CN203950791U - A kind of wafer bearing device and wafer carrying system - Google Patents
A kind of wafer bearing device and wafer carrying system Download PDFInfo
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- CN203950791U CN203950791U CN201420234328.5U CN201420234328U CN203950791U CN 203950791 U CN203950791 U CN 203950791U CN 201420234328 U CN201420234328 U CN 201420234328U CN 203950791 U CN203950791 U CN 203950791U
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- wafer
- base plate
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- bearing device
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Abstract
The utility model relates to technical field of semiconductors, discloses a kind of wafer bearing device and wafer carrying system.This wafer bearing device comprises: top board, base plate, bearing and Duo Gen fixed leg; Described fixed leg is arranged on described top board and described bearing through described base plate, the week that many described fixed legs are arranged in described base plate upwards, inside many described fixed legs, correspondence is provided with groove, wafer support is in the described groove of many described fixed legs, described base plate is provided with the first through hole, in described the first through hole, be provided with the first hollow column, the two ends of described the first column are connected with described top board and described bearing respectively, in described the first column, are provided with thermocouple; The invention also discloses a kind of wafer carrying system.The utility model is installed thermocouple by be provided with the first column on base plate, can reduce the distance of thermocouple and wafer, makes the more temperature of actual response wafer of measurement data, has improved temperature control effect, has improved processing quality.
Description
Technical field
The utility model relates to technical field of semiconductors, relates in particular to a kind of wafer bearing device and wafer carrying system.
Background technology
In semi-conductive manufacture craft, wafer will pass through multiple tracks Technology for Heating Processing, reaches different technique objects, and along with the difference of technique, per pass process of thermal treatment temperature also has difference.Physics or chemical change that technological temperature refers to crystal column surface or occurs at a certain temperature with process gas, some technique is very high to the requirement of temperature, and temperature control obtains the fine or not impact of the result on technique also can be obvious.
In existing wafer carrying system, process duct is generally U-shaped pipe, be arranged on the inwall of process duct for measuring the thermocouple of temperature, wafer is placed on the center in this process duct, prior art is carried out the temperature of approximate substitution wafer by near the temperature process duct inwall at test thermocouple place, there is certain distance in the edge of the surface distance wafer of process duct, because of the difference of process equipment, process duct inner surface is also different to the distance of wafer, distance is larger, and the temperature that thermocouple reacts just more departs from the actual temperature of wafer.In actual process, can be by engineer testing repeatedly, give suitable compensation to thermocouple, obtain comparatively ideal technological effect, but because thermocouple test point exists certain distance apart from wafer, the factors such as the variation of the interior gas flow of process duct still can be brought disturbing factor, can have influence on the effect of technique.
Utility model content
There is certain distance in the wafer that the technical problems to be solved in the utility model is mounted in center in thermocouple test point on process duct inwall and process duct, thereby in process duct, the variation of gas flow can have influence on the problem of technological effect.
In order to solve the problems of the technologies described above, the utility model provides a kind of wafer bearing device, comprising: top board, base plate, bearing and Duo Gen fixed leg; Described fixed leg is arranged on described top board and described bearing through described base plate, the week that many described fixed legs are arranged in described base plate upwards, inside many described fixed legs, correspondence is provided with groove, wafer support is in the described groove of many described fixed legs, described base plate is provided with the first through hole, in described the first through hole, be provided with the first hollow column, the two ends of described the first column are connected with described top board and described bearing respectively, in described the first column, are provided with thermocouple.
Wherein, described base plate is provided with the second through hole, is provided with the second hollow column in described the second through hole, and the two ends of described the second column are connected with described base plate and described bearing respectively, and thermocouple is through described the second column.
Wherein, between described base plate and described bearing, be provided with at least a slice warming plate.
Wherein, the material of described fixed leg and described warming plate is quartz or carborundum.
The utility model provides a kind of wafer carrying system, comprises body of heater, process duct and described wafer bearing device, and described wafer bearing device is positioned at described process duct, and described process duct is positioned at described body of heater.
Technique scheme tool of the present utility model has the following advantages: wafer bearing device provided by the utility model and wafer carrying system, by be provided with the first column on base plate, thermocouple is installed, can reduce the distance of thermocouple and wafer, make the more temperature of actual response wafer of measurement data, improved temperature control effect, improved processing quality, and on base plate, be also provided with the second column, thermocouple can, according to demand through the second column, be measured the temperature in process duct, meets the demand of other tests.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment wafer bearing device;
Fig. 2 is the transverse sectional view of the utility model embodiment wafer bearing device;
Fig. 3 is the structural representation of the utility model embodiment wafer carrying system.
In figure: 1: top board; 2: fixed leg; 3: the first columns; 4: base plate; 5: the second columns; 6: warming plate; 7: bearing; 8: process duct; 9: heater strip; 10: body of heater; 11: fire door; 12: elevating mechanism; 13: thermocouple; 14: wafer; 15: groove.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples are used for illustrating the utility model, but are not used for limiting scope of the present utility model.
As shown in Figure 1, a kind of wafer bearing device that the utility model provides, fixed leg 2 is arranged on top board 1 and bearing 7 through base plate 4, fixed leg 2 is provided with many, in the present embodiment, be provided with three but be not limited to three, support on fixing basis reaching wafer 14, can simplified structure and keep the levelness of wafer 14, the week that three fixed legs 2 are arranged in base plate 4 upwards, the material of fixed leg 2 is quartz or carborundum, fixed leg 2 inner side correspondences are provided with multiple grooves 15, wafer 14 is supported in the groove 15 of three fixed legs 2, base plate 4 is provided with the first through hole, the first through hole can be single or multiple, in the first through hole, be provided with the first hollow column 3, the two ends of the first column 3 are connected with top board 1 and bearing 7 respectively, in the first column 3, be provided with thermocouple 13 in order to measure the temperature of wafer 14, thermocouple 13 is installed on base plate 4 and has been reduced the distance of thermocouple and wafer, make the more temperature of actual response wafer of measurement data, improve temperature control effect, improve processing quality, the first column 3 is interior can place many thermocouples, measure the temperature of the wafer 14 of differing heights simultaneously.
As shown in Figure 2, preferably, base plate 4 is provided with the second through hole, in the second through hole, be provided with the second hollow column 5, the two ends of the second column 5 are connected with base plate 4 and bearing 7 respectively, thermocouple can, according to demand through the second column 5, be measured the temperature of process duct 8 interior differing heights, meets the demand of other tests.
As shown in figures 1 and 3, preferably, position near base plate 4 between base plate 4 and bearing 7 is provided with at least a slice warming plate 6, in the present embodiment, be provided with 4 warming plates 6, the second column 5 runs through warming plate 6 downwards, warming plate 6 can stop the heat going down of body of heater 10 inside, and warming plate 6 materials are quartz or carborundum or other opaque materials, better heat preservation.
As shown in Figure 3, the utility model also provides a kind of wafer carrying system, this system comprises body of heater 10, process duct 8 and wafer bearing device, wafer bearing device is positioned at process duct 8, the interior process gas that constantly passes into of process duct 8, because the process gas in process duct 8 is positioned at body of heater 10 in process duct 8, body of heater 10 inwalls are provided with on the fire door 11 that heater strip 9 wafer bearing devices are arranged on body of heater 10, and body of heater 10 is arranged on elevating mechanism 12.
As shown in figures 1 and 3, when the utility model wafer bearing device and wafer system are used, wafer 14 is supported in the groove of multiple fixed legs 2, and base plate 4 is provided with the first through hole, is provided with the first hollow column 3 in the first through hole, in the first column 3, be provided with thermocouple, thermocouple can be measured the temperature of wafer, is also provided with in the second column 5, the second columns 5 and is provided with thermocouple on base plate, can measure the temperature in process duct, meet the demand of other tests.
In sum, wafer bearing device provided by the utility model and wafer carrying system, by be provided with the first column on base plate, thermocouple is installed, can be reduced the distance of thermocouple and wafer, make the more temperature of actual response wafer of measurement data, improve temperature control effect, improved processing quality, and be also provided with the second column on base plate, thermocouple can be according to demand through the second column, measure the temperature in process duct, meet the demand of other tests.
Above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of the each embodiment technical scheme of the utility model.
Claims (5)
1. a wafer bearing device, is characterized in that, comprising: top board (1), base plate (4), bearing (7) and many fixed legs (2), described fixed leg (2) is arranged on described top board (1) and described bearing (7) through described base plate (4), the week that many described fixed legs (2) are arranged in described base plate (4) upwards, many described fixed legs (2) inner side correspondence is provided with groove (15), wafer support is in the groove (15) of many described fixed legs (2), described base plate (4) is provided with the first through hole, in described the first through hole, be provided with hollow the first column (3), the two ends of described the first column (3) are connected with described top board (1) and described bearing (7) respectively, in described the first column (3), be provided with thermocouple.
2. according to the described wafer bearing device of claim 1, it is characterized in that: described base plate (4) is provided with the second through hole, in described the second through hole, be provided with hollow the second column (5), the two ends of described the second column (5) are connected with described base plate (4) and described bearing (7) respectively, and thermocouple is through described the second column (5).
3. according to the described wafer bearing device of claim 1, it is characterized in that: between described base plate (4) and described bearing (7), be provided with at least a slice warming plate (6).
4. according to the described wafer bearing device of claim 3, it is characterized in that: the material of described fixed leg (2) and described warming plate (6) is quartz or carborundum.
5. a wafer carrying system, it is characterized in that, comprise wafer bearing device described in body of heater (10), process duct (8) and claim 1 to 4 any one, described wafer bearing device is positioned at described process duct (8), and described process duct (8) is positioned at described body of heater (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420234328.5U CN203950791U (en) | 2014-05-08 | 2014-05-08 | A kind of wafer bearing device and wafer carrying system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420234328.5U CN203950791U (en) | 2014-05-08 | 2014-05-08 | A kind of wafer bearing device and wafer carrying system |
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| Publication Number | Publication Date |
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| CN203950791U true CN203950791U (en) | 2014-11-19 |
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| CN201420234328.5U Active CN203950791U (en) | 2014-05-08 | 2014-05-08 | A kind of wafer bearing device and wafer carrying system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563188A (en) * | 2020-12-10 | 2021-03-26 | 吉林瑞能半导体有限公司 | Quartz clamp for wafer and using method thereof |
| CN113363191A (en) * | 2021-05-31 | 2021-09-07 | 北海惠科半导体科技有限公司 | Wafer boat, diffusion apparatus and semiconductor device manufacturing method |
-
2014
- 2014-05-08 CN CN201420234328.5U patent/CN203950791U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563188A (en) * | 2020-12-10 | 2021-03-26 | 吉林瑞能半导体有限公司 | Quartz clamp for wafer and using method thereof |
| CN113363191A (en) * | 2021-05-31 | 2021-09-07 | 北海惠科半导体科技有限公司 | Wafer boat, diffusion apparatus and semiconductor device manufacturing method |
| CN113363191B (en) * | 2021-05-31 | 2022-08-05 | 北海惠科半导体科技有限公司 | Wafer boat, diffusion apparatus and semiconductor device manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100015 Jiuxianqiao Chaoyang District, East Beijing Road, building M2, floor 1, No. 2 Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180319 Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |
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| TR01 | Transfer of patent right |