CN203893484U - USB refrigeration component - Google Patents
USB refrigeration component Download PDFInfo
- Publication number
- CN203893484U CN203893484U CN201420160510.0U CN201420160510U CN203893484U CN 203893484 U CN203893484 U CN 203893484U CN 201420160510 U CN201420160510 U CN 201420160510U CN 203893484 U CN203893484 U CN 203893484U
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- China
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- type semiconductor
- usb
- refrigeration
- refrigeration component
- cooling assembly
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a USB refrigeration component, belongs to the technical field of the electric appliance, and solves the problem of low refrigeration efficiency of the refrigeration component in the prior art. The USB refrigeration component comprises multiple N-type semiconductor chips and P-type semiconductor chips which are connected in series end to end and are arrayed parallelly at intervals on the same plane through electrodes; a cold end ceramic wafer and a hot end ceramic wafer are in fit connection with the two sides of the plane formed by the N-type semiconductor chips and the P-type semiconductor chips connected in series respectively; an electrode output interface is a USB interface. According to the USB refrigeration component, a USB is adopted to supply power directly, the refrigeration component is convenient to use, a heat conduction insulating layer is used for heat conduction, the heat conduction efficiency of the cold end ceramic wafer is improved, thus the refrigeration effect of the refrigeration component is improved, in addition a thermal insulation insulating medium is arranged between the ceramic wafers, loss of heat is prevented, and the refrigeration effect of the refrigeration component is further enhanced.
Description
Technical field
The utility model belongs to technical field of electric appliances, relates to a kind of cooling assembly, particularly a kind of USB cooling assembly.
Background technology
Semiconductor chilling plate is also thermoelectric module, is a kind of heat pump.Its basic principle is: when galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, can absorb respectively heat and emit heat at the two ends of galvanic couple, thereby realize the object of refrigeration.In semiconductor chilling plate, many N-types and P-type semiconductor element are arranged mutually, and between N-type and P-type semiconductor element, with copper, aluminium or other metallic conductors, are connected and form a complete line, and Hou is picked up by two potsherds as sandwich biscuits; Potsherd must insulate and heat conduction good.
In order to improve the life-span of cooling piece, the semiconductor element that expose on two potsherd four limits has all carried out curing processing, and galvanic couple and outside air in cooling piece are isolated completely; Can be moistureproof, also can improve the cooling piece life-span.Yet what adopt because cooling piece is common is 12V direct current supply, therefore need to power with dry cell or battery, and dry cell and battery need often replacing and charging, cause using inconvenient.
Summary of the invention
The purpose of this utility model is to have the problems referred to above for existing technology, has proposed a kind of USB cooling assembly.
The purpose of this utility model can realize by following technical proposal: a kind of USB cooling assembly, it is characterized in that, and comprise that several are connected in series and N-type semiconductor sheet and the P-type semiconductor sheet of spaced and parallel spread configuration on same plane from beginning to end by electrode; The described N-type semiconductor sheet being mutually connected in series and the both sides of P-type semiconductor plane that sheet forms have been fitted and connected respectively cold junction potsherd and hot junction potsherd; Described electrode output interface is USB interface.
Adopt USB interface that direct current is directly provided, be conveniently plugged on computer and power, it is easy to use, simple in structure.
In above-mentioned USB cooling assembly, described cold junction potsherd and N-type semiconductor sheet and P-type semiconductor sheet junction are provided with heat conductive insulating layer.Utilize heat-conducting layer to carry out heat conduction to the cold junction of semiconductor chip, then heat is conducted on cold junction potsherd, can strengthen the heat dispersion of cold junction potsherd, thereby improve the refrigeration performance of this cooling assembly.
In above-mentioned USB cooling assembly, between described cold junction potsherd and hot junction potsherd, be also provided with partiting thermal insulation medium, described partiting thermal insulation medium is positioned at the both sides of N-type semiconductor sheet P-type semiconductor sheet.By partiting thermal insulation medium, make heat conduct to the process of hot junction and can not distribute from both sides from cold junction, thereby guarantee the temperature difference in cold junction and hot junction, prevent that heat from distributing the refrigeration that affects cold junction from sidepiece.
