CN204045562U - A kind of lead frame pick-and-place mechanism for semiconductor packaging device - Google Patents
A kind of lead frame pick-and-place mechanism for semiconductor packaging device Download PDFInfo
- Publication number
- CN204045562U CN204045562U CN201420539924.4U CN201420539924U CN204045562U CN 204045562 U CN204045562 U CN 204045562U CN 201420539924 U CN201420539924 U CN 201420539924U CN 204045562 U CN204045562 U CN 204045562U
- Authority
- CN
- China
- Prior art keywords
- movable plate
- lead frame
- guide
- base
- pick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manipulator (AREA)
Abstract
The utility model discloses a kind of lead frame pick-and-place mechanism for semiconductor packaging device, comprise base, described base is provided with pick and place unit and latch segment, described pick and place unit comprises guide vane end stop, line slideway, guide rail slide block, linear bearing, cylinder holder, first movable plate, second movable plate, gripper, cushion block, pneumatic chuck, discharging guide plate, pad and the axis of guide, after have employed this structure, because pneumatic chuck can make the first movable plate and the second movable plate be synchronized with the movement, prevent from manipulator to be linked with lead frame to cause putting partially, when needs put into mould lead frame, pick-and-place mechanism makes lead frame end face and die face be affixed near mould, utilize spring force, discharging guide plate accurately will be pressed in mould pilot pin lead frame under the effect of spring force, therefore, it is possible to accurately lead frame is put into mould positioning pinholes, prevent lead frame from damaging, stable, ensure that the safety of production, improve operating efficiency.
Description
Technical field
The present invention relates to a kind of lead frame pick-and-place mechanism for semiconductor packaging device.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material, form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.In prior art, in order to enhance productivity, lead frame adopts automatic production line to encapsulate, automatic production line comprises the equipment such as pre-heating station, press, lead frame pick-and-place mechanism, device for discharging, what wherein lead frame pick-and-place mechanism adopted is feeding manipulator, when feeding manipulator puts into mould lead frame, adopt be air-drop mode and lead frame freely falling body fall to mould profile, adopt in this way sometimes lead frame put and partially fail to enter mould positioning pinholes, can damage of product be caused.And during feeding manipulator motion, lead frame may be made to put local derviation cause damage of product because manipulator is linked with lead frame.
Summary of the invention
The object of the invention is to solve lead frame pick-and-place mechanism of the prior art easily to put partially, the problem making lead frame fail to enter mould positioning pinholes to cause damage of product, the present invention provides a kind of safe, efficient, stable lead frame pick-and-place mechanism.
The technical solution used in the present invention is: a kind of lead frame pick-and-place mechanism for semiconductor packaging device, comprise base, described base is provided with pick and place unit and latch segment, described pick and place unit comprises guide vane end stop, line slideway, guide rail slide block, linear bearing, cylinder holder, first movable plate, second movable plate, gripper, cushion block, pneumatic chuck, discharging guide plate, pad and the axis of guide, described line slideway has 2, be fixed on both sides, base length direction to be respectively symmetric, each line slideway is all connected with 2 guide rail slide blocks, 2 guide rail slide blocks are positioned at line slideway length direction both sides and are symmetric, described first movable plate, the two ends of the second movable plate are connected with the guide rail slide block on the line slideway of both sides respectively, the first movable plate is made to be parallel to the second movable plate, the two ends of described guide vane end stop are connected with the first movable plate and the second movable plate respectively, described first movable plate and the second movable plate are equipped with cushion block, the both sides of described pneumatic chuck are connected by cushion block and the first movable plate and the second movable plate, described cylinder fixed seating is on pneumatic chuck, linear bearing is fixed on the base between the first movable plate and the second movable plate, the described axis of guide is movably connected on linear bearing, pad is positioned at one end of the axis of guide, described discharging guide plate to be positioned at below base and to be connected with the axis of guide, when the axis of guide is moved, discharging guide plate can move at vertical direction, spring is provided with between described discharging guide plate and base, described latch segment is fixed on the base lower surface outside the region that surrounds between the first movable plate and the second movable plate, described first movable plate and the second movable plate are all connected with gripper, described base is provided with several through holes, one end of described gripper is positioned at by the discharging guide plate below base through through hole, when spring is in initial condition and described first movable plate and the second movable plate to medial movement in opposite directions each other time, the end of gripper is stuck on discharging guide plate.
As further improvement of the utility model, described guide vane end stop and linear bearing be equipped with 2, lay respectively at both sides, base length direction is symmetric, and each linear bearing is equipped with pad and the axis of guide; Described first movable plate and the second movable plate are respectively evenly equipped with 5 grippers; Described latch segment have 4, wherein 2 be positioned at base length direction be symmetric, other 2 be positioned at base Width and be symmetric.
