CN203842842U - Four-test-position single-rail automatic discharging and splitting shuttle - Google Patents
Four-test-position single-rail automatic discharging and splitting shuttle Download PDFInfo
- Publication number
- CN203842842U CN203842842U CN201420168238.0U CN201420168238U CN203842842U CN 203842842 U CN203842842 U CN 203842842U CN 201420168238 U CN201420168238 U CN 201420168238U CN 203842842 U CN203842842 U CN 203842842U
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- CN
- China
- Prior art keywords
- guide rail
- sub
- material shuttle
- test bit
- shuttle
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Abstract
The utility model discloses a four-test-position single-rail automatic discharging and splitting shuttle which comprises a test position guide rail AI, a test position guide rail AII, a test position guide rail AIII, a test position guide rail AIV, a test position baffle plate, a test position baffle plate air cylinder, a test position baffle plate bracket, a splitting shuttle guide rail BI, a splitting shuttle guide rail BII, a splitting shuttle guide rail BIII, a splitting shuttle baffle plate, a splitting shuttle bottom plate and an output guide rail C, wherein the center distance of the adjacent test position guide rails of four test position guide rails is a; the center distance of the splitting shuttle guide rail BI and the splitting shuttle guide rail BII is a; the center distance of the splitting shuttle guide rail BII and the splitting shuttle guide rail BIII is 0.5a; the output guide rail C is arranged on the lower end of the splitting shuttle guide rails, and the vertical position is positioned on the center line of the two middle test position guide rails; the three splitting shuttle guide rails are fixedly arranged on the splitting shuttle bottom plate, the splitting shuttle bottom plate is driven by a motor to reciprocate left and right, and the motor carries out four steps in all in driving the splitting shuttle guide rails to sequentially put four ICs (Integrated Circuit) positioned on the four test positions into the output guide rail C. The four-test position single-rail automatic discharging and splitting shuttle disclosed by the utility model simplifies the actions, increases the speed by 30%-50% compared with original speed and improves the integral machine efficiency.
Description
Technical field
The utility model relates to the finished product test of gravity type integrated circuit separator, relates in particular to IC self-test position to sub-material mode and the speed of automatic output guide rail.
Background technology
Gravity type integrated circuit separator is by integrated circuit categorised collection according to the test result of integrated circuit.In four location single track self-emptying separators, the sub-material shuttle conventionally adopting is the mode of a sub-material shuttle guide rail or two sub-material shuttle guide rails, and the centre-to-centre spacing of two sub-material shuttle guide rails is half of the adjacent guideway centreline of test bit two distance.If adopt a sub-material shuttle guide rail sub-material, motor driving is put into output guide rail by four IC in four test bits need to walk 8 steps; If adopt two sub-material shuttle guide rail sub-materials, motor driving is put into output guide rail by four IC in four test bits needs to walk 6 steps.This is that most gravity type integrated circuit separator four location single tracks are exported the sub-material mode of use automatically, not only moves loaded down with trivial detailsly, and speed is also slow, and UPH(is hourly output) be difficult to improve, whole operating efficiency is also lower.
Summary of the invention
Deficiency for prior art, the purpose of this utility model is to overcome the deficiency of prior art, provide a kind of and can reduce action step, hourly output is improved on original basis, improve four location single track self-emptying sub-material shuttles of the operating efficiency of complete machine.
Realize the technical solution of the utility model as follows:
Four location single track self-emptying sub-material shuttles, comprising: test bit guide rail A I, test bit guide rail A II, test bit guide rail A III, test bit guide rail A IV, test bit baffle plate, test bit baffle plate cylinder, test bit barrier support, sub-material shuttle guide rail B I, sub-material shuttle guide rail B II, sub-material shuttle guide rail B III, sub-material shuttle baffle plate, sub-material shuttle base plate, output guide rail C form.Centre-to-centre spacing between four described test bit adjacent rails is a, centre-to-centre spacing between sub-material shuttle guide rail B I and sub-material shuttle guide rail B II is a, centre-to-centre spacing between sub-material shuttle guide rail B II and sub-material shuttle guide rail B III is 0.5a, output guide rail C is located at the lower end of sub-material shuttle guide rail, and upright position is on the center line of middle two test bit guide rails, each test bit guide rail is provided with a set of test bit baffle plate assembly, test bit baffle plate is arranged on test bit baffle plate cylinder end, test bit baffle plate cylinder is fixedly mounted on test bit barrier support, and test bit barrier support is arranged on the lower end of test bit guide rail, for locating IC, three cover sub-material shuttle guide rails are fixedly mounted on sub-material shuttle base plate, by motor driving sub-material shuttle base plate left and right, are moved back and forth, and every cover sub-material shuttle guide rail is equipped with a set of sub-material shuttle baffle plate, act as and blocks IC downslide, sub-material shuttle guide rail B I and sub-material shuttle guide rail B II move to test bit guide rail A I and test bit guide rail A II lower end position, test bit baffle plate rises, IC falls into sub-material shuttle guide rail B I and sub-material shuttle guide rail B II guide rail, sub-material shuttle base plate moves right 0.5a, sub-material shuttle guide rail B II punishment material shuttle baffle plate rises, IC puts into output guide rail C, in test bit guide rail A III, IC is put simultaneously, enter sub-material shuttle guide rail B III, sub-material shuttle guide rail continues to left movement 0.5a, in sub-material shuttle guide rail B III, IC puts into output guide rail C, sub-material shuttle base plate moves right 1.5a, in sub-material shuttle guide rail B I, IC puts into output guide rail C, in test bit guide rail A IV, IC is put simultaneously, enter sub-material shuttle guide rail B III, sub-material shuttle base plate continues to left movement 1.5a, in sub-material shuttle guide rail B III, IC puts into output guide rail C, in test bit guide rail A I and test bit guide rail A II, IC falls into sub-material shuttle guide rail B I and sub-material shuttle guide rail B II simultaneously simultaneously, so just complete one bout, in four test bit guide rails, IC all enters in output guide rail C.Motor driving sub-material shuttle guide rail is put into successively output guide rail by four IC in four test bits and is amounted to walk 4 steps, has simplified action, and speed had also improved 30-50% than originally, had improved overall efficiency.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is that the ratio of the utility model physical dimension lists intention.
