CN203850282U - 一种带锁料口的塑封引线框架 - Google Patents
一种带锁料口的塑封引线框架 Download PDFInfo
- Publication number
- CN203850282U CN203850282U CN201420137809.4U CN201420137809U CN203850282U CN 203850282 U CN203850282 U CN 203850282U CN 201420137809 U CN201420137809 U CN 201420137809U CN 203850282 U CN203850282 U CN 203850282U
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- CN
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- Prior art keywords
- lead frame
- plastic packaging
- plastic
- fin
- material locking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 claims abstract description 17
- 239000003566 sealing material Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420137809.4U CN203850282U (zh) | 2014-03-26 | 2014-03-26 | 一种带锁料口的塑封引线框架 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420137809.4U CN203850282U (zh) | 2014-03-26 | 2014-03-26 | 一种带锁料口的塑封引线框架 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850282U true CN203850282U (zh) | 2014-09-24 |
Family
ID=51563262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420137809.4U Expired - Fee Related CN203850282U (zh) | 2014-03-26 | 2014-03-26 | 一种带锁料口的塑封引线框架 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850282U (zh) |
-
2014
- 2014-03-26 CN CN201420137809.4U patent/CN203850282U/zh not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: TAIZHOU YOURUN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: ZHANG XUAN Effective date: 20150731 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150731 Address after: 225300, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Taizhou Yourun Electronic Co., Ltd. Address before: 225324, Jiangsu Taizhou hi tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard workshop area 126 Patentee before: Zhang Xuan |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 225300, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee after: Friends of Taizhou run electronic Polytron Technologies Inc Address before: 225300, Jiangsu Taizhou high tech Port Industrial Park, Hong Kong Hong Kong Industrial Park standard factory area Patentee before: Taizhou Yourun Electronic Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20170326 |