CN203846126U - PCB vertical plating line thin copper baffle pillar - Google Patents
PCB vertical plating line thin copper baffle pillar Download PDFInfo
- Publication number
- CN203846126U CN203846126U CN201420109626.1U CN201420109626U CN203846126U CN 203846126 U CN203846126 U CN 203846126U CN 201420109626 U CN201420109626 U CN 201420109626U CN 203846126 U CN203846126 U CN 203846126U
- Authority
- CN
- China
- Prior art keywords
- telescopic mast
- telescopic column
- pillar
- lower telescopic
- thin copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 239000010949 copper Substances 0.000 title claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 27
- 238000007747 plating Methods 0.000 title claims abstract description 16
- 239000011889 copper foil Substances 0.000 abstract description 9
- 238000009713 electroplating Methods 0.000 abstract description 8
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Abstract
The utility model discloses a PCB vertical plating line thin copper baffle pillar which comprises a flying rod bracket, an upper telescopic column, a lower telescopic column, an upper telescopic column embedding tank, a lower telescopic column embedding block, a screw cap and an adjustable annular ring embedding tank. The PCB vertical plating line thin copper baffle pillar is characterized in that one end of the upper telescopic column and two flying rods are fixed through bolts, the upper telescopic column and the lower telescopic column are screwed down through screw thread and are fixedly connected by using the screw cap; the adjustable annular ring embedding tank is sleeved on the lower telescopic column; the upper telescopic column is provided with an upper telescopic column embedding tank; the other end of the lower telescopic column is provided with the lower telescopic column embedding block. According to the PCB vertical plating line thin copper baffle pillar, current unbalance affected by electric conduction of the bracket can be avoided, the telescopic range of the bracket is wide, the electroplating demands of the existing PCB boards with any size can be met, and purchasing cost and purchasing price differences between waste copper and copper foil can be reduced by using a thin copper plate.
Description
Technical field
The utility model relates to PCB electroplanting device, relates in particular to the thin copper baffle plate of a kind of PCB upright plating line pillar.
Background technology
The PCB thin plate of circuit board plant does not carry out current balance type and will cause pcb board copper facing inhomogeneous in electroplating process, and quality product is defective and scrap, and causes serious waste.Carry additionally two stainless steel plates and carry out current balance type flying palladium two ends, quality product gets a promotion, and product rejection rate declines.But stainless steel has also plated copper in electroplating process, because of stainless material costliness, in technique, stainless steel is recycled, so, in recycling process, increase and got plate technique (stainless steel of plated with copper is taken out from copper layer).Get the shortcoming that plate technique is brought: increased operating personnel, increased personnel cost; The serious potential safety hazard such as sound nuisance, mechanical wounding and danger in this operation, are also produced; The stainless steel of recycling contains other impurity can, on the impact of latter products mass formation, reduce conforming product rate.Consider from practical function angle, the floating trough in plating tank is pressed into bottom land by the intensity that adopts thick copper coin can possess stainless steel baffle plate, realizes the object of distributed lines plate electric current simultaneously, but thick copper coin purchase cost is high, loss in price is post sales large, and thick copper coin is difficult for clamping.
Summary of the invention
For meet the requirement that floating trough is pressed into bottom land and distributes electric current and use copper sheet to reduce costs simultaneously, the utility model provides the thin copper baffle plate of a kind of PCB upright plating line pillar, and the height of this support can regulate according to the pcb board size of electroplating, and meets the need of production of different size pcb board.
The utility model is achieved like this, the thin copper baffle plate of a kind of PCB upright plating line pillar, comprise and fly to cling to support, upper telescopic mast, lower telescopic mast, lower telescopic mast embedded block, upper telescopic mast embedded groove, nut, adjustable annular circle embedded groove, the one end that it is characterized in that telescopic mast adopts screw and two to fly to cling to support and fixes, upper telescopic mast and lower telescopic mast are tightened by screw thread, and be fixed connection with nut, on lower telescopic mast, be set with adjustable annular circle embedded groove, described upper telescopic mast is provided with telescopic mast embedded groove, the other end of described lower telescopic mast is provided with lower telescopic mast embedded block.
Described regulable ring-shaped circle embedded groove has internal thread, and adjustable annular embedded groove can be slided along lower telescopic mast, in the time that needs are fixed, and tightening nuts.
Described lower flexible embedded block is directly tightened on lower telescopic mast by internal thread, and adopts the mode of check nut to lock.
The utility model adopts red copper Copper Foil to replace stainless steel to carry out current balance type in plating, flies to cling to two ends two same telescopic PP material pillars are installed copper is flat.The effect of described pillar: prevent that red copper foil and electroplating thin plate are in the time putting into processing solution tank, pontoon bridge contacts with red copper foil with thin plate and thin plate and the red copper foil situation such as deform, fracture occurs.
The utility model pillar adopts the flexible principle of screw, can meet 17.5 inches of clampings to 24.5 inches of scopes and support.Because of this pillar with fly to cling to inboardend and can not slip into aborning in processing solution tank, can not be coated with copper, in order to save material cost, to select ferrous material to add anticorrosion, fixed form adopts and flies to cling to upper and lower two ends screw and fix.It is PP material that pillar slips into liquid portion in groove, prevents pillar energising and affect current balance type effect, simultaneously for preventing that pillar is coated with copper and affects its work-ing life, provides convenience for safeguarding, reduces maintenance times, can be fixed on for a long time and fly to cling to.The Telescopic Fixed end of pillar is PP material, adopts bolt mode to be connected and fixed with ferrous material inboardend, and this inboardend embeds in sleeve pipe, and outer adopts PP material welding process to connect.The flexible employing sleeve pipe of pillar and coordinating of screw rod, the upper telescopic mast of pillar is PP sleeve pipe, 50 centimetres of pipe ranges, the internal thread of processing 14 cm long in pipe, in order to the coordinating of screw rod, the Telescopic of performance pillar.The internal thread of processing 14 cm long in sleeve pipe, can meet the contact strength of pillar sleeve pipe and screw rod in the time of the thin plate of clamping 24.5 inchages, the lower telescopic mast of pillar is PP screw rod, and long 48 centimetres, screw rod all screws in sleeve pipe can meet the product that hangs 17.5 inches.For preventing that in long-term production, the inefficacy of pillar occurs getting loose of screw rod, adopt nut mode to lock.For meeting the firm effect of whole pillar in integral clamp group, the rectangular parallelepiped that strut ends is designed to match with original thin plate bottom jig descends telescopic mast embedded block, this matching part can regulate arbitrarily its direction on screw rod, facilitate the connection clamping in actually operating, and adopt the mode of check nut to lock.Fixedly embedded groove is housed on sleeve pipe, the embedded groove that can regulate arbitrarily height on screw rod is housed on screw rod, the balance clamping for meeting the product of different size, these two kinds of embedded grooves prevent that red copper foil from making red copper foil distortion because of the air blowing effect in groove and the air effect in handling process in groove, thereby affect equalizing current effect.
The utility model advantage: the utility model is except addressing the above problem; Change plate in actual production time, all take off current balance type plate no longer at every turn simultaneously, reduced the labour intensity of electroplating activity personnel in clamping plate process; Save the storage place of stainless steel plate, for having vacateed more space in whole workshop; Can avoid pillar conduction and affect current imbalance, the pillar wide ranges of stretch, the specification while that has met existing basic product is also the expansion of the later product specification condition that provides the foundation.
Brief description of the drawings
Fig. 1 is front view of the present utility model.
Fig. 2 is upward view of the present utility model.
Current balance type schematic diagram when Fig. 3 is the utility model use.
Fig. 4 is the front view that flies to cling to support described in the utility model.
Fig. 5 is the vertical view that flies to cling to support described in the utility model.
Fig. 6 is the side-view that flies to cling to support described in the utility model.
In the drawings 1, fly to cling to support 2, upper telescopic mast 3, lower telescopic mast 4, lower telescopic mast embedded block 5, upper telescopic mast embedded groove 6, nut 7, regulable ring-shaped circle embedded groove 8, support 9, fly to cling to 10, bottom bar 11, red copper foil 12, electroplating thin plate.
Embodiment
As shown in Figures 1 to 6, the thin copper baffle plate of a kind of PCB upright plating line pillar, comprise and fly to cling to support 1, upper telescopic mast 2, lower telescopic mast 3, lower telescopic mast embedded block 4, upper telescopic mast embedded groove 5, nut 6, adjustable annular circle embedded groove 7, the one end that it is characterized in that telescopic mast 2 adopts screw to fly to cling to support 1 and fix with two, upper telescopic mast 2 and lower telescopic mast 3 are tightened by screw thread, and be fixed connection with nut 6, on lower telescopic mast 3, be set with adjustable annular circle embedded groove 7, described upper telescopic mast 2 is provided with telescopic mast embedded groove 5, the other end of described lower telescopic mast 3 is provided with lower telescopic mast embedded block 4, described lower flexible embedded block 4 is directly tightened on lower telescopic mast 3 by internal thread, and adopts the mode of check nut to lock, described regulable ring-shaped circle embedded groove 7 has internal thread, and regulable ring-shaped embedded groove 7 can be slided along lower telescopic mast 3, in the time that needs are fixed, and tightening nuts 6.
Described upper telescopic mast 2 is tapped PP sleeve pipe, 50 centimetres of pipe ranges; The lower telescopic mast of described pillar is PP screw rod, long 48 centimetres.
As shown in Figure 3, in use, with fly to cling to 9 and bottom bar 10 on fixture clamp respectively lower telescopic mast embedded block 4, red copper foil 11 and electroplating thin plate 12.
Claims (5)
1. the thin copper baffle plate of a PCB upright plating line pillar, comprise and fly to cling to support, upper telescopic mast, lower telescopic mast, lower telescopic mast embedded block, upper telescopic mast embedded groove, nut, adjustable annular circle embedded groove, the one end that it is characterized in that telescopic mast adopts screw and two to fly to cling to support and fixes, upper telescopic mast and lower telescopic mast are tightened by screw thread, and be fixed connection with nut, on lower telescopic mast, be set with adjustable annular circle embedded groove, described upper telescopic mast is provided with telescopic mast embedded groove, and the other end of described lower telescopic mast is provided with lower telescopic mast embedded block.
2. the thin copper baffle plate of PCB upright plating line according to claim 1 pillar, is characterized in that described regulable ring-shaped circle embedded groove has internal thread, and adjustable annular embedded groove can be slided along lower telescopic mast, in the time that needs are fixed, and tightening nuts.
3. the thin copper baffle plate of PCB upright plating line according to claim 1 pillar, is characterized in that described lower flexible embedded block is directly tightened on lower telescopic mast by internal thread, and adopts the mode of check nut to lock.
4. the thin copper baffle plate of PCB upright plating line according to claim 1 pillar, is characterized in that described upper telescopic mast is tapped PP sleeve pipe.
5. the thin copper baffle plate of PCB upright plating line according to claim 1 pillar, the lower telescopic mast that it is characterized in that described pillar is PP screw rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420109626.1U CN203846126U (en) | 2014-03-12 | 2014-03-12 | PCB vertical plating line thin copper baffle pillar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420109626.1U CN203846126U (en) | 2014-03-12 | 2014-03-12 | PCB vertical plating line thin copper baffle pillar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203846126U true CN203846126U (en) | 2014-09-24 |
Family
ID=51559164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420109626.1U Expired - Lifetime CN203846126U (en) | 2014-03-12 | 2014-03-12 | PCB vertical plating line thin copper baffle pillar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203846126U (en) |
-
2014
- 2014-03-12 CN CN201420109626.1U patent/CN203846126U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343000 No. 281 Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140924 |