CN204029770U - Die bonder - Google Patents
Die bonder Download PDFInfo
- Publication number
- CN204029770U CN204029770U CN201420339201.XU CN201420339201U CN204029770U CN 204029770 U CN204029770 U CN 204029770U CN 201420339201 U CN201420339201 U CN 201420339201U CN 204029770 U CN204029770 U CN 204029770U
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- CN
- China
- Prior art keywords
- pressure head
- scolder
- objective table
- lead frame
- die bonder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a kind of die Bonder, comprise the objective table of chip placement and lead frame, described objective table top arranges a pressure head, described pressure head is a plane towards described objective table one end, described plane is for suppressing the scolder of lead frame surface, described pressure head is connected with a lift, and described lift is for driving described pressure head to move along the direction perpendicular to stage surface.The utility model has the advantage of, by the above-mentioned die Bonder with pressure head, can obtain larger horizontal area and smooth upper surface by compacting scolder, thereby reach the technique effect of saving scolder and bonding die success rate being provided.
Description
Technical field
The utility model relates to chip package field, relates in particular to a kind of die Bonder.
Background technology
Bonding die is one of committed step in chip package process.Available technology adopting Die Bonder is implemented bonding die.Die Bonder is the semiconductor packaging device that integrates the fields such as precision optical machinery, control automatically, image recognition, optics, is mainly used in the operation of semiconductor manufacture rear end, microchip on wafer being bonded on lead frame.
Die Bonder implement the technique key step of bonding die be by solder dots in lead frame surface, then adopt fixture that chip is bonded on scolder.
The shortcoming of prior art is that solder dots is after lead frame surface, and surface is spherical because capillary effect presents, and chip is placed on scolder and easily departs from.And for scolder is coated with enough large area, and scolder is spherical, therefore needs more scolder could realize enough area coverings.
Summary of the invention
Technical problem to be solved in the utility model is, a kind of die Bonder is provided, and can save scolder and improve the success rate of bonding die.
In order to address the above problem, the utility model provides a kind of die Bonder, comprise the objective table of chip placement and lead frame, described objective table top arranges a pressure head, described pressure head is a plane towards described objective table one end, described plane is for suppressing the scolder of lead frame surface, and described pressure head is connected with a lift, and described lift is for driving described pressure head to move along the direction perpendicular to stage surface.
Optionally, further comprise one group of planar motor, described planar motor is connected with described pressure head, for driving described pressure head to move in the direction that is parallel to stage surface.
Optionally, further comprise a measuring instrument, for measuring the lateral dimension after the scolder of lead frame surface is pressed.
The utility model has the advantage of, by the above-mentioned die Bonder with pressure head, can obtain larger horizontal area and smooth upper surface by compacting scolder, thereby reach the technique effect of saving scolder and bonding die success rate being provided.
Brief description of the drawings
It shown in accompanying drawing 1, is the structural representation installing described in the utility model embodiment;
Accompanying drawing 2 is the schematic diagrames that adopt accompanying drawing 1 shown device compacting scolder.
Embodiment
The embodiment of die Bonder the utility model being provided below in conjunction with accompanying drawing elaborates.
Shown in accompanying drawing 1, be the structural representation installing described in this embodiment, comprise objective table 10, described objective table 10 surfaces are used for placing lead frame 11, and there is scolder 110 on lead frame 11 surfaces.Described objective table 10 tops arrange a pressure head 12.Described pressure head 12 is a plane towards described objective table 10 one end, and described plane is for suppressing the scolder 110 on lead frame 11 surfaces.Described pressure head 12 is connected with a lift 13, and described lift 13 is for driving described pressure head 12 along moving perpendicular to the direction on objective table 10 surfaces.
The schematic diagrames that adopt said apparatus compacting scolder 110 with reference to accompanying drawing 2.Adopt said apparatus, can be on the surface of lead frame 11 the less scolder 110 of a pre-formed area coverage, its initial horizontal area can be less than the horizontal area of chip placed on it (not shown).Then adopt lift 13 drive ram 12 that scolder 110 is flattened, expand its horizontal area to the horizontal area that is greater than chip, thereby play the stable support to chip.And the end of pressure head 12 is planes, the surface of downtrodden scolder 110 is also a plane thereupon, and this has also ensured that follow-up chip can be placed in the surface of scolder 110 reposefully.
In this embodiment, said apparatus has further comprised one group of planar motor 14, described planar motor 14 is connected with described pressure head 12, for driving described pressure head 12 to move in the direction that is parallel to objective table 10 surfaces,, to adjust the position of pressure head 12 and to aim at scolder 110 out of position in the situation that at scolder 110.
In this embodiment, said apparatus can further include a measuring instrument (not shown), for measuring the lateral dimension after the scolder of lead frame surface is pressed.Adjust the compacting degree of depth of pressure head 12 according to measurement result, to obtain larger or less lateral dimension.
Obviously, adopt the above-mentioned die Bonder with pressure head 12, can obtain larger horizontal area and smooth upper surface by compacting scolder 110, thereby reach the technique effect of saving scolder and bonding die success rate being provided.
The above is only preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (3)
1. a die Bonder, comprise the objective table of chip placement and lead frame, it is characterized in that, described objective table top arranges a pressure head, described pressure head is a plane towards described objective table one end, described plane is for suppressing the scolder of lead frame surface, and described pressure head is connected with a lift, and described lift is for driving described pressure head to move along the direction perpendicular to stage surface.
2. die Bonder according to claim 1, is characterized in that, further comprises one group of planar motor, and described planar motor is connected with described pressure head, for driving described pressure head to move in the direction that is parallel to stage surface.
3. die Bonder according to claim 1, is characterized in that, further comprises a measuring instrument, for measuring the lateral dimension after the scolder of lead frame surface is pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420339201.XU CN204029770U (en) | 2014-06-24 | 2014-06-24 | Die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420339201.XU CN204029770U (en) | 2014-06-24 | 2014-06-24 | Die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204029770U true CN204029770U (en) | 2014-12-17 |
Family
ID=52069601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420339201.XU Expired - Fee Related CN204029770U (en) | 2014-06-24 | 2014-06-24 | Die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204029770U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117810156A (en) * | 2024-02-23 | 2024-04-02 | 中国电子科技集团公司第四十六研究所 | Wafer bonding method and wafer bonding device |
-
2014
- 2014-06-24 CN CN201420339201.XU patent/CN204029770U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117810156A (en) * | 2024-02-23 | 2024-04-02 | 中国电子科技集团公司第四十六研究所 | Wafer bonding method and wafer bonding device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20170624 |