JP2015030162A5 - - Google Patents

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JP2015030162A5
JP2015030162A5 JP2013160341A JP2013160341A JP2015030162A5 JP 2015030162 A5 JP2015030162 A5 JP 2015030162A5 JP 2013160341 A JP2013160341 A JP 2013160341A JP 2013160341 A JP2013160341 A JP 2013160341A JP 2015030162 A5 JP2015030162 A5 JP 2015030162A5
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plating layer
thickness
hardness
fine crystal
bright plating
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開口部周辺がダレないように比較的薄くした板厚の高硬度光沢めっき層と、
前記高硬度光沢めっき層の上に板厚調整用として高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚の微細結晶皮膜層と、
を備えたことを特徴とする多層構造メタルマスク。 A high-hardness bright plating layer with a relatively thin plate thickness so that the periphery of the opening does not sag,
A fine crystal film layer of a plate thickness that is equal to or slightly thicker or thinner than the high hardness gloss plating layer for adjusting the plate thickness on the high hardness gloss plating layer,
A multilayer metal mask characterized by comprising: 開口部周辺がダレないように比較的薄くした板厚が５〜１０μｍの高硬度光沢めっき層と、
前記高硬度光沢めっき層の上に板厚調整用として高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１０μｍ程度の微細結晶皮膜層と、
を備えたことを特徴とする多層構造メタルマスク。 A high-hardness bright plating layer having a thickness of 5 to 10 μm, which is relatively thin so that the periphery of the opening does not sag,
A fine crystal film layer having a thickness of about 4 to 10 μm, which is equal to or slightly thicker or thinner than the high hardness gloss plating layer for adjusting the plate thickness on the high hardness gloss plating layer,
A multilayer metal mask characterized by comprising: 板厚が１μｍ以下の微細結晶皮膜からなる下地層と、
前記下地層の上に開口部周辺がダレないように比較的薄くした板厚が５〜１０μｍの高硬度光沢めっき層と、
前記高硬度光沢めっき層の上に板厚調整用として高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１０μｍ程度の微細結晶皮膜層と、
を備えたことを特徴とする多層構造メタルマスク。 An underlayer composed of a fine crystal film having a thickness of 1 μm or less;
A high-hardness bright plating layer having a thickness of 5 to 10 μm that is relatively thin so that the periphery of the opening does not sag on the underlayer;
A fine crystal film layer having a thickness of about 4 to 10 μm, which is equal to or slightly thicker or thinner than the high hardness gloss plating layer for adjusting the plate thickness on the high hardness gloss plating layer,
A multilayer metal mask characterized by comprising: 板厚が１μｍ以下の微細結晶皮膜からなる下地層と、
前記下地層の上に開口部周辺がダレないように比較的薄くした板厚が５〜１０μｍの高硬度光沢めっき層と、
前記高硬度光沢めっき層の上に板厚調整用として高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１０μｍ程度の微細結晶皮膜層と、
前記微細結晶皮膜層の上に指紋付着防止用としての極薄の高硬度光沢めっき層と、
を備えたことを特徴とする多層構造メタルマスク。 An underlayer composed of a fine crystal film having a thickness of 1 μm or less;
A high-hardness bright plating layer having a thickness of 5 to 10 μm that is relatively thin so that the periphery of the opening does not sag on the underlayer;
A fine crystal film layer having a thickness of about 4 to 10 μm, which is equal to or slightly thicker or thinner than the high hardness gloss plating layer for adjusting the plate thickness on the high hardness gloss plating layer,
An ultra-thin high hardness gloss plating layer for preventing fingerprint adhesion on the fine crystal film layer,
A multilayer metal mask characterized by comprising: 微細結晶皮膜層は、クエン酸めっき浴を用いてめっきし、高硬度光沢めっき層は、硬度５５０Ｈｖ以上で経時変化の少ないホウ酸めっき浴を用いてめっきすることを特徴とする請求項１〜請求項４のいずれかに記載の多層構造メタルマスク。 The fine crystal coating layer is plated using a citric acid plating bath, and the high hardness bright plating layer is plated using a boric acid plating bath having a hardness of 550 Hv or more and little change with time. multilayer metal mask according to any one of claim 4. 開口部周辺がダレないように比較的薄くした板厚の第１の高硬度光沢めっき層と、
前記第１の高硬度光沢めっき層の上に板厚調整用として第１の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚の第１の微細結晶皮膜層と、
前記第１の微細結晶皮膜層の上に開口部周辺がダレないように比較的薄くした板厚の第２の高硬度光沢めっき層と、
前記第２の高硬度光沢めっき層の上に板厚調整用として第２の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚の第２の微細結晶皮膜層と、
を備えたことを特徴とする多層構造メタルマスク。 A first high-brightness bright plating layer having a thickness that is relatively thin so that the periphery of the opening does not sag;