Number in the figure explanation:
1-test bit guide rail A I, 2-test bit guide rail A II, 3-test bit guide rail A III
4-test bit guide rail A IV, 5-test bit baffle plate cylinder, 6-test bit barrier support
7-test bit baffle plate, 8-IC, 9-sub-material shuttle guide rail B I
10-sub-material shuttle guide rail B II, 11-sub-material shuttle guide rail B III, 12-sub-material shuttle baffle plate
13-sub-material shuttle base plate, 14-output guide rail C.
The specific embodiment
how below in conjunction with accompanying drawing, further illustrate the utility model realizes:
As shown in accompanying drawing 1,2, four location single track self-emptying sub-material shuttles, comprising: test bit guide rail A I, test bit guide rail A II, test bit guide rail A III, test bit guide rail A IV, test bit baffle plate, test bit baffle plate cylinder, test bit barrier support, sub-material shuttle guide rail B I, sub-material shuttle guide rail B II, sub-material shuttle guide rail B III, sub-material shuttle baffle plate, sub-material shuttle base plate, output guide rail C form.Centre-to-centre spacing between four test bit adjacent rails is a, centre-to-centre spacing between sub-material shuttle guide rail B I (9) and sub-material shuttle guide rail B II (10) is a, centre-to-centre spacing between sub-material shuttle guide rail B II and sub-material shuttle guide rail B III (11) is 0.5a, output guide rail C(14) be located at the lower end of sub-material shuttle guide rail, upright position is on the center line of middle two test bit guide rails, each test bit guide rail is provided with a set of test bit baffle plate (7) assembly, test bit baffle plate is arranged on test bit baffle plate cylinder (5) end, test bit baffle plate cylinder is fixedly mounted on test bit barrier support (6), test bit barrier support is arranged on the lower end of test bit guide rail, for locating IC(8), it is upper that three cover sub-material shuttle guide rails are fixedly mounted on sub-material shuttle base plate (13), by motor driving sub-material shuttle base plate left and right, moved back and forth, and every cover sub-material shuttle guide rail is equipped with a set of sub-material shuttle baffle plate, act as and blocks IC downslide, sub-material shuttle guide rail B I and sub-material shuttle guide rail B II move to the lower end position of test bit guide rail A I (1) and test bit guide rail A II (2), test bit baffle plate rises, IC falls into sub-material shuttle guide rail B I and sub-material shuttle guide rail B II guide rail, sub-material shuttle base plate moves right 0.5a, sub-material shuttle guide rail B II punishment material shuttle baffle plate (12) rises, IC puts into output guide rail C, in test bit guide rail A III (3), IC is put simultaneously, enter sub-material shuttle guide rail B III, sub-material shuttle guide rail continues to left movement 0.5a, in sub-material shuttle guide rail B III, IC puts into output guide rail C, sub-material shuttle base plate moves right 1.5a, in sub-material shuttle guide rail B I, IC puts into output guide rail C, in test bit guide rail A IV (4), IC is put simultaneously, enter sub-material shuttle guide rail B III, sub-material shuttle base plate continues to left movement 1.5a, in sub-material shuttle guide rail B III, IC puts into output guide rail C, in test bit guide rail A I and test bit guide rail A II, IC falls into sub-material shuttle guide rail B I and sub-material shuttle guide rail B II simultaneously simultaneously, so just complete one bout, in four test bit guide rails, IC all enters in output guide rail C.Motor driving sub-material shuttle guide rail is put into successively output guide rail by four IC in four test bits and is amounted to walk four steps, has simplified action, and speed had also improved 30-50% than originally, had improved overall efficiency.
Step is decomposed:
First step sub-material shuttle moves to test bit guide rail A I: in test bit guide rail A I, IC falls into sub-material shuttle guide rail B I, test bit guide rail A II IC falls into sub-material shuttle guide rail B II; Sub-material shuttle moves right 0.5a: in sub-material shuttle guide rail B II, IC falls into output guide rail C, test bit guide rail A III IC falls into sub-material shuttle guide rail B III;
Second step sub-material shuttle is to left movement 0.5a: in sub-material shuttle guide rail B III, IC falls into output guide rail C;
The 3rd step sub-material shuttle moves right 1.5a: in sub-material shuttle guide rail B I, IC falls into output guide rail C, test bit guide rail A III IC falls into sub-material shuttle guide rail B III;
The 4th step sub-material shuttle is to left movement 1.5a: in sub-material shuttle guide rail B III, IC falls into output guide rail C, test bit guide rail A I and test bit guide rail A II IC and falls into sub-material shuttle guide rail B I and sub-material shuttle guide rail B II simultaneously.
Claims (3)
1. four location single track self-emptying sub-material shuttles, comprise: test bit guide rail A I, test bit guide rail A II, test bit guide rail A III, test bit guide rail A IV, test bit baffle plate, test bit baffle plate cylinder, test bit barrier support, sub-material shuttle guide rail B I, sub-material shuttle guide rail B II, sub-material shuttle guide rail B III, sub-material shuttle baffle plate, sub-material shuttle base plate, output guide rail C form, and it is characterized in that: the centre-to-centre spacing between four described test bit adjacent rails is a; Centre-to-centre spacing between sub-material shuttle guide rail B I and sub-material shuttle guide rail B II is a; Centre-to-centre spacing between sub-material shuttle guide rail B II and sub-material shuttle guide rail B III is 0.5a, output guide rail C is located at the lower end of sub-material shuttle guide rail, upright position is on the center line of middle two test bit guide rails, each test bit guide rail is provided with a set of test bit baffle plate assembly, test bit baffle plate is arranged on test bit baffle plate cylinder end, test bit baffle plate cylinder is fixedly mounted on test bit barrier support, and test bit barrier support is arranged on the lower end of test bit guide rail, for locating IC.
2. four location single track self-emptying sub-material shuttles according to claim 1, it is characterized in that: three described cover sub-material shuttle guide rails are fixedly mounted on sub-material shuttle base plate, by motor driving sub-material shuttle base plate left and right, moved back and forth, every cover sub-material shuttle guide rail is equipped with a set of sub-material shuttle baffle plate, blocks IC and glides.
3. four location single track self-emptying sub-material shuttles according to claim 1, is characterized in that: described every cover sub-material shuttle guide rail is equipped with a set of sub-material shuttle baffle plate, block IC and glide, sub-material shuttle guide rail B I and sub-material shuttle guide rail B II move to test bit guide rail A I and test bit guide rail A II lower end position, test bit baffle plate rises, IC falls into sub-material shuttle guide rail B I and sub-material shuttle guide rail B II, sub-material shuttle base plate moves right 0.5a, B II guide rail punishment material shuttle baffle plate rises, IC puts into output guide rail C, in test bit guide rail A III, IC is put simultaneously, enter sub-material shuttle guide rail B III, sub-material shuttle guide rail continues to left movement 0.5a, in sub-material shuttle guide rail B III, IC puts into output guide rail C, sub-material shuttle base plate moves right 1.5a, in sub-material shuttle guide rail B I, IC puts into output guide rail C, in test bit guide rail A IV, IC is put simultaneously, enter sub-material shuttle guide rail B III, sub-material shuttle base plate continues to left movement 1.5a, in sub-material shuttle guide rail B III, IC puts into output guide rail C, in test bit guide rail A I and test bit guide rail A II, IC falls into sub-material shuttle guide rail B I and B II simultaneously simultaneously, so just complete one bout, in four test bit guide rails, IC all enters in output guide rail C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420168238.0U CN203842842U (en) | 2014-04-09 | 2014-04-09 | Four-test-position single-rail automatic discharging and splitting shuttle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420168238.0U CN203842842U (en) | 2014-04-09 | 2014-04-09 | Four-test-position single-rail automatic discharging and splitting shuttle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203842842U true CN203842842U (en) | 2014-09-24 |
Family
ID=51555905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420168238.0U Expired - Fee Related CN203842842U (en) | 2014-04-09 | 2014-04-09 | Four-test-position single-rail automatic discharging and splitting shuttle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203842842U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110961379A (en) * | 2019-12-21 | 2020-04-07 | 王桂花 | Grading mechanism of integrated circuit testing and sorting machine |
-
2014
- 2014-04-09 CN CN201420168238.0U patent/CN203842842U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110961379A (en) * | 2019-12-21 | 2020-04-07 | 王桂花 | Grading mechanism of integrated circuit testing and sorting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20160409 |