CN203882991U - Liquid forced cooling device of anti-inversion diode - Google Patents
Liquid forced cooling device of anti-inversion diode Download PDFInfo
- Publication number
- CN203882991U CN203882991U CN201420288051.4U CN201420288051U CN203882991U CN 203882991 U CN203882991 U CN 203882991U CN 201420288051 U CN201420288051 U CN 201420288051U CN 203882991 U CN203882991 U CN 203882991U
- Authority
- CN
- China
- Prior art keywords
- heat
- housing
- counnter attack
- attack diode
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a liquid forced cooling device of an anti-inversion diode. The liquid forced cooling device includes a lead, a heat-insulation layer, a housing, an insulating and heat-conducting liquid and a refrigerating device. The heat-insulation layer completely covers the housing and a low-temperature surface of the refrigerating device. The housing is filled with the insulating and heat-conducting liquid, and the anti-inversion diode is completely immerged in the insulating and heat-conducting liquid. The anti-inversion diode passes through the housing and the heat-insulation layer through the lead to be connected to a current convergence system in a current convergence box. The housing and the low-temperature surface of the refrigerating device are fully in tight contact with each other.
Description
Technical field:
The utility model belongs to the domain of control temperature of electronic power element, relates to specifically a kind of liquid forced cooling device of counnter attack diode.
Background technology:
In order to reduce the line between solar photovoltaic assembly array and DC load or inverter, and the convenience in order to keep in repair and to safeguard, after photovoltaic module, be all furnished with a series of header box, the multi-channel DC in photovoltaic module is converged into a road, be connected on DC load or inverter.
In header box, on the direct current incoming line of every road from photovoltaic module, there is a counnter attack diode, its effect is: (1) prevents when photovoltaic module does not generate electricity, and the electric energy storing in storage battery flows backwards, and wastes energy and causes photovoltaic module heating to damage; (2) prevent certain photovoltaic module because shade covers or during fault, other photovoltaic module electricity flows backwards, reduce output voltage and the electric current of whole photovoltaic plant.
Counnter attack diode be exactly a kind of can be by the larger diode of current ratio, when having electric current to pass through, counnter attack diode, due to the various losses of inside, also can generate heat.With Yi Ge 16 tunnels, the header box of every road rated current 8A is example, and the pressure drop in the time of counnter attack diode current flow is by 1.2 volts of calculating, and the caloric value of the counnter attack diode of 16 conductings is 8A*1.2V*16 road=153.6W.If these heats can not be discharged in time, the temperature in header box will be too high, electronics wherein of impact and work and the life-span of electric elements, very easily cause fault, and even affect the generating efficiency of whole photovoltaic plant.
In order to address this problem, patent 201310428734 has designed a kind of header box of cellular-type, and the heat that allows counnter attack diode produce does not affect other electronics of header box inside and the work of electric elements.Patent 201220255825 is simply arranged on counnter attack diode the outside of header box, allows in the air that the heat of its generation can directly fall apart outside casing.Patent 201320194559 and 201320214310 has increased a radiator structure that heat is fallen apart outside header box to the counnter attack diode being contained in header box.But outdoor because header box is all directly installed on, when its energy output is the highest, ambient temperature is also always the highest, so the method for passing through heat conducting and radiating of above passiveness all can not fundamentally solve the too high problem of counnter attack diode junction temperature.
Summary of the invention:
The purpose of this utility model is to provide a kind of liquid forced cooling device of counnter attack diode, it comprises liquid and refrigerating plant that wire, heat-insulation layer, housing, insulation are conducted heat, the low temperature face of the complete covering shell of heat-insulation layer and refrigerating plant wherein, in housing, be full of the liquid that insulation is conducted heat, counnter attack diode is immersed in the liquid the inside that insulation is conducted heat completely, counnter attack diode passes housing by wire and heat-insulation layer is connected to confluxing in system in the outside header box of cooling device, the abundant close contact of low temperature face of housing and refrigerating plant;
Wherein wire has insulation protection, and housing can heat conduction;
Wherein refrigerating plant can be heat exchanger; On heat exchanger, distribute porose, have low temperature refrigerant to flow through from hole, reach the effect of heat exchange;
Heat exchanger obtains cold from heat conduction or the phase transformation of low temperature refrigerant, the liquid cools counnter attack diode conducting heat by housing and insulation;
Wherein refrigerating plant can also be the semiconductor cooling device that comprises semiconductor chilling plate and fin;
The liquid cools counnter attack diode that the cold junction face of the semiconductor chilling plate of energising conducts heat by housing and insulation, the hot junction face of the semiconductor chilling plate of energising by fin dissipation of heat in environment.
Operation principle of the present utility model is:
Counnter attack diode is all immersed in the insulation heat transfer liquids in the housing that is closed in heat conduction, and the cold that refrigerating plant produces freezes to counnter attack diodes force through housing and insulation heat transfer liquids.
Heat-insulation layer has two effects, and the one, the cold that refrigerating plant is produced is enclosed in this liquid forced cooling device, all for cooling counnter attack diode, the 2nd, prevent liquid forced cooling device dewfall, cause damage or the electric shock casualty accident of header box.
Wire all has insulation protection, can be safely through housing and can dewfall.
The utility model has the advantages that:
1. counnter attack diode is directly immersed in insulation heat transfer liquids with housing and forms a complete thermal conductor, and the heat equivalent of counnter attack diode is significantly improved, and has improved the tolerance of counnter attack diode pair thermal shock; 2. counnter attack diode is immersed in the middle of insulation heat transfer liquids completely, and ingress of air, can not produce condensed water in no instance; 3. whole liquid forced cooling device wraps in heat-insulation layer the inside, whenever can not produce condensed water, and counnter attack diode can short circuit or ground connection; 4. large heat conductor of heat transfer liquids and the counnter attack diode formation of insulating, can alleviate the negative effect of unexpected thermal shock to counnter attack diode; 5. whole forced cooling device has the protection of heat-insulation layer on the surface of header box inside, also can not destroy because of producing condensed water the insulating properties of header box inside.
Accompanying drawing explanation
The liquid forced cooling device structural representation of Fig. 1 counnter attack diode
Fig. 2 refrigerating plant is the liquid forced cooling device structural representation of the counnter attack diode of heat exchanger
Fig. 3 refrigerating plant is the liquid forced cooling device structural representation of the counnter attack diode of semiconductor cooling device
Wherein: the wire that 1, has insulation protection; 2, counnter attack diode; 3, insulation heat transfer liquids; 4, heat-insulation layer; 5, housing; 6, refrigerating plant; 61, the low temperature face of refrigerating plant; 7, heat exchanger; 71, hole; 8, semiconductor chilling plate; 81, the cold junction face of semiconductor chilling plate; 82, the hot junction face of semiconductor chilling plate; 9, fin
Embodiment,
A kind of liquid forced cooling device of counnter attack diode, structural representation is shown in Fig. 1, it comprises wire (1), heat-insulation layer (4), housing (5), liquid (3) and refrigerating plant (6) that insulation is conducted heat, in its middle shell (5), be full of the liquid (3) that insulation is conducted heat, counnter attack diode (2) is immersed in liquid (3) the inside that insulation is conducted heat completely, counnter attack diode (2) is by there being the wire (1) of insulation protection to be connected to confluxing in system in the outside header box of cooling device through housing (5) and heat-insulation layer (4), the low temperature face (61) of the surface of housing (5) and refrigerating plant is close contact fully,
Wherein wire (1) has insulation protection, and housing (5) can heat conduction.
Embodiment mono-
Shown in Fig. 2 is the liquid forced cooling device that uses the counnter attack diode of coolant refrigeration device.
In the present embodiment, refrigerating plant of the present utility model (6) is the heat exchanger (7) that low temperature refrigerant is flow through in an inside.The refrigerant that hole (71) in heat exchanger (7) is flow through can by conduction and or the mode of phase transformation the heat absorption of the housing of heat conduction (5) is come and is led out.Heat-insulation layer (4) covers housing (5) and the heat exchanger (7) of heat conduction completely.If the refrigerant flowing through in heat exchanger (7) is the water of 15 degree of low temperature, after the heat of housing (5) that has absorbed heat conduction, the temperature of water is elevated to 25 degree and then flows out, at this moment, the temperature of the housing of heat conduction (5) will be 27 degree left and right, and the surface temperature of counnter attack diode (2) should be unable to surpass 30 degree.If what flow through in heat exchanger (7) is the freon liquid of low pressure, its evaporating temperature is 10 degree, in evaporation process, freon absorbs the housing (5) of heat conduction and the heat of insulation heat transfer liquids (3) in a large number, makes the surface temperature of counnter attack diode (2) not higher than 25 degree.At this moment, if counnter attack diode (2) is not the liquid (3) that is insulated heat transfer, do not surround, its surface is bound to produce condensed water, and the insulating properties of counnter attack diode (2) is destroyed.
Embodiment bis-
Shown in Fig. 3 is the liquid forced refrigeration device that uses the counnter attack diode of semiconductor refrigerating.In the present embodiment, refrigerating plant of the present utility model (6) be one by semiconductor chilling plate (8) be exposed at a set of semiconductor cooling device that the fin (9) of header box outside forms.Heat-insulation layer (4) covers all surface not contacting with the cold junction face (81) of semiconductor chilling plate on the housing (5) of heat conduction.The cold junction face (81) of semiconductor chilling plate is close on the housing (5) of heat conduction, through the housing (5) of heat conduction and the heat transfer liquids (3) that insulate, absorbs the heat that counnter attack diode (2) sends.Together with the hot junction face (82) of semiconductor chilling plate fully fits tightly with fin (9), through fin (9), in the middle of the air of the header box outside that the heat that counnter attack diode (2) is absorbed is diffused.Can there be the temperature difference of 30 to 60 degree on fin (9) and counnter attack diode (2) surface, and like this, even if ambient temperature reaches 60 degree, the surface temperature of counnter attack diode (2) can be higher than 30 degree yet.
Claims (4)
1. a liquid forced cooling device for counnter attack diode, is characterized in that it comprises liquid and refrigerating plant that wire, heat-insulation layer, housing, insulation are conducted heat;
The low temperature face of the complete covering shell of heat-insulation layer and refrigerating plant wherein, in housing, be full of the liquid that insulation is conducted heat, counnter attack diode is immersed in the liquid the inside that insulation is conducted heat completely, counnter attack diode passes housing by wire and heat-insulation layer is connected to confluxing in system in header box, the abundant close contact of low temperature face of housing and refrigerating plant.
2. the liquid forced cooling device of counnter attack diode according to claim 1, is characterized in that
Wherein wire has insulation protection, and housing can heat conduction.
3. the liquid forced cooling device of counnter attack diode according to claim 1, is characterized in that
Wherein refrigerating plant is heat exchanger; On heat exchanger, distribute porose, low temperature refrigerant flows through from hole, reaches the effect of heat exchange.
4. the liquid forced cooling device of counnter attack diode according to claim 1, is characterized in that
Wherein refrigerating plant is the semiconductor cooling device that comprises semiconductor chilling plate and fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420288051.4U CN203882991U (en) | 2014-05-30 | 2014-05-30 | Liquid forced cooling device of anti-inversion diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420288051.4U CN203882991U (en) | 2014-05-30 | 2014-05-30 | Liquid forced cooling device of anti-inversion diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203882991U true CN203882991U (en) | 2014-10-15 |
Family
ID=51683465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420288051.4U Withdrawn - After Issue CN203882991U (en) | 2014-05-30 | 2014-05-30 | Liquid forced cooling device of anti-inversion diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203882991U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103996664A (en) * | 2014-05-30 | 2014-08-20 | 佐志温控技术（上海）有限公司 | Liquid forced cooling device of anti-backflow diode |
-
2014
- 2014-05-30 CN CN201420288051.4U patent/CN203882991U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103996664A (en) * | 2014-05-30 | 2014-08-20 | 佐志温控技术（上海）有限公司 | Liquid forced cooling device of anti-backflow diode |
| CN103996664B (en) * | 2014-05-30 | 2016-08-24 | 佐志温控技术（上海）有限公司 | A kind of liquid forced cooling device of counnter attack diode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201332372Y (en) | Residual heat thermoelectric power generation system using circulating liquid cooling | |
| CN103199316B (en) | Battery pack and radiator structure thereof | |
| CN101183808B (en) | Stator structure of inner cooling type self-circulation vaporization cooling wind power generator | |
| US20110048502A1 (en) | Systems and Methods of Photovoltaic Cogeneration | |
| CN104795610A (en) | Thermoelectric cooling-based power battery thermal management system | |
| CN103398474B (en) | Solar photovoltaic-photothermal-thermoelectric comprehensive utilization system | |
| CN110492135B (en) | Fuel cell automobile waste heat power generation system, working method thereof and fuel cell automobile | |
| CN204011602U (en) | A kind of phase-change heat radiating device for flat battery | |
| JP2011243309A (en) | Warming device of battery | |
| CN102299614A (en) | Semiconductor-refrigeration-based inverter radiating system | |
| US20100139736A1 (en) | Geothermal heating and cooling management system | |
| CN108599720A (en) | A kind of solid matter CPV assembly radiating devices | |
| CN106785199B (en) | A kind of Li-ion batteries piles power supply heat sinking device | |
| KR101335277B1 (en) | Heat storaging tank used in solar heat power system, solar heat dynamo used therein and solar heat power system including the same | |
| CN205027183U (en) | Use solid heat accumulation device at solar thermal power generation system | |
| CN114566734A (en) | Lithium battery pack stability maintaining device based on feedback system and water cooling condition | |
| CN103489948A (en) | Semiconductor component with optical cold/optical heat conversion function | |
| CN203882991U (en) | Liquid forced cooling device of anti-inversion diode | |
| CN105515527A (en) | Solar energy coupling multi-source heat pump integrated system | |
| CN205209001U (en) | Energy -concerving and environment -protective type refrigerating plant | |
| CN101582665A (en) | Generating device based on absolute temperature difference of evaporator and condenser in air conditioner and refrigerator | |
| CN204011608U (en) | A kind of phase-change heat radiating device for circle battery | |
| JP2006064203A (en) | Solar battery module | |
| CN202261069U (en) | Inverter cooling system based on semiconductor refrigeration | |
| CN110190780A (en) | Couple thermo-electric generation system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141015 Effective date of abandoning: 20160824 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |