CN203960109U - The adhesive film of firm pasting at high temperature - Google Patents
The adhesive film of firm pasting at high temperature Download PDFInfo
- Publication number
- CN203960109U CN203960109U CN201420282814.4U CN201420282814U CN203960109U CN 203960109 U CN203960109 U CN 203960109U CN 201420282814 U CN201420282814 U CN 201420282814U CN 203960109 U CN203960109 U CN 203960109U
- Authority
- CN
- China
- Prior art keywords
- layer
- high temperature
- adhesive film
- firm pasting
- hot melt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of adhesive film of at high temperature firm pasting, comprise substrate layer, described substrate layer at least one side is coated with non-drying glue layer and hot melt adhesive layer in horizontal interval successively, on described non-drying glue layer and hot melt adhesive layer, be coated with a separate-type paper, described separate-type paper is coated with release layer towards substrate layer.The utlity model has and can increase the at high temperature advantage of firm pasting of adhesive film.
Description
Technical field
The utility model relates to adhesive film, especially relates to a kind of adhesive film of at high temperature firm pasting.
Background technology
Along with the generally use of the electronic products such as mobile phone, panel computer, notebook computer, electronic product in use can generate heat, and is affixed on its surperficial or inner non-setting adhesive when temperature is higher, has the situation that is pasted not strongly solid and occurs.
Utility model content
For addressing the above problem, the purpose of this utility model is to provide a kind of adhesive film of at high temperature firm pasting.
The utility model is realized by following technical measures, a kind of adhesive film of at high temperature firm pasting, comprise substrate layer, described substrate layer at least one side is coated with non-drying glue layer and hot melt adhesive layer in horizontal interval successively, on described non-drying glue layer and hot melt adhesive layer, be coated with a separate-type paper, described separate-type paper is coated with release layer towards substrate layer.
As a kind of optimal way, two faces of described substrate layer all successively horizontal interval be coated with non-drying glue layer and hot melt adhesive layer.
As a kind of optimal way, described non-drying glue layer and hot melt adhesive layer are spaced apart into strips.
As a kind of optimal way, described non-drying glue layer becomes trellis spaced apart with hot melt adhesive layer.
As a kind of optimal way, described substrate layer is tinsel or the scraps of paper or organic membrane.
As a kind of optimal way, the thickness of described substrate layer is 0.05mm-0.5mm.
First the utility model is that the non-drying glue layer by substrate layer surface sticks on article surface, and when electronic product produces higher temperature in use, hot melt adhesive layer is wherein subject to thermal softening, thereby has increased the stability that adhesive film is at high temperature pasted.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the utility model embodiment;
Fig. 2 is the surface tissue schematic diagram of the utility model one embodiment substrate layer;
Fig. 3 is the surface tissue schematic diagram of another embodiment substrate layer of the utility model.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.
The adhesive film of a kind of at high temperature firm pasting of the present embodiment, please refer to Fig. 1, comprise substrate layer 1, described substrate layer 1 at least one side is coated with non-drying glue layer 2 and hot melt adhesive layer 3 in horizontal interval successively, on described non-drying glue layer 2 and hot melt adhesive layer 3, be coated with a separate-type paper 5, described separate-type paper 5 is coated with release layer 4 towards substrate layer 1.
First this adhesive film is that the non-drying glue layer 2 by substrate layer 1 surface sticks on article surface, and when electronic product produces higher temperature in use, hot melt adhesive layer 3 is wherein subject to thermal softening, thereby has increased adhesive film in the stability of at high temperature pasting.
The adhesive film of the at high temperature firm pasting of the present embodiment, please refer to Fig. 1, on the basis of previous technique scheme, can also be specifically, two faces of substrate layer 1 all successively horizontal interval be coated with non-drying glue layer 2 and hot melt adhesive layer 3.Thereby make its two sticking veneers can firm pasting.
The adhesive film of the at high temperature firm pasting of the present embodiment, please refer to Fig. 2, on the basis of previous technique scheme, can also be specifically, and non-drying glue layer 2 and hot melt adhesive layer 3 are spaced apart into strips.
The adhesive film of the at high temperature firm pasting of the present embodiment, please refer to Fig. 3, on the basis of previous technique scheme, can also be specifically, and 3 one-tenth trellis of non-drying glue layer 2 and hot melt adhesive layer are spaced apart.
The adhesive film of the at high temperature firm pasting of the present embodiment, please refer to Fig. 1, on the basis of previous technique scheme, can also be specifically, and substrate layer 1 is tinsel or the scraps of paper or organic membrane.
The adhesive film of the at high temperature firm pasting of the present embodiment, please refer to Fig. 1, on the basis of previous technique scheme, can also be specifically, and the thickness of substrate layer 1 is 0.05mm-0.5mm.
Be more than to the utility model at high temperature the adhesive film of firm pasting set forth; be used for helping to understand the utility model; but embodiment of the present utility model is not restricted to the described embodiments; anyly do not deviate from the change done under the utility model principle, modification, substitute, combination, simplify; all should be equivalent substitute mode, be included in protection domain of the present utility model in.
Claims (6)
1. the adhesive film of firm pasting at high temperature, it is characterized in that: comprise substrate layer, described substrate layer at least one side is coated with non-drying glue layer and hot melt adhesive layer in horizontal interval successively, on described non-drying glue layer and hot melt adhesive layer, be coated with a separate-type paper, described separate-type paper is coated with release layer towards substrate layer.
2. the adhesive film of at high temperature firm pasting according to claim 1, is characterized in that: two faces of described substrate layer all successively horizontal interval be coated with non-drying glue layer and hot melt adhesive layer.
3. the adhesive film of at high temperature firm pasting according to claim 1, is characterized in that: described non-drying glue layer and hot melt adhesive layer are spaced apart into strips.
4. the adhesive film of at high temperature firm pasting according to claim 1, is characterized in that: described non-drying glue layer becomes trellis spaced apart with hot melt adhesive layer.
5. the adhesive film of at high temperature firm pasting according to claim 1, is characterized in that: described substrate layer is tinsel or the scraps of paper or organic membrane.
6. the adhesive film of at high temperature firm pasting according to claim 1, is characterized in that: the thickness of described substrate layer is 0.05mm-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420282814.4U CN203960109U (en) | 2014-05-29 | 2014-05-29 | The adhesive film of firm pasting at high temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420282814.4U CN203960109U (en) | 2014-05-29 | 2014-05-29 | The adhesive film of firm pasting at high temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203960109U true CN203960109U (en) | 2014-11-26 |
Family
ID=51920718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420282814.4U Expired - Fee Related CN203960109U (en) | 2014-05-29 | 2014-05-29 | The adhesive film of firm pasting at high temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203960109U (en) |
-
2014
- 2014-05-29 CN CN201420282814.4U patent/CN203960109U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20170529 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |