CN204046939U - 具有电路板的电子单元 - Google Patents

具有电路板的电子单元 Download PDF

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Publication number
CN204046939U
CN204046939U CN201420438485.8U CN201420438485U CN204046939U CN 204046939 U CN204046939 U CN 204046939U CN 201420438485 U CN201420438485 U CN 201420438485U CN 204046939 U CN204046939 U CN 204046939U
Authority
CN
China
Prior art keywords
circuit board
packing element
electronic unit
unit according
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420438485.8U
Other languages
English (en)
Chinese (zh)
Inventor
阿明·施米德鲍尔
克里斯托夫·席科拉
托马斯·迈尔
约瑟夫·洛伊布尔
赫尔曼·约瑟夫·罗宾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Application granted granted Critical
Publication of CN204046939U publication Critical patent/CN204046939U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
CN201420438485.8U 2013-08-05 2014-08-05 具有电路板的电子单元 Active CN204046939U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013215368.6 2013-08-05
DE102013215368.6A DE102013215368A1 (de) 2013-08-05 2013-08-05 Elektronische Einheit mit Leiterplatte

Publications (1)

Publication Number Publication Date
CN204046939U true CN204046939U (zh) 2014-12-24

Family

ID=52247556

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420438485.8U Active CN204046939U (zh) 2013-08-05 2014-08-05 具有电路板的电子单元

Country Status (2)

Country Link
CN (1) CN204046939U (de)
DE (1) DE102013215368A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105338788A (zh) * 2015-10-30 2016-02-17 重庆帕特龙智通电子科技有限公司 大功率电子设备散热结构
CN107295741A (zh) * 2016-04-11 2017-10-24 Zf 腓德烈斯哈芬股份公司 带有esd保护装置的电子单元
CN108141975A (zh) * 2015-10-29 2018-06-08 罗伯特·博世有限公司 用于机动车的变速器控制装置的控制设备

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013223542A1 (de) 2013-11-19 2015-05-21 Zf Friedrichshafen Ag Elektronische Einheit mit Leiterplatte
DE102014201945A1 (de) 2014-02-04 2015-08-20 Zf Friedrichshafen Ag Elektronische Einheit mit Kurzschlussschutz, Steuergerät und Verfahren dazu
DE102015214311A1 (de) 2015-07-29 2017-02-02 Robert Bosch Gmbh Elektronikmodul mit über Sockelelement flexibel platzierbarem Bauelement und Verfahren zum Fertigen desselben
DE102017222014A1 (de) * 2017-12-06 2019-06-06 Zf Friedrichshafen Ag Elektronische Einheit mit Leiterplatte
JP2020004840A (ja) 2018-06-28 2020-01-09 アルパイン株式会社 電子ユニットおよびその製造方法
DE102018211105A1 (de) 2018-07-05 2020-01-09 Zf Friedrichshafen Ag Elektronikmodul für eine Getriebesteuereinheit und Getriebesteuereinheit
DE102018218783A1 (de) 2018-11-05 2020-05-07 Zf Friedrichshafen Ag Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung
DE102018219392A1 (de) 2018-11-14 2020-05-14 Zf Friedrichshafen Ag Elektronische Einheit mit Leiterplatte
DE102021203904B4 (de) 2021-04-20 2024-02-01 Vitesco Technologies Germany Gmbh Verfahren zum Verkapseln einer elektronischen Baugruppe
DE102021213703A1 (de) 2021-12-02 2023-06-07 Zf Friedrichshafen Ag Verfahren zur Herstellung einer Baugruppe

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013212265A1 (de) 2013-06-26 2014-12-31 Zf Friedrichshafen Ag Elektronische Einheit und Verfahren zur Herstellung einer elektronischen Einheit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108141975A (zh) * 2015-10-29 2018-06-08 罗伯特·博世有限公司 用于机动车的变速器控制装置的控制设备
US10925193B2 (en) 2015-10-29 2021-02-16 Robert Bosch Gmbh Control device for a gearbox control system of a motor vehicle
CN108141975B (zh) * 2015-10-29 2021-07-30 罗伯特·博世有限公司 用于机动车的变速器控制装置的控制设备
CN105338788A (zh) * 2015-10-30 2016-02-17 重庆帕特龙智通电子科技有限公司 大功率电子设备散热结构
CN105338788B (zh) * 2015-10-30 2018-06-26 重庆帕特龙智通电子科技有限公司 大功率电子设备散热结构
CN107295741A (zh) * 2016-04-11 2017-10-24 Zf 腓德烈斯哈芬股份公司 带有esd保护装置的电子单元
CN107295741B (zh) * 2016-04-11 2022-04-08 Zf 腓德烈斯哈芬股份公司 带有esd保护装置的电子单元

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Publication number Publication date
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