CN203944990U - Ultrasonic wave gold ball bonding line machine and guide rail thereof - Google Patents
Ultrasonic wave gold ball bonding line machine and guide rail thereof Download PDFInfo
- Publication number
- CN203944990U CN203944990U CN201420393027.7U CN201420393027U CN203944990U CN 203944990 U CN203944990 U CN 203944990U CN 201420393027 U CN201420393027 U CN 201420393027U CN 203944990 U CN203944990 U CN 203944990U
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- China
- Prior art keywords
- ultrasonic wave
- guide rail
- bonding line
- ball bonding
- line machine
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Abstract
The utility model relates to welding technology field, and ultrasonic wave gold ball bonding line machine and guide rail thereof are provided.The ultrasonic wave gold ball bonding line machine guide rail providing, comprises body, and described body offers guide-track groove, and a side of described guide-track groove is provided with regulating wheel on described body.By the regulating wheel of installing, this ultrasonic wave gold ball bonding line machine guide rail can be convenient to the motion of mould bar, and registration in the motion process of mould bar simultaneously can also reduce reduction difficulty of processing and the cost of guide rail.
Description
Technical field
The utility model relates to welding technology field, is specifically related to ultrasonic wave gold ball bonding line machine and guide rail thereof.
Background technology
When the lead of LED chip, laser tube, middle-size and small-size pliotron, integrated circuit and other particular semiconductor device welds, generally adopt ultrasonic wave gold ball bonding line machine to weld.
The volume of above-mentioned soldered semiconductor devices is very little, and therefore, existing ultrasonic wave gold ball bonding line machine provides carrier and guide rail to facilitate, above-mentioned soldered semiconductor devices is fixed and is transmitted.
This carrier is for bearing semiconductor device, it is known as mould bar, before and after the welding of semiconductor devices, all by mould bar, carried, because the volume of semiconductor devices is very little, structure is very accurate, when the width of the guide rail therefore mould bar being led is wide, will increase the positioning difficulty of welding, and will increase the resistance of the motion of mould bar when narrow.
Utility model content
The purpose of this utility model is to provide can be so that the ultrasonic wave gold ball bonding line machine guide rail of the motion of mould bar, while registration in mould bar motion process.
Ultrasonic wave gold ball bonding line machine guide rail, comprises body, and described body offers guide-track groove, and a side of described guide-track groove is provided with regulating wheel on described body.
Further, described body offers installation cavity, and described regulating wheel is installed in described installation cavity.
Further, described regulating wheel comprises base, axle sleeve, framework, rotating shaft, bearing;
Described base top is provided with supporting surface and baffle plate, described axle sleeve is arranged on described supporting surface, described rotating shaft is sheathed in described axle sleeve, in described frame installation is located on described baffle plate and by a part of frame of described axle sleeve and described rotating shaft, described bearing holder (housing, cover) is located on the described framework another part of protruding from of described rotating shaft.
Another object of the present utility model also provides the ultrasonic wave gold ball bonding line machine that comprises above-mentioned ultrasonic wave gold ball bonding line machine guide rail.
By the regulating wheel of installing, this ultrasonic wave gold ball bonding line machine guide rail can be convenient to the motion of mould bar, and registration in the motion process of mould bar simultaneously can also reduce reduction difficulty of processing and the cost of guide rail.
Accompanying drawing explanation
Fig. 1 is the perspective view of the ultrasonic wave gold ball bonding line machine of embodiment;
Fig. 2 is the decomposition texture schematic diagram of the ultrasonic wave gold ball bonding line machine of embodiment;
Fig. 3 is the decomposition texture schematic diagram of the ultrasonic wave gold ball bonding line machine guide rail of embodiment.
The specific embodiment
Below in conjunction with drawings and the specific embodiments, the utility model is described in further detail.
With reference to Fig. 1 ~ 3.
Ultrasonic wave gold ball bonding line machine guide rail, comprises body 1, and body 1 offers guide-track groove 2, and a side of guide-track groove 2 is provided with regulating wheel 3 on body 1.
In the present embodiment, body 1 offers installation cavity 11, and regulating wheel 3 is installed in installation cavity 11.
In the present embodiment, regulating wheel 3 comprises base 31, axle sleeve 32, framework 33, rotating shaft 34, bearing 35, bearing 36;
Described rotating shaft 34 is sheathed in described axle sleeve 32, in described framework 33 is installed on and is located on described base 31 and by a part of frame of described axle sleeve 32 and described rotating shaft 34, described bearing 35 is sheathed on described framework 33 another part of protruding from of described rotating shaft 34, and described spring 36 is installed between described axle sleeve 32 and described base 31.
When mould bar moves on ultrasonic wave gold ball bonding line machine guide rail, due to the elastic force of regulating wheel, thus can be by the opposite side of mould bar top direction guiding rail, walking in the motion process of mould bar can not wander off thus, thereby realizes accurately location; In view of the little advantage of regulating wheel force of rolling friction, also facilitate the motion of mould bar simultaneously; In addition, because regulating wheel to the mould bar extremely at last that begins pushes up to opposite side, therefore guide rail also can not affect the motion of mould bar in the height of the machining accuracy of this side of regulating wheel, therefore can suitably reduce track in the machining accuracy of this this side of regulating wheel, thereby reduce difficulty of processing and cost.
To sum up, by the regulating wheel 3 of installing, this ultrasonic wave gold ball bonding line machine guide rail can be convenient to the motion of mould bar, and registration in the motion process of mould bar simultaneously can also reduce reduction difficulty of processing and the cost of guide rail.
The present embodiment also provides the ultrasonic wave gold ball bonding line machine that comprises above-mentioned ultrasonic wave gold ball bonding line machine guide rail.
More than for the utility model illustrates.
Claims (4)
1. ultrasonic wave gold ball bonding line machine guide rail, is characterized in that, comprises body (1), and described body (1) offers guide-track groove (2), and a side of described guide-track groove (2) is provided with regulating wheel (3) on described body (1).
2. ultrasonic wave gold ball bonding line machine guide rail as claimed in claim 1, is characterized in that, described body (1) offers installation cavity (11), and described regulating wheel (3) is installed in described installation cavity (11).
3. ultrasonic wave gold ball bonding line machine guide rail as claimed in claim 2, is characterized in that, described regulating wheel (3) comprises base (31), axle sleeve (32), framework (33), rotating shaft (34), bearing (35), spring (36);
Described rotating shaft (34) is sheathed in described axle sleeve (32), described framework (33) is installed on described base (31) and in a part of frame of described axle sleeve (32) and described rotating shaft (34) is located at, described bearing (35) is sheathed on protruding from described framework (33) another part of described rotating shaft (34), and described spring (36) is installed between described axle sleeve (32) and described base (31).
4. ultrasonic wave gold ball bonding line machine, is characterized in that, comprises the ultrasonic wave gold ball bonding line machine guide rail described in claim 1 ~ 3 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420393027.7U CN203944990U (en) | 2014-07-17 | 2014-07-17 | Ultrasonic wave gold ball bonding line machine and guide rail thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420393027.7U CN203944990U (en) | 2014-07-17 | 2014-07-17 | Ultrasonic wave gold ball bonding line machine and guide rail thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203944990U true CN203944990U (en) | 2014-11-19 |
Family
ID=51887049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420393027.7U Active CN203944990U (en) | 2014-07-17 | 2014-07-17 | Ultrasonic wave gold ball bonding line machine and guide rail thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203944990U (en) |
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2014
- 2014-07-17 CN CN201420393027.7U patent/CN203944990U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160920 Address after: 518000, 501-1, Sunshine Industrial Zone, sunny road, Shenzhen, Guangdong, 7, Nanshan District Patentee after: Shenzhen open nine automation equipment Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Nanshan District Xili Sunshine Industrial District seven building five floor Patentee before: Song Yongfei |