CN203846128U - PCB vertical plating line thin copper baffle bracket - Google Patents
PCB vertical plating line thin copper baffle bracket Download PDFInfo
- Publication number
- CN203846128U CN203846128U CN201420109628.0U CN201420109628U CN203846128U CN 203846128 U CN203846128 U CN 203846128U CN 201420109628 U CN201420109628 U CN 201420109628U CN 203846128 U CN203846128 U CN 203846128U
- Authority
- CN
- China
- Prior art keywords
- telescopic mast
- telescopic column
- lower telescopic
- thin copper
- plating line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 36
- 239000010949 copper Substances 0.000 title claims abstract description 36
- 238000007747 plating Methods 0.000 title claims abstract description 22
- 230000004888 barrier function Effects 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 abstract description 8
- 239000002699 waste material Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000003814 drug Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910000619 316 stainless steel Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Abstract
The utility model discloses a PCB vertical plating line thin copper baffle bracket which comprises a flying rod bracket, an upper telescopic column, a lower telescopic column, an upper telescopic column embedding tank, a lower telescopic column embedding block, falling stopping side, a fixed annular ring and an adjustable annular ring embedding tank. The PCB vertical plating line thin copper baffle bracket is characterized in that one end of the upper telescopic column and a flying rod are fixed through bolts, the upper telescopic column and the lower telescopic column are sleeved and are fixedly connected by using the fixed annular ring; the lower telescopic column is sleeved by the adjustable annular ring embedding tank; the upper telescopic column is provided with an upper telescopic column embedding tank; the other end of the lower telescopic column is provided with the lower telescopic column embedding block. According to the PCB vertical plating line thin copper baffle bracket, current unbalance affected by electric conduction of the bracket can be avoided, the telescopic range of the bracket is wide, the electroplating demands of the existing PCB boards with any size can be met, and purchasing cost and purchasing price differences between waste copper and a copper plate can be reduced by using the thin copper plate.
Description
Technical field
The utility model relates to PCB electroplanting device, relates in particular to the thin copper barrier support of a kind of PCB upright plating line.
Background technology
The vertical plating of circuit board plant need to carry out equalizing current at folder point position good stainless steel plate or the copper coin of placement electroconductibility that flies copper-clad plate outside on bar or short of width, avoid outside copper-clad plate edge current density excessive, coating is partially thick, has influence on the quality of the operations such as subsequent diagram transfer and product.Adopt baffle plate uniform current density to coordinate liquid medicine can realize the vertical Electroplating Production HDI plate of tradition, when ensureing quality product, production cost is lower than mean level (ML) of the same trade.Because of reasons such as copper baffle plate price are high, hardness is low and can not recycle, in production, go up as the recyclable copper of baffle plate and recycle the thick 316 stainless steel baffle plates of current employing 1.5mm, as distributing electric current and spacing floating trough in plating tank being supportted to the use into bottom land.But, adopt stainless steel baffle plate to divest the copper layer on plated surface by the mode such as etching, polishing, the link such as upper and lower plates, carrying labor intensive, material, financial resources, adopt chemical method alkali etching to move back that copper need to consume etching solution and electric energy could first dissolve the copper on baffle plate, again reclaim copper by extraction, back extraction and electrolysis again, produce new waste water, exhaust emission discharge, cost recovery is high; Produce noise pollution and adopt in physics polishing stripping copper process, polishing cloak easily causes work accident, and the stainless steel baffle plate after polishing is infected with dust, cotton gloves fiber etc., and bringing plating tank into affects liquid medicine quality and production quality.Consider from practical function angle, the floating trough in plating tank is pressed into bottom land by the intensity that adopts thick copper coin can possess stainless steel baffle plate, realizes the object of distributed lines plate electric current simultaneously, but thick copper coin purchase cost is high, loss in price is post sales large, and thick copper coin is difficult for clamping.
Summary of the invention
For meet the requirement that floating trough is pressed into bottom land and distributes electric current and use copper sheet to reduce costs simultaneously, the utility model provides a kind of PCB upright plating line thin copper barrier support, and the height of this support can regulate according to the pcb board size of electroplating, and meets the need of production of different size pcb board.
