CN105228271A - A kind of structure of micro-crystal plate mica sheet semiconductor heating components and parts - Google Patents
A kind of structure of micro-crystal plate mica sheet semiconductor heating components and parts Download PDFInfo
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- CN105228271A CN105228271A CN201410267451.1A CN201410267451A CN105228271A CN 105228271 A CN105228271 A CN 105228271A CN 201410267451 A CN201410267451 A CN 201410267451A CN 105228271 A CN105228271 A CN 105228271A
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- insulating material
- material matrix
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Abstract
The invention discloses a kind of micro-crystal plate mica sheet semiconductor heating component structure, comprise heat-sink unit, upper insulating material matrix, lower insulating material matrix, lower heat-sink unit and fixture, upper insulating material matrix is arranged at the top of lower insulating material matrix, lower insulating material matrix is arranged at the below of insulating material matrix, upper heat-sink unit is arranged at above insulating material matrix, lower heat-sink unit is arranged at below lower insulating material matrix, described upper heat-sink unit, upper insulating material matrix, the correspondence position of lower insulating material matrix and lower heat-sink unit is provided with a through hole, through hole has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture makes it fixing through described through hole.The present invention has that structure is simple, energy-efficient, the life-span is long, comfort level is high, quick heating, thermal source are soft, security performance is high, health environment-friendly, low temperature radiation, maintenance humidity feature, be mainly used in heating of house.
Description
Technical field
The invention belongs to electric-heating technology field, particularly relate to a kind of micro-crystal plate mica sheet semiconductor heating component structure.
Background technology
Existing electric heater is stacked primarily of mica fin, resistor disc or resistance wire, consist of riveted joint bonding, extraction electrode, surrounding cornerite, just like application number be 200420067475.4, denomination of invention is the patent application of electric heater, a kind of electric heater, comprise mica sheet, resistor disc, it is characterized in that described resistor disc both sides are provided with mica sheet, between described mica sheet and mica sheet and and resistor disc between bonded together by bonding agent.The heater of this patent is poor apart from radiating effect, beyond the defect of complex structure, manufacturability difference, after also there is thermal shock, material binding structure such as to become slack at the potential safety hazard, heat up after moisture test and have peculiar smell generation, resistor disc (silk) life-span is short, the defects such as mechanical resistant impact difference, can only use at cryosphere by structure influence, range of application is very limited;
Traditional heating wire, halide torch etc., because radiating surface is little, indirectly conducting by other objects with heated object, in electric heating transfer process, the heat energy that electric energy produces can not pass to heated object very soon, and cause heat on electric heating element too concentrated, element itself becomes red-hot very soon, the very large some of electric energy becomes luminous energy and scatters and disappears, and causes electric heating conduction efficiency lower.General heating wire always uses under red-hot state, so be easy to produce oxidation, make resistance more and more thinner, more and more crisp, finally causes open circuit.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of micro-crystal plate mica sheet semiconductor heating component structure, have that structure is simple, energy-efficient, the life-span is long, comfort level is high, quick heating, thermal source are soft, security performance is high, health environment-friendly, low temperature radiation, maintenance humidity feature;
Present invention employs following technical scheme:
A kind of micro-crystal plate mica sheet semiconductor heating component structure, comprise heat-sink unit, upper insulating material matrix, lower insulating material matrix, lower heat-sink unit and fixture, described upper insulating material matrix is arranged at the top of lower insulating material matrix, lower insulating material matrix is arranged at the below of insulating material matrix, upper heat-sink unit is arranged at above insulating material matrix, lower heat-sink unit is arranged at below lower insulating material matrix, described upper heat-sink unit, upper insulating material matrix, the correspondence position of lower insulating material matrix and lower heat-sink unit is provided with a through hole, described through hole has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture makes it fixing through described through hole,
Preferably, described upper heat-sink unit and lower heat-sink unit compare to described insulating material matrix and are symmetrical arranged;
Preferably, described upper heat-sink unit comprises the first planar metallic matrix and multiple first fin, the size of described first planar metallic matrix is not less than the size of described upper insulating material matrix, described multiple first fin is equidistant to be vertically installed in above described first planar metallic matrix, wherein the first fin described in two panels is arranged at the both sides of described first planar metallic matrix respectively, and first fin one end away from described first planar metallic matrix is provided with connection draw-in groove;
Preferably, described first fin is aluminum alloy heat sink;
Preferably, described lower heat-sink unit comprises the second planar metallic matrix and multiple second fin, the size of described second planar metallic matrix is not less than the size of described lower insulating material matrix, described multiple second fin is equidistant to be vertically installed in below described second planar metallic matrix, wherein the second fin described in two panels is arranged at the both sides of described second planar metallic matrix respectively, and second fin one end away from described second planar metallic matrix is provided with connection draw-in groove;
Preferably, described second fin is aluminum alloy heat sink;
Preferably, described upper insulating material matrix is mica sheet;
Preferably, described lower insulating material matrix is mica sheet;
Preferably, described fixture is the combination of screw or bolts and nuts;
Preferably, described structure can be arranged many groups in parallel continuously;
The present invention has following beneficial effect:
1. simple, the low cost of manufacture of reasonable in design, structure, easy to install;
2. area of dissipation is large, and electric conversion efficiency is high, Same Efficieney, and temperature rise is faster; Equal temperature rise, power consumption is less; Than conventional electric heater energy saving more;
3. temperature rise is fast, and one point of kind can reach maximum heat, heats indoor temperature rapidly;
4. thermal source is soft, not scorching, and not oxygen consumption, does not reduce indoor air humidity, and body heating is more comfortable;
5. noiselessness, free from extraneous odour, without light pollution, environmentally-friendly sanitary, suitable high-quality life uses;
6. full parallel circuit design, durable in use, the life-span is long;
7. warm start electric current is little, proof voltage impacts, patience heat-flash starting current is little, proof voltage impacts, corrosion resistance is strong, reliability is high, long-life safety, and the semiconductor heating components and parts life of product through design can reach up to ten thousand hours;
8. material is frivolous, and supporting electric equipment products are handsome in appearance;
9. thermal inertia is little, synchronously heats up, and thermal field is even, is easy to accurate temperature controlling, also can be used for the heating of subzero temperature environment.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present application, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings;
Fig. 1 is the structure-improved front view of a kind of micro-crystal plate mica sheet of the present invention semiconductor heating components and parts;
Fig. 2 is the structure-improved vertical view of a kind of micro-crystal plate mica sheet of the present invention semiconductor heating components and parts;
[primary symbols explanation]
Heat-sink unit on 1
Insulating material matrix on 2
4 times insulating material matrix
5 times heat-sink units
6 fixtures
7 through holes
8 connect draw-in groove
11 first planar metallic matrixes
12 first fin
51 second planar metallic matrixes
52 second fin
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, be clearly and completely described the technical scheme in the embodiment of the present application, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the application's protection;
See Fig. 1 and Fig. 2, disclosed herein the structure of a kind of micro-crystal plate mica sheet semiconductor heating components and parts, comprise heat-sink unit 1, upper insulating material matrix 2, lower insulating material matrix 4, lower heat-sink unit 5 and fixture 6, described upper insulating material matrix 2 is arranged at the top of lower insulating material matrix 4, lower insulating material matrix 4 is arranged at the below of insulating material matrix 2, upper heat-sink unit 1 is arranged at above insulating material matrix 2, lower heat-sink unit 5 is arranged at below lower insulating material matrix 4, described upper heat-sink unit 1, upper insulating material matrix 2, the correspondence position of lower insulating material matrix 4 and lower heat-sink unit 5 is provided with a through hole 7, described through hole 7 has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture 6 makes it fixing through described through hole 7,
In the present embodiment, described upper heat-sink unit 1 comprises the first planar metallic matrix 11 and multiple first fin 12, the size of described first planar metallic matrix 11 is not less than the size of described upper insulating material matrix 2, described multiple first fin 12 is vertically installed in above described first planar metallic matrix 11, preferably, described multiple first fin 12 is equidistant is vertically installed in above described first planar metallic matrix 11.Wherein the first fin 12 described in two panels is arranged at the both sides of described first planar metallic matrix 11 respectively, and is provided with connection draw-in groove 8 in first fin 12 one end away from described first planar metallic matrix 11;
Preferably, described upper heat-sink unit 1 and lower heat-sink unit 5 compare to described insulation cushion rubber 3 and are symmetrical arranged.Namely described lower heat-sink unit 5 comprises the second planar metallic matrix 51 and multiple second fin 52 equally, the size of described second planar metallic matrix 51 is not less than the size of described lower insulating material matrix 4, described multiple second fin 52 is vertically installed in below described second planar metallic matrix 51, preferably, described multiple second fin 52 is equidistant is vertically installed in below described second planar metallic matrix 51.Wherein the second fin 52 described in two panels is arranged at the both sides of described second planar metallic matrix 51 respectively, and is provided with connection draw-in groove 8 in second fin 52 one end away from described second planar metallic matrix 51;
Preferably, described first fin 12 and the second fin 52 all adopt aluminum alloy material, and material is frivolous.Described first fin 12 and the second fin 52 is equidistant is vertically installed in the top of the first planar metallic matrix 11 and the below of the second planar metallic matrix 51 equably, area of dissipation is large, the heat efficiency is high, thermal source is soft, not scorching, not oxygen consumption, does not reduce indoor air humidity, and body heating is more comfortable;
In the present embodiment, described first planar metallic matrix 11, upper insulating material matrix 2, lower insulating material matrix 4 and the second planar metallic matrix 51 are connected as a single entity by through hole 7, profile design is rectangle, describedly evenly be arranged at rectangular four corners containing female through hole 7, be easy to fixing, the fixed structure adopted is the screw of mechanical connection or the combination of bolts and nuts, this kind of connected mode compares to the adhesion process adopted in prior art, not easily layering, and difficult drop-off, free from extraneous odour during high temperature, more environmental protection, not easily loosen;
In prior art, heating wire is wire heating, and area of dissipation is little, in the present embodiment, semiconductor heating components and parts and upper and lower insulating material matrix adopt mica sheet, described mica sheet size dimension is equal to the size of the first planar metallic matrix 11 and the second planar metallic matrix 51, planar heating, and area of dissipation is large, electric conversion efficiency is high, Same Efficieney, equal temperature rise, energy saving better for traditional electrical thermal element;
Preferably, the structure of above-mentioned micro-crystal plate mica sheet semiconductor heating components and parts can be arranged many groups in parallel continuously, and be applicable to heat on a large scale environment, area of dissipation is larger, can heat indoor temperature rapidly;
Those skilled in the art should be understood that the present invention can realize with other concrete forms many and not depart from the spirit or scope of the present invention.Although already describe embodiments of the invention, the present invention should be understood and should not be restricted to these embodiments, within the spirit and scope of the invention that those skilled in the art can define as appended claims, make change and amendment.The changes that any person skilled in the art can think of, all should drop in the protection range of the application.
Claims (10)
1. a micro-crystal plate mica sheet semiconductor heating component structure, it is characterized in that, comprise heat-sink unit, upper insulating material matrix, lower insulating material matrix, lower heat-sink unit and fixture, upper insulating material matrix is arranged at the top of lower insulating material matrix, lower insulating material matrix is arranged at the below of insulating material matrix, upper heat-sink unit is arranged at above insulating material matrix, lower heat-sink unit is arranged at below lower insulating material matrix, described upper heat-sink unit, upper insulating material matrix, the correspondence position of lower insulating material matrix and lower heat-sink unit is provided with a through hole, described through hole has internal thread, and be uniformly distributed in the surrounding of described upper and lower heat-sink unit, described fixture makes it fixing through described through hole.
2. the structure of a kind of micro-crystal plate mica sheet semiconductor heating components and parts as claimed in claim 1, it is characterized in that, described upper heat-sink unit and lower heat-sink unit compare to described insulating material matrix and are symmetrical arranged.
3. a kind of micro-crystal plate mica sheet semiconductor heating component structure as claimed in claim 1, it is characterized in that, described upper heat-sink unit comprises the first planar metallic matrix and multiple first fin, the size of described first planar metallic matrix is not less than the size of described upper insulating material matrix, described multiple first fin is equidistant to be vertically installed in above described first planar metallic matrix, wherein the first fin described in two panels is arranged at the both sides of described first planar metallic matrix respectively, and first fin one end away from described first planar metallic matrix is provided with connection draw-in groove.
4. a kind of micro-crystal plate mica sheet semiconductor heating component structure as claimed in claim 3, it is characterized in that, described first fin is aluminum alloy heat sink.
5. a kind of micro-crystal plate mica sheet semiconductor heating component structure as claimed in claim 1, it is characterized in that, described lower heat-sink unit comprises the second planar metallic matrix and multiple second fin, the size of described second planar metallic matrix is not less than the size of described lower insulating material matrix, described multiple second fin is equidistant to be vertically installed in below described second planar metallic matrix, wherein the second fin described in two panels is arranged at the both sides of described second planar metallic matrix respectively, and second fin one end away from described second planar metallic matrix is provided with connection draw-in groove.
6. a kind of micro-crystal plate mica sheet semiconductor heating component structure as claimed in claim 6, it is characterized in that, described second fin is aluminum alloy heat sink.
7. a kind of micro-crystal plate mica sheet semiconductor heating component structure as claimed in claim 1, it is characterized in that, described upper insulating material matrix is mica sheet.
8. a kind of micro-crystal plate mica sheet semiconductor heating component structure as claimed in claim 1, it is characterized in that, described lower insulating material matrix is mica sheet.
9. a kind of micro-crystal plate mica sheet semiconductor heating component structure as claimed in claim 1, it is characterized in that, described fixture is the combination of screw or bolts and nuts.
10. any the micro-crystal plate mica sheet semiconductor heating component structure as described in claim 1 ~ 9, it is characterized in that, described structure can be arranged many groups in parallel continuously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410267451.1A CN105228271A (en) | 2014-06-17 | 2014-06-17 | A kind of structure of micro-crystal plate mica sheet semiconductor heating components and parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410267451.1A CN105228271A (en) | 2014-06-17 | 2014-06-17 | A kind of structure of micro-crystal plate mica sheet semiconductor heating components and parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105228271A true CN105228271A (en) | 2016-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410267451.1A Pending CN105228271A (en) | 2014-06-17 | 2014-06-17 | A kind of structure of micro-crystal plate mica sheet semiconductor heating components and parts |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07103498A (en) * | 1993-07-01 | 1995-04-18 | Hazama Gumi Ltd | Radiation panel and wall-mounted heater |
| CN2786900Y (en) * | 2005-04-08 | 2006-06-07 | 郜长福 | Wing piece type PTC heating apparatus |
| CN201054802Y (en) * | 2007-03-20 | 2008-04-30 | 林少东 | Mica slice electric heating plate |
-
2014
- 2014-06-17 CN CN201410267451.1A patent/CN105228271A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07103498A (en) * | 1993-07-01 | 1995-04-18 | Hazama Gumi Ltd | Radiation panel and wall-mounted heater |
| CN2786900Y (en) * | 2005-04-08 | 2006-06-07 | 郜长福 | Wing piece type PTC heating apparatus |
| CN201054802Y (en) * | 2007-03-20 | 2008-04-30 | 林少东 | Mica slice electric heating plate |
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Application publication date: 20160106 |