CN206250156U - A kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine - Google Patents
A kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine Download PDFInfo
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- CN206250156U CN206250156U CN201621171380.6U CN201621171380U CN206250156U CN 206250156 U CN206250156 U CN 206250156U CN 201621171380 U CN201621171380 U CN 201621171380U CN 206250156 U CN206250156 U CN 206250156U
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- axis
- scolding tin
- straight line
- tin
- line module
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Abstract
The utility model discloses a kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine,Including scolding tin support,Y-axis straight line module is provided with the scolding tin support,The Z axis straight line module that can be slided along Y direction is provided with the Y-axis straight line module,The scolding tin pressure regulating mechanism that can be slided along Z-direction is provided with the Z axis straight line module,The soldering tip of this tin soldering equipment is connected on the piston rod of a regulation cylinder,Regulation cylinder is connected with precise pressure regulating valve,Different chip bonding pad sizes can be directed to,Accurate adjustment scolding tin pressure,Improving prior art can not adjust the defect of scolding tin pressure,Simultaneously universal floating base is used on base,When chip material strip can not entirely fit base,By universal floating base,Soldering tip can be welded smooth being pressure bonded on gimballed base of chip,Welding quality and precision are all greatly improved,When welding simultaneously,Soldering tip is driven to push using servomotor,The height and speed of welding head motion can accurate adjustments.
Description
Technical field
The utility model is related to the process equipment field of double interface chips, more specifically to a kind of pair of interface chip
The tin soldering equipment of scolding tin back-gluing machine.
Background technology
Double-interface card is assembled by PVC card piece, chip and coil, integrates contact with non-contact interface
Smart card, it has two operation interfaces, can be by way of directly contact chip contacts to the access of chip, it is also possible to pass through
It is separated by a distance, access chip is come with RF-wise.Only one of which chip on card, two interfaces, by contact interface and
Non-contact interface can carry out identical operation.This double-interface card in an assembling process, chip need to be electrically connected with coil,
In particular, it is desirable to make two pads (golden finger) on chip be welded with the two ends of induction coil, current welding process needs
First scolding tin realizes that Chinese patent 201210255794.7 discloses a kind of pair of interface chip scolding tin for glue on the pad of chip
Method and its device, carry out scolding tin while can be with gum, because double-interface card is commercially marked for the chip to double-interface card
Accurate and specification is a lot, and the spacing between the pad size and pad of chip is also had nothing in common with each other, and for different size of pad, needs
Corresponding fine adjustment, but current equipment are carried out to the consumption of scolding tin, pressure and scolding tin speed without this function,
Versatility is poor.
Utility model content
The utility model is in order to overcome the deficiency of prior art, it is proposed that a kind of versatility can be with flexible modulation compared with what is strengthened
The tin soldering equipment of double interface chip scolding tin back-gluing machines of scolding tin pressure.
The utility model is to solve above-mentioned technical problem by following technical proposals.
A kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine, is arranged on chip web feed track neighbour side, the weldering
Tin device includes scolding tin support, and Y-axis straight line module is provided with the scolding tin support, and being provided with the Y-axis straight line module can
Along the Z axis straight line module that Y direction is slided, the scolding tin pressure that being provided with the Z axis straight line module can slide along Z-direction is adjusted
Section mechanism.
More specifically, the scolding tin pressure regulating mechanism includes driving what can be moved along Z-direction by Z axis straight line module
Z axis slide, is provided with the Z axis slide and be can slide up and down soldering tip installing plate, soldering tip installing plate lower end relative to Z axis slide
Be connected a soldering tip, and the piston rod of the regulation cylinder that the soldering tip installing plate is attached to Z axis slide with is connected, the regulation cylinder
It is connected with a precise pressure regulating valve, solder vias, solder vias is set immediately below the soldering tip, on chip web feed track
Underface be provided with lifting pedestal mechanism, the lifting pedestal mechanism is included positioned at the universal bottom of the superiors of lifting pedestal mechanism
Seat, the gimballed base is arranged on a lifting pedestal by universal bearing, and the lifting pedestal can slide up and down and be connected to
One firm banking, the lifting pedestal is driven by a lift cylinder and can moved up and down.
More specifically, Y-axis straight line module includes the Y-axis mould bases set along Y direction and the Y-axis being arranged on Y-axis mould bases
Slide rail, one end of the Y-axis mould bases is installed with Y-axis servomotor, and the output shaft of the Y-axis servomotor passes through Y-axis screw mandrel and Z
Axle straight line module is connected.
More specifically, Z axis straight line module includes the Z axis mould bases set along Z-direction and the Z axis being arranged on Z axis mould bases
Slide rail, one end of the Z axis mould bases is installed with Z axis servomotor, and the output shaft of the Z axis servomotor passes through Z axis screw mandrel and Z
Axle slide is connected.
More specifically, solder vias and gimballed base are square, and the gimballed base can pass through solder vias.
The beneficial effects of the utility model are that the soldering tip of this tin soldering equipment is connected on the piston rod of a regulation cylinder,
Regulation cylinder is connected with precise pressure regulating valve, can be directed to different chips, and accurate adjustment scolding tin pressure improves prior art not
The defect of scolding tin pressure can be adjusted, while universal floating base is used on base, when chip material strip can not entirely fit base
When, by universal floating base, soldering tip can be welded smooth being pressure bonded on gimballed base of chip, welding quality and essence
Degree is all greatly improved, while during welding, driving soldering tip to push using servomotor, the height and speed of welding head motion can be accurate
Regulation.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Specific embodiment
The utility model preferred embodiment is given below in conjunction with the accompanying drawings, to describe the technical solution of the utility model in detail.
Such as Fig. 1, a kind of pair of embodiment of the tin soldering equipment of interface chip scolding tin back-gluing machine is arranged on chip web feed rail
The side of road 1, the chip web feed track 1 is set along X-direction, is provided with chip web feed track 1 for tin device
(not shown) and tin soldering equipment, the tin soldering equipment include scolding tin support 31, are provided with Y-axis on the scolding tin support 31 straight
Line module 32, is provided with the Z axis straight line module 33 that can be slided along Y direction, the Z axis straight line on the Y-axis straight line module 32
The scolding tin pressure regulating mechanism 34 that can be slided along Z-direction is provided with module 33.
The scolding tin pressure regulating mechanism 34 includes driving the Z axis that can be moved along Z-direction to slide by Z axis straight line module 33
Seat 341, is provided with the Z axis slide 341 and be can slide up and down soldering tip installing plate 342 relative to Z axis slide 341, soldering tip peace
The connected soldering tip 344 in dress plate 342 bottom, the soldering tip installing plate 342 and is attached to the regulation cylinder 343 of Z axis slide 341
Piston rod is connected, and the regulation cylinder 343 is connected with a precise pressure regulating valve 345, immediately below the soldering tip 344, positioned at chip material
Solder vias 10 are set on band delivery track 1, the underface of solder vias 10 is provided with lifting pedestal mechanism 35, the lifting bottom
Seat mechanism 35 includes the gimballed base 351 positioned at the superiors of lifting pedestal mechanism 35, and the gimballed base 351 passes through universal bearing
It is arranged on a lifting pedestal 352, the lifting pedestal 352 can slide up and down and be connected to a firm banking 353, the lifting
Base 352 is driven by a lift cylinder 354 and can moved up and down.
Before operation, the welding pressure that soldering tip 344 is pushed is regulated by adjustment precision pressure regulator valve 345, while adjusting soldering tip
The stroke height and movement velocity (being input into corresponding data by man-machine interface) moved along Z-direction, after regulating, startup sets
Standby, a soldering operation process is：Z axis straight line module 33 drives soldering tip 344 to push, while lift cylinder 354 drives universal bottom
Seat 351 passes through top in solder vias 10, and it is upper with chip material strip that soldering tip 344 and gimballed base 351 are connected to solder termination simultaneously
Lower both sides carry out scolding tin, straight by Y-axis after scolding tin continuous operation a period of time so as to form tin ball at the pad of chip material strip
Line module 32 drives Z axis straight line module 33 to be slided along Y-axis together with soldering tip 344, so that away from chip web feed track 1,
To clear up the scruff remained on chip web feed track 1.
Although the foregoing describing specific embodiment of the present utility model, it will be appreciated by those of skill in the art that
These are merely illustrative of, and protection domain of the present utility model is defined by the appended claims.Those skilled in the art
Member can make numerous variations or repair to these implementation methods on the premise of without departing substantially from principle of the present utility model and essence
Change, but these changes and modification each fall within protection domain of the present utility model.
Claims (5)
1. a kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine, is arranged on chip web feed track neighbour side, and its feature exists
In the tin soldering equipment includes scolding tin support, Y-axis straight line module is provided with the scolding tin support, on the Y-axis straight line module
The Z axis straight line module that can be slided along Y direction is provided with, the weldering that can be slided along Z-direction is provided with the Z axis straight line module
Tin pressure regulating mechanism.
2. the according to claim 1 pair of tin soldering equipment of interface chip scolding tin back-gluing machine, it is characterised in that the scolding tin pressure
Power governor motion includes driving the Z axis slide that can be moved along Z-direction by Z axis straight line module, is provided with the Z axis slide
Be can slide up and down soldering tip installing plate relative to Z axis slide, soldering tip installing plate lower end is connected a soldering tip, the soldering tip installing plate with
The piston rod connection of the one regulation cylinder for being attached to Z axis slide, the regulation cylinder is connected with a precise pressure regulating valve, the soldering tip
Underface, on chip web feed track solder vias are set, lifting pedestal mechanism are provided with immediately below solder vias,
The lifting pedestal mechanism includes the gimballed base positioned at the superiors of lifting pedestal mechanism, and the gimballed base passes through universal bearing
It is arranged on a lifting pedestal, the lifting pedestal can slide up and down and be connected to a firm banking, and the lifting pedestal is by one
Lift cylinder drives and can move up and down.
3. the according to claim 2 pair of tin soldering equipment of interface chip scolding tin back-gluing machine, it is characterised in that Y-axis straight line mould
Group includes the Y-axis mould bases set along Y direction and the Y-axis slide rail being arranged on Y-axis mould bases, and one end of the Y-axis mould bases is fixed
The output shaft for having Y-axis servomotor, the Y-axis servomotor is connected by Y-axis screw mandrel with Z axis straight line module.
4. the according to claim 3 pair of tin soldering equipment of interface chip scolding tin back-gluing machine, it is characterised in that Z axis straight line mould
Group includes the Z axis mould bases set along Z-direction and the Z axis slide rail being arranged on Z axis mould bases, and one end of the Z axis mould bases is fixed
The output shaft for having Z axis servomotor, the Z axis servomotor is connected by Z axis screw mandrel with Z axis slide.
5. the according to claim 4 pair of tin soldering equipment of interface chip scolding tin back-gluing machine, it is characterised in that solder vias and
Gimballed base is square, and the gimballed base can pass through solder vias.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621171380.6U CN206250156U (en) | 2016-10-26 | 2016-10-26 | A kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621171380.6U CN206250156U (en) | 2016-10-26 | 2016-10-26 | A kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine |
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| Publication Number | Publication Date |
|---|---|
| CN206250156U true CN206250156U (en) | 2017-06-13 |
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ID=58995879
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621171380.6U Active CN206250156U (en) | 2016-10-26 | 2016-10-26 | A kind of pair of tin soldering equipment of interface chip scolding tin back-gluing machine |
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| Country | Link |
|---|---|
| CN (1) | CN206250156U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108123243A (en) * | 2017-12-20 | 2018-06-05 | 东莞市锐祥智能卡科技有限公司 | A kind of one, two, the SIM card production method of four chips |
| CN112719708A (en) * | 2020-12-25 | 2021-04-30 | 浙江银安人防设备有限公司 | Welding machine and production process of plugging plate using same |
-
2016
- 2016-10-26 CN CN201621171380.6U patent/CN206250156U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108123243A (en) * | 2017-12-20 | 2018-06-05 | 东莞市锐祥智能卡科技有限公司 | A kind of one, two, the SIM card production method of four chips |
| CN108123243B (en) * | 2017-12-20 | 2019-06-11 | 东莞市锐祥智能卡科技有限公司 | A kind of SIM card production method of one, two, four chips |
| CN112719708A (en) * | 2020-12-25 | 2021-04-30 | 浙江银安人防设备有限公司 | Welding machine and production process of plugging plate using same |
| CN112719708B (en) * | 2020-12-25 | 2022-01-04 | 浙江银安人防设备有限公司 | Welding machine and production process of plugging plate using same |
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