semiconductor cooler as refrigeration source, and miscellaneous part (baffle plate, active cycle fan, heater, humidifier, air inlet, air outlet) rational deployment, interval below and between baffle plate is as circulation air path, semiconductor cooler and described miscellaneous part is made to play the facilitation that cooperatively interacts, the application can be good at the environment realizing constant temperature and humidity in chamber, the structure that prior art adopts compressor can be substituted completely, the application is due to without the need to structures such as compressors, and rational deployment, make the application's structure comparatively simple, compact, volume can be less, volume can be accomplished desktop uses, and there is not the risk that refrigrant leakage causes fault, later stage working service work is simple, in addition the use of semiconductor cooler makes power consumption lower, be applicable to Long-Time Service.
As improvement, heater adopts electric-heating-wire-heating, and each heating wire is sequentially rack-mount from top to bottom, and level is to being parallel to each other, support is that after top is close to, bottom is close to being obliquely installed of baffle plate, and heating wire is in this experimental enviroment, and service life is longer, working stability is reliable, and support be obliquely installed not only compact conformation, and it is even to be more conducive to thermal field, and thermal field is evenly more conducive to carrying out homogeneous heating to air, in a word, above-mentioned measure is more conducive to the raising of the application's performance.
As improvement, the cold junction of semiconductor cooler is positioned at after test casing, the hot junction of semiconductor cooler is positioned at the position corresponding with going up cold junction installation position below, the chamber external body back side, like this, only need offer one for installing the installing hole of semiconductor cooler on test casing backboard, not only structure is simple, and is convenient to test box sealing, reduce because of install semiconductor cooler may cause inside and outside disclosure risk.
As improvement, the cold junction of semiconductor cooler and hot junction are equipped with heat exchange fin, case and fan, fan is arranged on the front of case, and the part that the two ends, left and right of case and case are used for provided with fan is the opening of ventilation, like this, wind sucks from the two ends, left and right of case, after fin heat exchange, discharge from fan, greatly can improve heat exchange efficiency and heat exchange uniformity, reduce energy consumption, meet refrigeration requirement.
As improvement, semiconductor cooler is two, and like this, two can take turns to operate, namely, during a job, another stops, or when a fault, another can also normally work, and final guarantee test case maintains isoperibol in long term test process, can not interrupt causing damage to user.
As improvement, two semiconductor coolers are set up in parallel up and down, the cold junction of two semiconductor coolers shares a case, the hot junction of two semiconductor coolers shares a case, like this, be set up in parallel heat exchange when two semiconductor coolers can be made to take turns to operate up and down still even, and heat exchange efficiency is high.
As improvement, humidifier comprises tank and is located at heating pole in tank, the heating part local of heating pole or all submerge in water, and like this, humidification efficiency is high, and humidification capability is strong.
As improvement, the bottom surface in test casing is provided with delivery port and guiding gutter, and like this, condensed water can be discharged in time, can not affect subjects.
As improvement, side in test casing is provided with lead wire outlet, one end that lead wire outlet is positioned at test casing is coated with the silica gel that cross scratches, the other end that lead wire outlet is positioned at chamber external is equipped with seal cover, and the silica gel that cross scratches has been that cross has broken, and object is convenient to object and is passed, opening can be reduced again, the structure of this claim be convenient to the application's chamber dispatch from the factory after user additionally increase the needs of sensor or other charging equipments, there is lead-in wire convenient, the advantage of good sealing effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model semiconductor refrigerating constant temperature humidity chamber.
Fig. 2 is the structural representation in the utility model semiconductor refrigerating constant temperature humidity chamber.
Fig. 3 is the structural representation after taking away baffle plate in the utility model semiconductor refrigerating constant temperature humidity chamber.
Fig. 4 is the structural representation at the outside back side of the utility model semiconductor refrigerating constant temperature humidity chamber.
Shown in figure, 1, test casing, 2, below, 3, baffle plate, 4, active cycle fan, 5, air inlet, 6, air outlet, 7, heating wire, 8, support, 9, the back side, 10, case, 11, fan, 12, tank, 13, heating pole, 14, delivery port, 15, guiding gutter, 16, lead wire outlet.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in further detail.
The utility model semiconductor refrigerating constant temperature humidity chamber, it comprises test casing 1, temperature-humidity sensor is located in test casing 1,2 baffle plate 3 is installed below in test casing 1, active cycle fan 4, heater, semiconductor cooler, humidifier are sequentially installed from top to bottom in interval between next 2 and baffle plate 3, on baffle plate 3, the position of corresponding active cycle fan 4 is provided with air inlet 5, and baffle plate 3 bottom is provided with air outlet 6; Active cycle fan 4, heater, semiconductor cooler, humidifier, temperature-humidity sensor are all electrically connected with control unit.
Heater adopts heating wire 7 to heat, and each heating wire 7 is sequentially arranged on support 8 from top to bottom, and level is to being parallel to each other, and support 8 is close to next 2 and bottom is close to being obliquely installed of baffle plate 3 in top.
The cold junction of semiconductor cooler is positioned at 2 of test casing 1 below, and the hot junction of semiconductor cooler is positioned at the test outside back side of casing 19 and the position that cold junction installation position is corresponding on 2 below.
The cold junction of semiconductor cooler and hot junction are equipped with heat exchange fin, case 10 and fan 11, and fan 11 is arranged on the front of case 10, and the two ends, left and right of case 10 and case 10 are the opening of ventilation for the part of provided with fan 11.
Semiconductor cooler is two.
Two semiconductor coolers are set up in parallel up and down, the cold junction of two semiconductor coolers shares a case 10, the hot junction of two semiconductor coolers shares a case 10, i.e. two cases 10, case 10 front of cold junction is provided with two fans 11, two fans about 11 are arranged side by side, and draw close to centre, and case 10 front in hot junction is provided with a fan 11 also between two parties.
Humidifier comprises tank 12 and is located at the heating pole 13 in tank 12, the heating part local of heating pole 13 or all submerge in water.
Bottom surface in test casing 1 is provided with delivery port 14 and guiding gutter 15.
Side in test casing 1 is provided with lead wire outlet 16, and one end that lead wire outlet 16 is positioned at test casing 1 is coated with the silica gel that cross scratches, and the other end that lead wire outlet 16 is positioned at outside test casing 1 is equipped with seal cover.
The temperature of the utility model semiconductor refrigerating constant temperature humidity chamber, humidity sensor is located in test casing 1, active cycle fan 4, heater, semiconductor cooler, humidifier, temperature, humidity sensor is all electrically connected with control unit, the electric control structure that the utility model semiconductor refrigerating constant temperature humidity chamber adopts is prior art, namely control unit comprises controller, driver, controller is the Hpc55 controller of Suntow (remarkable ability) and the control software design that carries thereof, Hpc55 controller control and drive system (such as contactor) controls active cycle fan 4, heater, semiconductor cooler, the Kai Heguan of humidifier, the control software design that also can adopt the controller of other companies of market and carry.
The control method of the utility model semiconductor refrigerating constant temperature humidity chamber adopts prior art, be generally, active cycle fan 4 operates all the time, work as temperature, when the temperature and humidity that humidity sensor records reaches requirement, then close refrigerator or heater, humidifier, when temperature is on the low side, then heater, when temperature drift, then close heater and open refrigerator, when humidity is on the low side, then open humidifier, the key that the utility model semiconductor refrigerating constant temperature humidity chamber can solve prior art problem is to adopt semiconductor cooler as refrigeration source, and miscellaneous part (baffle plate 3, active cycle fan 4, heater, humidifier, air inlet, air outlet) rational deployment, interval between next 2 and baffle plate 3 is as circulation air path, semiconductor cooler and described miscellaneous part is made to play the facilitation that cooperatively interacts, the application can be good at realizing the environment of constant temperature and humidity in chamber and efficient, the structure that prior art adopts compressor can be substituted completely.

Claims (9)

1. a semiconductor refrigerating constant temperature humidity chamber, it comprises test casing (1), temperature, humidity sensor is located in test casing (1), it is characterized in that, after in test casing (1), (2) are provided with baffle plate (3), in interval below between (2) and baffle plate (3), active cycle fan (4) is sequentially installed from top to bottom, heater, semiconductor cooler, humidifier, the position of the upper corresponding active cycle fan (4) of baffle plate (3) is provided with air inlet (5), baffle plate (3) bottom is provided with air outlet (6), active cycle fan (4), heater, semiconductor cooler, humidifier, temperature-humidity sensor are all electrically connected with control unit.
2. semiconductor refrigerating constant temperature humidity chamber according to claim 1, it is characterized in that, heater adopts heating wire (7) heating, each heating wire (7) is sequentially arranged on support (8) from top to bottom, and level is to being parallel to each other, after support (8) is close in top (2) and bottom is close to being obliquely installed of baffle plate (3).
3. semiconductor refrigerating constant temperature humidity chamber according to claim 1, it is characterized in that, the cold junction of semiconductor cooler is positioned at after test casing (1) (2), and the hot junction of semiconductor cooler is positioned at test casing (1) the outside back side (9) position that (2) upper cold junction installation position is corresponding with below.
4. semiconductor refrigerating constant temperature humidity chamber according to claim 3, it is characterized in that, the cold junction of semiconductor cooler and hot junction are equipped with heat exchange fin, case (10) and fan (11), fan (11) is arranged on the front of case (10), and the two ends, left and right of case (10) and case (10) are the opening of ventilation for the part of provided with fan (11).
5. semiconductor refrigerating constant temperature humidity chamber according to claim 4, is characterized in that, semiconductor cooler is two.
6. semiconductor refrigerating constant temperature humidity chamber according to claim 5, it is characterized in that, two semiconductor coolers are set up in parallel up and down, the cold junction of two semiconductor coolers shares a case (10), and the hot junction of two semiconductor coolers shares a case (10).
7. semiconductor refrigerating constant temperature humidity chamber according to claim 1, it is characterized in that, humidifier comprises tank (12) and is located at the heating pole (13) in tank (12), the heating part of heating pole (13) local or all submerge in water.
8. semiconductor refrigerating constant temperature humidity chamber according to claim 1, is characterized in that, the bottom surface in test casing (1) is provided with delivery port (14) and guiding gutter (15).
9. semiconductor refrigerating constant temperature humidity chamber according to claim 1, it is characterized in that, side in test casing (1) is provided with lead wire outlet (16), one end that lead wire outlet (16) is positioned at test casing (1) is coated with the silica gel that cross scratches, and lead wire outlet (16) is positioned at test casing (1) other end outward and seal cover is housed.
CN201420372683.9U 2014-07-04 2014-07-04 Semiconductor refrigerating constant temperature humidity chamber Expired - Fee Related CN204074094U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420372683.9U CN204074094U (en) 2014-07-04 2014-07-04 Semiconductor refrigerating constant temperature humidity chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420372683.9U CN204074094U (en) 2014-07-04 2014-07-04 Semiconductor refrigerating constant temperature humidity chamber

Publications (1)

Publication Number Publication Date
CN204074094U true CN204074094U (en) 2015-01-07

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105170055A (en) * 2015-07-31 2015-12-23 张家港江苏科技大学产业技术研究院 Biochemical reaction cabinet
CN105353809A (en) * 2015-12-11 2016-02-24 无锡职业技术学院 Semiconductor temperature and humidity control device
CN105403380A (en) * 2015-11-19 2016-03-16 深圳大学 Humidity test box for miniature optical fiber device
CN106238107A (en) * 2016-08-31 2016-12-21 杭州雪中炭恒温技术有限公司 The drain pan of temperature test chamber and preparation method and temperature test chamber

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105170055A (en) * 2015-07-31 2015-12-23 张家港江苏科技大学产业技术研究院 Biochemical reaction cabinet
CN105403380A (en) * 2015-11-19 2016-03-16 深圳大学 Humidity test box for miniature optical fiber device
CN105403380B (en) * 2015-11-19 2018-04-13 深圳大学 A kind of miniature fiber device humidity measurement case
CN105353809A (en) * 2015-12-11 2016-02-24 无锡职业技术学院 Semiconductor temperature and humidity control device
CN106238107A (en) * 2016-08-31 2016-12-21 杭州雪中炭恒温技术有限公司 The drain pan of temperature test chamber and preparation method and temperature test chamber

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C14 Grant of patent or utility model
GR01 Patent grant
EXPY Termination of patent right or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150107

Termination date: 20150704