CN204046938U - A kind of pcb board and compression bonding apparatus - Google Patents
A kind of pcb board and compression bonding apparatus Download PDFInfo
- Publication number
- CN204046938U CN204046938U CN201420226313.4U CN201420226313U CN204046938U CN 204046938 U CN204046938 U CN 204046938U CN 201420226313 U CN201420226313 U CN 201420226313U CN 204046938 U CN204046938 U CN 204046938U
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- Prior art keywords
- pcb board
- crimping
- hole
- pin
- board body
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- Expired - Lifetime
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- 230000006835 compression Effects 0.000 title claims description 12
- 238000007906 compression Methods 0.000 title claims description 12
- 238000002788 crimping Methods 0.000 claims abstract description 123
- 210000002615 epidermis Anatomy 0.000 claims abstract description 11
- 230000000994 depressogenic effect Effects 0.000 claims description 29
- 239000010410 layer Substances 0.000 claims description 22
- 239000011229 interlayer Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 6
- 238000005868 electrolysis reaction Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
Abstract
The utility model discloses a kind of pcb board, comprise pcb board body 1, described pcb board body 1 is provided with crimping hole 11, the upper epidermis of described crimping hole 11 opening part adopts without porose disc structure, simultaneously can also according to the concrete condition of pcb board, neatly in conjunction with back drill technique, the antenna effect that crimping porose disc brings effectively can be reduced, the integrality of promotion signal.
Description
Technical field
The utility model relates to PCB technology, particularly a kind of pcb board.The utility model also relates to a kind of compression bonding apparatus simultaneously.
Background technology
Along with the raising of veneer speed, based on antenna effect, PCB (Printed Circuit Board, printed wiring board) plate crimping hole 11 redundance (hole wall, porose disc) impact of signal integrity is highlighted gradually, crimp hole longitudinal profile as shown in Figure 1, signal is delivered to (or being delivered to internal layer cabling 15 by crimping pin 21) on crimping pin 21 by internal layer cabling 15 via through holes, when crimping hole 11 and not carrying out special processing, the antenna effect of PCB is mainly derived from Stub (antenna)-1, Stub-2, Stub-3, Stub-4; And for the antenna effect that pcb board there will be, do not have corresponding settling mode in the prior art.
Utility model content
The utility model provides a kind of pcb board and compression bonding apparatus, is arranged in crimping hole without porose disc structure, can reduce pcb board crimping hole and crimp the antenna effect produced after device coordinates.
The utility model embodiment provides a kind of pcb board, comprises pcb board body 1, and described pcb board body 1 is provided with crimping hole 11, and the upper epidermis of described crimping hole 11 opening part adopts without porose disc structure.
In above-mentioned pcb board, the layer of described pcb board body 1 can be provided with non-depressed junction 14, and described non-depressed junction 14 adopts without porose disc structure.
In above-mentioned pcb board, the layer of described pcb board body 1 can be provided with non-depressed junction 14, and described non-depressed junction 14 adopts perforated tray structure.
In above-mentioned pcb board, described non-depressed junction 14 side can be provided with back drill hole 12.
The center in described back drill hole 12 is consistent with the center in described crimping hole 11.
In above-mentioned pcb board, described pcb board body 1 interlayer is also provided with internal layer cabling 15, and the degree of depth in described back drill hole 12 is less than on described pcb board body 1 from described non-depressed junction 14 to the length of described internal layer cabling 15.
The utility model embodiment also provides a kind of compression bonding apparatus, comprises crimping device 2 and above-mentioned pcb board body 1, wherein,
Described crimping device 2 is provided with crimping pin 21;
Described crimping pin 21 is pressed in the crimping hole 11 of described pcb board, achieves a fixed connection with described pcb board body 1 to make described crimping device 2.
Preferably, described crimping pin 21 adopts stress and deformation structure, and the Breadth Maximum of described crimping pin 21 core or diameter are greater than the aperture in described crimping hole 11;
Described crimping pin 21 is when being pressed into described crimping hole 11, and described crimping pin 21 stress and deformation also abuts on the hole wall in described crimping hole 11, is closely fixedly connected with the described hole 11 that crimps to realize described crimping pin 21.
The quantity in described crimping hole 11 has multiple; The quantity of described crimping pin 21 has multiple.
The quantity in described crimping hole 11 is identical with the quantity of described crimping pin 21, in each crimping pin 21 correspondence press-in crimping hole 11.
In the utility model embodiment, by the crimping hole in pcb board is arranged to without porose disc structure, make to crimp device 2 by crimping pin 21 and crimping hole 11 without porose disc and be directly connected on pcb board body 1, pcb board crimping hole can be reduced and crimp the antenna effect produced after device coordinates, the integrality of promotion signal.
Accompanying drawing explanation
Fig. 1 is the crimping hole longitudinal profile schematic diagram in prior art on pcb board;
Fig. 2 is the crimping hole longitudinal profile schematic diagram of technical scheme in the embodiment of the present application one;
Fig. 3 is the crimping hole longitudinal profile schematic diagram of technical scheme in the embodiment of the present application two;
Fig. 4 is the crimping hole longitudinal profile schematic diagram of technical scheme in the embodiment of the present application three;
Fig. 5 is the device structure schematic diagram in the embodiment of the present application;
Description of reference numerals:
1, pcb board body 2, crimping device
11, hole 12, back drill hole 13 electrolysis 14 non-depressed junction 15 internal layer cabling is crimped
16 electrolysis porose disc 17 crimpless face dishes
21, pin is crimped
Embodiment
The purpose of this utility model is to provide a kind of pcb board and compression bonding apparatus, effectively to eliminate the antenna effect that electrolysis porose disc brings.
In order to reach above technique effect, the utility model provides a kind of pcb board and compression bonding apparatus, wherein, crimping device 2 by crimping pin 21 and crimping hole 11 without porose disc and be fixedly connected with on pcb board body 1, the antenna effect that the porose disc effectively eliminating electrolysis brings.
In order to set forth technological thought of the present utility model further, now in conjunction with concrete application scenarios, the technical solution of the utility model is described.
As shown in Figure 2, a kind of pcb board that the utility model embodiment one provides, in this PCB, electrolysis and the non-depressed junction in crimping hole are all arranged to without porose disc structure, and the non-depressed junction in crimping hole has also carried out back drill process.Particularly, this PCB comprises pcb board body 1, and described pcb board body 1 is provided with crimping hole 11, and the upper epidermis of described crimping hole 11 opening part adopts without porose disc structure, and the electrolysis on this upper epidermis i.e. pcb board, for installing crimping device.The layer of described pcb board body 1 is also provided with non-depressed junction 14, and described non-depressed junction 14 adopts without porose disc structure.
The upper epidermis of described pcb board body 1 and layer adopt the structure without porose disc, achieve electrolysis and non-depressed junction atresia dish (electrolysis is in the upper epidermis of pcb board body 1), and the antenna effect of electrolysis of the prior art derives from Stub-4, the antenna effect of non-depressed junction derives from Stub-2, in the present embodiment, electrolysis and non-depressed junction all do not have porose disc structure, just there is not the antenna effect deriving from Stub-2 (crimpless face dish) and Stub-4 accordingly yet.
Non-depressed junction 14 side is also provided with back drill hole 12.The center in described back drill hole 12 is consistent with the center in described crimping hole 11.The aperture in described back drill hole 12 is greater than the aperture in described crimping hole 11.Described pcb board body 1 interlayer is also provided with internal layer cabling 15, and the degree of depth in described back drill hole 12 is less than on described pcb board body 1 from described non-depressed junction 14 to the length of described internal layer cabling 15.
Concrete, as in Fig. 2, optimization for back drill technological effect is considered, the axis at the place, center in back drill hole 12 will be in same straight line with the axis at the center crimping hole 11, in addition, need the aperture in back drill hole 12 larger than the aperture in crimping hole 11, so that the antenna effect that will derive from Stub-1 (i.e. hole wall) is eliminated; But in order to avoid destroying internal layer cabling, the degree of depth in back drill hole 12 can not exceed the length of non-depressed junction 14 to described internal layer cabling 15.
As shown in Figure 3, a kind of pcb board that the utility model embodiment two provides, in this PCB, the electrolysis in crimping hole is arranged to without porose disc structure, non-depressed junction is arranged to without porose disc structure, this PCB comprises pcb board body 1, and described pcb board body 1 is provided with crimping hole 11, and the upper epidermis of described crimping hole 11 opening part adopts without porose disc structure.
Adopt the structure without porose disc at the upper epidermis of crimping hole 11 opening part, achieve electrolysis without porose disc, thus eliminate the antenna effect deriving from Stub-4; Pcb board body 1 interlayer does not arrange internal layer cabling 15 in addition, and the propagation path of signal is that in this case, antenna effect derives from Stub-3 and Stub-4 (electrolysis porose disc) from layer to crimping pin 21; In addition, for the consideration of protection pcb board, the cabling of signal can not be destroyed, not need the technique adopting back drill.
As shown in Figure 4, the utility model embodiment three provides a kind of pcb board, in this PCB, electrolysis and the non-depressed junction in crimping hole are all arranged to without porose disc structure, and non-depressed junction does not adopt back drill, this PCB comprises pcb board body 1, and described pcb board body 1 is provided with crimping hole 11, and the upper epidermis of described crimping hole 11 opening part adopts without porose disc structure.The layer of described pcb board body 1 is provided with non-depressed junction 14, and non-depressed junction 14 adopts without porose disc structure.
Adopt the structure without porose disc at the upper epidermis of crimping hole 11 opening part, achieve electrolysis without porose disc, eliminate the antenna effect deriving from Stub-4; In addition, as shown in Figure 4, although its pcb board body 1 interlayer is provided with internal layer cabling 15, non-depressed junction 14 is too short to the length of described internal layer cabling 15, in this case, for the consideration of protection pcb board, can not adopt back drill technique; In its non-depressed junction 14, also adopt without porose disc structure, therefore, eliminate the antenna effect deriving from Stub-2.
As shown in Figure 5, the utility model embodiment also provides a kind of compression bonding apparatus, comprises crimping device 2, and the pcb board body 1 that above-mentioned any embodiment provides, wherein,
Described crimping device 2 is provided with crimping pin 21; Described crimping pin 21 is pressed in described crimping hole 11, achieves a fixed connection with described pcb board body 1 to make described crimping device 2.
Preferably, described crimping pin 21 adopts stress and deformation structure, and the Breadth Maximum of described crimping pin 21 core or diameter are greater than the aperture in described crimping hole 11; Described crimping pin 21 is when being pressed into described crimping hole 11, and described crimping pin 21 stress and deformation also abuts on the hole wall in described crimping hole 11, is closely fixedly connected with the described hole 11 that crimps to realize described crimping pin 21.
Crimping pin 21 core inserted in crimping hole 11 is oval shape, its maximum gauge is greater than the aperture in crimping hole 11, so, time at the beginning, crimping pin 21 can insert in crimping hole 11 smoothly, during follow-up further insertion, crimping pin 21 is stressed, and the elliptical section at its center divides generation deformation, closely sticks together with the hole wall crimping hole 11 with this, crimping pin 21 with crimp hole 11 and combines closely, thus make to crimp device 2 and pcb board body 1 can achieve a fixed connection.
The quantity in described crimping hole 11 has multiple; The quantity of described crimping pin 21 has multiple.
The quantity in described crimping hole 11 is identical with the quantity of described crimping pin 21, in each crimping pin 21 correspondence press-in crimping hole 11.
The quantity in crimping hole 11 not necessarily needs identical with the quantity of crimping pin 21, only needs each crimping pin 21 can corresponding press-in one crimping hole 11, therefore crimping hole 11 quantity can more than or equal the quantity of crimping pin.
In the utility model embodiment, by the crimping hole in pcb board is arranged to without porose disc structure, make to crimp device 2 by crimping pin 21 and crimping hole 11 without porose disc and be directly connected on pcb board body 1, pcb board crimping hole can be reduced and crimp the antenna effect produced after device coordinates, the integrality of promotion signal.
It will be appreciated by those skilled in the art that accompanying drawing is a schematic diagram preferably implementing scene, the module in accompanying drawing or flow process might not be that enforcement the utility model is necessary.
Above-mentioned the utility model sequence number, just to describing, does not represent the quality implementing scene.
Be only several concrete enforcement scene of the present utility model above, but the utility model is not limited thereto, the changes that any person skilled in the art can think of all should fall into protection range of the present utility model.
Claims (10)
1. a pcb board, is characterized in that, comprises pcb board body (1), and described pcb board body (1) is provided with crimping hole (11), and the upper epidermis of described crimping hole (11) opening part adopts without porose disc structure.
2. pcb board as claimed in claim 1, it is characterized in that, the layer of described pcb board body (1) is provided with non-depressed junction (14), and described non-depressed junction (14) adopts without porose disc structure.
3. pcb board as claimed in claim 1, it is characterized in that, the layer of described pcb board body (1) is provided with non-depressed junction (14), and described non-depressed junction (14) adopts perforated tray structure.
4. pcb board as claimed in claim 2 or claim 3, it is characterized in that, described non-depressed junction (14) side is provided with back drill hole (12).
5. pcb board as claimed in claim 4, it is characterized in that, the center of described back drill hole (12) is consistent with the center of described crimping hole (11).
6. pcb board as claimed in claim 4, it is characterized in that, described pcb board body (1) interlayer is also provided with internal layer cabling (15), and the degree of depth of described back drill hole (12) is less than on described pcb board body (1) from described non-depressed junction (14) to the length of described internal layer cabling (15).
7. a compression bonding apparatus, is characterized in that, comprises crimping device (2) and the pcb board described in any one of claim 1-6, wherein,
Described crimping device (2) is provided with crimping pin (21);
Described crimping pin (21) is pressed in the crimping hole (11) of described pcb board, achieves a fixed connection to make described crimping device (2) and described pcb board body (1).
8. compression bonding apparatus as claimed in claim 7, it is characterized in that, described crimping pin (21) adopts stress and deformation structure, and the Breadth Maximum of described crimping pin (21) core or diameter are greater than the aperture of described crimping hole (11);
Described crimping pin (21) is when being pressed into described crimping hole (11), described crimping pin (21) stress and deformation also abuts on the hole wall of described crimping hole (11), is closely fixedly connected with the described hole (11) that crimps to realize described crimping pin (21).
9. compression bonding apparatus as claimed in claim 7 or 8, is characterized in that,
The quantity of described crimping hole (11) has multiple;
The quantity of described crimping pin (21) has multiple.
10. compression bonding apparatus as claimed in claim 9, it is characterized in that, the quantity of described crimping hole (11) is identical with the quantity of described crimping pin (21), in each crimping pin (21) correspondence press-in crimping hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420226313.4U CN204046938U (en) | 2014-05-05 | 2014-05-05 | A kind of pcb board and compression bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420226313.4U CN204046938U (en) | 2014-05-05 | 2014-05-05 | A kind of pcb board and compression bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204046938U true CN204046938U (en) | 2014-12-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420226313.4U Expired - Lifetime CN204046938U (en) | 2014-05-05 | 2014-05-05 | A kind of pcb board and compression bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204046938U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979922A (en) * | 2017-11-21 | 2018-05-01 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB for being suitable for crimping device |
| CN111372376A (en) * | 2020-02-28 | 2020-07-03 | 苏州浪潮智能科技有限公司 | Signal interference prevention PCBA and PCB signal interference prevention processing technology |
-
2014
- 2014-05-05 CN CN201420226313.4U patent/CN204046938U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979922A (en) * | 2017-11-21 | 2018-05-01 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB for being suitable for crimping device |
| CN111372376A (en) * | 2020-02-28 | 2020-07-03 | 苏州浪潮智能科技有限公司 | Signal interference prevention PCBA and PCB signal interference prevention processing technology |
| CN111372376B (en) * | 2020-02-28 | 2021-06-29 | 苏州浪潮智能科技有限公司 | Signal interference prevention PCBA and PCB signal interference prevention processing technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Patentee after: Xinhua three Technology Co., Ltd. Address before: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Patentee before: Huasan Communication Technology Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |