CN204014102U - A kind of structure of semiconductor heating components and parts - Google Patents
A kind of structure of semiconductor heating components and parts Download PDFInfo
- Publication number
- CN204014102U CN204014102U CN201420320147.4U CN201420320147U CN204014102U CN 204014102 U CN204014102 U CN 204014102U CN 201420320147 U CN201420320147 U CN 201420320147U CN 204014102 U CN204014102 U CN 204014102U
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- insulating material
- sink unit
- material matrix
- heat
- fin
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Abstract
The utility model discloses a kind of structure of semiconductor heating components and parts, comprise heat-sink unit, upper insulating material matrix, insulation cushion rubber, lower insulating material matrix, lower heat-sink unit and fixture, insulation cushion rubber even thickness, upper insulating material matrix is arranged at insulation cushion rubber top, lower insulating material matrix is arranged at insulation cushion rubber below, upper heat-sink unit is arranged at insulating material matrix top, lower heat-sink unit is arranged at lower insulating material matrix below, described upper heat-sink unit, upper insulating material matrix, insulation cushion rubber, the correspondence position of lower insulating material matrix and lower heat-sink unit is provided with a through hole, through hole has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture makes it fixing through described through hole.The utlity model has simple in structure, energy-efficient, the life-span is long, comfort level is high, quick heating, thermal source is soft, security performance is high, the feature of health environment-friendly, low temperature radiation, maintenance humidity, is mainly used in heating of house.
Description
Technical field
The utility model belongs to electric-heating technology field, relates in particular to a kind of structure of semiconductor heating components and parts.
Background technology
Existing electric heater mainly stacked by mica fin, resistor disc or resistance wire, form by riveted joint bonding, extraction electrode, surrounding cornerite, just like the patent application that application number is 200420067475.4, denomination of invention is electric heater, a kind of electric heater, comprise mica sheet, resistor disc, it is characterized in that described resistor disc both sides are provided with mica sheet, between described mica sheet and mica sheet and and resistor disc between bond together by bonding agent.The heater of this patent is poor apart from radiating effect, beyond the poor defect of complex structure, manufacturability, also there is the potential safety hazards such as material binding structure becomes slack after thermal shock, after moisture test, heat up and have peculiar smell generation, resistor disc (silk) life-span is short, the defects such as resistance to mechanical impact property is poor, can only be used at cryosphere by structure influence, and range of application is very limited;
Traditional heating wire, halide torch etc., because radiating surface is little, indirectly conducting by other objects with heated object, in electric heating transfer process, the heat energy that electric energy produces can not be passed to heated object very soon, causes on electric heating element heat too concentrated, and it is red-hot that element itself becomes very soon, the very large some of electric energy becomes luminous energy and scatters and disappears, and causes electric heating conduction efficiency lower.General heating wire always uses under red-hot state, so be easy to produce oxidation, makes resistance more and more thinner, more and more crisp, finally causes and opens circuit.
Summary of the invention
For solving the problems of the technologies described above, the utility model provides the structure of a kind of semiconductor heating components and parts, have simple in structure, energy-efficient, the life-span is long, comfort level is high, quick heating, thermal source is soft, security performance is high, the feature of health environment-friendly, low temperature radiation, maintenance humidity;
The utility model has adopted following technical scheme:
A kind of structure of semiconductor heating components and parts, comprise heat-sink unit, upper insulating material matrix, insulation cushion rubber, lower insulating material matrix, lower heat-sink unit and fixture, described insulation cushion rubber even thickness, described upper insulating material matrix is arranged at described insulation cushion rubber top, described lower insulating material matrix is arranged at described insulation cushion rubber below, described upper heat-sink unit is arranged at described upper insulating material matrix top, described lower heat-sink unit is arranged at described lower insulating material matrix below, described upper heat-sink unit, upper insulating material matrix, insulation cushion rubber, the correspondence position of lower insulating material matrix and lower heat-sink unit is provided with a through hole, described through hole has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture makes it fixing through described through hole,
Preferably, described upper heat-sink unit and lower heat-sink unit compare to described insulation cushion rubber and are symmetrical arranged;
Preferably, described upper heat-sink unit comprises the first planar metallic matrix and multiple the first fin, the size of described the first planar metallic matrix is not less than the size of described upper insulating material matrix, described multiple the first fin is equidistant to be vertically installed in above described the first planar metallic matrix, wherein two described the first fin are arranged at respectively the both sides of described the first planar metallic matrix, and are provided with connection draw-in groove in first fin one end away from described the first planar metallic matrix;
Preferably, described the first fin is aluminum alloy heat sink;
Preferably, described lower heat-sink unit comprises the second planar metallic matrix and multiple the second fin, the size of described the second planar metallic matrix is not less than the size of described lower insulating material matrix, described multiple the second fin is equidistant to be vertically installed in below described the second planar metallic matrix, wherein two described the second fin are arranged at respectively the both sides of described the second planar metallic matrix, and are provided with connection draw-in groove in second fin one end away from described the second planar metallic matrix;
Preferably, described the second fin is aluminum alloy heat sink;
Preferably, described upper insulating material matrix is mica sheet;
Preferably, described lower insulating material matrix is mica sheet;
Preferably, described fixture is the combination of screw or bolts and nuts;
Preferably, described structure can be arranged many groups in parallel continuously;
The utlity model has following beneficial effect:
1. reasonable in design, simple in structure, low cost of manufacture, easy to install;
2. area of dissipation is large, and electric conversion efficiency is high, Same Efficieney, and temperature rise is faster; Equal temperature rise, power consumption is still less; Than conventional electric heater energy saving more;
3. temperature rise is fast, and one point of kind can reach maximum heat, heats rapidly indoor temperature;
4. thermal source is soft, not scorching, and not oxygen consumption does not reduce indoor air humidity, and body heating is more comfortable;
5. noiselessness, free from extraneous odour, without light pollution, environmentally-friendly sanitary, suitable high-quality life is used;
6. full parallel circuits design, durable in use, the life-span is long;
7. warm start electric current is little, proof voltage impacts, patience heat-flash starting current is little, proof voltage impacts, corrosion resistance is strong, reliability is high, long-life safety, can reach up to ten thousand hours through the semiconductor heating components and parts life of product of design;
8. material is frivolous, and supporting electric equipment products are handsome in appearance;
9. thermal inertia is little, synchronously heats up, and thermal field is even, is easy to accurate temperature controlling, also can be used for the heating of subzero temperature environment.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the present application, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiment of the application, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing;
Fig. 1 is the structure front view of a kind of semiconductor heating of the utility model components and parts;
Fig. 2 is the structure vertical view of a kind of semiconductor heating of the utility model components and parts;
[main symbol description]
Heat-sink unit on 1
Insulating material matrix on 2
3 insulation cushion rubbers
4 times insulating material matrixes
5 times heat-sink units
6 fixtures
7 through holes
8 connect draw-in groove
11 first planar metallic matrixes
12 first fin
51 second planar metallic matrixes
52 second fin
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiment.Based on the embodiment in the application, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the application's protection;
Referring to Fig. 1 and Fig. 2, the utility model has disclosed a kind of structure of semiconductor heating components and parts, comprise heat-sink unit 1, upper insulating material matrix 2, insulation cushion rubber 3, lower insulating material matrix 4, lower heat-sink unit 5 and fixture 6, described insulation cushion rubber 3 even thickness, described upper insulating material matrix 2 is arranged at described insulation cushion rubber 3 tops, described lower insulating material matrix 4 is arranged at described insulation cushion rubber 3 belows, described upper heat-sink unit 1 is arranged at described upper insulating material matrix 2 tops, described lower heat-sink unit 5 is arranged at described lower insulating material matrix 4 belows, described upper heat-sink unit 1, upper insulating material matrix 2, insulation cushion rubber 3, the correspondence position of lower insulating material matrix 4 and lower heat-sink unit 5 is provided with a through hole 7, described through hole 7 has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture 6 makes it fixing through described through hole 7,
In the present embodiment, described upper heat-sink unit 1 comprises the first planar metallic matrix 11 and multiple the first fin 12, the size of described the first planar metallic matrix 11 is not less than the size of described upper insulating material matrix 2, described multiple the first fin 12 is vertically installed in described the first planar metallic matrix 11 tops, preferably, described multiple the first fin 12 is equidistant is vertically installed in described the first planar metallic matrix 11 tops.Wherein two described the first fin 12 are arranged at respectively the both sides of described the first planar metallic matrix 11, and are being provided with connection draw-in groove 8 away from first fin 12 one end of described the first planar metallic matrix 11;
Preferably, described upper heat-sink unit 1 compares to described insulation cushion rubber 3 with lower heat-sink unit 5 and is symmetrical arranged.Be that described lower heat-sink unit 5 comprises the second planar metallic matrix 51 and multiple the second fin 52 equally, the size of described the second planar metallic matrix 51 is not less than the size of described lower insulating material matrix 4, described multiple the second fin 52 is vertically installed in described the second planar metallic matrix 51 belows, preferably, described multiple the second fin 52 is equidistant is vertically installed in described the second planar metallic matrix 51 belows.Wherein two described the second fin 52 are arranged at respectively the both sides of described the second planar metallic matrix 51, and are being provided with connection draw-in groove 8 away from second fin 52 one end of described the second planar metallic matrix 51;
Preferably, described the first fin 12 and the second fin 52 all adopt aluminum alloy material, and material is frivolous.The equidistant top of the first planar metallic matrix 11 and the below of the second planar metallic matrix 51 of being vertically installed in equably of described the first fin 12 and the second fin 52, area of dissipation is large, the heat efficiency is high, thermal source is soft, not scorching, not oxygen consumption, does not reduce indoor air humidity, and body heating is more comfortable;
In the present embodiment, described the first planar metallic matrix 11, upper insulating material matrix 2, insulation cushion rubber 3, lower insulating material matrix 4 and the second planar metallic matrix 51 are connected as a single entity by through hole 7, shape is designed to rectangle, describedly evenly be arranged at rectangular four corners containing female through hole 7, be easy to fix, the fixed structure adopting is the combination of screw or the bolts and nuts of mechanical connection, this kind of connected mode compares to the adhesion process of available technology adopting, be difficult for layering, and difficult drop-off, free from extraneous odour when high temperature, more environmental protection, and owing to adopting insulation cushion rubber 3 in this structure, more difficult loosening,
In prior art, heating wire is wire heating, and area of dissipation is little, in the present embodiment, semiconductor heating components and parts are that upper and lower insulating material matrix adopts mica sheet, described mica sheet size dimension is equal to the size of the first planar metallic matrix 11 and the second planar metallic matrix 51, planar heating, and area of dissipation is large, electric conversion efficiency is high, Same Efficieney, equal temperature rise, than the better energy saving of traditional electrical thermal element;
Preferably, the structure of above-mentioned semiconductor heating components and parts can be arranged many groups in parallel continuously, is applicable to heat on a large scale environment, and area of dissipation is larger, can heat rapidly indoor temperature;
Those skilled in the art should be understood that the utility model can not depart from spirit or scope of the present utility model with many other concrete forms realizations.Although already described embodiment of the present utility model, should understand the utility model and should not be restricted to these embodiment, within these practical spirit and scope that those skilled in the art can define as appended claims, make and changing and amendment.The changes that any person skilled in the art can think of, all should drop in the application's protection range.
Claims (10)
1. the structure of semiconductor heating components and parts, it is characterized in that, comprise heat-sink unit, upper insulating material matrix, insulation cushion rubber, lower insulating material matrix, lower heat-sink unit and fixture, described insulation cushion rubber even thickness, described upper insulating material matrix is arranged at described insulation cushion rubber top, described lower insulating material matrix is arranged at described insulation cushion rubber below, described upper heat-sink unit is arranged at described upper insulating material matrix top, described lower heat-sink unit is arranged at described lower insulating material matrix below, described upper heat-sink unit, upper insulating material matrix, insulation cushion rubber, the correspondence position of lower insulating material matrix and lower heat-sink unit is provided with a through hole, described through hole has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture makes it fixing through described through hole.
2. the structure of a kind of semiconductor heating components and parts as claimed in claim 1, is characterized in that, described upper heat-sink unit and lower heat-sink unit compare to described insulation cushion rubber and be symmetrical arranged.
3. the structure of a kind of semiconductor heating components and parts as claimed in claim 1, it is characterized in that, described upper heat-sink unit comprises the first planar metallic matrix and multiple the first fin, the size of described the first planar metallic matrix is not less than the size of described upper insulating material matrix, described multiple the first fin is equidistant to be vertically installed in above described the first planar metallic matrix, wherein two described the first fin are arranged at respectively the both sides of described the first planar metallic matrix, and are provided with connection draw-in groove in first fin one end away from described the first planar metallic matrix.
4. the structure of a kind of semiconductor heating components and parts as claimed in claim 3, is characterized in that, described the first fin is aluminum alloy heat sink.
5. the structure of a kind of semiconductor heating components and parts as claimed in claim 1, it is characterized in that, described lower heat-sink unit comprises the second planar metallic matrix and multiple the second fin, the size of described the second planar metallic matrix is not less than the size of described lower insulating material matrix, described multiple the second fin is equidistant to be vertically installed in below described the second planar metallic matrix, wherein two described the second fin are arranged at respectively the both sides of described the second planar metallic matrix, and are provided with connection draw-in groove in second fin one end away from described the second planar metallic matrix.
6. the structure of a kind of semiconductor heating components and parts as claimed in claim 5, is characterized in that, described the second fin is aluminum alloy heat sink.
7. the structure of a kind of semiconductor heating components and parts as claimed in claim 1, is characterized in that, described upper insulating material matrix is mica sheet.
8. the structure of a kind of semiconductor heating components and parts as claimed in claim 1, is characterized in that, described lower insulating material matrix is mica sheet.
9. the structure of a kind of semiconductor heating components and parts as claimed in claim 1, is characterized in that, described fixture is the combination of screw or bolts and nuts.
10. the structure of any semiconductor heating components and parts as described in claim 1 ~ 9, is characterized in that, described structure can be arranged many groups in parallel continuously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420320147.4U CN204014102U (en) | 2014-06-17 | 2014-06-17 | A kind of structure of semiconductor heating components and parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420320147.4U CN204014102U (en) | 2014-06-17 | 2014-06-17 | A kind of structure of semiconductor heating components and parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204014102U true CN204014102U (en) | 2014-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420320147.4U Expired - Fee Related CN204014102U (en) | 2014-06-17 | 2014-06-17 | A kind of structure of semiconductor heating components and parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204014102U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104010390A (en) * | 2014-06-17 | 2014-08-27 | 梁卫兵 | Structure of semiconductor heating component |
-
2014
- 2014-06-17 CN CN201420320147.4U patent/CN204014102U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104010390A (en) * | 2014-06-17 | 2014-08-27 | 梁卫兵 | Structure of semiconductor heating component |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20150617 |
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| EXPY | Termination of patent right or utility model |