CN203932028U - Fluid bearings device - Google Patents

Abstract

The utility model discloses a kind of fluid bearings device, it comprises carriage and is positioned at the weight sensing device of carriage bottom.Weight sensing device includes multiple weight sensors, on each weight sensor, can place the container of a carrying fluid, each weight sensor can the sensing side of being located thereon the weight of container, and the weight data of the corresponding container being sensed transfers out, described weight sensing device comprises installs body, multiple container tray, multiple jointing, multiple weight sensing unit and bottom shrouding, and cell therefor pallet, jointing, weight sensing unit fit together and form a weight sensor.The weight of each container of understanding that like this can be real-time, thus monitor the ruuning situation of the semiconductor processing device that uses the fluid in container according to these data.

Description

Fluid bearings device

[technical field]

The present invention relates to semiconductor surface process field, relate in particular to a kind of semiconductor processing equipment and online fault detection method thereof that semiconductor crystal wafer is carried out to chemical surface treatment.

[background technology]

Integrated circuit manufacturing industry is the important infrastructural industries of modern high technology, and the electronic product of integrated circuit (IC) design manufacture is called " industrial grain ", be " heart " of all whole set equipments, be widely used in several large fields such as computer, consumer electronics, network service, automotive electronics.

Wafer is the carrier of producing used in integrated circuits.In actual production, need the wafer of preparation must there is smooth, super clean surface, and can be divided into two kinds for the preparation of the existing method of super clean wafer surface: such as the wet treatment process of submergence and spraying technique, and such as the dry process process based on chemical gaseous phase and plasma technology.Wherein wet treatment process is that prior art adopts method comparatively widely, and wet treatment process generally includes a succession of step composition that adopts suitable chemical solution submergence or spray wafer.

The equipment of the super clean wafer surface of general existing preparation is mainly made up of reaction vessel, chemical liquids storage system, chemical liquids transfer system.Reaction vessel is the reactive tank pond of immersion or the reaction chamber of fountain; Chemical liquids storage system is mainly made up of container, pump, valve, filter etc.; Chemistry transfer system is mainly made up of pump, valve, pressure and flow control part, pipeline etc.Once the parts in each system break down as pump, valve, can not normal switch as valve, will affect the cleaning performance of wafer, thereby affect the yield of product, therefore, on production line, 50% yield problem is relevant with cleaning.Conventionally, need to supervise in real time and periodic maintenance all system units, but because system unit is too many, be difficult to ensure that each problematic parts can be found in time.

Therefore, be necessary to propose a solution and can be checked through in time the fault occurring in chemical transfer system and chemical liquids storage system, stop in time wafer-process, and find fast problematic parts.

[summary of the invention]

The technical problem to be solved in the present invention is to provide a kind of fluid bearings device, it not only can realize the carrying of fluid, can also, by the service condition of real-time monitoring fluid, find contingent fault, take the necessary measures in time, find the place going wrong.

In order to address the above problem, according to an aspect of the present invention, the invention provides a kind of fluid bearings device, it comprises carriage and is positioned at the weight sensing device of carriage bottom.Weight sensing device includes multiple weight sensors, on each weight sensor, can place the container of a carrying fluid, each weight sensor can the sensing side of being located thereon the weight of container, and the weight data of the corresponding container being sensed transfers out, described weight sensing device comprises installs body, multiple container tray, multiple jointing, multiple weight sensing unit and bottom shrouding, and cell therefor pallet, jointing, weight sensing unit fit together and form a weight sensor.

Further, described installation body includes the multiple lug bosses that are formed on its end face, what be formed at described lug boss downside multiplely holds cavity and runs through described lug boss and hold with described multiple perforation that cavity is communicated with, each container tray comprises body, be formed at the groove of described body bottom and be formed at the duct of described body bottom centre, each container tray is installed in the respective protrusions portion of described installation body, the sidewall in wherein said duct extends into the perforation of described lug boss fixing in the inner, described lug boss extends into the groove of described container tray fixing in the inner.Each weight sensor unit includes the connecting hole that is formed at its top center, it is contained in corresponding the holding in cavity of described installation body, one end of wherein said jointing extends in the connecting hole of described weight sensor, the other end extends in the duct of described pallet through described perforation, described bottom shrouding is installed on the bottom of described installation body, and each weight sensing unit is packaged in described installation body.

Further, the periphery of the body of described container tray is formed with fin.

Further, the bottom of the groove of described pallet is also provided with annular channel.

Further, described installation body includes the stop part being formed on its end face periphery, between each lug boss, has gap space.

Further, described installation body is integral structure.

Further, on the sidewall of described installation body, be formed with the space that stop part and lug boss are surrounded and be communicated to extraneous passage.

Compared with prior art, in the present invention, below each container, weight sensor is set, the weight of each container of understanding that like this can be real-time, thus determine according to these data whether current semiconductor processing device breaks down, or carry out other analyses.

About other objects of the present invention, feature and advantage, describe in detail in embodiment below in conjunction with accompanying drawing.

[brief description of the drawings]

In conjunction with reference to accompanying drawing and ensuing detailed description, the present invention will be easier to understand, wherein structure member corresponding to same Reference numeral, wherein:

Fig. 1 is the structural representation of the semiconductor processing equipment in the present invention;

Fig. 2 A is fluid bearings device in Fig. 1 perspective view in one embodiment;

Fig. 2 B is the perspective exploded view of the fluid bearings device in Fig. 2 A;

Fig. 3 A is fluid delivery module in Fig. 1 perspective view in one embodiment

Fig. 3 B is the plane projection view of the fluid delivery module in Fig. 3 A;

Fig. 3 C is fluid delivery module in Fig. 1 perspective view in another embodiment;

Fig. 3 D is the plane projection view of the fluid delivery module in Fig. 3 C;

Fig. 3 E is the structural representation of the receipts liquid box in the fluid delivery module in Fig. 1;

Fig. 4 is control module in Fig. 1 structured flowchart in one embodiment;

Fig. 5 A is the structural representation of the another kind of assembling mode of the semiconductor processing equipment in the present invention;

Fig. 5 B is the structural representation of another assembling mode of the semiconductor processing equipment in the present invention;

Fig. 6 A is that the weight sensing device in Fig. 2 B is assembled schematic diagram in the amplification of an embodiment;

Fig. 6 B is the perspective exploded view of the weight sensing device shown in Fig. 6 A;

Fig. 6 C is the cutaway view of the container tray of the weight sensing device in Fig. 6 B;

Fig. 6 D is the upward view of the container tray of the weight sensing device in Fig. 6 B;

Fig. 6 E is the schematic perspective view of another angle of the installation body of the weight sensing device in Fig. 6 B;

Fig. 6 F is the stereogram of the weight sensing unit of the weight sensing device in Fig. 6 B;

Fig. 7 A is semiconductor processes module in Fig. 1 schematic perspective view in one embodiment;

Fig. 7 B is that the master of the semiconductor processes module in Fig. 7 A looks schematic diagram;

Fig. 8 is lower box device in Fig. 7 A schematic perspective view in one embodiment;

Fig. 9 be lower chambers plate in Fig. 7 A in one embodiment with the assembling schematic diagram of described lower box device;

Figure 10 is plug-in unit in Fig. 7 A reverse side schematic perspective view in one embodiment;

Figure 11 is top box device in Fig. 7 A schematic perspective view in one embodiment;

Figure 12 is top box device in Fig. 7 A schematic top plan view in one embodiment;

Figure 13 is dividing plate in Fig. 7 A schematic top plan view in one embodiment.

[embodiment]

For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.

Alleged " embodiment " or " embodiment " refer to that the special characteristic relevant to described embodiment, structure or characteristic at least can be contained at least one implementation of the present invention herein.Different local in this manual " in one embodiment " that occur also nonessentially all refer to same embodiment, must not be yet with other embodiment mutually exclusive separately or select embodiment." multiple ", " some " in the present invention represent two or more."and/or" in the present invention represent " with " or "or".

Fig. 1 shows the structural representation of the semiconductor processing equipment 1 in the present invention.As shown in Figure 1, described semiconductor processing equipment 1 comprises semiconductor processes module 10, fluid delivery module 20, fluid bearings device 30 and control module 40.

Described semiconductor processes module 10 comprises that one for holding and process the micro chamber of semiconductor crystal wafer, and described micro chamber comprises one or more entrance and one or more outlets for micro chamber described in processing fluid expulsion that enter described micro chamber for processing fluid.Described micro chamber comprises the portion of upper chamber that forms upper working surface and the lower chambers portion that forms lower working surface, and portion of described upper chamber and described lower chambers portion can be under the driving of a drive unit relatively move for holding between the off-position of this semiconductor crystal wafer at the open position and that loads and/or remove this semiconductor crystal wafer.When portion of upper chamber or described lower chambers portion are time in the closed position, semiconductor crystal wafer is placed between described upper working surface and lower working surface.Owing to adopting the structure of micro chamber, the volume of described semiconductor processes module 10 becomes very little.

As shown in Figure 2 A and 2B, described fluid bearings device 30 used fluid for what carry that the needed chemicals of the described semiconductor crystal wafer of various processing, super clean water or other fluids (can be referred to as and not use fluid) and/or carrying processed described semiconductor crystal wafer.As shown in Figure 2 A and 2B, it shows an embodiment of described fluid bearings device 30, described fluid bearings device 30 comprises carriage 31, be positioned over the multiple containers 32 in described carriage 31 and be positioned at the weight sensing device 33 of described container 32 belows, and described container can hold for the treatment of the needed various various fluids that used that do not use fluid and/or processed described semiconductor crystal wafer of described semiconductor crystal wafer.Such as containing super clean water in a container, in another container, fill the chemical pretreatment solution for the treatment of described crystal column surface, separately have in a container contain utilize super clean water to process described semiconductor crystal wafer after the waste liquid that obtains of recovery.Certainly waste liquid also can directly be discharged by predetermined fluid discharge line, and is not positioned in the container 32 of described fluid bearings device 30.In one embodiment, fluid can be by the real-time feed of predetermined fluid service, fluid bearings device 30 now can be set specially and carry various fluids.Certainly, described container 32 also can be considered to not be a part for fluid bearings device 30, and now described fluid bearings device 30 comprises carriage 31 and the weight sensing device 33 that is positioned at carriage 31 bottoms.

As shown in Figure 6A, described weight sensing device 33 comprises multiple weight sensors 330, the weight of the container 32 of each weight sensor 330 sensing sides of being located thereon, and the weight data of the corresponding container being sensed is transferred to described control module 40.

In a concrete example, as shown in Figure 6B, described weight sensing device 33 comprises multiple container trays 331, body 332, multiple jointing 333, multiple weight sensing unit 334 and bottom shrouding 335 is installed.

As shown in Fig. 6 B and 6E, described installation body 332 includes multiple lug bosses 3321 of being formed on its end face, be formed at described lug boss downside multiplely hold cavity 3322 and run through described lug boss 3321 and hold with described multiple perforation 3323 that cavity 3322 is communicated with.

As shown in Fig. 6 C and 6D, each container tray 331 comprises body 3311, be formed at the groove 3312 of described body 3311 bottoms and be formed at the duct 3313 of described body 3311 bottom centre.Each container tray 331 is installed in the respective protrusions portion 3321 of described installation body 332, the sidewall in wherein said duct 3313 extends into the perforation 3323 of described lug boss 3321 and locates in the inner, and 3321 of described lug bosses extend into the groove 3312 of described pallet 331 and locate in the inner.

As shown in Fig. 6 F, each weight sensor unit 334 includes the connecting hole 3341 that is formed at its top center, it is contained in corresponding the holding in cavity 3322 of described installation body 332, one end of wherein said jointing 333 extends in the connecting hole 3341 of described weight sensor 334, and the other end extends in the duct 3313 of described pallet 331 through described perforation 3323.Bottom shrouding 335 is installed on the bottom of described installation body 332, and each weight sensing unit 334 is packaged in described installation body 332.Corresponding container tray 331, jointing 333 and a weight sensor 330 of weight sensing unit 334 common formation.

Preferably, as shown in Fig. 6 C and 6D, the periphery of the body 3311 of described pallet 331 is formed with fin, more stable in the time that container 32 is positioned on described pallet 331 like this.The bottom of the groove 3312 of described pallet 331 is also provided with annular channel 3314, being provided with of this annular channel 3314 be beneficial to weight sensor unit 334 more stable be positioned described in hold in cavity 3322.

Preferably, as shown in Figure 6 A and 6B, described installation body 332 includes the stop part 3324 being formed on its end face periphery, between each lug boss 3321, there is gap space, when liquid in container occurs to reveal like this, the fluid of revealing also can be deposited in the space that stop part 3324 and lug boss 3321 surround, and whether in this space, add fluid sensor to detect has fluid leakage to occur herein.In one embodiment, between the lug boss 3321 of described installation body 332 and its end face without any gap, they are integral structures, when the fluid of revealing so is from container deposited in the space that stop part 3324 and lug boss 3321 surround, can not infiltrate into below described installation body 332, thereby avoid weight sensor 334 to receive corrosion.At one further in embodiment, on the sidewall of described installation body 332, be formed with the space that stop part 3324 and lug boss 3321 are surrounded and be communicated to extraneous passage (not shown), the fluid of leakage can be discharged in time like this.

Described fluid delivery module 20 is connected with the entrance and exit of described micro chamber by pipeline, by the fluid communication in pipeline and described fluid bearings device 30, it is for being urged to described micro chamber by the various fluids that do not use interior fluid bearings device 30 or that supplied with by predetermined fluid service by the entrance of pipeline and described micro chamber.Described fluid is processed described semiconductor crystal wafer in described micro chamber, such as utilizing super clean water, described semiconductor crystal wafer is carried out to surface clean, adopt afterwards pressure, gravity or vacuum, by the motion of gas, delivery had been used contaminated-fluid to send in the corresponding container or predetermined fluid discharge line in described fluid bearings device 30 via various valves, joint, pipeline in outlet and pipeline and the fluid delivery module of described micro chamber described in ordering about.

As shown in Fig. 3 A and 3B, it shows an embodiment of described fluid delivery module 20, described fluid delivery module 20 comprises carriage 21, be assembled in bottom substrate 22 on described carriage 21, with the spaced head substrate 23 of described bottom substrate 22 and two apart from one another by the side substrates 24 and 25 that arrange, multiple valves 26, and one or more pump 27.In this embodiment, two side substrates 24 and 25 be arranged in parallel, and described head substrate 23 and described bottom substrate 24 be arranged in parallel, and described bottom substrate 22 is crossing with two side substrates 24 and 25, and described head substrate 23 is crossing with two side substrates 24 and 25.The centre of described bottom substrate 22, described head substrate 23 and two side substrates 24 and 25 crosses a fluid space 28.

On one end of described valve 26, be provided with multiple communications ports 261, can optionally two communications ports 261 be communicated with according to valve described in external control 26.On one end of described pump 27, be provided with one and suck the suction inlet 271 of liquid and the outlet 272 of a discharge liquid.Each side substrate is provided with one or more installing holes (unmarked).The end that is provided with communications ports 261 of described valve 26 extends in described fluid space 28 through the installing hole on described side substrate 24, the other end of described valve 26 includes electrical cable (not shown), and the electrical cable of described valve 26 is positioned at a side in the nonfluid space 28 of described side substrate 24.The end that is provided with suction inlet 271 and outlet 272 of described pump 27 extends in described fluid space 28 through the installing hole on described side substrate 25, the other end of described pump 27 includes electrical cable (not shown), and the electrical cable of described pump 27 is positioned at a side in the nonfluid space 28 of described side substrate 25.

In use, can utilize pipeline that the fluid of the outlet of the outlet 272 of the suction inlet of described pump 27 271, described pump 27, the communications ports 261 of described valve 26, the entrance of described micro chamber, described micro chamber and/or described fluid bearings device carrying 30 is communicated with.Like this, under the driving of pump 27, the fluid of described fluid bearings device carrying 30 can be delivered to described micro chamber by pipeline and/or described valve 26, the fluid flowing out from described micro chamber is delivered in described fluid bearings device carrying 30 or predetermined fluid discharge line by pipeline and/or described valve 26.

On described bottom substrate 22, offer the under shed 221 that is communicated with described fluid space 28, this under shed 221 pipeline for connection passes.For instance, if shown in position relationship Fig. 1 of modules 10,20,30 and 40, the pipeline passing from described under shed 221 so will be communicated to described fluid bearings device 30.On described head substrate 23, offer the upper shed 231 that is communicated with described fluid space 28, this upper shed 231 pipeline for connection passes.For instance, if shown in position relationship Fig. 1 of modules 10,20,30 and 40, the pipeline passing from described upper shed 231 so will be communicated to the micro chamber of described semiconductor processes module 10.In a preferred embodiment, described fluid delivery module 20 also comprises the receipts liquid box 210 as shown in Fig. 3 E of the below that is positioned at described under shed 221, the opening of described receipts liquid box 210 is aimed at described under shed 221, and the liquid of the leakage in fluid space 28 can be collected in described receipts liquid box 27 like this.

In described receipts liquid box, be provided with the fluid sensor (not shown) that whether has leak fluid for surveying, have leak fluid in described fluid sensor detects receipts liquid box time, sensed data is transferred to described control module 40, send in time leak alarm, and it is local to analyze leakage failure generation by described control module 40.

Feature or the advantage of the fluid delivery module 20 in the present invention are: because the end that is provided with suction inlet 271 and outlet 272 of described pump 27 extends in described fluid space 28 through described side substrate 25, the end that is provided with communications ports 261 of described valve 26 extends in described fluid space 28 through described side substrate 24, make like this suction inlet 271 of described pump 27 and the communications ports 261 of outlet 272 and described valve 26 be oppositely arranged, thereby shorten as much as possible the distance of the suction inlet of pump 27 and the communications ports of outlet and described valve 26, facilitate them to pass through pipeline communication, space availability ratio is very high, make overall smaller volume.

Another feature or the advantage of the fluid delivery module 20 in the present invention are: bottom substrate 22, head substrate 23 and two side substrates 24 and 25 of described fluid delivery module 20 have surrounded a comparatively fluid space 28 for sealing, the fluid line of described fluid delivery module 20 all passes through from this fluid space 28, facilitate the management of these fluid lines with the exchanging of other module.In addition, if there is the situation of fluid leakage or injection, the fluid big city of leaking or spray is limited in fluid space 28, be convenient to implement in time, effectively process, can also avoid as much as possible revealing being diffused into other region, cause the damage and fracture of other parts and produce other safety problem simultaneously.For instance, described liquid is generally acidity or akaline liquid, if do not set the fluid space of sealing, if there is the situations such as leak of liquid, described acidity or akaline liquid corrode electrical cable and other parts of described valve or described pump possibly, thereby may bring out security incident or damage equipment.

Another feature or the advantage of the fluid delivery module 20 in the present invention are: below described under shed 221, be also provided with described receipts liquid box 210, like this can be in the time there is fluid leakage or spray, receive in time and get rid of described liquid, avoiding other parts to impact.

Refer again to shown in Fig. 3 A and 3B, described fluid delivery module 20 also comprises that the 5th substrate 29, the five substrates 29 that extend to head substrate 23 from bottom substrate 22 are vertical with 25 with described side substrate 24 and crossing.One side of the 5th substrate 29 comprises described fluid space 28, is provided with the gas device such as air valve and barometer in the space of another side.Gas in the container of described fluid bearings device 30 or that predetermined gas service is supplied with can be transported to by described air valve and pipeline the micro chamber of described semiconductor processes module 10, and the gas that the micro chamber of described semiconductor processes module 10 is discharged can be expelled in the container of described fluid bearings device 30 or predetermined gas discharge line by pipeline and described air valve.Described barometer can detect the air pressure of micro chamber.Like this, described the 5th substrate 29 can and comprise that air valve and the barometrical gas compartment separate by described fluid space 28, can not have influence on like this equipment of gas zone, thereby further improve fail safe in the time there is leak of liquid.Described air valve also includes electrical cable.

As shown in Fig. 3 C and 3D, it shows another embodiment of described fluid delivery module 20.In order more to specify the internal structure in described fluid delivery module 20, in Fig. 3 C and not shown described head substrate 23.Fig. 3 C is identical with the most of structure in Fig. 3 A and Fig. 3 B with the fluid delivery module in Fig. 3 D, difference is: what on the side substrate 25 of the fluid delivery module shown in Fig. 3 C, install is not pump, and or valve 26, the end that is provided with communications ports 261 of described valve 26 extends in described fluid space 28 through the installing hole on described side substrate 25.That is to say, in this embodiment, on two side substrates 24 and 25, described valve 26 is all set, now fluid can be by the real-time feed of predetermined fluid service, be transported to described micro chamber via described valve 26, and be fed to predetermined fluid discharge line from described micro chamber via described valve 26.

Described control module 40 is electrically connected by the electrical cable (not shown) of the drive unit in semiconductor processes module 10, electrical cable, the electrical cable of described pump 27 and/or the electrical cable of air valve of described valve 26, realizes drive unit, valve 26, pump 27 and/or air valve are controlled.Described control module 40 is also connected to receive the weight data of each container 32 sensing with weight sensor 330.

It shows an embodiment of described control module 40 Fig. 4, and described control module 40 comprises valve positioner 41, driving governor 42, pump controller 43, air valve controller 44 and monitoring unit 45.Described valve positioner 41 can be controlled each valve 26 in described fluid delivery module 20, such as whether each valve 26 is communicated with, and which communications ports and which communications ports connection etc.Described driving governor 42 is controlled the drive unit in described semiconductor processes module 10, make upper and lower micro chamber in an open position such as controlling described drive unit, now can load and/or remove this semiconductor crystal wafer, also can control described drive unit and make upper and lower micro chamber in the closed position.Described pump controller 43 is controlled the pump 27 in described fluid delivery module 20, and such as opening or closing, various parameters for another example, such as hydraulic pressure, rotating speed etc.Can also control described air valve controller 44 air valve in described fluid delivery module 20 is controlled, such as opening or closing, control for another example various parameters, such as air pressure etc.Described monitoring unit 45 is according to monitoring in real time from weight sensor 330, the induced signal receiving the fluid sensor in liquid box 27 or be arranged at the transducer of other positions, for example: in the time that leak sensor has detected leak of liquid, report to the police or remind, and assisting fault to get rid of.

In common application, described semiconductor processes module 10 is communicated with described fluid delivery module 20 by pipeline, described fluid delivery module 20 is communicated with the fluid in described fluid bearings device 30 by pipeline, described control module 40 is electrical connected by pump, valve, air valve in drive unit, described fluid delivery module 20 in electrical cable and described semiconductor processes module 10, the annexation of modules is very simple, assembles and change very convenient.In one embodiment, modules can put together modules according to the position relationship shown in Fig. 1, described fluid bearings device 30 is positioned over bottommost, described fluid delivery module 20 is positioned over the top of described fluid bearings device 30, described semiconductor processes module 10 is positioned over the top of described fluid delivery module 20, and described control module 40 is positioned over the side of described fluid delivery module 20 and described fluid bearings device 30.

In other embodiments, can carry out position to modules as required and adjust the position relationship between modules.Fig. 5 A shows the structural representation of the another kind of assembling mode of the semiconductor processing equipment in the present invention.As shown in Figure 5A, described fluid bearings device 30, described fluid delivery module 20 and described semiconductor processes module 10 are from left to right placed successively, and described control module 40 is positioned over described fluid bearings device 30 and described fluid delivery module 20 tops.Fig. 5 B shows the structural representation of another assembling mode of the semiconductor processing equipment in the present invention.As shown in Figure 5 B, described fluid bearings device 30 is positioned over the top of described fluid delivery module 20, described semiconductor processes module 10 is positioned over the right side of described fluid delivery module 20, and described control module 40 is positioned over described fluid bearings device 30 and described fluid delivery module 20 left sides.

With respect to the existing semiconductor processing equipment of bulky complex, semiconductor processing device in the present invention carries out rational modularized design to the composition of device, and this modular result tool has the following advantages: 1, realize the maintenance of production line external equipment parts and malfunction elimination, maintenance; When equipment breaks down, only need to preprepared spare part module by problematic module just replace can restorer operation, affect as small as possible the manufacturing schedule of whole production line, the module of changing strictly check, repair and safeguard after can become on the spare part module of fault once; 2, facilitate assembling and the carrying of equipment; 3, the assembling diversification of forms of module, can assemble according to the variation of different manufacturers, different production line and other requirements, condition; 4, the expansion of range of application and extension, in the time that production technology need to change, after only need to certain module of equipment being adjusted or be redesigned, replace the old module that obtains, for example: use the process chamber module that can process 300 millimeters of wafers to change the process chamber module that can only process 200 millimeters of wafers.

In one embodiment, as shown in Figure 4, in described monitoring unit 45, record the preset time of each container 32 in semiconductor crystal wafer processing procedure to weight data.The real time that the weight data that described monitoring unit 45 transmits according to each weight sensor 330 obtains each container 32 is to weight data, and preset time based on each container determines to weight data whether the Fluid Transport path that this container is corresponding breaks down to weight data and real time.If the preset time of a container 32 exceedes predetermined threshold to weight data and real time to weight data deviation, the Fluid Transport path that judges these container 32 correspondences may break down, such as leak or a valve there is no normal switch, the Fluid Transport path of one of them container 32 correspondence refers to that fluid is driven into the path of described micro chamber from this container, or fluid flows into the path in described container 32 from described micro chamber.From the time of described container to learning the service condition of fluid weight data, if a certain period consumption is excessive or too smallly all may cause owing to breaking down.In addition, described monitoring unit 45 can also be adjusted from the flow velocity of this container 32 withdrawn fluid weight data according to the time of described container, can adjust from the flow velocity of this container withdrawn fluid described pump 27 by described pump controller 43.

Described monitoring unit 45 can also receive from the sensed data of receiving the fluid sensor in liquid box 27 and determine whether to occur fluid leakage fault.In a preferred embodiment, described monitoring unit 45 can integrated fluid transducer and the sensed data of weight sensor judge, can carry out more accurately like this fault detect, such as can directly judging which bar path breaks down, break down in which position of which bar path.

Only semiconductor processing module 10 has been carried out to simple introduction above, Fig. 7 A and 7B show a detailed embodiment of described semiconductor processes module 10, below in conjunction with Fig. 7 A and Fig. 7 B, described semiconductor module 10 are described in detail.

Please refer to Fig. 7 A and Fig. 7 B, it shows respectively semiconductor processes module in the present invention schematic perspective view and front schematic view in one embodiment.Simply, described semiconductor processes module comprises smooth means for correcting 110, micro chamber module 120, drive unit 130 and stand column device 140.Each assembly in described first three module is fixed, is supported or guided by four stand column device 140 parallel to each other, and is respectively from lower to upper drive unit 130, micro chamber module 120 and smooth means for correcting 110 along described stand column device 140.Wherein micro chamber module 120 comprises the micro chamber of a processing semiconductor crystal wafer, described micro chamber includes upper chamber's plate 122 and lower chambers plate 126, described upper chamber plate 122 is supported by top box device 124, and is fixed in described top box device 124 by the smooth means for correcting 110 of the side of being located thereon; Correspondingly, described lower chambers plate 126 is supported by lower box device 128, and lower box device 128 is supported and driven by the drive unit 130 that is positioned at its below again.

Described drive unit 130 can drive described lower box device 128 guide and move with respect to described top box device 124 according to described stand column device 140, need to load and remove semiconductor die bowlder with box lunch and can open or close top box device 124 and lower box device 128, also can open or close the micro chamber that upper chamber's plate 122 and lower chambers plate 126 form.In the time closing described micro chamber, chemical reagent and other fluids can be introduced to described micro chamber inside by the entrance of described micro chamber and carry out chemical analysis, clean, etching and other processing for the semiconductor crystal wafer in it, and after being disposed, described chemical reagent and other fluids are drawn to described micro chamber by the entrance of described micro chamber.

The present invention for convenience of description, first described drive unit 130 is described, described drive unit 130 comprises base plate 132 from bottom to top successively, be positioned at base plate top the first intermediate plate 134, be positioned at the second intermediate plate 136 of the first intermediate plate 134 tops and be positioned at the upper plate 138 of the second intermediate plate 136 tops.The columniform cavity that described base plate 132, the first intermediate plate 134, the second intermediate plate 136 and upper plate 138 form, its inner space can accommodate driver, described driver is product comparatively ripe in prior art, such as air impeller, similarly, also can adopt other drivers such as Mechanical Driven, motorized motions or hydraulic-driven principle.But should recognize, in the time that described driver produces actuating force upwards, described the second intermediate plate 136 and upper plate 138 can be driven by the actuating force of described driver and move up; In the time that described driver produces downward actuating force, described the second intermediate plate 136 and upper plate 138 can be driven and move down by the actuating force of described driver and self gravitation, thereby make described micro chamber complete the conversion from open mode to closed condition.Easily full of beard and, in another embodiment, described base plate 132 and the first intermediate plate 134 can one-body molded making become a bottom plate; Described the second intermediate plate 136 and upper plate 138 can become a top plate in conjunction with making.That is to say, described drive unit 130 is also not limited to the embodiment describing in above-described embodiment, all can as long as can reach the execution mode of same or more excellent effect.

Micro chamber module 120 shown in Fig. 7 A and Fig. 7 B is then described.Lower chambers plate 126, dividing plate 125, the top box device 124 of dividing plate 125 tops and the upper chamber's plate 122 being supported by top box device 124 that described micro chamber module 120 comprises successively from bottom to top lower box device 128, supported by lower box device 128.Described lower box device 128 and the lower chambers plate 126 that supported by lower box device 128 can be under the driving of described drive unit 130 along the guiding of described stand column device 140 and upwards or move down.The top box device 124 of described dividing plate 125, dividing plate 125 tops and the common transfixion of upper chamber's plate 122 being supported by top box device 124, carry out the summary inching about planarization by described smooth means for correcting 110 only, and relevant this details below will describe in detail.When described lower box device 128 and the lower chambers plate 126 that supported by lower box device 128 under the driving of described drive unit 130 along the guiding of described stand column device 140 and move up and with described upper chamber plate 122 and top box device 124 closures after, will form micro chamber.

Fig. 8 is described lower box device 124 700 schematic perspective view in one embodiment.It is that foursquare uncovered is box-like that the shape of described lower box device 700 is bottom surface substantially.Draw together the hole, four post positions 702 corresponding to described stand column device 140 at the tetra-pack of described lower box device 700.The bottom surface of described lower box device 700 is thicker, and it is identical with inclination mode, side by side and the identical slope 704 of width to include three angles of inclination with respect to the one side of top box device 124, comprises that the bottom surface of slope is designed for chemical agent or other fluids of the lower chambers plate water clock of collecting the side of being located thereon herein.By above-mentioned slope, at the bottom of chemicals or other fluids finally can flow to the slope of described slope 704.Now coordinate again the device that is communicated with at the bottom of the slope of described slope diversion groove, hole, pipeline or receiver of 704 and so on can collect this fluid.

Will be appreciated that at the bottom of the slope of described odd number slope simultaneously 704 towards box wall disappearance non-existent, and the inwall position that other three box walls 706 contact with described bottom surface is recessed to form a groove 707 to horizontal direction.Described lower chambers plate 128 can, via the box wall position of disappearance, enter described lower box device 700 and by described bottom supporting along groove 707 horizontal slips on other box walls 706.In like manner, in the time that described lower chambers plate 128 is positioned at lower box device 700, also can slide along described groove 707, from disappearance box wall position slide out described box device 700.Four limits of described lower box device 700 are also formed with respectively the breach 708 of rectangle.

Please refer to Fig. 9, its show described lower chambers plate 128 in an embodiment 800 with the assembling schematic diagram of described lower box device 700.Although described lower chambers plate 800 is generally one-body molded.Described lower chambers plate 800 comprises bottom 820 and is positioned at the top 840 on described bottom 820.The size of described bottom 820 and edge thickness correspond respectively to distance between the box wall 706 of described lower box device 700 and the width of groove 707.So that described lower chambers plate 800 can slide along the groove 707 on the box wall 706 of described lower box device 700.On described top 840, be formed with chamber wall, described chamber wall surrounds open cavity, the lower working face that the bottom surface of cavity is described micro chamber.

Will be appreciated that, described lower chambers plate 800 adopts pullable mode to slip into or shift out, and can load easily and remove.Because the size of semiconductor crystal wafer is divided into the equal-specifications such as 4 inches, 5 inches, 6 inches, 8 inches, add man-hour requirement according to the lower chambers plate of the wafer replacement coupling of different size.Simultaneously, in the time that described lower chambers plate 800 slips into described lower box device 700, can also use a plug-in unit 160 (as shown in Figure 7A) to be sticked in described lower box device, figure 10 illustrates the reverse side schematic perspective view of described plug-in unit 160 in an embodiment 900.The both sides of described plug-in unit 900 comprise the fin corresponding with the groove 707 of described lower box device 700 902, and including above corresponding to the projection 904 of described even number slope and the depression 906 of odd number slope during the bottom of described plug-in unit 900 also illustrates constructed with the bottom surface of the described lower box device 700 of correspondence.Apparently, by the fixation of described plug-in unit 900, described lower chambers plate 800 can be fixed in described lower box device 700.

Described upper chamber plate 122 includes the structure that is symmetrical in substantially described lower chambers plate 800 substantially.Described upper chamber plate 122 comprises and is foursquare top and is discoidal bottom, and those skilled in the art is highly susceptible to thinking by Fig. 8 and to the structure of described upper chamber plate 122, therefore omit the relevant schematic diagram of described upper chamber plate 122 herein.Obviously, the diameter of the length of side on the foursquare top of described upper chamber plate 122 and described disc bottom can be identical or close with described lower chambers plate 800, and on described bottom, be formed with chamber wall, described chamber wall surrounds open cavity, the upper working face that the bottom surface of cavity is described micro chamber.Will be appreciated that, in the time that the chamber of the chamber of described lower chambers plate 800 wall and described upper chamber plate wall is closed or be close to, wherein can form a cavity for holding semiconductor wafer.

Figure 11 and Figure 12 show respectively schematic perspective view and the upward view of described top box device 124 in an embodiment 1000.It is that foursquare uncovered is box-packed that the shape of described top box device 1000 is substantially bottom.Four jiaos of described top box device 1000 have respectively the circular cavity 1040 that includes the bottom that is slightly larger than described upper chamber plate corresponding to the middle body of bottom described in the hole, post position 1020 of described stand column device 140, and described circular cavity 1040 includes the circumference fin 1042 that extends described bottom downwards.And the box-like space matching by the top with described upper chamber plate 122 that comprises three box walls 1060, the structure of described upper chamber plate 122 can be closely held in formation.By this structure, described upper chamber plate 122 can be by the stable support of described top box device 1000.

Figure 13 shows the schematic top plan view of described dividing plate 125 in an embodiment 1200.The shape of described dividing plate 1200 is square, and draws together the hole, four post positions 1220 corresponding to described stand column device 140 at the tetra-pack of described dividing plate 1200.The middle body of described dividing plate 1200 includes the circumferential notch 1240 of the circumference fin 1042 that can closely receive top box device 1000.The Main Function of described dividing plate 1200 is the square thereon top box devices 1000 of support level and is contained in the upper chamber's plate 122 in described top box device 1000.Four limits of described dividing plate 1200 are also formed with respectively the breach 1260 of rectangle, and described breach 1260 can and be installed other elements such as valve, flow governor, sensor for containing pipe line.In one embodiment, described dividing plate 1200 can adopt stainless steel material to make.

Described smooth means for correcting 110 comprises correcting plate 114, top board 112 and screw 152.First by regulating the nut of four jiaos of described correcting plate 114 tops to give four jiaos of suitable pressure of described correcting plate 114, can tentatively regulate the planarization of described upper chamber plate 122.The micro chamber that recycles existing level measurement device or observe closure state, according to measurement result or observed result, coordinate the installation of multiple screws 152 on top board 112, can accurately adjust the pressure distribution on described correcting plate 122, thereby make described upper chamber plate 122 in comparatively meeting the state of technological requirement.Certainly, in certain embodiments, also may need to regulate the state of described upper chamber plate 122 in certain inclination angle, to facilitate, semiconductor crystal wafer be done to corresponding processing, now regulate the mode of described upper chamber plate 122 from foregoing description, to associate easily.

Described smooth means for correcting 110 can make the lower surface of described upper chamber plate 122 in comparatively suitable stationary state, and described drive unit 130 can make the upper surface of described lower chambers plate 126 decline or rise and make the micro chamber of the lower surface of described upper chamber plate 122 and the formation of the upper surface of described lower chambers plate 126 in opening or closed condition.Certainly, in order to obtain comparatively tight micro chamber, the lower surface of described upper chamber plate 122 and the upper surface of described lower chambers plate 126 can have corresponding laminating or coupled structure, and the joint place of described upper chamber plate 122, top box device 124, lower chambers plate 126 and lower box device 128 can also adopt elements such as the sealing O ring of rubber quality.Simultaneously in order to make chemicals or other fluids can inlet and outlet micro chamber, described upper chamber plate 122 and lower chambers plate 126 also should have the inlet and outlet structure of the microtubule of hollow and guiding gutter and so on.For example need to make semiconductor crystal wafer in the time that described micro chamber is inner, the inwall of semiconductor crystal wafer and described micro chamber is formed with can be for the space of chemicals circulation, and the preset width in this space is conventionally between 0.01mm and 10mm.Such as the above-mentioned part that these are not described in detail herein, the content being well known to the skilled person, is not repeated at this.

In a specific embodiment, when adopting the semiconductor processing device 100 in the present invention to process semiconductor die bowlder, processing procedure probably can be divided into following several process: chamber panel Renewal process, chemical treating process.

At chamber panel Renewal process, can change according to semiconductor die size to be processed the chamber panel of coupling.First driver is produced to downward actuating force and lower box device 128 and lower chambers plate 126 are declined, then open or extract plug-in unit 160, more original lower chambers plate 126 is taken out along slip in the navigation groove of described lower box device 128.Suitable described lower chambers plate 126, along sliding and pack in the navigation groove of described lower box device 128, is installed to described plug-in unit 160 so that described lower chambers plate 126 is fixed in described lower box device 128.

At chemical treating process, first utilize described drive unit 130 by described micro chamber closure, again the microtubule by the hollow in described upper chamber plate 122 and entrance by chemicals or other fluids introduce described micro chamber with the wafer to inner carry out such as analyzing, processing etching, then by inner pressure, such as the delivery of gas or gravity orders about described chemicals or other fluids are discharged via the structure within microtubule or the guiding gutter of the hollow in described lower chambers plate 126 and outlet.Especially; because upper chamber's plate 122 and lower chambers plate 126 need to be considered the structure such as microtubule or the guiding gutter of hollow when the design; may there be various deformation and more complicated structure according to upper chamber's plate 122 described in specific embodiment and lower chambers plate 126; and not exclusively as herein for the description of upper chamber's plate 122 and lower chambers plate 126, therefore should not serve as the factor that restricts protection scope of the present invention about difference herein.

Except the structure shown in Fig. 7 A and 7B, described semiconductor processes module 10 can also be the structure that adopts other similar micro chamber.

According to another aspect of the present invention, the present invention also provides the online fault detection method of the semiconductor processing device shown in Fig. 1, and it comprises: the preset time that records each container in semiconductor crystal wafer processing procedure in described control module 40 is to weight data; The weight of the container 32 of each weight sensor 330 sensing sides of being located thereon, and the weight data of the corresponding container being sensed is transferred to described control module 40; The real time that the weight data that described control module 40 transmits according to each weight sensor 330 obtains each container 32 is to weight data, and preset time based on each container determines to weight data whether the Fluid Transport path of these container 32 correspondences breaks down to weight data and real time.

Above-mentioned explanation has fully disclosed the specific embodiment of the present invention.It is pointed out that and be familiar with the scope that any change that person skilled in art does the specific embodiment of the present invention does not all depart from claims of the present invention.Correspondingly, the scope of claim of the present invention is also not limited only to previous embodiment.

Claims (7)

1. a fluid bearings device, is characterized in that, it comprises carriage and the weight sensing device that is positioned at carriage bottom,

Weight sensing device includes multiple weight sensors, on each weight sensor, can place the container of a carrying fluid, each weight sensor can the sensing side of being located thereon the weight of container, and the weight data of the corresponding container being sensed transfers out

Described weight sensing device comprises installs body, multiple container tray, multiple jointing, multiple weight sensing unit and bottom shrouding, and cell therefor pallet, jointing, weight sensing unit fit together and form a weight sensor.

2. fluid bearings device according to claim 1, is characterized in that,

Described installation body includes multiple lug bosses of being formed on its end face, be formed at described lug boss downside multiplely hold cavity and run through described lug boss and hold with described multiple perforation that cavity is communicated with,

Each container tray comprises body, be formed at the groove of described body bottom and be formed at the duct of described body bottom centre,

Each container tray is installed in the respective protrusions portion of described installation body, and the sidewall in wherein said duct extends into the perforation of described lug boss fixing in the inner, and described lug boss extends into the groove of described container tray fixing in the inner,

Each weight sensor unit includes the connecting hole that is formed at its top center, it is contained in corresponding the holding in cavity of described installation body, one end of wherein said jointing extends in the connecting hole of described weight sensor, the other end extends in the duct of described pallet through described perforation, described bottom shrouding is installed on the bottom of described installation body, and each weight sensing unit is packaged in described installation body.

3. fluid bearings device according to claim 2, is characterized in that, the periphery of the body of described container tray is formed with fin.

4. fluid bearings device according to claim 3, is characterized in that, the bottom of the groove of described pallet is also provided with annular channel.

5. fluid bearings device according to claim 2, is characterized in that, described installation body includes the stop part being formed on its end face periphery, between each lug boss, has gap space, and described stop part and described lug boss surround certain space.

6. fluid bearings device according to claim 5, is characterized in that, described installation body is integral structure.

7. fluid bearings device according to claim 5, is characterized in that, is formed with the space that stop part and lug boss are surrounded and is communicated to extraneous passage on the sidewall of described installation body.