CN204342905U - A kind of electro-deposition system - Google Patents
A kind of electro-deposition system Download PDFInfo
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- CN204342905U CN204342905U CN201420691434.6U CN201420691434U CN204342905U CN 204342905 U CN204342905 U CN 204342905U CN 201420691434 U CN201420691434 U CN 201420691434U CN 204342905 U CN204342905 U CN 204342905U
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- negative electrode
- electro
- screen plate
- cathode screen
- deposition system
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Abstract
The utility model discloses a kind of electro-deposition system, comprise galvanic deposition cell, negative electrode and anode; Described galvanic deposition cell also comprises cathode screen plate and negative electrode vibrating mechanism; Described negative electrode vibrating mechanism comprises level and is placed in negative electrode fixed link above galvanic deposition cell; Described negative electrode is fixedly installed on negative electrode fixed link; Described cathode screen plate is placed in parallel between negative electrode, anode.The utility model comprehensively adopts negative electrode to vibrate and cathode screen two kinds of methods, solves the problem of deposition layer thickness distribution inequality to greatest extent.
Description
Technical field
The utility model belongs to electrodeposition, particularly relates to a kind of electro-deposition system.
Background technology
Thickness evenness is the important indicator weighing settled layer quality.Deposit thickness inequality is the problem received much concern for a long time.Analysis shows, cathode surface current density and Flow Field Distribution inequality are the deciding factors causing deposit thickness inequality.In electrodeposition process, due to the ununiformity of cathode surface current density and Flow Field Distribution, depositional plane mostly presents high, middle low " saddle " shape in edge.
" micro-electroforming apparatus " of the patent No. 200810200426.6 adopts a kind of electric field reallocation baffle plate to solve the uneven problem of cathode surface electric current distribution, obtains good effect.A kind of method that " trickle electromoulding machine tool " of the patent No. 201210024051.9 then adopts negative electrode to vibrate, solves the uneven problem of cathode surface Flow Field Distribution preferably.But aforesaid method often only payes attention to one of them aspect, the uneven problem of deposit thickness still fundamentally can not be solved.So, be necessary to develop a kind of electro-deposition system, solve cathode surface current density and the uneven problem of Flow Field Distribution working in coordination with, and then obtain the homogeneous settled layer of thickness distribution.
Summary of the invention
The purpose of this utility model is to provide and a kind ofly can realizes uniform flow field distribution and can obtain again the electro-deposition system of homogeneous electric current distribution, to solving the uneven problem of deposit thickness to greatest extent.
For achieving the above object, the technical solution adopted in the utility model is: a kind of electro-deposition system, comprises galvanic deposition cell, negative electrode and anode; Described galvanic deposition cell also comprises cathode screen plate and negative electrode vibrating mechanism; Described negative electrode vibrating mechanism comprises level and is placed in negative electrode fixed link above galvanic deposition cell; Described negative electrode is fixedly installed on negative electrode fixed link; Described cathode screen plate is placed in parallel between negative electrode, anode.
Described negative electrode fixed link can do horizontal linear double vibrations, and amplitude is 30mm ~ 60mm.
The material of described cathode screen plate is the non-conductive corrosion resistant non-metallic material such as polypropylene.
The cross-sectional shape of described cathode screen plate is similar to negative electrode, and its area is 1.5 times of cathode area, and center has the shape hole similar to negative electrode cross-sectional shape, and hole area is 2/3rds of cathode area.
The position of described cathode screen plate can regulate relative to negative electrode.
The utility model has the advantages that and can solve cathode surface current density and the uneven problem of Flow Field Distribution simultaneously.
Accompanying drawing explanation
Fig. 1 is a kind of electro-deposition system schematic diagram.
Embodiment
Below in conjunction with accompanying drawing 1, enforcement of the present utility model is further described.
As shown in Figure 1, a kind of electro-deposition system, comprises galvanic deposition cell 1, negative electrode 8 and anode 4.
Galvanic deposition cell 1 also comprises cathode screen plate 6 and negative electrode vibrating mechanism; Negative electrode vibrating mechanism comprises level and is placed in negative electrode fixed link 2 above galvanic deposition cell 1; Roller 7 is equipped with at negative electrode fixed link 2 two ends; Negative electrode 8 is fixedly installed on negative electrode fixed link 2 by screw; Negative electrode vibrating mechanism drives negative electrode 8 to do horizontal linear double vibrations by negative electrode fixed link 2, and amplitude is 40mm.
The material of cathode screen plate 6 is polypropylene.
The cross-sectional shape of cathode screen plate 6 is similar to negative electrode 8, and its area is 1.5 times of negative electrode 8 area, and center has the shape hole 5 similar to negative electrode 8 cross-sectional shape, and the area of hole 5 is 2/3rds of negative electrode 8 area.
Cathode screen plate 6 is inserted in the draw-in groove 3 being positioned at galvanic deposition cell 1 two side and bottom, and parallel with anode 4 with negative electrode 8; Cathode screen plate 6 is 10cm with the distance of negative electrode 8.
Claims (5)
1. an electro-deposition system, comprises galvanic deposition cell, negative electrode and anode, it is characterized in that: described galvanic deposition cell also comprises cathode screen plate and negative electrode vibrating mechanism; Described negative electrode vibrating mechanism comprises level and is placed in negative electrode fixed link above galvanic deposition cell; Described negative electrode is fixedly installed on negative electrode fixed link; Described cathode screen plate is placed in parallel between negative electrode, anode.
2. a kind of electro-deposition system as claimed in claim 1, is characterized in that: described negative electrode fixed link can do horizontal linear double vibrations, and amplitude is 30mm ~ 60mm.
3. a kind of electro-deposition system as claimed in claim 1, is characterized in that: the material of described cathode screen plate is polypropylene.
4. a kind of electro-deposition system as claimed in claim 1, it is characterized in that: the cross-sectional shape of described cathode screen plate is similar to negative electrode, its area is 1.5 times of cathode area, and center has the shape hole similar to negative electrode cross-sectional shape, and hole area is 2/3rds of cathode area.
5. a kind of electro-deposition system as claimed in claim 1, is characterized in that: the position of described cathode screen plate can regulate relative to negative electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420691434.6U CN204342905U (en) | 2014-11-17 | 2014-11-17 | A kind of electro-deposition system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420691434.6U CN204342905U (en) | 2014-11-17 | 2014-11-17 | A kind of electro-deposition system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204342905U true CN204342905U (en) | 2015-05-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420691434.6U Expired - Fee Related CN204342905U (en) | 2014-11-17 | 2014-11-17 | A kind of electro-deposition system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204342905U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108149293A (en) * | 2016-12-05 | 2018-06-12 | 苏州能讯高能半导体有限公司 | Semiconductor crystal wafer electro-deposition method and semiconductor crystal wafer electric deposition device |
| CN114703534A (en) * | 2022-04-13 | 2022-07-05 | 中山大学 | Electrodeposition device and method capable of reducing edge effect and improving capillary performance |
-
2014
- 2014-11-17 CN CN201420691434.6U patent/CN204342905U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108149293A (en) * | 2016-12-05 | 2018-06-12 | 苏州能讯高能半导体有限公司 | Semiconductor crystal wafer electro-deposition method and semiconductor crystal wafer electric deposition device |
| CN114703534A (en) * | 2022-04-13 | 2022-07-05 | 中山大学 | Electrodeposition device and method capable of reducing edge effect and improving capillary performance |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150520 Termination date: 20161117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |