CN204043639U - The accurate thickness detection apparatus of ultrasound wave equivalent peak - Google Patents
The accurate thickness detection apparatus of ultrasound wave equivalent peak Download PDFInfo
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- CN204043639U CN204043639U CN201420319774.6U CN201420319774U CN204043639U CN 204043639 U CN204043639 U CN 204043639U CN 201420319774 U CN201420319774 U CN 201420319774U CN 204043639 U CN204043639 U CN 204043639U
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Abstract
The utility model discloses the accurate thickness detection apparatus of a kind of ultrasound wave equivalent peak, comprise ultrasonic probe, described ultrasonic probe is connected with comparer, and described comparer is connected with timer, and described timer is connected with main control chip; Advantage is 1, thickness measuring precision improves, and error is reduced to below 0.001mm; 2, interelement impact by degree of coupling diminishes, and Measurement sensibility improves; 3, phase error is essentially eliminated; 4, easier miniaturization, timing chip area occupied is approximately 1/10 of original timing circuit; 5, the difference of testee material does not produce any impact to thickness measure; 6, can there is impact to hyperacoustic propagation in the pressing dynamics of ultrasonic probe and temperature, can control within 0.02mm by this method precision.
Description
Technical field
The utility model relates to a kind of thickness detection apparatus, particularly relates to a kind of device utilizing ultrasound wave equivalent peak to carry out accurate Thickness sensitivity.
Background technology
The principle of ultrasonic measurement thickness is similar to light wave measurement principle.The ultrasonic pulse that probe is launched arrives testee and propagates in object, probe is reflected back toward when arriving material interface, the time of propagating in the material by accurately measuring ultrasound wave determines the thickness of testee, measure formula is S=v*t/2, wherein S is the thickness of testee, v is the velocity of propagation of ultrasound wave in described testee material, and t is the travel-time of ultrasound wave in described testee material.
The starting point of ultrasonic propagation time is relevant to pulse launch time, and the detection of end time has two kinds of modes:
1, it is hyperacoustic arrival mark that the piezoelectric effect caused with ultrasonic echo exceedes some threshold values.
2, the mark that peak value arrives as echo is reached using the piezoelectric effect of ultrasonic echo first time.
Wherein, front one is called leading edge detection, and rear one is called peakvalue's checking.The advantage of leading edge detection is that circuit easily realizes, and cost is lower, as long as just can detect with the comparer that response time is shorter, its shortcoming is also apparent, easily has larger phase error when measurement thin pieces.And peakvalue's checking can eliminate this phase error, but peakvalue's checking generally all needs to use data acquisition unit (A/D conversion chip) at a high speed and the higher microprocessor of processing speed to realize, and this can increase the cost of instrument and the volume of instrument greatly.
When calculating testee thickness, the time of arrival of ultrasonic echo can be measured, and a setting threshold value, as the reference point of ultrasonic echo time of arrival, generally, threshold value is a fixed value, can not change in test process, but amplitude of ultrasonic is the gain with amplifying circuit, pops one's head in relevant to the degree that test block is coupled, that is, in repetitive measurement, hyperacoustic amplitude cannot be consistent.The change of amplitude can cause the skew of crossover point, amplitude to strengthen then crossover point reach, and amplitude weakens, and moves after crossover point, and in extreme circumstances, this skew is maximum can reach hyperacoustic 1/4 cycle.Calculate for 5920m/s with the velocity of sound in steel, suppose that the natural frequency of the ultrasonic probe adopted is 5MHz, then phase deviation can reach 5920/5000/2*0.25=0.148mm, and this is can not be received in thin objects is measured.
For peak value measurement, if sampling rate is enough high, instrument can collect very close to the time point of peak value.Suppose that sampling rate is 16 times of frequency, then the quantization error of peak value moment is approximately 5920/5000/2/16, is about 0.03mm, substantially can reach the requirement of accurate thickness measuring.But in this case, the sampling rate of needs is approximately 5M*16=80MSPS.Therefore the instrument cost of supersonic thickness meter can be made like this to increase considerably, and this is difficult to be accepted on cost.Therefore need one and can reduce phase error, little amplitude increases the method for cost again.
Utility model content
Technical problem to be solved in the utility model be to provide a kind of error little, be convenient to realize and the low accurate thickness detection apparatus of ultrasound wave equivalent peak of cost.
For solving the problems of the technologies described above, the technical solution of the utility model is: the accurate thickness detection apparatus of ultrasound wave equivalent peak, comprises ultrasonic probe, and described ultrasonic probe is connected with comparer, described comparer is connected with timer, and described timer is connected with main control chip.
As preferred technical scheme, described comparer comprises the integrated comparator chip A with eight pins, the 1# pin of described integrated comparator chip A is connected with supply voltage VDD_R, 1# pin is also connected with amplifier capacitance protection circuit, the 2# pin of described comparer integrated comparator chip A is by electric capacity C17 ground connection, resistance R16 is connected with between the 1# pin of described comparer integrated comparator chip A and 2# pin, the negative pole of described resistance R16 passes through the sliding contact ground connection of slide rheostat RP1, the negative pole of described slide rheostat RP1 is unsettled, the dividing potential drop that described R16 and described slide rheostat RP1 is formed is as the 3# pin of voltage reference input comparator integrated comparator chip A, described supply voltage VDD_R is also serially connected with resistance R15 and resistance R17, described resistance R15 is identical with the resistance of described resistance R17, the negative pole of described resistance R17 is connected with the sliding contact of described slide rheostat RP1, and ground connection, described in integrated comparator integrated chip comparer integrated chip comparer chip, the 5# pin of integrated comparator chip A is connected to the negative pole of described electric capacity C17 by resistance R18, the 7# pin of described integrated comparator chip A is the signal output part of described comparer, the 8# pin of described integrated comparator chip A is unsettled.
As preferred technical scheme, described supply voltage VDD_R is+5V burning voltage.
As preferred technical scheme, described amplifier capacitance protection circuit comprises the electric capacity C15 be connected on described integrated comparator chip A1# pin, the minus earth of described electric capacity C15, and described electric capacity C15 two ends are also parallel with electrochemical capacitor C13.
As preferred technical scheme, described timer comprises the timing chip TDC-GP21 with 32 pins, the 1# pin of described timing chip TDC-GP21 is connected to the 3# pin of active crystal oscillator X1, the 1# pin of described active crystal oscillator X1 is unsettled, the 2# pin ground connection of described active crystal oscillator X1, the 4# pin of described active crystal oscillator X1 is connected with+3.3V power supply, the 3# pin of described timing chip TDC-GP21 is also connected with+3.3V power supply, the 4# pin of described timing chip TDC-GP21 is connected to the 3# pin of described timing chip TDC-GP21 by electric capacity C40, the 4# pin of described timing chip TDC-GP21 and 7# pin be direct ground connection also, the 14# pin of described timing chip TDC-GP21 is connected with+3.3V power supply, the 14# pin of described timing chip TDC-GP21 is also by electric capacity C47 ground connection simultaneously, the 15# pin of described timing chip TDC-GP21 is by resistance R44 and electric capacity C48 ground connection, the 16# pin of described timing chip TDC-GP21 is by electric capacity C45 ground connection, passive crystal oscillator X2 is connected with between the positive pole of described electric capacity C48 and the positive pole of described electric capacity C45, the 21# pin ground connection of described timing chip TDC-GP21, the 22# pin of described timing chip TDC-GP21 is connected to+3.3V power supply, electric capacity C34 is connected with between the 21# pin of described timing chip TDC-GP21 and the 22# pin of described timing chip TDC-GP21, the 25# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R36, the 26# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R35, the 27# pin of described timing chip TDC-GP21 is by resistance R33 ground connection, the direct ground connection of 28# pin of described timing chip TDC-GP21, the 29# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply, the 29# pin of described timing chip TDC-GP21 is also connected with timing chip protection circuit, the 30# pin of described timing chip TDC-GP21 is connected with described integrated comparator chip A7# pin, the 32# pin of described timing chip TDC-GP21 is connected with described main control chip, the 32# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R31, the 2# pin of described timing chip TDC-GP21, 5# pin, 6# pin, 17# pin, 18# pin, 19# pin, 20# pin, 23# pin and 24# pin are distinguished unsettled.
As preferred technical scheme, described timing chip protection circuit comprises the electric capacity C31 on the 29# pin being connected to described timing chip TDC-GP21, the minus earth of described electric capacity C31, and described electric capacity C31 two ends are also parallel with electrochemical capacitor C10.
As preferred technical scheme, described main control chip comprises the chip MSP430F149 with 64 pins, the 1# pin of described chip MSP430F149 and 64# pin are connected with chip protection circuit, passive crystal oscillator X3 is connected with between the 8# pin of described chip MSP430F149 and 9# pin, the 44# pin of described chip MSP430F149 is connected with the 13# pin of described timing chip TDC-GP21, the 45# pin of described chip MSP430F149 is connected with the 12# pin of described timing chip TDC-GP21, the 46# pin of described chip MSP430F149 is connected with the 11# pin of described timing chip TDC-GP21, the 47# pin of described chip MSP430F149 is connected with the 10# pin of described timing chip TDC-GP21, the 48# pin of described chip MSP430F149 is connected with the 9# pin of described timing chip TDC-GP21, the 49# pin of described chip MSP430F149 is connected with the 8# pin of described timing chip TDC-GP21, the 50# pin of described chip MSP430F149 is connected with the 31# pin of described timing chip TDC-GP21, the 58# pin of described chip MSP430F149 is by electric capacity C49 ground connection, the 62# pin of described chip MSP430F149 and 63# pin ground connection respectively, all the other pins of described chip MSP430F149 are unsettled.
As preferred technical scheme; described chip protection circuit comprise be connected to described chip MSP430F149 1# pin and 64# pin on electric capacity C51; the minus earth of described electric capacity C51, described electric capacity C51 two ends are also parallel with electric capacity C50, and the positive pole of described electric capacity C50 connects+3.3V power supply.
Owing to have employed technique scheme, the beneficial effects of the utility model are:
1, thickness measuring precision improves a lot, because adopt timing chip TDC-GP21, belong to high-precision timing chip, make quantization error be reduced to below 0.001mm, quantization error of the prior art is generally about 0.074mm.
2, because interelement to affect by degree of coupling diminishes, therefore Measurement sensibility improves.
3, essentially eliminate phase error, by the phase error of 0.148mm in prior art, be substantially reduced to almost nil.
4, easier miniaturization.The timing circuit of prior art approximately needs the circuit of 3 ~ 4 SO encapsulation, and timing chip area occupied is approximately 1/10 of original timing circuit.
5, the material due to detected member is different, and the degree of its ultrasonic attenuation is also different, causes the intensity of ultrasound echo signal to there is larger difference, and after employing method of the present utility model, this species diversity does not produce any impact to thickness measure.
6, during test can there is certain influence to hyperacoustic propagation in the pressing dynamics of ultrasonic probe and temperature, and after adopting this method, precision can control within 0.02mm, substantially can reach the requirement of accurate thickness measuring.
Accompanying drawing explanation
The following drawings is only intended to schematically illustrate the utility model and explain, does not limit scope of the present utility model.Wherein:
Fig. 1 is the circuit theory diagrams of the utility model embodiment comparer;
Fig. 2 is the circuit theory diagrams of the timer of the utility model embodiment;
Fig. 3 is the circuit theory diagrams of the main control chip of the utility model embodiment;
Fig. 4 is the principle schematic of the utility model embodiment step one;
Fig. 5 is the principle schematic of the utility model embodiment step 2;
Fig. 6 is the principle schematic of the utility model embodiment step 3;
Embodiment
Below in conjunction with drawings and Examples, set forth the utility model further.In the following detailed description, the mode only by illustrating describes some one exemplary embodiment of the present utility model.Undoubtedly, those of ordinary skill in the art can recognize, when not departing from spirit and scope of the present utility model, can revise by various different mode to described embodiment.Therefore, accompanying drawing is illustrative with being described in essence, instead of for limiting the protection domain of claim.
The accurate thickness detection apparatus of ultrasound wave equivalent peak, comprises ultrasonic probe, and described ultrasonic probe is connected with comparer, and described comparer is connected with timer, and described timer is connected with main control chip.
As shown in Figure 1, described comparer comprises the integrated comparator chip A with eight pins, the 1# pin of described integrated comparator chip A is connected with supply voltage VDD_R, 1# pin is also connected with amplifier capacitance protection circuit, the 2# pin of described comparer integrated comparator chip A is by electric capacity C17 ground connection, resistance R16 is connected with between the 1# pin of described comparer integrated comparator chip A and 2# pin, the negative pole of described resistance R16 passes through the sliding contact ground connection of slide rheostat RP1, the negative pole of described slide rheostat RP1 is unsettled, the dividing potential drop that described R16 and described slide rheostat RP1 is formed as the 3# pin of voltage reference input comparator integrated comparator chip A as benchmark.Described supply voltage VDD_R is also serially connected with resistance R15 and resistance R17, and described resistance R15 is identical with the resistance of described resistance R17, and for ultrasonic signal Ultrasonic provides bias voltage, and described bias voltage is 0.7mv.Ultrasonic signal Ultrasonic is become by electric capacity C16 AC coupling is worth attenuation sinusoidal wave centered by bias voltage VDD_R/2.The negative pole of described resistance R17 is connected with the sliding contact of described slide rheostat RP1, and ground connection.Described in integrated comparator integrated chip comparer integrated chip comparer chip, the 5# pin of integrated comparator chip A is connected to the negative pole of described electric capacity C17 by resistance R18, the 7# pin of described integrated comparator chip A is the signal output part of described comparer, and the 8# pin of described integrated comparator chip A is unsettled.
Described supply voltage VDD_R is+5V burning voltage, and the 3# pin voltage reference of described integrated comparator chip should be adjusted to VDD_R/2+0.5V=3V, makes ultrasonic echo signal substantially can not cause phase delay, contributes to improving accuracy of detection.Described amplifier capacitance protection circuit comprises the electric capacity C15 be connected on described integrated comparator chip A1# pin, the minus earth of described electric capacity C15, and described electric capacity C15 two ends are also parallel with electrochemical capacitor C13.
As shown in Figure 2, described timer comprises the timing chip TDC-GP21 with 32 pins, the 1# pin of described timing chip TDC-GP21 is connected to the 3# pin of active crystal oscillator X1, the 1# pin of described active crystal oscillator X1 is unsettled, the 2# pin ground connection of described active crystal oscillator X1, the 4# pin of described active crystal oscillator X1 is connected with+3.3V power supply, the 3# pin of described timing chip TDC-GP21 is also connected with+3.3V power supply, the 4# pin of described timing chip TDC-GP21 is connected to the 3# pin of described timing chip TDC-GP21 by electric capacity C40, the 4# pin of described timing chip TDC-GP21 and 7# pin be direct ground connection also, the 14# pin of described timing chip TDC-GP21 is connected with+3.3V power supply, the 14# pin of described timing chip TDC-GP21 is also by electric capacity C47 ground connection simultaneously, the 15# pin of described timing chip TDC-GP21 is by resistance R44 and electric capacity C48 ground connection, the 16# pin of described timing chip TDC-GP21 is by electric capacity C45 ground connection, passive crystal oscillator X2 is connected with between the positive pole of described electric capacity C48 and the positive pole of described electric capacity C45, the 21# pin ground connection of described timing chip TDC-GP21, the 22# pin of described timing chip TDC-GP21 is connected to+3.3V power supply, electric capacity C34 is connected with between the 21# pin of described timing chip TDC-GP21 and the 22# pin of described timing chip TDC-GP21, the 25# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R36, the 26# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R35, the 27# pin of described timing chip TDC-GP21 is by resistance R33 ground connection, the direct ground connection of 28# pin of described timing chip TDC-GP21, the 29# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply, the 29# pin of described timing chip TDC-GP21 is also connected with timing chip protection circuit, the 30# pin of described timing chip TDC-GP21 is timing end signal, be connected with described integrated comparator chip A7# pin, the 31# pin of described timing chip TDC-GP21 connects the 50# pin of main control chip MSP430F149 as timing enabling signal.The 32# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R31, and the 2# pin of described timing chip TDC-GP21,5# pin, 6# pin, 17# pin, 18# pin, 19# pin, 20# pin, 23# pin and 24# pin are unsettled respectively.The enabling signal (START) of timing chip TDC-GP21 is that main control chip sends, and differs a strict clock period with ultrasound wave launch time; The end signal (STOP1) of timing chip TDC-GP21 comes from the output signal of comparer.
Described timing chip protection circuit comprises the electric capacity C31 on the 29# pin being connected to described timing chip TDC-GP21, the minus earth of described electric capacity C31, and described electric capacity C31 two ends are also parallel with electrochemical capacitor C10.
As shown in Figure 3, described main control chip comprises the chip MSP430F149 with 64 pins, the 1# pin of described chip MSP430F149 and 64# pin are connected with chip protection circuit, passive crystal oscillator X3 is connected with between the 8# pin of described chip MSP430F149 and 9# pin, the 44# pin of described chip MSP430F149 is connected with the 13# pin of described timing chip TDC-GP21, the 45# pin of described chip MSP430F149 is connected with the 12# pin of described timing chip TDC-GP21, the 46# pin of described chip MSP430F149 is connected with the 11# pin of described timing chip TDC-GP21, the 47# pin of described chip MSP430F149 is connected with the 10# pin of described timing chip TDC-GP21, the 48# pin of described chip MSP430F149 is connected with the 9# pin of described timing chip TDC-GP21, the 49# pin of described chip MSP430F149 is connected with the 8# pin of described timing chip TDC-GP21, the 50# pin of described chip MSP430F149 is connected with the 31# pin of described timing chip TDC-GP21, the 58# pin of described chip MSP430F149 is by electric capacity C49 ground connection, the 62# pin of described chip MSP430F149 and 63# pin ground connection respectively, all the other pins of described chip MSP430F149 are unsettled.
In the present embodiment; described chip protection circuit comprise be connected to described chip MSP430F149 1# pin and 64# pin on electric capacity C51; the minus earth of described electric capacity C51, described electric capacity C51 two ends are also parallel with electric capacity C50, and the positive pole of described electric capacity C50 connects+3.3V power supply.
The course of work of the present embodiment is as described below:
As shown in Figure 4, step one, ultrasonic probe to be vertically resisted against on testee and to send ultrasound wave, ultrasonic probe before testing, need accompanying drawing couplant on ultrasonic probe, described ultrasound wave arrives the material interface of described testee, described ultrasound wave is reflected back formation ultrasonic echo, described ultrasonic echo is received by described ultrasonic probe and is transformed into electric echo signal, described electric echo signal sends comparer to, threshold parameter Tyz is transfused in described comparer, when the electric signal of described ultrasonic echo rising edge is equal with described threshold parameter, described comparator output signal is to timer, rising edge Ts time of arrival is passed to described main control chip by described timer, this step at least carries out twice, and the Tsp that averages after each rising edge Ts time of arrival is added, in the present embodiment, this step needs to carry out eight times, thus farthest improves the precision of testee Thickness sensitivity.
As shown in Figure 5, step 2, to continue ultrasonic probe to be vertically resisted against on testee and to send ultrasound wave, described ultrasound wave arrives the material interface of described testee, described ultrasound wave is reflected back formation ultrasonic echo, described ultrasonic echo is received by described ultrasonic probe and is transformed into electric echo signal, described electric echo signal sends comparer to, threshold parameter Tyz is transfused in described comparer, when the electric signal of described ultrasonic echo negative edge is equal with described threshold parameter, described comparator output signal is to timer, negative edge Tx time of arrival is passed to described main control chip by described timer, correspondingly, the number of times that this step is carried out also carries out eight times, and the Txp that averages after each negative edge Tx time of arrival is added,
As shown in Figure 6, step 3, get the mean value of rising edge Tsp time of arrival and negative edge Txp time of arrival, be echo-peak time Tfp;
Step 4, described echo-peak time Tfp is substituted into ultrasonic measurement thickness equations S=V*Tfp/2, the thickness of testee can be obtained; Wherein, V is the velocity of propagation of ultrasound wave in described testee material.
The present embodiment has following characteristics:
1, the precision of Edge check increases substantially
The common implementation of Edge check is: setting threshold value is input to one end of comparer, and detected Waveform Input is to the other end of comparer, and the two difference is when Zero change, and the output generation level of comparer reverses.
As can be seen here, the precision of Edge check depends on the two indices of comparer: response time and activation threshold value.Namely, when positive and negative change occurs input end level difference value, level reversion is rapider, then phase error is less; The less then phase error of activation threshold value less (when incoming level difference occurs to hand over more, output level reversion is more precipitous).Therefore in an embodiment, choose the device of this comparer of MAX9013 IC as Edge check, the corresponding time is short, reversion is rapid.
2, the timing circuit that design is accurate
The instant circuit many employings counter of tradition, realizes timing by the way of step-by-step counting.Be that 40MHz calculates with recurrence interval, accuracy of timekeeping can only reach 25nS, calculate with the velocity of sound of 5920m/S, the measuring error of thickness is 5920*0.025/2=0.074mm, and the instrument of the clocking method of this principle of employing therefore used at present cannot reach 0.05mm precision.The accurate timing chip adopting calorimeter industry to use in a large number at present in the present embodiment is to realize accurate timing, and accuracy of timekeeping can reach PS level, can meet the requirement of accurate thickness measuring completely.
3, the realization of equivalent peak
In prior art, the realization of equivalent peak is: the rising edge and the negative edge (for same threshold value) that detect Mintrop wave, peak value moment is the average of rising edge and negative edge.Here produced problem is, needs to use two-way comparer, if but adopt two-way comparer to detect rising edge and negative edge respectively, the complexity of hardware circuit will certainly be increased, also improve cost.And due to the difference of two passages, the asymmetric of rising time and negative edge time detecting can be caused, thus introduce certain systematic error.And first arrange in the present embodiment timing chip TDC-GP21 be positive pulse trigger, survey the average arrival time Tsp be averaged at least 4 times as rising edge continuously; Arranging TDC-GP21 timing chip is that negative pulse triggers, and continuous coverage is averaged the average arrival time Txp drawing negative edge for 4 times, and peak value time of arrival is Tfp=(Tsp+Txp)/2.
In fact when detecting the testee of different materials, because probe transmission frequency can reach 50Hz or higher, therefore can use to launch for 8 times and calculate a ultrasonic thickness with echo reception, response speed is also than faster, can not affect rate of reading.
4, there is not coupling influence
Because the phase place of peak value does not change with changes in amplitude, so the change of coupling condition, the change of material attenuate on the echo amplitude that the impact of hyperacoustic amplitude and circuit performance difference cause can't affect the measurement of one-tenth-value thickness 1/10, the ultrasonic thickness this method being used for echo-echo system detects, higher precision can be reached, experiment proves, the Thickness resolution of this method is about 0.001mm, error can control within 0.02mm substantially, and in fact this can meet the requirement of thin pieces thickness measuring completely.
More than show and describe ultimate principle of the present utility model, principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and instructions just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (1)
1. the accurate thickness detection apparatus of ultrasound wave equivalent peak, is characterized in that, comprise ultrasonic probe, and described ultrasonic probe is connected with comparer, and described comparer is connected with timer, and described timer is connected with main control chip.
2. the accurate thickness detection apparatus of ultrasound wave equivalent peak as claimed in claim 1, it is characterized in that: described comparer comprises the integrated comparator chip A with eight pins, the 1# pin of described integrated comparator chip A is connected with supply voltage VDD_R, 1# pin is also connected with amplifier capacitance protection circuit, the 2# pin of described comparer integrated comparator chip A is by electric capacity C17 ground connection, resistance R16 is connected with between the 1# pin of described comparer integrated comparator chip A and 2# pin, the negative pole of described resistance R16 passes through the sliding contact ground connection of slide rheostat RP1, the negative pole of described slide rheostat RP1 is unsettled, the dividing potential drop that described R16 and described slide rheostat RP1 is formed is as the 3# pin of voltage reference input comparator integrated comparator chip A, described supply voltage VDD_R is also serially connected with resistance R15 and resistance R17, described resistance R15 is identical with the resistance of described resistance R17, the negative pole of described resistance R17 is connected with the sliding contact of described slide rheostat RP1, and ground connection, described in integrated comparator integrated chip comparer integrated chip comparer chip, the 5# pin of integrated comparator chip A is connected to the negative pole of described electric capacity C17 by resistance R18, the 7# pin of described integrated comparator chip A is the signal output part of described comparer, the 8# pin of described integrated comparator chip A is unsettled.
3. the accurate thickness detection apparatus of ultrasound wave equivalent peak as claimed in claim 2, is characterized in that: described supply voltage VDD_R is+5V burning voltage.
4. the accurate thickness detection apparatus of ultrasound wave equivalent peak as claimed in claim 2 or claim 3; it is characterized in that: described amplifier capacitance protection circuit comprises the electric capacity C15 be connected on described integrated comparator chip A 1# pin; the minus earth of described electric capacity C15, described electric capacity C15 two ends are also parallel with electrochemical capacitor C13.
5. the accurate thickness detection apparatus of ultrasound wave equivalent peak as claimed in claim 4, it is characterized in that: described timer comprises the timing chip TDC-GP21 with 32 pins, the 1# pin of described timing chip TDC-GP21 is connected to the 3# pin of active crystal oscillator X1, the 1# pin of described active crystal oscillator X1 is unsettled, the 2# pin ground connection of described active crystal oscillator X1, the 4# pin of described active crystal oscillator X1 is connected with+3.3V power supply, the 3# pin of described timing chip TDC-GP21 is also connected with+3.3V power supply, the 4# pin of described timing chip TDC-GP21 is connected to the 3# pin of described timing chip TDC-GP21 by electric capacity C40, the 4# pin of described timing chip TDC-GP21 and 7# pin be direct ground connection also, the 14# pin of described timing chip TDC-GP21 is connected with+3.3V power supply, the 14# pin of described timing chip TDC-GP21 is also by electric capacity C47 ground connection simultaneously, the 15# pin of described timing chip TDC-GP21 is by resistance R44 and electric capacity C48 ground connection, the 16# pin of described timing chip TDC-GP21 is by electric capacity C45 ground connection, passive crystal oscillator X2 is connected with between the positive pole of described electric capacity C48 and the positive pole of described electric capacity C45, the 21# pin ground connection of described timing chip TDC-GP21, the 22# pin of described timing chip TDC-GP21 is connected to+3.3V power supply, electric capacity C34 is connected with between the 21# pin of described timing chip TDC-GP21 and the 22# pin of described timing chip TDC-GP21, the 25# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R36, the 26# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R35, the 27# pin of described timing chip TDC-GP21 is by resistance R33 ground connection, the direct ground connection of 28# pin of described timing chip TDC-GP21, the 29# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply, the 29# pin of described timing chip TDC-GP21 is also connected with timing chip protection circuit, the 30# pin of described timing chip TDC-GP21 is connected with described integrated comparator chip A 7# pin, the 32# pin of described timing chip TDC-GP21 is connected with described main control chip, the 32# pin of described timing chip TDC-GP21 is connected to described+3.3V power supply by resistance R31, the 2# pin of described timing chip TDC-GP21, 5# pin, 6# pin, 17# pin, 18# pin, 19# pin, 20# pin, 23# pin and 24# pin are distinguished unsettled.
6. the accurate thickness detection apparatus of ultrasound wave equivalent peak as claimed in claim 5; it is characterized in that: described timing chip protection circuit comprises the electric capacity C31 on the 29# pin being connected to described timing chip TDC-GP21; the minus earth of described electric capacity C31, described electric capacity C31 two ends are also parallel with electrochemical capacitor C10.
7. the accurate thickness detection apparatus of ultrasound wave equivalent peak as claimed in claim 6, it is characterized in that: described main control chip comprises the chip MSP430F149 with 64 pins, the 1# pin of described chip MSP430F149 and 64# pin are connected with chip protection circuit, passive crystal oscillator X3 is connected with between the 8# pin of described chip MSP430F149 and 9# pin, the 44# pin of described chip MSP430F149 is connected with the 13# pin of described timing chip TDC-GP21, the 45# pin of described chip MSP430F149 is connected with the 12# pin of described timing chip TDC-GP21, the 46# pin of described chip MSP430F149 is connected with the 11# pin of described timing chip TDC-GP21, the 47# pin of described chip MSP430F149 is connected with the 10# pin of described timing chip TDC-GP21, the 48# pin of described chip MSP430F149 is connected with the 9# pin of described timing chip TDC-GP21, the 49# pin of described chip MSP430F149 is connected with the 8# pin of described timing chip TDC-GP21, the 50# pin of described chip MSP430F149 is connected with the 31# pin of described timing chip TDC-GP21, the 58# pin of described chip MSP430F149 is by electric capacity C49 ground connection, the 62# pin of described chip MSP430F149 and 63# pin ground connection respectively, all the other pins of described chip MSP430F149 are unsettled.
8. the accurate thickness detection apparatus of ultrasound wave equivalent peak as claimed in claim 7; it is characterized in that: described chip protection circuit comprise be connected to described chip MSP430F149 1# pin and 64# pin on electric capacity C51; the minus earth of described electric capacity C51; described electric capacity C51 two ends are also parallel with electric capacity C50, and the positive pole of described electric capacity C50 connects+3.3V power supply.
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