As a further improvement on the present invention, described pick and place unit has 2, and the both sides laying respectively at base Width center line are symmetric.
The invention has the beneficial effects as follows: after have employed this structure, because pneumatic chuck can make the first movable plate and the second movable plate be synchronized with the movement, prevent from manipulator to be linked with lead frame to cause putting partially, when needs put into mould lead frame, pick-and-place mechanism makes lead frame end face and die face be affixed near mould, utilize spring force, discharging guide plate accurately will be pressed in mould pilot pin lead frame under the effect of spring force, therefore, it is possible to accurately lead frame is put into mould positioning pinholes, prevent lead frame from damaging, stable, ensure that the safety of production, improve operating efficiency.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is schematic perspective view.
Shown in figure: 1 base, 2 guide vane end stops, 3 latch segments, 4 line slideways, 5 guide rail slide blocks, 6 linear bearings, 7 cylinder holders, 8 first movable plates, 9 second movable plates, 10 grippers, 11 cushion blocks, 12 pneumatic chucks, 13 discharging guide plates, 14 pads, 15 axis of guides.
Embodiment
Below in conjunction with Fig. 1,2,3, the present invention is described further.
As Fig. 1, 2, shown in 3, a kind of lead frame pick-and-place mechanism for semiconductor packaging device, it is characterized in that comprising base 1, described base is provided with pick and place unit and latch segment 3, described pick and place unit has 2, the both sides laying respectively at base 1 Width center line are symmetric, described pick and place unit comprises guide vane end stop 2, line slideway 4, guide rail slide block 5, linear bearing 6, cylinder holder 7, first movable plate 8, second movable plate 9, gripper 10, cushion block 11, pneumatic chuck 12, discharging guide plate 13, pad 14 and the axis of guide 15, described line slideway 4 has 2, be fixed on base 1 length direction both sides to be respectively symmetric, each line slideway 4 is connected with 2 guide rail slide blocks 5, 2 guide rail slide blocks 5 are positioned at line slideway 4 length direction both sides and are symmetric, described first movable plate 8, the two ends of the second movable plate 9 are connected with the guide rail slide block 5 on both sides line slideway 4 respectively, the first movable plate 8 is made to be parallel to the second movable plate 9, the two ends of described guide vane end stop 2 are connected with the first movable plate 8 and the second movable plate 9 respectively, described first movable plate 8 and the second movable plate 9 are equipped with cushion block 11, the both sides of described pneumatic chuck 12 are connected by cushion block 11 and the first movable plate 8 and the second movable plate 9, described cylinder holder 7 is positioned on pneumatic chuck 12, linear bearing 6 is fixed on the base 1 between the first movable plate 8 and the second movable plate 9, the described axis of guide 15 is movably connected on linear bearing 6, pad 14 is positioned at one end of the axis of guide 15, described discharging guide plate 13 to be positioned at below base 1 and to be connected with the axis of guide 15, when the axis of guide 15 is moved, discharging guide plate 13 can move at vertical direction, spring is provided with between described discharging guide plate 13 and base 1, described latch segment 3 is fixed on base 1 lower surface outside the region that surrounds between the first movable plate 8 and the second movable plate 9, described first movable plate 8 and the second movable plate 9 are all connected with gripper 10, described base 1 is provided with several through holes, the discharging guide plate 13 that one end of described gripper 10 is positioned at below base 1 through through hole is other, when spring is in initial condition and described first movable plate 8 and the second movable plate 9 to medial movement in opposite directions each other time, the end of gripper 10 is stuck on discharging guide plate 13, described guide vane end stop 2 and linear bearing 6 are equipped with 2, lay respectively at base 1 length direction both sides to be symmetric, each linear bearing 6 is equipped with the axis of guide 15 and pad 14, described first movable plate 8 and the second movable plate 9 are respectively evenly equipped with 5 grippers 10, described latch segment 3 have 4, wherein 2 be positioned at base 1 length direction be symmetric, other 2 be positioned at base 1 Width and be symmetric.
In the present invention, latch segment 3 is for realizing location, and pneumatic chuck 12 adopts tracheae to connect with source of the gas, tracheae solenoid.Guide vane end stop 2 plays position-limiting action, avoids lead frame both sides to be out of shape under the effect of gripper 10.
The present invention substitutes existing equipment with this lead frame pick-and-place mechanism before using.
When the present invention uses:
When lead frame pick-and-place mechanism enters into pre-heating station, lead frame pick-and-place mechanism drops to grabs lead frame station, latch segment 3 enters in pre-heating station location notch and realizes location, control pneumatic chuck 12 and drive the first movable plate 8 and the second movable plate 9 synchronously to direction motion away from each other by cushion block 11, discharging guide plate 13 is left in the end of gripper 10, lead frame pick-and-place mechanism continues to decline and makes discharging guide plate 13 flatten lead frame on pre-heating station, spring contraction while flattening, after spring contraction, control pneumatic chuck 12 and drive the first movable plate 8 and the second movable plate 9 synchronously to medial motion toward each other by cushion block 11, then lead frame pick-and-place mechanism rises, thus the gripper 10 realized on the first movable plate 8 and the second movable plate 9 captures the lead frame on pre-heating station.
When lead frame pick-and-place mechanism enters into mould, lead frame pick-and-place mechanism drops to puts lead frame station, latch segment 3 enters in mould location notch and realizes location, lead frame end face and die face are affixed, then controlling pneumatic chuck 12 drives the first movable plate 8 and the second movable plate 9 synchronously to move to both sides by cushion block 11, now discharging guide plate 13 is left in the end of gripper 10, make discharging guide plate 13 downward voltage lead wires framework under the action of the spring, lead frame is accurately pressed in mould pilot pin.
In embodiment, described pick and place unit has 2, and guide vane end stop 2 and linear bearing 6 be equipped with 2, lay respectively at base 1 length direction both sides is symmetric, and each linear bearing 6 is equipped with the axis of guide 15 and pad 14; Described first movable plate 8 and the second movable plate 9 are respectively evenly equipped with 5 grippers 10; Described latch segment 3 have 4, wherein 2 be positioned at base 1 length direction be symmetric, other 2 be positioned at base 1 Width and be symmetric.Can accurate positioning be ensured like this, more stable when equipment runs, improve operating efficiency.
In sum, after have employed this structure, because pneumatic chuck can make the first movable plate and the second movable plate be synchronized with the movement, prevent from manipulator to be linked with lead frame to cause putting partially, when needs put into mould lead frame, pick-and-place mechanism makes lead frame end face and die face be affixed near mould, utilize spring force, discharging guide plate accurately will be pressed in mould pilot pin lead frame under the effect of spring force, therefore, it is possible to accurately lead frame is put into mould positioning pinholes, prevent lead frame from damaging, stable, ensure that the safety of production, improve operating efficiency.
Those skilled in the art should know; protection scheme of the present invention is not limited only to the above embodiments; various permutation and combination and conversion can also be carried out on the basis of above-described embodiment; under the prerequisite without prejudice to spirit of the present invention, the various conversion that the present invention carries out all are dropped in protection scope of the present invention.
Claims (3)
1. the lead frame pick-and-place mechanism for semiconductor packaging device, it is characterized in that comprising base (1), described base is provided with pick and place unit and latch segment (3), described pick and place unit comprises guide vane end stop (2), line slideway (4), guide rail slide block (5), linear bearing (6), cylinder holder (7), first movable plate (8), second movable plate (9), gripper (10), cushion block (11), pneumatic chuck (12), discharging guide plate (13), pad (14) and the axis of guide (15), described line slideway (4) has 2, be fixed on base (1) length direction both sides to be respectively symmetric, each line slideway (4) is connected with 2 guide rail slide blocks (5), 2 guide rail slide blocks (5) are positioned at line slideway (4) length direction both sides and are symmetric, described first movable plate (8), the two ends of the second movable plate (9) are connected with the guide rail slide block (5) on both sides line slideway (4) respectively, the first movable plate (8) is made to be parallel to the second movable plate (9), the two ends of described guide vane end stop (2) are connected with the first movable plate (8) and the second movable plate (9) respectively, described first movable plate (8) and the second movable plate (9) are equipped with cushion block (11), the both sides of described pneumatic chuck (12) are connected by cushion block (11) and the first movable plate (8) and the second movable plate (9), described cylinder holder (7) is positioned on pneumatic chuck (12), linear bearing (6) is fixed on the base (1) between the first movable plate (8) and the second movable plate (9), the described axis of guide (15) is movably connected on linear bearing (6), pad (14) is positioned at one end of the axis of guide (15), described discharging guide plate (13) is positioned at base (1) below and is connected with the axis of guide (15), when the axis of guide (15) is moved, discharging guide plate (13) can be moved at vertical direction, spring is provided with between described discharging guide plate (13) and base (1), described latch segment (3) is fixed on base (1) lower surface outside the region that surrounds between the first movable plate (8) and the second movable plate (9), described first movable plate (8) and the second movable plate (9) are all connected with gripper (10), described base (1) is provided with several through holes, the discharging guide plate (13) that one end of described gripper (10) is positioned at base (1) below through through hole is other, when spring is in initial condition and described first movable plate (8) and the second movable plate (9) to medial movement in opposite directions each other time, the end of gripper (10) is stuck on discharging guide plate (13).
2. a kind of lead frame pick-and-place mechanism for semiconductor packaging device according to claim 1, it is characterized in that described guide vane end stop (2) and linear bearing (6) are equipped with 2, (1) length direction both sides are symmetric to lay respectively at base, each linear bearing (6) is equipped with the axis of guide (15) and pad (14); Described first movable plate (8) and the second movable plate (9) are respectively evenly equipped with 5 grippers (10); Described latch segment (3) have 4, wherein 2 be positioned at base (1) length direction be symmetric, other 2 be positioned at base (1) Width and be symmetric.
3. a kind of lead frame pick-and-place mechanism for semiconductor packaging device according to claim 1 and 2, it is characterized in that described pick and place unit has 2, the both sides laying respectively at base (1) Width center line are symmetric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420539924.4U CN204045562U (en) | 2014-09-19 | 2014-09-19 | A kind of lead frame pick-and-place mechanism for semiconductor packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420539924.4U CN204045562U (en) | 2014-09-19 | 2014-09-19 | A kind of lead frame pick-and-place mechanism for semiconductor packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204045562U true CN204045562U (en) | 2014-12-24 |
Family
ID=52246200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420539924.4U Expired - Fee Related CN204045562U (en) | 2014-09-19 | 2014-09-19 | A kind of lead frame pick-and-place mechanism for semiconductor packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204045562U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109698150A (en) * | 2018-12-29 | 2019-04-30 | 铜陵富仕三佳机器有限公司 | A kind of band clamping device for full-automatic semiconductor packaging device |
| CN111244002A (en) * | 2020-03-25 | 2020-06-05 | 铜陵富仕三佳机器有限公司 | A novel manipulator that snatchs for IC chip encapsulation |
| CN114953267A (en) * | 2022-06-08 | 2022-08-30 | 苏州博宇科技有限公司 | Five metals gasket embedding device |
-
2014
- 2014-09-19 CN CN201420539924.4U patent/CN204045562U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109698150A (en) * | 2018-12-29 | 2019-04-30 | 铜陵富仕三佳机器有限公司 | A kind of band clamping device for full-automatic semiconductor packaging device |
| CN111244002A (en) * | 2020-03-25 | 2020-06-05 | 铜陵富仕三佳机器有限公司 | A novel manipulator that snatchs for IC chip encapsulation |
| CN111244002B (en) * | 2020-03-25 | 2022-07-29 | 铜陵富仕三佳机器有限公司 | Grabbing manipulator for packaging IC chip |
| CN114953267A (en) * | 2022-06-08 | 2022-08-30 | 苏州博宇科技有限公司 | Five metals gasket embedding device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2023060966A9 (en) | Automatic pin inserting apparatus having carrier | |
| CN204045562U (en) | A kind of lead frame pick-and-place mechanism for semiconductor packaging device | |
| CN103569637B (en) | Commutator automatic tray filler | |
| CN103258939A (en) | Novel LED module encapsulation automation complete equipment | |
| CN204045550U (en) | A kind of full-automatic package system | |
| CN216085670U (en) | Automatic pin inserting equipment for carrier | |
| CN216413042U (en) | High-power chip plastic package device | |
| CN104308895A (en) | Automatic punching device of vehicle door outer pressing bar | |
| CN105818406B (en) | The automatic machine-shaping device of carrying belt | |
| CN106449962B (en) | Automate packaging production line | |
| CN203679405U (en) | Automatic cutting machine | |
| CN107838590B (en) | Material taking device for line pressing terminal for photovoltaic junction box | |
| CN205996965U (en) | A kind of two shaft mechanical arms for accumulator transfer | |
| CN214236990U (en) | Electric operating mechanism's intermediate lamella and divide-shut brake sign assembly quality | |
| CN205057240U (en) | Go up tin machine cable conveying mechanism | |
| CN208555763U (en) | Sheet material multi-process punching machine punching press automatic conveying device | |
| CN204195884U (en) | A kind of car door outside casing automatic cutting device | |
| CN209913212U (en) | Automatic terminal pressing device | |
| CN208288733U (en) | A kind of Switch of working position device of tubing folding brake | |
| CN102509755A (en) | Led lamp strip processing equipment | |
| CN112775647A (en) | Electric operating mechanism's intermediate lamella and divide-shut brake sign assembly quality | |
| CN204376171U (en) | A kind of Full-automatic crimping machine clamp presses integral mechanism with heavy | |
| CN205415950U (en) | Pressure head and framed brake assembly | |
| CN203674187U (en) | Lead wire frame lifting mechanism | |
| CN211236204U (en) | Intelligent magnetic force detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20180919 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |