CN204016592U - Cold/hot dressing header structure - Google Patents
Cold/hot dressing header structure Download PDFInfo
- Publication number
- CN204016592U CN204016592U CN201420314340.7U CN201420314340U CN204016592U CN 204016592 U CN204016592 U CN 204016592U CN 201420314340 U CN201420314340 U CN 201420314340U CN 204016592 U CN204016592 U CN 204016592U
- Authority
- CN
- China
- Prior art keywords
- cold
- hot dressing
- dressing head
- quasiconductor
- radiating module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This utility model discloses a kind of cold/hot dressing header structure, comprise encapsulating shell, power supply, control circuit board, quasiconductor, radiating module and there is the cold/hot dressing head assembly of cold/hot dressing head, described control circuit board and described power supply are electrically connected, described quasiconductor and described control circuit board are electrically connected, described quasiconductor has a heating face and a chill surface, described radiating module is installed in a side of described semi-conductive heating face, described cold/hot dressing head assembly is installed in a side of described semi-conductive chill surface, described power supply, described control circuit board, quasiconductor, radiating module and cold/hot dressing head component package are in encapsulating shell, the corresponding described cold/hot dressing head assembly of described encapsulating shell place has and holds the through hole that described cold/hot dressing head stretches out, the corresponding described radiating module of described encapsulating shell place is provided with louvre.Thereby this cold/hot dressing header structure is by better freezing semi-conductive chill surface in semi-conductive heating face heat radiation, makes the temperature of cold/hot dressing head lower better, thereby improve the effect of cold compress.
Description
Technical field
This utility model relates to dynamo-electric field, relates in particular to a kind of cold/hot dressing header structure.
Background technology
Cold/hot dressing head is medical common tool, and the cryogenic temperature of current cold/hot dressing head is low not, and cold compress effect is not good enough.
Therefore, urgently a kind ofly can produce the cold/hot dressing header structure that cryogenic temperature is lower, thereby make cold compress better effects if.
Utility model content
The purpose of this utility model is to provide a kind of can produce the cold/hot dressing header structure that cryogenic temperature is lower, thereby makes cold compress better effects if.
To achieve these goals, the technical solution of the utility model is: a kind of cold/hot dressing header structure is provided, comprise encapsulating shell, power supply, control circuit board, quasiconductor, radiating module and there is the cold/hot dressing head assembly of cold/hot dressing head, described control circuit board and described power supply are electrically connected, described quasiconductor and described control circuit board are electrically connected, described quasiconductor has a heating face and a chill surface, described radiating module is installed in a side of described semi-conductive heating face, described cold/hot dressing head assembly is installed in a side of described semi-conductive chill surface, described power supply, described control circuit board, quasiconductor, radiating module and cold/hot dressing head component package are in described encapsulating shell, the corresponding described cold/hot dressing head assembly of described encapsulating shell place has and holds the through hole that described cold/hot dressing head stretches out, the corresponding described radiating module of described encapsulating shell place is provided with louvre.
Described radiating module comprises fine aluminium radiator and fan, and described fine aluminium radiator is placed between described semi-conductive heating face and described fan.Fine aluminium radiator and fan dispel the heat simultaneously, better heat-radiation effect.
A described cold compress assembly comprises cold/hot dressing head and deposited head bracket, and described deposited head bracket is placed between described cold/hot dressing head and described through hole and supports described cold/hot dressing head.
Described encapsulating shell comprises drain pan, upper cover and top cover, the middle part of described drain pan convexes with the first dividing plate and second partition, between described the first dividing plate and described second partition, form main body encapsulated space, described through hole is located at the bottom of the corresponding described main body encapsulated space of described drain pan, the outside of corresponding described the first dividing plate of described drain pan is provided with power capacity district, described power supply is placed in described power capacity district, described cold/hot dressing head assembly, quasiconductor, radiating module and control circuit board are packaged in described main body encapsulated space successively, described upper cover is placed on described drain pan admittedly, the middle part of described upper cover is provided with some the first louvres, the middle part of described top cover is provided with the second louvre, described top cover cover is placed on described and covers, described the first louvre connects and forms described louvre with the second corresponding louvre.
Compared with prior art, thereby this utility model cold/hot dressing header structure is by better freezing semi-conductive chill surface in semi-conductive heating face heat radiation, makes the temperature of cold/hot dressing head lower better, thereby improves the effect of cold compress.
By following description also by reference to the accompanying drawings, it is more clear that this utility model will become, and these accompanying drawings are used for explaining embodiment of the present utility model.
Brief description of the drawings
Fig. 1 is the decomposing schematic representation of this utility model cold/hot dressing header structure.
Detailed description of the invention
With reference to figure 1, this utility model cold/hot dressing header structure 100 comprises encapsulating shell 10, power supply 20, control circuit board 30, quasiconductor 40, radiating module 50, has the cold/hot dressing head assembly 60 of cold/hot dressing head 61.
Described control circuit board 30 is electrically connected with described power supply 20.Described quasiconductor 40 is electrically connected with described control circuit board 30, and described quasiconductor 40 has a heating face 41 and a chill surface 42.Described radiating module 50 is installed in a side of the heating face of described quasiconductor 40, and described cold/hot dressing head assembly 60 is installed in a side of the chill surface 42 of described quasiconductor 40.Described power supply 20, described control circuit board 30, quasiconductor 40, radiating module 50 and cold/hot dressing head assembly 60 are packaged in described encapsulating shell 10.The corresponding described cold/hot dressing head assembly of described encapsulating shell 10 60 places have and hold the through hole 101 that described cold/hot dressing head 61 stretches out, and the corresponding described radiating module of described encapsulating shell 10 50 places are provided with louvre 102.
Particularly, described radiating module 50 comprises fine aluminium radiator 51 and fan 52.Described fine aluminium radiator 51 is placed between the heating face 41 and described fan 52 of described quasiconductor 40.A described cold compress assembly 60 comprises cold/hot dressing head 61 and deposited head bracket 62, and described deposited head bracket 62 is placed between described cold/hot dressing head 61 and described through hole 11 and supports described cold/hot dressing head 61.
Particularly, described encapsulating shell 10 comprises drain pan 11, upper cover 12 and top cover 13.The middle part of described drain pan 11 convexes with the first dividing plate 111 and second partition 112.Between described the first dividing plate 111 and described second partition 112, form main body encapsulated space 113.Described through hole 101 is located at the bottom of the corresponding described main body encapsulated space 113 of described drain pan 11.The outside of described drain pan 11 corresponding described the first dividing plates 111 is provided with power capacity district 114, and described power supply 20 is placed in described power capacity district 114.Described cold/hot dressing head assembly 60, quasiconductor 40, radiating module 50 and control circuit board 30 are packaged in described main body encapsulated space 113 successively.Described upper cover 12 is placed on described drain pan 11 admittedly.The middle part of described upper cover 12 is provided with some the first louvres 121, the middle part of described top cover 13 is provided with the second louvre 131, described top cover 13 covers are placed on described upper cover 12, and described the first louvre 121 connects and forms described louvre 102 with the second corresponding louvre 131.
Thereby this utility model cold/hot dressing header structure is by better freezing semi-conductive chill surface in semi-conductive heating face heat radiation, makes the temperature of cold/hot dressing head lower better, thereby improve the effect of cold compress.
In conjunction with most preferred embodiment, this utility model is described above, but this utility model is not limited to the embodiment of above announcement, and should contains the various amendments of carrying out according to the essence of the present embodiment, equivalent combinations.
Claims (4)
1. a cold/hot dressing header structure, it is characterized in that: comprise encapsulating shell, power supply, control circuit board, quasiconductor, radiating module and there is the cold/hot dressing head assembly of cold/hot dressing head, described control circuit board and described power supply are electrically connected, described quasiconductor and described control circuit board are electrically connected, described quasiconductor has a heating face and a chill surface, described radiating module is installed in a side of described semi-conductive heating face, described cold/hot dressing head assembly is installed in a side of described semi-conductive chill surface, described power supply, described control circuit board, quasiconductor, radiating module and cold/hot dressing head component package are in described encapsulating shell, the corresponding described cold/hot dressing head assembly of described encapsulating shell place has and holds the through hole that described cold/hot dressing head stretches out, the corresponding described radiating module of described encapsulating shell place is provided with louvre.
2. cold/hot dressing header structure as claimed in claim 1, is characterized in that: described radiating module comprises fine aluminium radiator and fan, described fine aluminium radiator is placed between described semi-conductive heating face and described fan.
3. cold/hot dressing header structure as claimed in claim 1, is characterized in that: a described cold compress assembly comprises cold/hot dressing head and deposited head bracket, and described deposited head bracket is placed between described cold/hot dressing head and described through hole and supports described cold/hot dressing head.
4. cold/hot dressing header structure as claimed in claim 1, it is characterized in that: described encapsulating shell comprises drain pan, upper cover and top cover, the middle part of described drain pan convexes with the first dividing plate and second partition, between described the first dividing plate and described second partition, form main body encapsulated space, described through hole is located at the bottom of the corresponding described main body encapsulated space of described drain pan, the outside of corresponding described the first dividing plate of described drain pan is provided with power capacity district, described power supply is placed in described power capacity district, described cold/hot dressing head assembly, quasiconductor, radiating module and control circuit board are packaged in described main body encapsulated space successively, described upper cover is placed on described drain pan admittedly, the middle part of described upper cover is provided with some the first louvres, the middle part of described top cover is provided with the second louvre, described top cover cover is placed on described and covers, described the first louvre connects and forms described louvre with the second corresponding louvre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420314340.7U CN204016592U (en) | 2014-06-13 | 2014-06-13 | Cold/hot dressing header structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420314340.7U CN204016592U (en) | 2014-06-13 | 2014-06-13 | Cold/hot dressing header structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204016592U true CN204016592U (en) | 2014-12-17 |
Family
ID=52056518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420314340.7U Expired - Fee Related CN204016592U (en) | 2014-06-13 | 2014-06-13 | Cold/hot dressing header structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204016592U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106726425A (en) * | 2015-11-24 | 2017-05-31 | 杨丞钏 | The heat release of massage machine |
| CN110495987A (en) * | 2018-05-17 | 2019-11-26 | 深圳天赋健医疗器械科技有限公司 | A kind of Worn type physical cooling instrument host refrigeration module |
| CN111023616A (en) * | 2019-12-28 | 2020-04-17 | 浙江奇翼特种服装有限公司 | Multifunctional cold and hot plate |
| CN112197460A (en) * | 2020-10-30 | 2021-01-08 | 深圳市太维新材料科技有限公司 | Packaged heat sink |
| CN112197460B (en) * | 2020-10-30 | 2024-10-22 | 深圳市太维新材料科技有限公司 | Encapsulated heat sink |
-
2014
- 2014-06-13 CN CN201420314340.7U patent/CN204016592U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106726425A (en) * | 2015-11-24 | 2017-05-31 | 杨丞钏 | The heat release of massage machine |
| CN110495987A (en) * | 2018-05-17 | 2019-11-26 | 深圳天赋健医疗器械科技有限公司 | A kind of Worn type physical cooling instrument host refrigeration module |
| CN111023616A (en) * | 2019-12-28 | 2020-04-17 | 浙江奇翼特种服装有限公司 | Multifunctional cold and hot plate |
| CN112197460A (en) * | 2020-10-30 | 2021-01-08 | 深圳市太维新材料科技有限公司 | Packaged heat sink |
| CN112197460B (en) * | 2020-10-30 | 2024-10-22 | 深圳市太维新材料科技有限公司 | Encapsulated heat sink |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20150613 |
|
| EXPY | Termination of patent right or utility model |