The utility model is achieved like this, the thin copper barrier support of a kind of PCB upright plating line, comprise and fly to cling to support, upper telescopic mast, lower telescopic mast, upper telescopic mast embedded groove, lower telescopic mast embedded block, falling stop limit, stationary annular circle and regulable ring-shaped circle embedded groove, it is characterized in that telescopic mast one end adopt screw with two fly bar fix, adopt stationary annular circle that upper telescopic mast is set in together and is fixedly connected with lower telescopic mast, on lower telescopic mast, be set with regulable ring-shaped circle embedded groove, described upper telescopic mast is provided with two telescopic mast embedded grooves.
Described stationary annular circle is made up of annular collar, nut, screw, and screw is through stationary annular circle, and nut sleeve is contained on screw.
Described regulable ring-shaped circle embedded groove is made up of nut, screw, annular collar, embedded groove, nut and screw are arranged on lower telescopic mast mobilizable regulable ring-shaped circle, annular collar can be slided along lower telescopic mast, in the time that needs are fixed, tighten the screws nail.
Described upper telescopic mast is provided with falling stop limit, in the time of controllable register support height, can prevent that telescopic mast from falling down.
The effect of described support: while flying bar landing, floating trough in plating tank is supportted at the bottom of plating tank; Avoid red copper foil and electroplating thin plate that bending distortion occurs in the time putting into plating tank; Being used in conjunction with along fixture with lower, is whole fly to cling to copper coin and a plane of frame bottom formation, ensures that current balance type and thickness of coating are even.
Support described in the utility model adopts and slides up and down flexible principle, can meet clamping and support that within the scope of 17.5 inches to 24.5 inches of height, pcb board is electroplated baffle plate.Because this support upper end is fixed on, to fly bar upper, can immersion plating groove in production in, can not be coated with copper, adopt 316 stainless materials to be welded into hook shape and with screw with fly bar and fix.In support immersion groove, liquid portion is corrosion-resistant material, makes as materials such as glass reinforced plastic, PP, PVC, prevents support energising and affects current balance type effect, simultaneously for preventing that support is coated with copper and affects its work-ing life, provide convenience for safeguarding, reduce maintenance times, can be fixed on for a long time and fly on bar.Telescopic end and 316 stainless material inboardends adopt bolt mode to be connected and fixed.The flexible employing of support is enclosed within fixed ring telescopic mast and lower telescopic mast and slides up and down and form.19.5 inches of upper flexible column lengths, 15 inches of lower flexible column lengths, the fixing employing annular collar between upper telescopic mast and lower telescopic mast, fills a screw on annular collar, be fixed with the pressure of screw and nut.For meeting the firm effect of whole support in integral clamp group, bracket end is designed to the size matching with original electroplating thin plate bottom jig.Stationary annular circle is housed on upper telescopic mast, the adjustable annular circle embedded groove that can regulate arbitrarily height on lower telescopic mast is housed on lower telescopic mast, the balance clamping for meeting the product of different size, stationary annular circle and adjustable annular circle embedded groove can prevent that red copper foil from making red copper foil swing, distortion because of the air effect in liquid medicine inflating stirring and handling process in groove, avoid impact to fly to cling to current balance type effect.Adjustable embedded groove on lower telescopic mast adopts the fixing mode of screw to carry out the location of short transverse.
The utility model also has the following advantages: change plate in actual production time, all need to take off baffle plate no longer at every turn, reduced the labour intensity of electroplating activity personnel in clamping plate process; Save the storage place of stainless steel plate, for having vacateed more space in whole workshop; Can avoid support conduction and affect current imbalance, the support wide ranges of stretching, has met the plating needs of existing arbitrary dimension pcb board.Adopt copper sheet can reduce purchase cost and copper scrap and copper coin buying price difference; Can reduce human cost, reduce logistics and warehousing costs, raising conforming product rate etc. through relatively adopting support assorted 0.3mm scale copper to do baffle plate.
Brief description of the drawings
Fig. 1 is front view of the present utility model.
Fig. 2 is upward view of the present utility model.
Current balance type schematic diagram when Fig. 3 is the utility model use.
Fig. 4 is the front view that flies to cling to support described in the utility model.
Fig. 5 is the vertical view that flies to cling to support described in the utility model.
Fig. 6 is the side-view that flies to cling to support described in the utility model.
In the drawings 1, fly to cling to that support 2, upper telescopic mast 3, lower telescopic mast 4, lower telescopic mast embedded block 5, upper telescopic mast embedded groove 6, stationary annular circle 7, nut 8, screw 9, regulable ring-shaped circle embedded groove 10, falling stop limit 11, support 12 fly to cling to 13, bottom fixed link 14 red copper baffle plates 15, electroplating thin plate.
Embodiment
As shown in Figures 1 to 6, the thin copper barrier support of a kind of PCB upright plating line, comprise and fly to cling to support 1, upper telescopic mast 2, lower telescopic mast 3, lower telescopic mast embedded block 4, upper telescopic mast embedded groove 5, stationary annular circle 6, nut 7, screw 8, regulable ring-shaped circle embedded groove 9, falling stop limit 10, the one end that it is characterized in that telescopic mast 2 adopts screw to fly to cling to support 1 and fix with two, adopt stationary annular circle 6 that upper telescopic mast 2 is set in together and is fixedly connected with lower telescopic mast 3, on lower telescopic mast 3, be set with regulable ring-shaped circle embedded groove 9, described upper telescopic mast 2 is provided with telescopic mast embedded groove 5, the other end of described lower telescopic mast 3 is provided with lower telescopic mast embedded block 4, described stationary annular circle 6 is made up of annular collar, nut 7, screw 8, and screw 8 is through annular collar, and nut 7 is sleeved on screw 8, described regulable ring-shaped circle embedded groove 9 is made up of nut 7, screw 8, annular collar, nut 7 and screw 8 are arranged on regulable ring-shaped circle embedded groove 9 on lower telescopic mast 3, adjustable annular embedded groove can be slided along lower telescopic mast 3, in the time that needs are fixed, tighten the screws nail 8, described upper telescopic mast 2 is provided with falling stop limit 10, and falling stop limit 10 is projections on upper telescopic mast 2, in the time of controllable register support height, can prevent that telescopic mast 2 from falling down.
As shown in Figure 3, in use, fly to cling to 12 and bottom fixed link 13 on fixture clamp respectively lower telescopic mast embedded block 4, red copper foil 14 and electroplating thin plate 15.
Claims (4)
1. the thin copper barrier support of PCB upright plating line, comprise and fly to cling to support, upper telescopic mast, lower telescopic mast, upper telescopic mast embedded groove, lower telescopic mast embedded block, falling stop limit, stationary annular circle and regulable ring-shaped circle embedded groove, the one end that it is characterized in that telescopic mast adopts screw and flies to cling to fixing, adopt stationary annular circle that upper telescopic mast is set in together and is fixedly connected with lower telescopic mast, on lower telescopic mast, be set with adjustable annular circle embedded groove, described upper telescopic mast is provided with telescopic mast embedded groove, and the other end of described lower telescopic mast is provided with lower telescopic mast embedded block.
2. the thin copper barrier support of PCB upright plating line according to claim 1, is characterized in that described stationary annular circle is made up of annular collar, nut, screw, and screw is through stationary annular circle, and nut sleeve is contained on screw.
3. the thin copper barrier support of PCB upright plating line according to claim 1 and 2, it is characterized in that described adjustable annular circle embedded groove is made up of nut, screw, regulable ring-shaped circle, nut and screw are arranged on lower telescopic mast mobilizable regulable ring-shaped circle, adjustable annular circle embedded groove can be slided along lower telescopic mast, in the time that needs are fixed, tighten the screws nail.
4. the thin copper barrier support of PCB upright plating line according to claim 1 and 2, is characterized in that described upper telescopic mast is provided with falling stop limit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420109628.0U CN203846128U (en) | 2014-03-12 | 2014-03-12 | PCB vertical plating line thin copper baffle bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420109628.0U CN203846128U (en) | 2014-03-12 | 2014-03-12 | PCB vertical plating line thin copper baffle bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203846128U true CN203846128U (en) | 2014-09-24 |
Family
ID=51559166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420109628.0U Expired - Lifetime CN203846128U (en) | 2014-03-12 | 2014-03-12 | PCB vertical plating line thin copper baffle bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203846128U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103820838A (en) * | 2014-03-12 | 2014-05-28 | 红板（江西）有限公司 | Thin copper baffle bracket for vertical PCB (printed circuit board) plating line |
-
2014
- 2014-03-12 CN CN201420109628.0U patent/CN203846128U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103820838A (en) * | 2014-03-12 | 2014-05-28 | 红板（江西）有限公司 | Thin copper baffle bracket for vertical PCB (printed circuit board) plating line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343000 No. 281 Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140924 |