CN203934235U - A kind of heat abstractor - Google Patents
A kind of heat abstractor Download PDFInfo
- Publication number
- CN203934235U CN203934235U CN201420194722.0U CN201420194722U CN203934235U CN 203934235 U CN203934235 U CN 203934235U CN 201420194722 U CN201420194722 U CN 201420194722U CN 203934235 U CN203934235 U CN 203934235U
- Authority
- CN
- China
- Prior art keywords
- air
- flow
- chip
- gas outlet
- kuppe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001133 acceleration Effects 0.000 claims abstract description 23
- 230000004888 barrier function Effects 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 238000001816 cooling Methods 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000002910 structure generation Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The utility model discloses a kind of heat abstractor, comprising: air-flow accelerator and guiding device; Described guiding device is arranged on chip top, and described guiding device is provided with gas outlet and air inlet, matches and form gas channel above described chip with described air inlet in described gas outlet; Described air-flow accelerator is arranged between described chip and described guiding device, and described airflow apparatus produces over against the acceleration air-flow of described gas outlet direction and accelerates the Air Flow in described gas channel; Heat abstractor of the present utility model by forming gas channel above chip, then use air-flow accelerator that the Air Flow in gas channel is accelerated, thereby the air-flow that impels chip top accelerates to flow and reaches the object to chip quick heat radiating, can solve prior art chips radiator structure complexity, poor effect, problem that application is more difficult.
Description
Technical field
The utility model relates to integrated chip field, relates in particular to a kind of heat abstractor.
Background technology
Current chip is almost applied in all terminals, but chip produces amount of heat in the course of the work, can cause terminal heating, has influence on the work of other elements in terminal; When heat accumulates and even can damage terminal and other electronic components too much in the situation that at terminal inner; So the problem of how chip being dispelled the heat is more and more paid close attention to by chip or terminal manufacturer.Application machine fan in portable set has been proposed, to reach the object of auxiliary heat dissipation in prior art; For example how Apple is studying in mobile terminal equipment wind and falls apart chip is dispelled the heat.A denomination of invention of the said firm is that the patent document of " cooling system of mobile electronic device " shows, can utilize motor to carry out the platform of drive fan and two assemblies of alarm.But this systematic comparison is complicated, and volume is larger, mobile phone application is more difficult.So in chip field, be badly in need of a kind of simple in structure, good heat dissipation effect, the radiator structure that can be widely used.
Utility model content
The main technical problems to be solved in the utility model is, a kind of heat abstractor is provided, and can solve prior art chips radiator structure complexity, poor effect, problem that application is more difficult.
For solving the problems of the technologies described above, the utility model provides a kind of heat abstractor, comprising: air-flow accelerator and guiding device;
Described guiding device is arranged on chip top, and described guiding device is provided with gas outlet and air inlet, matches and form gas channel above described chip with described air inlet in described gas outlet;
Described air-flow accelerator is arranged between described chip and described guiding device, and described airflow apparatus produces over against the acceleration air-flow of described gas outlet direction and accelerates the Air Flow in described gas channel.
Further, described guiding device comprises: kuppe, and described kuppe and described chip are connected and cover on the top of described chip; The side of described kuppe is provided with air inlet, and the top of described kuppe is provided with gas outlet, and described air-flow accelerator is positioned at described kuppe and produces the acceleration air-flow over against described gas outlet direction.
Further, the top of described kuppe is provided with a gas outlet, and the side of described kuppe is provided with at least one air inlet;
Or
The top of described kuppe is provided with two gas outlets, and described kuppe side is provided with at least one air inlet.
Further, the center at described kuppe top is provided with a gas outlet.
Further, described air-flow accelerator is connected with described chip, receives the signal of telecommunication that described chip provides and produces over against the acceleration air-flow of described gas outlet direction and accelerate the Air Flow in described gas channel according to the described signal of telecommunication.
Further, described air-flow accelerator comprises: energy conversion component and air-flow generating structure; The electric energy of the signal of telecommunication that described energy cell provides described chip is converted to mechanical energy and utilizes described mechanical energy to drive described air-flow generating structure to export at least one and accelerate air-flow, and the quantity of described acceleration air-flow is less than or equal to the quantity of described gas outlet.
Further, described energy conversion component comprises: piezoelectric element; Described piezoelectric element one side is connected with described air-flow generating structure, another side is connected with described air-flow generating structure, described piezoelectric element produces mechanical resonant according to the signal of telecommunication of described chip transmission, and utilizes the mechanical energy of mechanical resonant to drive described air-flow generating structure to export at least one acceleration air-flow.
Further, described air-flow generating structure comprises: the chamber that bottom is barrier film, described piezoelectric element one side is connected with described chip, another side is connected with described barrier film, the top of described chamber is provided with at least one outlet, a corresponding described gas outlet of described outlet and over against described gas outlet, the quantity of described outlet is less than or equal to the quantity of described gas outlet; Described piezoelectric element produces mechanical resonant according to the signal of telecommunication of described chip transmission, and drives described barrier film to vibrate together to make to accelerate air-flow from one of a described outlet output of described chamber.
Further, described piezoelectric element is comprised of piezoelectric ceramic piece and metal electrode layer, and described metal electrode layer is arranged in the one side of described piezoelectric ceramic piece and is connected with described chip, and the another side of described piezoelectric ceramic piece is connected with described barrier film.
Further, described metal electrode layer and described chips welding.
The beneficial effects of the utility model are:
The utility model provides a kind of heat abstractor, can solve prior art chips radiator structure complexity, poor effect, problem that application is more difficult.Heat abstractor of the present utility model comprises: air-flow accelerator and guiding device; Described guiding device is arranged on chip top, and described guiding device is provided with gas outlet and air inlet, matches and form gas channel above described chip with described air inlet in described gas outlet; Described air-flow accelerator is arranged between described chip and described guiding device, and described airflow apparatus produces over against the acceleration air-flow of described gas outlet direction and accelerates the Air Flow in described gas channel; Heat abstractor of the present utility model by forming gas channel above chip, then use air-flow accelerator that the Air Flow in gas channel is accelerated, thereby the air-flow that impels chip top accelerates to flow and reaches the object to chip quick heat radiating, compared with prior art, construction for heat radiating device of the present utility model is simple, volume is little, and better heat-radiation effect can be widely applied to the heating problem that improves mobile terminal in mobile terminal.
Accompanying drawing explanation
The structural representation of the first chip cooling system cross section that Fig. 1 provides for the utility model embodiment;
The structural representation of the second chip cooling system cross section that Fig. 2 provides for the utility model embodiment;
The structural representation of the third chip cooling system cross section that Fig. 3 provides for the utility model embodiment;
The structural representation of the 4th kind of chip cooling system cross section that Fig. 4 provides for the utility model embodiment;
The structural representation of the 5th kind of chip cooling system cross section that Fig. 5 provides for the utility model embodiment;
The structural representation of the 6th kind of chip cooling system cross section that Fig. 6 provides for the utility model embodiment.
Embodiment
Below by embodiment, by reference to the accompanying drawings the utility model is described in further detail.
The present embodiment provides a kind of heat abstractor, comprising: air-flow accelerator and guiding device;
Described guiding device is arranged on chip top, and described guiding device is provided with gas outlet and air inlet, matches and form gas channel above described chip with described air inlet in described gas outlet;
Described air-flow accelerator is arranged between described chip and described guiding device, and described airflow apparatus produces over against the acceleration air-flow of described gas outlet direction and accelerates the Air Flow in described gas channel.
The core concept of the present embodiment heat radiation is: above chip, form gas channel, thereby the air current flow of speed-up chip top gas channel reaches the effect to chip quick heat radiating.Compared with prior art, the construction for heat radiating device of the present embodiment is simple, and volume is little, and better heat-radiation effect can be widely applied to the heating problem that improves mobile terminal in mobile terminal.
Preferably, in the present embodiment, guiding device comprises: kuppe, and described kuppe and described chip are connected and cover on the top of described chip; The side of described kuppe is provided with air inlet, and the top of described kuppe is provided with gas outlet, and described air-flow accelerator is positioned at described kuppe and produces the acceleration air-flow over against described gas outlet direction.
The quantity that air inlet and gas outlet are set on kuppe in the present embodiment is unrestricted, can depend on the circumstances, for example, can be provided with in kuppe side 4 air inlets, at kuppe top, be provided with 2 gas outlets, or 3 air inlets are set in side, 3 gas outlets are set at top; In the present embodiment, the quantity of air-flow accelerator generation acceleration air-flow is to be associated with the quantity of gas outlet, and it is less than or equal to the quantity of gas outlet, preferably, equals the quantity of gas outlet.
Preferably, the top of kuppe described in the present embodiment is provided with a gas outlet, and the top of described chamber is provided with a gas outlet; Now, air-flow accelerator produces one and accelerates air-flow
Or
The top of described kuppe is provided with two gas outlets, and described kuppe side is provided with at least one air inlet; Now air-flow accelerator can produce one or two and accelerate air-flow.
Preferentially, in the present embodiment, kuppe arranges a gas outlet in heart position therein
With chip cooling system, introduce in detail the heat radiation process of heat abstractor in application the present embodiment below, chip cooling system in institute's diagram is all to show by cross section below, in figure below, cross section is all cross sections of cutting open from kuppe top center line, and air inlet and gas outlet are on same cross section:
Chip cooling system as shown in Figure 1, comprise: chip 11 and heat abstractor, in figure, this heat abstractor consists of air-flow accelerator 12 and kuppe 13, wherein the side of kuppe 13 is provided with two air inlets and is respectively air inlet 131, air inlet 132, top center is provided with gas outlet 133, air-flow is from entering from air inlet 131 and air inlet 132 respectively, because flow out gas outlet 133, air inlet 131,132 coordinates the gas channel that forms chip top with gas outlet 133, the base of water conservancy diversion 13 covers is fixed on the side of described chip 11; Air-flow accelerator 12 produce one over against gas outlet the acceleration air-flow of 133 directions, thereby accelerate kuppe 13 inside, be the air current flow of chip 11 tops, reach the effect to chip 11 quick heat radiatings.In Fig. 1, air-flow accelerator 12 can be fixedly connected with chip 11, also can be fixedly connected with kuppe 13.
Should be understood that, the present embodiment is not limited to, in two relative sides of kuppe, air inlet is set, can also be a side or adjacent two sides or four sides air inlet is set, and air inlet and gas outlet be not in same plane.
Chip cooling system as shown in Figure 2, comprise: chip 21 and heat abstractor, in figure, this heat abstractor consists of air-flow accelerator 22 and kuppe 23, wherein the side of kuppe 23 is provided with three air inlets and is respectively air inlet 231, air inlet 232, air inlet 233, top is provided with gas outlet 234,235, air-flow is from entering from air inlet 231, air inlet 232, air inlet 233 respectively, because flow out gas outlet 234,235, air inlet 231,232,233 coordinates the gas channel that forms chip top with gas outlet 234,235; The base of kuppe 23 is fixed on the side of described chip 21; Air-flow accelerator 22 produces respectively two over against the acceleration air-flow of 234He gas outlet, gas outlet 235 directions, thereby accelerate kuppe 23 inside, is the air current flow of chip 21 tops, reaches the effect to chip 21 quick heat radiatings.In addition, in Fig. 2, air-flow accelerator 22 also can produce one and accelerate air-flow, 234Huo gas outlet, corresponding gas outlet 235, and the mode of accelerating air current flow with air-flow accelerator in Fig. 1 is similar.
Chip cooling system as shown in Figure 3, comprise: chip 31 and heat abstractor, in figure, this heat abstractor consists of air-flow accelerator 32 and kuppe 33, wherein the side of kuppe 33 is provided with three air inlets and is respectively air inlet 331, air inlet 332, air inlet 333, top center is provided with gas outlet 334, be positioned at other positions on top center line and be provided with 335He gas outlet, gas outlet 336, air-flow is from respectively from air inlet 331, air inlet 332, air inlet 333 enters, due to gas outlet 334, 335, 336 flow out, air inlet 331, 332, 333 respectively with gas outlet 334, 335, 336 coordinate the gas channel that forms three chip tops, the base 330 of kuppe 33 is fixedly connected with the side 310 of chip 31, and kuppe 33 covers the top of whole chip 31 just, air-flow accelerator 32 produce respectively three respectively over against gas outlet 334, the acceleration air-flow of gas outlet 335, gas outlet 336 directions, thereby accelerate kuppe 33 inside, be the air current flow of chip 31 tops, reach the effect to chip 31 quick heat radiatings.In Fig. 3, air-flow accelerator 32 can be fixed on chip 31 upper surfaces or kuppe 33 inner sides.
In the present embodiment, preferentially, described air-flow accelerator is connected with described chip, receives the signal of telecommunication that described chip provides and produces over against the acceleration air-flow of described gas outlet direction and accelerate the Air Flow in described gas channel according to the described signal of telecommunication.This air-flow accelerator utilizes electric energy to produce and accelerates air-flow.
In the present embodiment, air-flow accelerator can consist of an energy conversion component and air-flow generating structure, and energy conversion component is converted to mechanical energy by the electric energy of chip output, utilizes mechanical energy driving device structure generation to accelerate air-flow.As shown in Figure 4, chip cooling system comprises: chip 41 and heat abstractor, in figure, this heat abstractor consists of air-flow accelerator 42 and kuppe 43, wherein the side of kuppe 43 is provided with two air inlets and is respectively air inlet 431, air inlet 432, top center is provided with gas outlet 433, air-flow is from entering from air inlet 431 and air inlet 432 respectively, and because flow out gas outlet 433, air inlet 431,432 coordinates the gas channel that forms chip top with gas outlet 433; The base of water conservancy diversion 43 covers is fixed on the side of described chip 41; Air-flow accelerator 42 consists of energy conversion element 421 and air-flow generating structure 422, and energy conversion component 421 is electrically connected to chip 41, and air-flow generating structure 422 is connected with energy conversion element 421; The electric energy of the signal of telecommunication that energy conversion component 421 provides described chip 41 is converted to mechanical energy and utilizes described mechanical energy to drive the acceleration air-flow of one of described air-flow generating structure 422 output, 433 directions over against gas outlet, thereby accelerating kuppe 43 inside is the air current flow of chip 41 tops, reaches the effect to chip 41 quick heat radiatings.
Preferentially, in the present embodiment, energy conversion component comprises: piezoelectric element; Described piezoelectric element one side is connected with described air-flow generating structure, another side is connected with described air-flow generating structure, described piezoelectric element produces mechanical resonant according to the signal of telecommunication of described chip transmission, and utilizes the mechanical energy of mechanical resonant to drive described air-flow generating structure to export at least one acceleration air-flow.
In the situation that energy conversion component is piezoelectric element, in the present embodiment, air-flow generating structure can comprise: the chamber that bottom is barrier film, described piezoelectric element one side is connected with described chip, another side is connected with described barrier film, the top of described chamber is provided with at least one outlet, a corresponding described gas outlet of described outlet and over against described gas outlet, the quantity of described outlet is less than or equal to the quantity of described gas outlet; Described piezoelectric element produces mechanical resonant according to the signal of telecommunication of described chip transmission, and drives described barrier film to vibrate together to make to accelerate air-flow from one of a described outlet output of described chamber.
As shown in Figure 5, chip cooling system comprises: chip 51 and heat abstractor, in figure, this heat abstractor consists of air-flow accelerator 52 and kuppe 53, wherein the side of kuppe 53 is provided with two air inlets and is respectively air inlet 531, air inlet 532, top center is provided with gas outlet 533, air-flow is from entering from air inlet 531 and air inlet 532 respectively, and because flow out gas outlet 533, air inlet 531,532 coordinates the gas channel that forms chip top with gas outlet 533; The base of water conservancy diversion 53 covers is fixed on the side of described chip 51; Air-flow accelerator 52 consists of piezoelectric element 521 and chamber 522, and the one side of piezoelectric element 521 is electrically connected to chip 51, and another side is connected with the bottom of chamber 522; Chamber 522 bottoms are barrier film 5220, and top is provided with one for the outlet 5221 of gas outlet 533; The mechanical resonant of the electric energy conversion of the signal of telecommunication that piezoelectric element 521 provides described chip 51 self, and the barrier film 5220 that drives chamber 522 vibrates the acceleration air-flow of outlet 5221 output making from described chamber 522 together, thereby accelerating kuppe 53 inside is the air current flow of chip 51 tops, reaches the effect to chip 51 quick heat radiatings.
Should be understood that, while being provided with a plurality of gas outlet at kuppe top, in chamber roof, can a plurality of outlets be set correspondence, each exports respectively over against a gas outlet, and the quantity of outlet can be less than or equal to the quantity of gas outlet.
Preferentially, piezoelectric element described in the present embodiment is comprised of piezoelectric ceramic piece and metal electrode layer, and described metal electrode layer is arranged in the one side of described piezoelectric ceramic piece and is connected with described chip, and the another side of described piezoelectric ceramic piece is connected with described barrier film.
As shown in Figure 6, chip cooling system comprises: chip 61 and heat abstractor, in figure, this heat abstractor consists of air-flow accelerator 62 and kuppe 63, wherein the side of kuppe 63 is provided with two air inlets and is respectively air inlet 631, air inlet 632, top center is provided with gas outlet 633, air-flow is from entering from air inlet 631 and air inlet 632 respectively, and because flow out gas outlet 633, air inlet 631,632 coordinates the gas channel that forms chip top with gas outlet 633; The base of water conservancy diversion 63 covers is fixed on the side of described chip 61; Air-flow accelerator 62 consists of piezoelectric element 621 and chamber 622, piezoelectric element 621 is due to piezoelectric ceramic piece 6210 and metal electrode layer 6211 formations, described metal electrode layer 6211 arranges in the one side of described piezoelectric ceramic piece 6210 and is connected with described chip 61, and the another side of described piezoelectric ceramic piece is connected with described barrier film 6220; Chamber 622 bottoms are barrier film 6220, and top is provided with one for the outlet 6221 of gas outlet 633; The mechanical resonant of the electric energy conversion self of the signal of telecommunication that piezoelectric ceramic piece 6210 provides by the described chip 61 of metal electrode layer 6211 reception, and the barrier film 6220 that drives chamber 622 vibrates the acceleration air-flow of outlet 6221 output making from described chamber 622 together, thereby accelerating kuppe 63 inside is the air current flow of chip 61 tops, reaches the effect to chip 61 quick heat radiatings.
In the present embodiment, preferentially, described metal electrode layer and described chips welding, can be welded on the pad of chip; Piezoelectric ceramic piece and barrier film are bonding.
In the present embodiment, be all to take kuppe the process of heat radiation is described as cuboid kuppe as example, should be understood that in the present embodiment, kuppe shape is unrestricted, the cover body shape that it can be well known to those skilled in the art, for example square, or hemisphere etc.It can be made according to the concrete shape of chip.
Above-mentioned Fig. 1-6 are all in two sides of kuppe, an air inlet to be set respectively, at end face, a gas outlet is set, two gas outlets and the cross sectional representation of air inlet in same plane, should be understood that, in heat abstractor in the present embodiment, the set-up mode of air inlet and gas outlet is not limited only to the set-up mode of above-mentioned Fig. 1-6, for example can some air inlets be set in a side of kuppe, some gas outlets are set at top, and air inlet and gas outlet be not on same cross section; Or in adjacent side, air inlet is set, air inlet and gas outlet be not on same cross section.
The signal that the heat abstractor of the present embodiment can utilize the characteristic of piezoelectric element that chip is provided is converted to the mechanical resonant of self, and by vibrating together with connect driving barrier film with barrier film, make constantly to produce and accelerate air-flow and accelerate air current flow from its top exit at chamber, reach the effect of quick heat radiating.The features such as the heat abstractor of the present embodiment has simple in structure, and volume is little, can be widely used in intelligent terminal, improve the problem of intelligent heating.
Above content is in conjunction with concrete execution mode further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (10)
1. a heat abstractor, is characterized in that, comprising: air-flow accelerator and guiding device;
Described guiding device is arranged on chip top, and described guiding device is provided with gas outlet and air inlet, matches and form gas channel above described chip with described air inlet in described gas outlet;
Described air-flow accelerator is arranged between described chip and described guiding device, and described airflow apparatus produces over against the acceleration air-flow of described gas outlet direction and accelerates the Air Flow in described gas channel.
2. heat abstractor as claimed in claim 1, is characterized in that, described guiding device comprises: kuppe, and described kuppe and described chip are connected and cover on the top of described chip; The side of described kuppe is provided with air inlet, and the top of described kuppe is provided with gas outlet, and described air-flow accelerator is positioned at described kuppe and produces the acceleration air-flow over against described gas outlet direction.
3. heat abstractor as claimed in claim 2, is characterized in that, the top of described kuppe is provided with a gas outlet, and the side of described kuppe is provided with at least one air inlet;
Or
The top of described kuppe is provided with two gas outlets, and described kuppe side is provided with at least one air inlet.
4. heat abstractor as claimed in claim 3, is characterized in that, the center at described kuppe top is provided with a gas outlet.
5. the heat abstractor as described in claim 1-4 any one, it is characterized in that, described air-flow accelerator is connected with described chip, receives the signal of telecommunication that described chip provides and produces over against the acceleration air-flow of described gas outlet direction and accelerate the Air Flow in described gas channel according to the described signal of telecommunication.
6. heat abstractor as claimed in claim 5, is characterized in that, described air-flow accelerator comprises: energy conversion component and air-flow generating structure; The electric energy of the signal of telecommunication that described energy cell provides described chip is converted to mechanical energy and utilizes described mechanical energy to drive described air-flow generating structure to export at least one and accelerate air-flow, and the quantity of described acceleration air-flow is less than or equal to the quantity of described gas outlet.
7. heat abstractor as claimed in claim 6, is characterized in that, described energy conversion component comprises: piezoelectric element; Described piezoelectric element one side is connected with described air-flow generating structure, another side is connected with described air-flow generating structure, described piezoelectric element produces mechanical resonant according to the signal of telecommunication of described chip transmission, and utilizes the mechanical energy of mechanical resonant to drive described air-flow generating structure to export at least one acceleration air-flow.
8. heat abstractor as claimed in claim 7, it is characterized in that, described air-flow generating structure comprises: the chamber that bottom is barrier film, described piezoelectric element one side is connected with described chip, another side is connected with described barrier film, the top of described chamber is provided with at least one outlet, a corresponding described gas outlet of described outlet and over against described gas outlet, the quantity of described outlet is less than or equal to the quantity of described gas outlet; Described piezoelectric element produces mechanical resonant according to the signal of telecommunication of described chip transmission, and drives described barrier film to vibrate together to make to accelerate air-flow from one of a described outlet output of described chamber.
9. heat abstractor as claimed in claim 8, it is characterized in that, described piezoelectric element is comprised of piezoelectric ceramic piece and metal electrode layer, and described metal electrode layer is arranged in the one side of described piezoelectric ceramic piece and is connected with described chip, and the another side of described piezoelectric ceramic piece is connected with described barrier film.
10. heat abstractor as claimed in claim 9, is characterized in that, described metal electrode layer and described chips welding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420194722.0U CN203934235U (en) | 2014-04-21 | 2014-04-21 | A kind of heat abstractor |
| PCT/CN2014/085064 WO2015161598A1 (en) | 2014-04-21 | 2014-08-22 | Heat-dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420194722.0U CN203934235U (en) | 2014-04-21 | 2014-04-21 | A kind of heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203934235U true CN203934235U (en) | 2014-11-05 |
Family
ID=51829976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420194722.0U Expired - Lifetime CN203934235U (en) | 2014-04-21 | 2014-04-21 | A kind of heat abstractor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203934235U (en) |
| WO (1) | WO2015161598A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229304A (en) * | 2016-08-05 | 2016-12-14 | 上海交通大学 | 3D chip package cooling structure based on inverse piezoelectric effect |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100427759C (en) * | 2003-09-12 | 2008-10-22 | 清华大学 | Dual piezoelectric beam driven diaphram air pump |
| JP2005142513A (en) * | 2003-11-10 | 2005-06-02 | Sony Corp | Cooling device and electronic equipment |
| JP2009222019A (en) * | 2008-03-18 | 2009-10-01 | Fujikura Ltd | Piezoelectric fan device |
| US8681495B2 (en) * | 2011-03-29 | 2014-03-25 | Eldon Technology Limited | Media device having a piezoelectric fan |
-
2014
- 2014-04-21 CN CN201420194722.0U patent/CN203934235U/en not_active Expired - Lifetime
- 2014-08-22 WO PCT/CN2014/085064 patent/WO2015161598A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229304A (en) * | 2016-08-05 | 2016-12-14 | 上海交通大学 | 3D chip package cooling structure based on inverse piezoelectric effect |
| CN106229304B (en) * | 2016-08-05 | 2018-08-17 | 上海交通大学 | 3D chip package cooling structures based on inverse piezoelectric effect |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015161598A1 (en) | 2015-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107369657A (en) | A kind of two-side radiation power model of multizone laid out in parallel | |
| CN107464785A (en) | A kind of staggered two-side radiation power model of multiple branch circuit | |
| CN206558493U (en) | Three-dimensional chip integrated circuit cooling system | |
| CN107393901A (en) | A kind of two-side radiation power model of laminated base plate | |
| CN203934235U (en) | A kind of heat abstractor | |
| CN205488244U (en) | Battery module and battery pack | |
| CN104112728B (en) | Device mounting structure and integrated circuit modules | |
| CN112216841B (en) | Battery current collector and lithium battery | |
| CN103779341B (en) | A kind of high-power half bridge module | |
| CN108281401A (en) | Three-dimensional chip integrated circuit cooling system | |
| CN107404181A (en) | A kind of radiating noise-decreasing device of generator | |
| CN207165558U (en) | A kind of two-side radiation power model of laminated base plate | |
| CN104701268B (en) | Spm | |
| TW200620573A (en) | Power module and electric transportation apparatus incorporating the same | |
| CN207602544U (en) | A kind of staggered two-side radiation power module of multiple branch circuit | |
| CN104405558A (en) | Water flow speed increasing device for bulb tubular generator set | |
| CN104681669B (en) | The preparation method and its electric performance test method of a kind of opto-electronic conversion laminate | |
| CN203746841U (en) | Power semiconductor module | |
| CN207165547U (en) | A kind of two-side radiation power model of multizone laid out in parallel | |
| CN208707592U (en) | A kind of photovoltaic junction box improving radiating efficiency | |
| CN203882103U (en) | Timer | |
| CN206332288U (en) | A kind of wire harness | |
| CN203632299U (en) | Portable power supply | |
| CN105374809B (en) | A kind of power module | |
| CN104409775A (en) | 3D printing technology of annular lithium battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141105 |