CN203928105U - A kind of structure of ceramic honeycomb pipe semiconductor heating components and parts - Google Patents
A kind of structure of ceramic honeycomb pipe semiconductor heating components and parts Download PDFInfo
- Publication number
- CN203928105U CN203928105U CN201420320149.3U CN201420320149U CN203928105U CN 203928105 U CN203928105 U CN 203928105U CN 201420320149 U CN201420320149 U CN 201420320149U CN 203928105 U CN203928105 U CN 203928105U
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- ceramic honeycomb
- material matrix
- heating components
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Abstract
The utility model discloses a kind of structure of ceramic honeycomb pipe semiconductor heating components and parts, comprise electrode, heat conductor material matrix, insulator, temperature controller, plastic insulation, fixture and binding post, heat conductor material matrix outer ring is insulator, plastic insulation is arranged at whole periphery, temperature controller be arranged at total in the middle of, between described upper/lower electrode, correspondence position is provided with a through hole, through hole has internal thread, and be uniformly distributed in the side of wear-resisting corrosion material matrix, structure surrounding is also provided with a through hole, through hole has internal thread, described fixture makes it fixing through described through hole, the fixture of surrounding structure is connecting binding post.The utlity model has simple in structure, energy-efficient, the life-span is long, comfort level is high, quick heating, thermal source is soft, security performance is high, the feature of health environment-friendly, low temperature radiation, maintenance humidity, is mainly used in heating of house.
Description
Technical field
The utility model belongs to electric-heating technology field, relates in particular to a kind of structure of ceramic honeycomb pipe semiconductor heating components and parts.
Background technology
Existing electric heater is mainly by electric heating substrate, electric heating film, pottery chassis, and electrode forms, just like application number, be 200910190462.3, denomination of invention is a kind of patent application of Novel ceramic electric heater, a kind of Novel ceramic electric heater, it includes electric heating substrate, electric heating film, pottery chassis, and electrode, in electric heating substrate lower flat, has electric heating film, configured electrodes on electric heating film, the bottom of electric heating film is provided with ceramic chassis, electrode is drawn from ceramic chassis, thus, electric heating film can produce heat from electric heating substrate bottom most surfaces, heat can balancedly pass out by electric heating substrate.The heater of this patent is poor apart from radiating effect, beyond the poor defect of complex structure, manufacturability, also there is the potential safety hazards such as material binding structure becomes slack after thermal shock, after moisture test, heat up and have peculiar smell generation, the defects such as resistance to mechanical impact property is poor, can only use at cryosphere by structure influence, range of application is very limited;
Traditional heating wire, halide torch etc., because radiating surface is little, indirectly conducting by other objects with heated object, in electric heating transfer process, the heat energy that electric energy produces can not be passed to heated object very soon, causes on heating heat too concentrated, and it is red-hot that element itself becomes very soon, the very large some of electric energy becomes luminous energy and scatters and disappears, and causes electric heating conduction efficiency lower.General heating wire is always used under red-hot state, so be easy to produce oxidation, makes resistance more and more thinner, more and more crisp, finally causes and opens circuit.
Summary of the invention
For solving the problems of the technologies described above, the utility model provides the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts, have simple in structure, energy-efficient, the life-span is long, comfort level is high, quick heating, thermal source is soft, security performance is high, the feature of health environment-friendly, low temperature radiation, maintenance humidity;
The utility model has adopted following technical scheme:
A kind of structure of ceramic honeycomb pipe semiconductor heating components and parts, comprise electrode, heat conductor material matrix, insulator, temperature controller, plastic insulation, fixture and binding post, heat conductor material matrix outer ring is insulator, plastic insulation is arranged at whole periphery, temperature controller be arranged at total in the middle of, between described upper/lower electrode, correspondence position is provided with a through hole, through hole has internal thread, and be uniformly distributed in the side of heat conductor material matrix, structure surrounding is also provided with a through hole, through hole has internal thread, described fixture makes it fixing through described through hole, the fixture of surrounding structure is connecting binding post,
Preferably, described electrode, heat conductor material matrix, insulator, plastic insulation is symmetrical arranged up and down;
Preferably, described heat conductor material matrix outer ring is insulator, and upper/lower electrode is tightly cut insulator;
Preferably, described temperature controller be arranged at total in the middle of;
Preferably, between described upper/lower electrode, correspondence position is provided with a through hole, and through hole has internal thread, and fixture makes it fixing through described through hole;
Preferably, the fixture of described surrounding structure is connecting binding post;
Preferably, described heat conductor material matrix is earthenware;
Preferably, described fixture is the combination of screw or bolts and nuts;
Preferably, described structure can be arranged many groups in parallel continuously;
The present invention has following beneficial effect:
1. reasonable in design, simple in structure, low cost of manufacture, easy to install;
2. area of dissipation is large, and electric conversion efficiency is high, Same Efficieney, and temperature rise is faster; Equal temperature rise, power consumption is still less; Than conventional electric heater energy saving more;
3. temperature rise is fast, and within one minute, kind can reach maximum heat, heats rapidly indoor temperature;
4. thermal source is soft, not scorching, and oxygen consumption, does not reduce indoor air humidity, and body heating is more comfortable;
5. noiselessness, free from extraneous odour, without light pollution, environmentally-friendly sanitary, suitable high-quality life is used;
6. full parallel circuit design, durable in use, the life-span is long;
7. thermal starting electric current is little, proof voltage impacts, patience heat-flash starting current is little, proof voltage impacts, corrosion resistance is strong, reliability is high, long-life safety, and the semiconductor heating components and parts life of product through designing can reach up to ten thousand hours;
8. material is frivolous, and supporting electric equipment products are handsome in appearance;
9. thermal inertia is little, synchronously heats up, and thermal field is even, is easy to accurate temperature controlling, also can be used for the heating of subzero temperature environment.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present application, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiment of the application, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing;
Fig. 1 is the structure front view of a kind of ceramic honeycomb pipe of the utility model semiconductor heating components and parts;
[main symbol description]
1 plastic insulation
2 temperature controllers
3 electrodes
4 fixtures
5 insulators
6 electrodes
7 heat conductor material matrix
8 binding posts
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only the application's part embodiment, rather than whole embodiment.Embodiment based in the application, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the application's protection;
Referring to Fig. 1 and Fig. 2, the utility model has disclosed a kind of structure of ceramic honeycomb pipe semiconductor heating components and parts, comprise electrode 3, heat conductor material matrix 7, insulator 5, temperature controller 2, plastic insulation 1, fixture 4 and binding post 8, described heat conductor material matrix 7 outer rings are insulator 5, plastic insulation 1 is arranged at whole periphery, temperature controller 2 be arranged at total in the middle of, described electrode 3, between heat conductor material matrix 7, correspondence position is provided with a through hole, through hole has internal thread, and be uniformly distributed in the side of heat conductor material matrix, structure surrounding is also provided with a through hole, through hole has internal thread, described fixture 4 makes it fixing through described through hole, the fixture of surrounding structure is connecting binding post 8,
In the present embodiment, described electrode, heat conductor material matrix, insulator, plastic insulation is symmetrical arranged up and down;
Preferably, described heat conductor material matrix outer ring is insulator, and upper/lower electrode is tightly cut insulator;
Preferably, described heat conductor material matrix, material is frivolous.Described upper/lower electrode is tightly cut insulator, and area of dissipation is large, and the thermal efficiency is high, and thermal source is soft, not scorching, and oxygen consumption, does not reduce indoor air humidity, and body heating is more comfortable;
In the present embodiment, described upper/lower electrode 3, by through hole, be connected as a single entity, shape is designed to rectangle, and the described side that is evenly arranged at rectangular four corners and heat conductor material matrix containing female through hole, is easy to fix, the fixed structure adopting is the combination of screw or the bolts and nuts of mechanical connection, this kind of connected mode compares to the adhesion process of available technology adopting, is difficult for layering, and difficult drop-off, free from extraneous odour during high temperature, more environmental protection;
In prior art, heating wire is wire heating, and area of dissipation is little, in the present embodiment, semiconductor heating components and parts are that upper and lower heat conductor material matrix adopts earthenware, planar heating, and area of dissipation is large, and electric conversion efficiency is high, Same Efficieney, equal temperature rise, than the better energy saving of traditional electrical thermal element;
Preferably, the structure of above-mentioned semiconductor heating components and parts can be arranged many groups in parallel continuously, is applicable to heat on a large scale environment, and area of dissipation is larger, can heat rapidly indoor temperature;
Those skilled in the art should be understood that the utility model can not depart from spirit or scope of the present utility model with many other concrete forms realizations.Although already described embodiment of the present utility model, the utility model should be understood and these embodiment should be restricted to, within the utility model spirit and scope that those skilled in the art can define as appended claims, make and change and revise.The changes that any person skilled in the art can think of, all should drop in the application's protection domain.
Claims (9)
1. the structure of ceramic honeycomb pipe semiconductor heating components and parts, it is characterized in that, comprise electrode, heat conductor material matrix, insulator, temperature controller, plastic insulation, fixture and binding post, heat conductor material matrix outer ring is insulator, plastic insulation is arranged at whole periphery, temperature controller be arranged at total in the middle of, between described upper/lower electrode, correspondence position is provided with a through hole, through hole has internal thread, and be uniformly distributed in the side of heat conductor material matrix, structure surrounding is also provided with a through hole, through hole has internal thread, described fixture makes it fixing through described through hole, the fixture of surrounding structure is connecting binding post.
2. the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts as claimed in claim 1, is characterized in that, described electrode, and heat conductor material matrix, insulator, plastic insulation is symmetrical arranged up and down.
3. the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts as claimed in claim 1, is characterized in that, described heat conductor material matrix outer ring is insulator, and upper/lower electrode is tightly cut insulator.
4. the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts as claimed in claim 1, is characterized in that, described temperature controller be arranged at total in the middle of.
5. the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts as claimed in claim 1, is characterized in that, between described upper/lower electrode, correspondence position is provided with a through hole, and through hole has internal thread, and fixture makes it fixing through described through hole.
6. the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts as claimed in claim 1, is characterized in that, the fixture of described surrounding structure is connecting binding post.
7. the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts as claimed in claim 1, is characterized in that, described heat conductor material matrix is earthenware.
8. the structure of a kind of ceramic honeycomb pipe semiconductor heating components and parts as claimed in claim 1, is characterized in that, described fixture is the combination of screw or bolts and nuts.
9. the structure of any ceramic honeycomb pipe semiconductor heating components and parts as described in claim 1 ~ 8, is characterized in that, described structure can be arranged many groups in parallel continuously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420320149.3U CN203928105U (en) | 2014-06-17 | 2014-06-17 | A kind of structure of ceramic honeycomb pipe semiconductor heating components and parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420320149.3U CN203928105U (en) | 2014-06-17 | 2014-06-17 | A kind of structure of ceramic honeycomb pipe semiconductor heating components and parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203928105U true CN203928105U (en) | 2014-11-05 |
Family
ID=51823909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420320149.3U Expired - Fee Related CN203928105U (en) | 2014-06-17 | 2014-06-17 | A kind of structure of ceramic honeycomb pipe semiconductor heating components and parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203928105U (en) |
-
2014
- 2014-06-17 CN CN201420320149.3U patent/CN203928105U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20150617 |
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| EXPY | Termination of patent right or utility model |