A first fine crystal film layer having a plate thickness equal to or slightly thicker or thinner than the first high hardness bright plating layer for adjusting the plate thickness on the first high hardness bright plating layer;
A second high-brightness bright plating layer having a thickness that is relatively thin so that the periphery of the opening does not sag on the first fine crystal film layer;
A second fine crystal film layer having a plate thickness equal to or slightly thicker or thinner than the second high hardness bright plating layer for adjusting the plate thickness on the second high hardness bright plating layer;
A multilayer metal mask characterized by comprising: 開口部周辺がダレないように比較的薄くした板厚が５〜１０μｍの第１の高硬度光沢めっき層と、
前記第１の高硬度光沢めっき層の上に板厚調整用として第１の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１０μｍ程度の第１の微細結晶皮膜層と、
前記第１の微細結晶皮膜層の上に開口部周辺がダレないように比較的薄くした板厚が１０μｍ以下の第２の高硬度光沢めっき層と、
前記第２の高硬度光沢めっき層の上に板厚調整用として第２の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１８μｍ程度の第２の微細結晶皮膜層と、
を備えたことを特徴とする多層構造メタルマスク。 A first high-hardness bright plating layer having a thickness of 5 to 10 μm that is relatively thin so that the periphery of the opening does not sag;
A first microcrystalline film having a thickness of about 4 to 10 μm on the first high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the first high-hardness bright plating layer, for adjusting the plate thickness. Layers,
A second high-hardness bright plating layer having a thickness of 10 μm or less that is relatively thin so that the periphery of the opening does not sag on the first fine crystal film layer;
A second fine crystal film having a thickness of about 4 to 18 μm on the second high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the second high-hardness bright plating layer, for adjusting the plate thickness. Layers,
A multilayer metal mask characterized by comprising: 板厚が１μｍ以下の微細結晶皮膜からなる下地層と、
前記下地層の上に開口部周辺がダレないように比較的薄くした板厚が５〜１０μｍの第１の高硬度光沢めっき層と、
前記第１の高硬度光沢めっき層の上に板厚調整用として第１の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１０μｍ程度の第１の微細結晶皮膜層と、
前記第１の微細結晶皮膜層の上に開口部周辺がダレないように比較的薄くした板厚が１０μｍ以下の第２の高硬度光沢めっき層と、
前記第２の高硬度光沢めっき層の上に板厚調整用として第２の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１８μｍ程度の第２の微細結晶皮膜層と、
を備えたことを特徴とする多層構造メタルマスク。 An underlayer composed of a fine crystal film having a thickness of 1 μm or less;
A first high-hardness bright plating layer having a thickness of 5 to 10 μm, which is relatively thin so that the periphery of the opening does not sag on the underlayer;
A first microcrystalline film having a thickness of about 4 to 10 μm on the first high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the first high-hardness bright plating layer, for adjusting the plate thickness. Layers,
A second high-hardness bright plating layer having a thickness of 10 μm or less that is relatively thin so that the periphery of the opening does not sag on the first fine crystal film layer;
A second fine crystal film having a thickness of about 4 to 18 μm on the second high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the second high-hardness bright plating layer, for adjusting the plate thickness. Layers,
A multilayer metal mask characterized by comprising: 板厚が１μｍ以下の微細結晶皮膜からなる下地層と、
前記下地層の上に開口部周辺がダレないように比較的薄くした板厚が５〜１０μｍの第１の高硬度光沢めっき層と、
前記第１の高硬度光沢めっき層の上に板厚調整用として第１の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１０μｍ程度の第１の微細結晶皮膜層と、
前記第１の微細結晶皮膜層の上に開口部周辺がダレないように比較的薄くした板厚が１０μｍ以下の第２の高硬度光沢めっき層と、
前記第２の高硬度光沢めっき層の上に板厚調整用として第２の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１８μｍ程度の第２の微細結晶皮膜層と、
前記第２の微細結晶皮膜層の上に指紋付着防止用としての極薄の高硬度光沢めっき層と、
を備えたことを特徴とする多層構造メタルマスク。 An underlayer composed of a fine crystal film having a thickness of 1 μm or less;
A first high-hardness bright plating layer having a thickness of 5 to 10 μm, which is relatively thin so that the periphery of the opening does not sag on the underlayer;
A first microcrystalline film having a thickness of about 4 to 10 μm on the first high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the first high-hardness bright plating layer, for adjusting the plate thickness. Layers,
A second high-hardness bright plating layer having a thickness of 10 μm or less that is relatively thin so that the periphery of the opening does not sag on the first fine crystal film layer;
A second fine crystal film having a thickness of about 4 to 18 μm on the second high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the second high-hardness bright plating layer, for adjusting the plate thickness. Layers,
An ultrathin high hardness gloss plating layer for preventing fingerprint adhesion on the second fine crystal film layer;
A multilayer metal mask characterized by comprising: 微細結晶皮膜層は、クエン酸めっき浴を用いてめっきし、高硬度光沢めっき層は、硬度５５０Ｈｖ以上で経時変化の少ないホウ酸めっき浴を用いてめっきすることを特徴とする請求項６〜請求項９のいずれかに記載の多層構造メタルマスク。 The fine crystal film layer is plated using a citric acid plating bath, and the high hardness bright plating layer is plated using a boric acid plating bath having a hardness of 550 Hv or more and little change with time. multilayer metal mask according to any one of claim 9. ホウ酸めっき浴はアリルスルフォン酸Ｎａを含むことを特徴とする請求項１０記載の多層構造メタルマスク。 Multilayer metal mask according to claim 10, wherein the boric acid plating bath containing allyl sulfonic acid Na. 板厚が１μｍ以下の微細結晶皮膜からなる下地層と、
前記下地層の上に開口部周辺がダレないように比較的薄くした板厚が５〜１０μｍの第１の高硬度光沢めっき層と、
前記第１の高硬度光沢めっき層の上に板厚調整用として第１の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１０μｍ程度の第１の微細結晶皮膜層と、
前記第１の微細結晶皮膜層の上に開口部周辺がダレないように比較的薄くした板厚が１０μｍ以下の第２の高硬度光沢めっき層と、
前記第２の高硬度光沢めっき層の上に板厚調整用として第２の高硬度光沢めっき層と同等若しくはそれよりも若干厚く又は薄くした板厚が４〜１８μｍ程度の第２の微細結晶皮膜層とを備えた多層構造メタルマスクであって、
前記多層構造メタルマスクの基板面側に逃げ用の凹溝を設け、前記第１の高硬度光沢めっき層と第２の高硬度光沢めっき層に、スルファミン酸Ｃｏを添加しためっき浴を使用することにより、前記逃げ用の凹溝を設けた部分の皮膜の強靭性を高めたことを特徴とする多層構造メタルマスクの製造方法。 An underlayer composed of a fine crystal film having a thickness of 1 μm or less;
A first high-hardness bright plating layer having a thickness of 5 to 10 μm, which is relatively thin so that the periphery of the opening does not sag on the underlayer;
A first microcrystalline film having a thickness of about 4 to 10 μm on the first high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the first high-hardness bright plating layer, for adjusting the plate thickness. Layers,
A second high-hardness bright plating layer having a thickness of 10 μm or less that is relatively thin so that the periphery of the opening does not sag on the first fine crystal film layer;
A second fine crystal film having a thickness of about 4 to 18 μm on the second high-hardness bright plating layer, which is the same as, slightly thicker or thinner than the second high-hardness bright plating layer, for adjusting the plate thickness. A multi-layer metal mask comprising a layer,
A relief groove is provided on the substrate surface side of the multilayer metal mask, and a plating bath in which Co is added to the first high-hardness bright plating layer and the second high-hardness bright plating layer is used. Thus, the toughness of the film at the portion where the recessed groove for escape is provided is improved.
JP2013160341A 2013-08-01 2013-08-01 Multilayer metal mask and method of manufacturing the same Active JP6204107B2 (en)

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CN104626735B (en) * 2015-03-11 2017-06-09 京东方科技集团股份有限公司 Half tone component, screen painting system and half-tone screen printing method
JP7554035B2 (en) * 2018-04-18 2024-09-19 太陽誘電株式会社 Printing stencil and its manufacturing method
JP6894141B2 (en) * 2019-06-07 2021-06-23 株式会社プロセス・ラボ・ミクロン Metal mask and its manufacturing method

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JP2840666B2 (en) * 1989-11-22 1998-12-24 九州日立マクセル株式会社 Screen printing mesh and method of manufacturing the same
JP5291353B2 (en) * 2007-02-08 2013-09-18 株式会社ボンマーク Metal mask and manufacturing method thereof
JP5394652B2 (en) * 2007-04-10 2014-01-22 株式会社ボンマーク Multilayer metal mask and method of manufacturing the same
JP2009233948A (en) * 2008-03-26 2009-10-15 Bonmaaku:Kk Metal mask for screen printing and method for manufacturing the same
JP5441663B2 (en) * 2009-12-16 2014-03-12 株式会社ソノコム Multilayer metal mask

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