In above-mentioned USB cooling assembly, the material of described heat conductive insulating layer is at least one in AlN, Si, SiC, B4C, BN or Al203.
Compared with prior art, this USB cooling assembly adopts USB directly to power, make cooling assembly easy to use, heat conductive insulating layer carries out heat conduction, improve the heat transfer efficiency of cold junction potsherd, thereby effectively improved the refrigeration of this cooling assembly, between potsherd, be also provided with in addition partiting thermal insulation medium, prevent distributing of heat, further promote the refrigeration of this cooling assembly.
Accompanying drawing explanation
Fig. 1 is the perspective view of this USB cooling assembly;
Fig. 2 is the sectional structure schematic diagram of this USB cooling assembly.
In figure, 1, cold junction potsherd; 2, hot junction potsherd; 3, N-type semiconductor; 4, P-type semiconductor; 5, heat conductive insulating layer; 6, partiting thermal insulation medium; 7, USB interface.
The specific embodiment
Be below specific embodiment of the utility model by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiment.
As depicted in figs. 1 and 2, this USB cooling assembly, comprises that several are connected in series and N-type semiconductor sheet 3 and the P-type semiconductor sheet 4 of spaced and parallel spread configuration on same plane from beginning to end by electrode; The described N-type semiconductor sheet being mutually connected in series and the both sides of P-type semiconductor plane that sheet forms have been fitted and connected respectively cold junction potsherd 1 and hot junction potsherd 2; Described electrode output interface is USB interface 7, and the convenient USB that directly adopts powers.Described cold junction potsherd and N-type semiconductor sheet and P-type semiconductor sheet junction are provided with heat conductive insulating layer 5.Utilize heat-conducting layer to carry out heat conduction to the cold junction of semiconductor chip, then heat is conducted on cold junction potsherd, can strengthen the heat dispersion of cold junction potsherd, thereby improve the refrigeration performance of this cooling assembly.
In this USB cooling assembly, between cold junction potsherd and hot junction potsherd, be also provided with partiting thermal insulation medium 6, described partiting thermal insulation medium is positioned at the both sides of N-type semiconductor sheet P-type semiconductor sheet.By partiting thermal insulation medium, make heat conduct to the process of hot junction and can not distribute from both sides from cold junction, thereby guarantee the temperature difference in cold junction and hot junction, prevent that heat from distributing the refrigeration that affects cold junction from sidepiece.
The material of the heat conductive insulating layer in this USB cooling assembly is at least one in AlN, Si, SiC, B4C, BN or Al203.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or supplements or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Claims (4)
1. a USB cooling assembly, is characterized in that, comprises that several are connected in series and N-type semiconductor sheet and the P-type semiconductor sheet of spaced and parallel spread configuration on same plane from beginning to end by electrode; The described N-type semiconductor sheet being mutually connected in series and the both sides of P-type semiconductor plane that sheet forms have been fitted and connected respectively cold junction potsherd and hot junction potsherd; Described electrode output interface is USB interface.
2. USB cooling assembly according to claim 1, is characterized in that, described cold junction potsherd and N-type semiconductor sheet and P-type semiconductor sheet junction are provided with heat conductive insulating layer.
3. USB cooling assembly according to claim 1 and 2, is characterized in that, between described cold junction potsherd and hot junction potsherd, is also provided with partiting thermal insulation medium, and described partiting thermal insulation medium is positioned at the both sides of N-type semiconductor sheet P-type semiconductor sheet.
4. USB cooling assembly according to claim 2, is characterized in that, the material of described heat conductive insulating layer is at least one in AlN, Si, SiC, B4C, BN or Al203.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420160510.0U CN203893484U (en) | 2014-04-01 | 2014-04-01 | USB refrigeration component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420160510.0U CN203893484U (en) | 2014-04-01 | 2014-04-01 | USB refrigeration component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203893484U true CN203893484U (en) | 2014-10-22 |
Family
ID=51719879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420160510.0U Expired - Fee Related CN203893484U (en) | 2014-04-01 | 2014-04-01 | USB refrigeration component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203893484U (en) |
-
2014
- 2014-04-01 CN CN201420160510.0U patent/CN203893484U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20150401 |
|
| EXPY | Termination of patent right or utility model |