CN203850256U - Long body structure wiring duct for packaging technology - Google Patents
Long body structure wiring duct for packaging technology Download PDFInfo
- Publication number
- CN203850256U CN203850256U CN201420198950.5U CN201420198950U CN203850256U CN 203850256 U CN203850256 U CN 203850256U CN 201420198950 U CN201420198950 U CN 201420198950U CN 203850256 U CN203850256 U CN 203850256U
- Authority
- CN
- China
- Prior art keywords
- base plate
- respectively arranged
- welding
- wire
- metallic channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012536 packaging technology Methods 0.000 title claims abstract description 12
- 238000007789 sealing Methods 0.000 claims description 15
- 238000003466 welding Methods 0.000 abstract description 20
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Arc Welding In General (AREA)
Abstract
The utility model discloses a long body structure wiring duct for a packaging technology, i.e., the wiring duct comprises a bottom plate and a bottom plate cover; in mounting, an inner surface of the bottom plate and an inner surface of the bottom plate cover are used to form a wire containing space used for containing a welding line; in work, the wiring duct is matched with a chopper, a blade, and a blade limit push rod to form a complete work mechanism; in welding, the welding line goes along a tail portion of the wire containing space in the wiring duct of the work mechanism and enters an inner side of the wire containing space; the welding line then goes to a wire nozzle of the mounted wire containing space; then welding is carried out from a first welding point of a chip to the first welding point in a preset track until a second welding point is reached; the welding line is cut by the chopper, so the welding line is injected to form a regulated arc; a molded welding line cannot be deformed in a wiring step; self deformation is small in the wiring step, and welding line arc height and radian requirements can be satisfied.
Description
[technical field]
The utility model relate to aluminum steel welding procedure aspect in a kind of semiconductor die package industry for the long body structure metallic channel of packaging technology.
[background technology]
Along with social development, people are more and more general to the demand of terminal electronic product, and quality and volume requirement to portable terminal electronic product is more and more higher, and power device be compositing terminal electronic product must indispensable components and parts, improve so its encapsulation technology and also just more and more extensive to the equipment requirement of high-performance and high accuracy.On information technology and portable terminal electronic product market, this trend is particularly evident, and up to date, silicon technology always is the greatest factor of improving power-supply management system performance.But the progress of silicon technology is subject to the restriction that encapsulation performance improves now.In order to realize obvious improvement, must improve power semiconductor package technology and corresponding equipment and the accessory supporting with it.In large electric current application, the power-supply system of installing on DC/DC converter, notebook computer and the circuit board of using as voltage regulator module, the electric current ability to bear of individual devices is the most important figure of merit.The resistance of encapsulation and thermal resistance are reduced to minimum, most important for improving the electric current that individual devices can bear.Along with the raising of portable type electronic product current density and size, encapsulation and integratedly more and more becoming essential improving aspect systematic function jointly.The most successful platform will provide minimum every Ampere currents cost, ensures the profile specification that user is required simultaneously, and this has just proposed new requirement to sealed in unit and accessory thereof.Described packaging technology refers to installs the shell that semiconductor integrated circuit chip is used; it not only plays a part to install, fixes, seals, protects chip and strengthens the aspects such as electric heating property; but also be wired to by the contact on chip on the pin of package casing, these pins are connected with other devices by the wire on printed circuit board (PCB) again.Because routing welding sequence process chips bonding wire mechanism self deformation ratio is larger, cause the requirement of height and the radian that cannot meet routing radian.
[utility model content]
Technical purpose of the present utility model is to provide in order to solve the problem that above-mentioned prior art exists that a kind of little, the height that can meet routing radian of self-deformation and radian require in routing process for the long body structure metallic channel of packaging technology.
In order to realize above-mentioned technical problem, it is a kind of for the long body structure metallic channel of packaging technology that the utility model provides, refer to and chopper, blade, the matching used metallic channel of the spacing push rod of blade, described metallic channel comprises base plate and is arranged at the base plate cover cooperatively interacting of base plate upper end.
According to above-mentioned technical characteristics, described upper end, base plate two side is respectively arranged with outwards outstanding upper stripe board, and on this, stripe board upper end is respectively arranged with upper latch notch groove, and on this, buckle slot inner side is respectively arranged with ladder breach; Described bottom, base plate two side is respectively arranged with outwards outstanding lower stripe board, and this lower stripe board upper end is respectively arranged with lower bayonet slot, and this lower buckle slot inner side is respectively arranged with downstairs breach; Described base plate top is provided with wire mouth hole, and this lower end, wire mouth hole is provided with the wire guide for accommodating sealing wire.
According to above-mentioned technical characteristics, described base plate cover inner top side is provided with the upper pinch plate cooperatively interacting with upper buckle slot, on this, pinch plate upper end is provided with the upper buckling body cooperatively interacting with upper ladder breach, and on this, pinch plate bottom is provided with the first rectangle arc groove; The bottom, inner side of described base plate cover is provided with the lower pinch plate cooperatively interacting with lower buckle slot, and this lower pinch plate bottom is provided with the second rectangle arc groove, and this lower pinch plate upper end is provided with the lower buckling body cooperatively interacting with downstairs breach.
The beneficial effects of the utility model: because described metallic channel comprises base plate and is arranged at the base plate cover cooperatively interacting of base plate upper end.When installation, utilize the inner surface of base plate interior surface and base plate cover to be formed for accommodating the wire receiving space of sealing wire.When work, described metallic channel and chopper, blade, complete operating mechanism of the supporting formation of the spacing push rod of blade.When welding, described sealing wire enters wire receiving space inside along the tail end of metallic channel inside conductor receiving space in operating mechanism, to the wire mouth hole place that rear wire receiving space is installed, treat from the first pad to chip, start welding to the first pad, move to the second pad place according to presetting track, and cut off by chopper, make to be injected out sealing wire and form regulation radian, also avoided moulding sealing wire in routing process to deform simultaneously, therefore reach in routing process self-deformation little, can meet height and the radian requirement of sealing wire radian.
Below in conjunction with drawings and Examples, the technical solution of the utility model is described in further detail.
[brief description of the drawings]
Fig. 1 is the three-dimensional exploded view for the long body structure metallic channel of packaging technology in the utility model;
Fig. 2 is the side schematic view of base plate in the utility model;
Fig. 3 is the front schematic view of middle base plate in the utility model;
Fig. 4 is the side schematic view of base plate cover in the utility model;
Fig. 5 is the front schematic view of base plate cover in the utility model.
[embodiment]
Please refer to shown in Fig. 1 to Fig. 5, illustrate that below in conjunction with embodiment one, for the long body structure metallic channel of packaging technology, refers to and chopper, blade, the matching used metallic channel of the spacing push rod of blade.
Described metallic channel comprises base plate 1 and is arranged at the base plate cover cooperatively interacting 2 of base plate 1 upper end.Described base plate 1 upper end, two side is respectively arranged with outwards outstanding upper stripe board 11, and on this, stripe board 11 upper ends are respectively arranged with upper latch notch groove 12, and on this, buckle slot 12 inner sides are respectively arranged with ladder breach 13; Described base plate 1 bottom, two side is respectively arranged with outwards outstanding lower stripe board 14, and these lower stripe board 14 upper ends are respectively arranged with lower bayonet slot 15, and these lower buckle slot 15 inner sides are respectively arranged with downstairs breach 16; Described base plate 1 top is provided with wire mouth hole 17, and these 17 lower ends, wire mouth hole are provided with wire guide 18 and the size for accommodating sealing wire.Described base plate cover 2 inner top side are provided with the upper pinch plate 21 cooperatively interacting with upper buckle slot 12, and on this, pinch plate 21 upper ends are provided with the upper buckling body 22 cooperatively interacting with upper ladder breach 13, and on this, pinch plate 21 bottoms are provided with the first rectangle arc groove 23; The bottom, inner side of described base plate cover 2 is provided with the lower pinch plate 24 cooperatively interacting with lower buckle slot 15, these lower pinch plate 24 bottoms are provided with the second rectangle arc groove 25, and these lower pinch plate 24 upper ends are provided with the lower buckling body 26 cooperatively interacting with downstairs breach 16.
When installation, described base plate cover 2 is installed on above base plate 1, upper pinch plate 21 on described base plate 1 is inserted into upper latch notch groove 12 inside, and upper buckling body on base plate cover 2 22 and the upper ladder breach 13 on base plate 1 cooperatively interact, lower pinch plate 21 on described base plate 1 is inserted into lower buckle slot 15 inside, and lower buckling body on base plate cover 2 26 and the downstairs breach 16 on base plate 1 cooperatively interact.In the space that described upper stripe board 11 cooperatively interacts with upper pinch plate 21 and lower stripe board 14 and lower pinch plate 24 complement each other to form, after making to install, described upper stripe board 11, lower stripe board 14 and upper pinch plate 21, lower pinch plate 24 complement each other to form the sidewall paneling of the both sides of metallic channel.Base plate 1 forms wire receiving space after cooperatively interacting with base plate cover 2, and this wire receiving space is mainly used for accommodating wire.
