CN203984766U - High abrasion button wiring board - Google Patents
High abrasion button wiring board Download PDFInfo
- Publication number
- CN203984766U CN203984766U CN201420350311.6U CN201420350311U CN203984766U CN 203984766 U CN203984766 U CN 203984766U CN 201420350311 U CN201420350311 U CN 201420350311U CN 203984766 U CN203984766 U CN 203984766U
- Authority
- CN
- China
- Prior art keywords
- key mapping
- layer
- wiring board
- button
- high abrasion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The utility model relates to wiring board field, particularly high abrasion button wiring board.The utility model discloses high abrasion button wiring board, comprise by key mapping, substrate layer, line layer and solder mask, wherein can be connected with internal layer circuit or direct top layer line layer by metallization via hole by key mapping, realize the circuit function of button circuit, two the each silk-screen one deck of outer surface solder masks of wiring board, form good insulation; Described by independent nickel plating for key mapping, craft of gilding, forming abundant nickel coating and Gold plated Layer by key mapping table face, effectively improving resistance to wear and the corrosion resistance of button, performance is more stable, also reduced production cost, and be applicable to individual layer, bilayer and multilayer circuit board simultaneously.
Description
Technical field
The utility model relates to wiring board technical field, particularly high abrasion button wiring board.
Background technology
Gold-plated or the immersion process of what traditional button circuit board adopted is full plate, and below golden thickness 1.5 μ m, the one, the gold-plated production cost of full plate is higher, and immersion process gold thickness does not reach 5 μ m, and the hardness of gold is inadequate; The 2nd, useful life is not long; The 3rd, easily malfunctioning after long-term use by key mapping.
Summary of the invention
The deficiency existing for prior art, the utility model provides high abrasion button wiring board, is forming abundant nickel coating and Gold plated Layer by key mapping table face, has effectively improved resistance to wear and the corrosion resistance of button, and performance is more stable, has also reduced production cost simultaneously.
For achieving the above object, the utility model provides following technical scheme: high abrasion button wiring board, comprise by key mapping, substrate layer, line layer and solder mask, wherein can be connected with internal layer circuit layer or top layer line layer by metallization via hole by key mapping, realize the circuit function of button circuit, two the each silk-screen one deck of outer surface solder masks of wiring board.
High abrasion button wiring board described in the utility model, can be wherein that plane is irregularly shaped arbitrarily by the shape of key mapping, first carry out Nickel Plating Treatment by key mapping table face, form the nickel coating that thickness is greater than 10 μ m, carry out gold-plated processing on nickel coating surface again, form the Gold plated Layer that thickness is greater than 5 μ m, ensured by the anti-wear performance of key mapping and corrosion resistance; Wherein by plate top layer, key mapping online design road, can be surface wherein one deck establish by key mapping or two top layers all establish by key mapping simultaneously.
Adopt the technical scheme that the utility model provides to produce following beneficial effect: described high abrasion button wiring board, wherein adopt independent electroplating technology by key mapping, first pressing key mapping table face Nickel Plating Treatment, can form the nickel coating that thickness is greater than 10 μ m, carry out gold-plated processing on nickel coating surface again, form the Gold plated Layer that thickness is greater than 5 μ m, adopt whole plate craft of gilding to form one deck Gold plated Layer compared with conventional keys wiring board, and coating is too thin, wear no resistance, useful life is short, not only coating is thick for described nickel coating by key mapping and Gold plated Layer, and coating is even, utilization rate of raw materials is high, both improved by the anti-wear performance of key mapping and corrosion resistance, reduce again production cost.
High abrasion button wiring board that the utility model provides is wherein said can be connected with internal layer circuit layer or top layer line layer by metallization via hole by key mapping, realize the circuit function of button circuit, go for lamina, doubling plate and multi-layer sheet, applied widely; Wherein said by plate top layer, key mapping online design road, can be that surface wherein one deck or two top layers has simultaneously, can meet the setting of multiple difference in functionality button.
Describe and make the utility model accurately for more clear, with instantiation, the utility model is described in detail by reference to the accompanying drawings.
Brief description of the drawings
Fig. 1 is the utility model embodiment high abrasion button circuit board structure schematic diagram.
In figure: 1 by key mapping, 11 nickel coatings, 12 Gold plated Layer, 2 substrate layers, 3 line layers, 4 solder masks.
Embodiment
The high abrasion button wiring board that the utility model embodiment provides, form abundant nickel coating 11 and Gold plated Layer 12 described by key mapping 1 surface, resistance to wear and the corrosion resistance of button are effectively improved, performance is more stable, also reduced production cost, be applicable to individual layer, bilayer and multilayer circuit board simultaneously.
Fig. 1 is the utility model embodiment high abrasion button circuit board structure schematic diagram, the high abrasion button wiring board that the present embodiment provides, comprise by key mapping 1, substrate layer 2, line layer 3 and solder mask 4, wherein can be connected with internal layer circuit layer 3 by metallization via hole by key mapping 1, realize the circuit function of button circuit, two the each silk-screen one deck of outer surface solder masks 4 of wiring board, play insulating effect.
The high abrasion button wiring board of the utility model embodiment, wherein by the square that is shaped as of key mapping 1, in the one deck of plate surface, online design road, adopt independent electroplating technology, first carry out Nickel Plating Treatment by key mapping 1 surface, form the nickel coating 11 that thickness is greater than 12 μ m, carry out gold-plated processing on nickel coating 11 surfaces again, form the Gold plated Layer 12 of thickness 6 μ m, adopt whole plate craft of gilding to form one deck Gold plated Layer compared with conventional keys wiring board, and coating is too thin, wear no resistance, useful life is short, described in the present embodiment, by the nickel coating 11 of key mapping 1 and Gold plated Layer 12, not only coating is thick, and coating is even, utilization rate of raw materials is high, both improved by the anti-wear performance of key mapping 1 and corrosion resistance, reduce again production cost.
The present embodiment is only for illustrating the use of the utility model, be not to restriction of the present utility model, those skilled in the art can also make corresponding distortion and modification in essential scope of the present utility model, and the embodiment being equal to so any belongs to category of the present utility model.
Claims (2)
1. high abrasion button wiring board, comprise by key mapping, substrate layer, line layer and solder mask, it is characterized in that: wherein can be connected with internal layer circuit layer or top layer line layer by metallization via hole by key mapping, realize the circuit function of button circuit, two the each silk-screen one deck of outer surface solder masks of wiring board.
2. high abrasion button wiring board according to claim 1, it is characterized in that: can be wherein that plane is irregularly shaped arbitrarily by the shape of key mapping, first carry out Nickel Plating Treatment by key mapping table face, form the nickel coating that thickness is greater than 10 μ m, carry out gold-plated processing on nickel coating surface again, form the Gold plated Layer that thickness is greater than 5 μ m, ensured by the anti-wear performance of key mapping and corrosion resistance; Wherein by plate top layer, key mapping online design road, can be surface wherein one deck establish by key mapping or two top layers all establish by key mapping simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420350311.6U CN203984766U (en) | 2014-06-27 | 2014-06-27 | High abrasion button wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420350311.6U CN203984766U (en) | 2014-06-27 | 2014-06-27 | High abrasion button wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203984766U true CN203984766U (en) | 2014-12-03 |
Family
ID=51982181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420350311.6U Expired - Fee Related CN203984766U (en) | 2014-06-27 | 2014-06-27 | High abrasion button wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203984766U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400715A (en) * | 2019-06-26 | 2019-11-01 | 桐城市畅润电力工程有限公司 | A kind of key circuit plate |
| CN112739074A (en) * | 2020-12-08 | 2021-04-30 | 深圳市祺利电子有限公司 | Manufacturing method of wear-resistant circuit board and wear-resistant circuit board |
-
2014
- 2014-06-27 CN CN201420350311.6U patent/CN203984766U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110400715A (en) * | 2019-06-26 | 2019-11-01 | 桐城市畅润电力工程有限公司 | A kind of key circuit plate |
| CN112739074A (en) * | 2020-12-08 | 2021-04-30 | 深圳市祺利电子有限公司 | Manufacturing method of wear-resistant circuit board and wear-resistant circuit board |
| CN112739074B (en) * | 2020-12-08 | 2021-12-07 | 深圳市祺利电子有限公司 | Manufacturing method of wear-resistant circuit board and wear-resistant circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104962965B (en) | The environment-friendly type ashing handling process of rolled copper foil | |
| TW200702162A (en) | Fiber-rein composite, laminate article, and board for printed wiring, and method for producing board for printed wiring | |
| CN203984766U (en) | High abrasion button wiring board | |
| CN103014799B (en) | A kind of circuit board plating process of burn-out-proof plate | |
| TW200610466A (en) | Method for fabricating conductive bumps of a circuit board | |
| CN103025066B (en) | A kind of preparation method of metal base single-sided doubling plate | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) | |
| CN204362410U (en) | A kind of Ni-Pd alloy coating wiring board | |
| CN204079805U (en) | Secondary glaze spraying production line | |
| JP2015030162A5 (en) | ||
| CN204031575U (en) | A kind of printed circuit board (PCB) | |
| CN206851140U (en) | Inserted ceramic copper-clad base plate | |
| CN203134973U (en) | Antenna coil | |
| CN204131819U (en) | A kind of core material preventing pressing wrinkling | |
| CN205622971U (en) | Printed circuit board with compound gold plated layer | |
| CN201904969U (en) | Double-sided sandwich circuit board | |
| CN208917312U (en) | Ferromagnetism coating structure | |
| CN203774183U (en) | Solid-state relay housing with multi-layered nickel plating layer | |
| CN206775814U (en) | High-frequency multilayer wiring board is used in one kind communication | |
| CN205670878U (en) | Smart machine high-layer, high-density interconnected circuit board | |
| CN203752603U (en) | Golden stainless steel coil tape with locally-gilded surface | |
| CN205378368U (en) | False negative structure of PCB | |
| CN204471997U (en) | Environment-friendly type wear-resistant composite board | |
| CN202231954U (en) | Doubled-side multi-layer conductive circuit board with solder paste pouring holes | |
| CN207581944U (en) | A kind of alloy rhodium ruthenium surface plating structure using new material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 Termination date: 20160627 |