When work, described metallic channel and chopper, blade, complete operating mechanism of the supporting formation of the spacing push rod of blade.
When welding, described sealing wire tail end of lower stripe board 11 in metallic channel from operating mechanism, enters into wire receiving space inside that base plate 1 and base plate cover 2 form, 17 places, wire mouth hole that form to base plate 1 and base plate cover 2.Treat from the first pad to chip, start welding to the first pad, move to the second pad place according to presetting track, and cut off by chopper, make to be injected out sealing wire and form regulation radian.
In sum, because described metallic channel comprises base plate 1 and be arranged at the base plate cover cooperatively interacting 2 of base plate 1 upper end.When installation, utilize the inner surface of base plate 1 and the inner surface of base plate cover 2 to be formed for accommodating the wire receiving space of sealing wire.When work, described metallic channel and chopper, blade, complete operating mechanism of the supporting formation of the spacing push rod of blade.When welding, described sealing wire enters wire receiving space inside along the tail end of metallic channel inside conductor receiving space in operating mechanism, to 17 places, wire mouth hole that rear wire receiving space is installed, treat from the first pad to chip, start welding to the first pad, move to the second pad place according to presetting track, and cut off by chopper, make to be injected out sealing wire and form regulation radian, also avoided moulding sealing wire in routing process to deform simultaneously, therefore reach in routing process self-deformation little, can meet height and the radian requirement of sealing wire radian.
Claims (3)
1. for a long body structure metallic channel for packaging technology, refer to and chopper, blade, the matching used metallic channel of the spacing push rod of blade, it is characterized in that: described metallic channel comprises base plate and is arranged at the base plate cover cooperatively interacting of base plate upper end.
2. according to claim 1 for the long body structure metallic channel of packaging technology, it is characterized in that: described upper end, base plate two side is respectively arranged with outwards outstanding upper stripe board, on this, stripe board upper end is respectively arranged with upper latch notch groove, and on this, buckle slot inner side is respectively arranged with ladder breach; Described bottom, base plate two side is respectively arranged with outwards outstanding lower stripe board, and this lower stripe board upper end is respectively arranged with lower bayonet slot, and this lower buckle slot inner side is respectively arranged with downstairs breach; Described base plate top is provided with wire mouth hole, and this lower end, wire mouth hole is provided with wire guide and the size for accommodating sealing wire.
3. according to claim 1 for the long body structure metallic channel of packaging technology, it is characterized in that: described base plate cover inner top side is provided with the upper pinch plate cooperatively interacting with upper buckle slot, on this, pinch plate upper end is provided with the upper buckling body cooperatively interacting with upper ladder breach, and on this, pinch plate bottom is provided with the first rectangle arc groove; The bottom, inner side of described base plate cover is provided with the lower pinch plate cooperatively interacting with lower buckle slot, and this lower pinch plate bottom is provided with the second rectangle arc groove, and this lower pinch plate upper end is provided with the lower buckling body cooperatively interacting with downstairs breach.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420198950.5U CN203850256U (en) | 2014-04-23 | 2014-04-23 | Long body structure wiring duct for packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420198950.5U CN203850256U (en) | 2014-04-23 | 2014-04-23 | Long body structure wiring duct for packaging technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850256U true CN203850256U (en) | 2014-09-24 |
Family
ID=51563239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420198950.5U Expired - Lifetime CN203850256U (en) | 2014-04-23 | 2014-04-23 | Long body structure wiring duct for packaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850256U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106583980A (en) * | 2017-01-09 | 2017-04-26 | 成都冶恒电子有限公司 | YH-RIBBON wire guider |
-
2014
- 2014-04-23 CN CN201420198950.5U patent/CN203850256U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106583980A (en) * | 2017-01-09 | 2017-04-26 | 成都冶恒电子有限公司 | YH-RIBBON wire guider |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Guan Guangwu Inventor after: Jiang Zhe Inventor before: Guan Guangwu |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: GUAN GUANGWU TO: GUAN GUANGWU JIANG ZHE |
|
| CX01 | Expiry of patent term |
Granted publication date: 20140924 |
|
| CX01 | Expiry of patent term |