CN203826637U - Earphone connector and electronic equipment - Google Patents
Earphone connector and electronic equipment Download PDFInfo
- Publication number
- CN203826637U CN203826637U CN201420074454.9U CN201420074454U CN203826637U CN 203826637 U CN203826637 U CN 203826637U CN 201420074454 U CN201420074454 U CN 201420074454U CN 203826637 U CN203826637 U CN 203826637U
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- Prior art keywords
- insulating base
- plate
- earphone jack
- assembly
- insulating
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- Expired - Fee Related
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- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 20
- 239000003351 stiffener Substances 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 5
- 230000002787 reinforcement Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 230000009286 beneficial effect Effects 0.000 description 7
- 239000004568 cement Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Headphones And Earphones (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model is suitable for the technical field of the structure of an earphone connector, and provides an earphone connector and an electronic device, wherein the earphone connector comprises an insulating socket and a conductive terminal, and an earphone jack is arranged on the insulating socket; the insulating socket comprises a first insulating seat, a second insulating seat and a third insulating seat, the earphone jack is arranged on the second insulating seat, the conductive terminals are formed on the first insulating seat in an insert injection molding mode and form a first assembly with the first insulating seat, the first assembly card is inserted and installed on the second insulating seat and form a second assembly with the second insulating seat, and the third insulating seat is used for packaging and fixing the first assembly on the second insulating seat. The utility model discloses a divide into the triplex setting with insulating socket to with conductive terminal insert molding on first insulation seat, the event, make conductive terminal and first insulation seat's cooperation more tight, avoided conductive terminal and insulating socket cooperation department to form the situation appearance of tiny hole, improved the sealing performance of conductive terminal and insulating socket cooperation department.
Description
Technical field
The utility model belongs to headset connector technical field of structures, relates in particular to a kind of headset connector and has the electronic equipment of this headset connector.
Background technology
Have and on the electronic equipment of audio playing function, be generally provided with the headset connector inserting for headset plug, headset connector comprises plastic cement socket and is embedded at the conducting terminal on plastic cement socket, plastic cement socket is provided with has the earphone jack of inserting for headset plug, and conducting terminal comprises the main part that is embedded in plastic cement socket, along main part, extends the contact site being convexly set on earphone jack inwall and extend along main part the leg portion outside plastic cement socket that is convexly set in.
In prior art, conducting terminal is generally installed on plastic cement socket by the mode of pressing.In order to realize the installation that presses of conducting terminal, plastic cement socket just need arrange the installing hole that presses and install for conducting terminal, and installing hole is communicated with earphone jack.Because the contact site of conducting terminal is that end bending along main part extends in earphone jack, therefore, by conducting terminal press install with installing hole in after, conducting terminal just unavoidably can form the said minuscule hole that some are communicated with earphone jack with the cooperation between installing hole.These said minuscule hole can directly affect the sealing of headset connector, make the waterproof effect of headset connector and dust-proof effect poor.Like this, in concrete application, the impurity such as the extraneous dust of one side, moisture easily enter into electronic equipment internal in said minuscule hole, thereby have had a strong impact on runnability and the useful life of electronic equipment; After the long-term use of product, the impurity such as extraneous dust, moisture are easily deposited in said minuscule hole place, thereby cause the generation of the situations such as conducting terminal elastic failure, conducting terminal corrosion and damage on the other hand, and then cause the situation of headset connector disabler to occur.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, a kind of headset connector is provided and has had the electronic equipment of this headset connector, it is intended to solve existing headset connector in conducting terminal and the poor technical problem of insulated receptacle cooperation place sealing.
The utility model is achieved in that a kind of headset connector, comprise insulated receptacle and be embedded at the conducting terminal in described insulated receptacle, described insulated receptacle is provided with the earphone jack of inserting for headset plug, and described conducting terminal comprises the main part that is embedded in described insulated receptacle, along described main part, extends the contact site being convexly set on described earphone jack inwall and extend along described main part the leg portion outside described insulated receptacle that is convexly set in; Described insulated receptacle comprises the first insulating base, the second insulating base and the 3rd insulating base, described earphone jack is located on described the second insulating base, described conducting terminal employing insert injection moulding mode takes shape on described the first insulating base and with described the first insulating base and forms the first assembly, described the first assembly card is inserted to be installed on described the second insulating base and with described the second insulating base and is formed the second assembly, and described the 3rd insulating base is injected and molded on described the second assembly and described the first component package is fixed on described the second insulating base.
Particularly, described the first insulating base comprises substrate and is convexly set in the plate on described substrate, the described main part of described conducting terminal is embedded in described plate, described contact site and described leg portion extend respectively the both sides of described substrate, described the second insulating base is provided with the installing hole being communicated with described earphone jack, and described plate and described contact site card insert in described installing hole.
Further, described the first insulating base also comprises stiffener, described stiffener be convexly set in described plate on the sidewall at described substrate-side edge, described the second insulating base is provided with the open slot being equipped with described stiffener, described reinforcement board inserts in described open slot.
Particularly, described substrate comprises intermediate board body and the two L shaped flaps that arrange along described intermediate board body two lateral bucklings respectively, described L shaped flap comprises vertical plate and plate anyhow, and the two ends of described vertical plate connect respectively described intermediate board body and described plate anyhow, described in described plate is convexly set in anyhow on plate.
Particularly, described earphone jack is the blind hole of being located on described the second insulating base, and it has openend and blind end, and the aperture of described openend is greater than the aperture of described blind end.
Preferably, the stepped setting of bottom profile of described the second insulating base, the bottom profile of described the second insulating base comprises that, near the first ladder bottom surface of described openend setting and the second ladder bottom surface of close described blind end, described the first ladder bottom surface is greater than described the second ladder bottom surface to the distance at described earphone jack center to the distance at described earphone jack center.
Particularly, described the first assembly card is inserted the bottom be installed on the second insulating base, and described the first insulating base is provided with the stepped groove with the bottom profile adaptation of described the second insulating base, and the bottom profile card inserting of this stepped groove and described the second insulating base is closed.
Particularly, described the 3rd insulating base is a U-shaped tabular component, it comprises rear portion plate body and the sidepiece plate body arranging along the bending of plate body two ends, described rear portion respectively, described back panel is shown consideration for the rear wall setting near described earphone jack blind end of closing described the second assembly, and described in two, fit the respectively two side of described the second assembly of sidepiece plate body arranges.
Further, the end of described sidepiece plate body also bends and is provided with clamping boss towards the inner side of described U-shaped tabular component, and described the second insulating base is provided with the draw-in groove being equipped with described clamping boss, and described clamping boss is contained in described draw-in groove.
The headset connector that the utility model provides, by insulated receptacle being divided into three parts, arrange, and specifically by conducting terminal insert-molding on the first insulating base to form the first assembly, then the first assembly card is inserted and is installed on the second insulating base to form the second assembly, again at the second assembly outer package moulding the 3rd insulating base so that the first assembly is locked on the second insulating base, thereby the assembling that has completed conducting terminal and insulated receptacle is fixed.Wherein, because conducting terminal is that insert-molding is on the first insulating base, the first insulating base injection molding packaging is outside conducting terminal, therefore, can make the mix proportion between conducting terminal and the first insulating base more tight, the situation of having avoided conducting terminal and insulated receptacle cooperation place to form said minuscule hole occurs, thereby improved the sealing property of conducting terminal and insulated receptacle cooperation place, improve waterproof effect and the dust-proof effect of headset connector, guaranteed stability and the useful life of headset connector.
The utility model also provides a kind of electronic equipment, and it comprises body, and described body is provided with above-mentioned headset connector.
The electronic equipment that the utility model provides, owing to having adopted above-mentioned headset connector, therefore, effectively realizing under the prerequisite of electronic equipment audio-frequency function, also improved the dust and water protection performance of electronic equipment, guarantee stability and the useful life of electronic equipment internal components and parts, thereby guaranteed the combination property of electronic equipment, improved the market competitiveness of electronic equipment.
Accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of the headset connector that provides of the utility model embodiment;
Fig. 2 is the assembling schematic diagram of the headset connector that provides of the utility model embodiment
Fig. 3 is the bottom view of Fig. 2;
Fig. 4 is the assembling schematic diagram of the first assembly of providing of the utility model embodiment;
Fig. 5 is the structural representation of the first insulating base of providing of the utility model embodiment;
Fig. 6 is the assembling schematic diagram of the second assembly of providing of the utility model embodiment;
Fig. 7 is the structural representation of the second insulating base of providing of the utility model embodiment.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figures 1 to 3, the headset connector that the utility model embodiment provides, comprises insulated receptacle 1 and is embedded at the conducting terminal 2 in insulated receptacle 1, conducting terminal 2 can be by the good metal material punch forming of electric conductivity.Insulated receptacle 1 is provided with the earphone jack 121 of inserting for headset plug, and conducting terminal 2 comprises the main part 21 that is embedded in insulated receptacle 1, along main part 21, extends the contact site 22 being convexly set on earphone jack 121 inwalls and extend along main part 21 the leg portion 23 outside insulated receptacle 1 that is convexly set in.The main part 21 of conducting terminal 2 is for realizing and being fixedly connected with of insulated receptacle 1; Contact site 22 is for contacting electrical connection with the signal terminal of headset plug; Leg portion 23 is connected for the control circuit board soldering with electronic equipment and being electrically connected to of realization and control circuit board.When headset plug plugged earphone jack 121 is interior, the signal terminal on headset plug can be supported on the contact site 22 that is contacted with conducting terminal 2, thereby can effectively realize audio frequency transmission function.Insulated receptacle 1 comprises the first insulating base 11, the second insulating base 12 and the 3rd insulating base 13, the first insulating base 11, the second insulating base 12 and the 3rd insulating base 13 specifically can be by plastic material injection mo(u)ldings, earphone jack 121 is located on the second insulating base 12, conducting terminal 2 employing insert injection moulding modes take shape on the first insulating base 11 and with the first insulating base 11 and form the first assemblies 101, the first assembly 101 cards are inserted to be installed on the second insulating base 12 and with the second insulating base 12 and are formed the second assembly 102, the 3rd insulating base 13 is injected and molded on the second assembly 102 and by the first assembly 101 encapsulation and is fixed on the second insulating base 12.The first insulating base 11 is for realizing and being fixedly connected with of conducting terminal 2, the second insulating base 12 is for arranging earphone jack 121, the 3rd insulating base 13 is locked in the second insulating base 12 for first assembly 101 that will consist of the first insulating base 11 and conducting terminal 2, thereby can guarantee the solid and reliable property that the first assembly 101 is connected with the second insulating base 12.Because the first insulating base 11 and the second insulating base 12 are injection mo(u)ldings separately, therefore, be both convenient to realize the insert-molding of conducting terminal 2 on the first insulating base 11, be unlikely to again to make the insert-molding of conducting terminal 2 to affect the processing and forming of earphone jack 121.Simultaneously, the insert-molding of conducting terminal 2 on the first insulating base 11, can make the mix proportion between conducting terminal 2 and the first insulating base 11 tighter, avoided conducting terminal 2 and the situation that insulated receptacle 1 cooperation place forms said minuscule hole to occur, improved the sealing property of conducting terminal 2 with insulated receptacle 1 cooperation place, thereby improved waterproof effect and the dust-proof effect of headset connector, guaranteed stability and the useful life of headset connector.
Particularly, earphone jack 121 is for to be located at the blind hole on the second insulating base 12, and it has openend 1211 and blind end (not shown), and the aperture of openend 1211 is greater than the aperture of blind end.Openend 1211 apertures of earphone jack 121 arrange greatlyr than blind end aperture, are mainly according to the Optimal Structure Designing of headset plug.In concrete application, plug for the ease of headset plug in earphone jack 121 and can not produce strong collision while avoiding headset plug turnover earphone jack 121 openend 1211, the leading section radial dimension of headset plug can design to obtain arm end radial dimension point a little thereafter.The present embodiment, setting is mated with the rearward end radial dimension of headset plug in openend 1211 apertures of earphone jack 121, like this, the leading section that both can make headset plug is easily in plugged earphone jack 121, can contact with the laminating of headset plug rearward end outer wall by earphone jack 121 openend 1211 inwalls again guarantee headset plug plugged earphone jack 121 interior after not slippage easily; Simultaneously, it mates setting by the blind end aperture of earphone jack 121 with the leading section radial dimension of headset plug, like this, both can guarantee that the blind end of earphone jack 121 can insert for the leading section of headset plug, be beneficial to again the overall dimensions that reduces headset connector, be beneficial to product and develop to miniaturization.Certainly, in concrete application, also can must follow openend 1211 apertures equally large the blind end aperture design of earphone jack 121, it can guarantee headset plug plugged earphone jack 121 interior smoothness equally, but it is unfavorable for that product develops to miniaturization.
Particularly, as shown in Figure 6 and Figure 7, the all stepped settings of the bottom profile of the second insulating base 12 and top profile, the bottom profile of the second insulating base 12 comprises the first ladder bottom surface 124 of arranging near openend 1211 and to the distance at earphone jack 121 centers, is greater than the distance that earphone jack 121 centers are arrived in the second ladder bottom surface 125 near 125, the first ladder bottom surfaces 124, the second ladder bottom surface of blind end; The top profile of the second insulating base 12 comprises the first ladder end face 126 of arranging near openend 1211 and to the distance at earphone jack 121 centers, is greater than the distance that the second ladder end face 127 arrives earphone jack 121 centers near the second ladder end face 127, the first ladder end faces 126 of blind end.The all stepped settings of the bottom profile of the second insulating base 12 and top profile, mainly that the characteristic that is greater than blind end aperture according to earphone jack 121 openend 1211 apertures is carried out matching optimization design, like this, can guarantee the uniformity of earphone jack 121 wall thickness on the one hand, be beneficial on the other hand the overall dimensions that reduces headset connector.Certainly, in concrete application, the bottom profile of the second insulating base 12 and top profile are also all planarization setting, but, like this, the Miniaturization Design of unfavorable product.
Preferably, as shown in Figure 5 and Figure 6, the first assembly 101 card is inserted the bottoms that are installed on the second insulating base 12, and the first insulating base 11 is provided with the stepped groove 110 with the bottom profile adaptation of the second insulating base 12, and the bottom profile card inserting of stepped groove 110 and the second insulating base 12 is closed.Stepped groove 110 comprise with the first step trough 1101 of the first ladder bottom surface 124 adaptations and with the second step trough 1102 of the second ladder bottom surface 125 adaptations, the first step trough 1101 be arranged with the degree of depth that is arranged with that the degree of depth is greater than the second step trough 1102, the diapire of the diapire of the first step trough 1101 and the second step trough 1102 is supported respectively and is contacted the first ladder bottom surface 124 and the second ladder bottom surface 125.The setting of stepped groove 110 on the first insulating base 11, can guarantee the first insulating base 11 and the compactness that the second insulating base 12 bottom profile coordinate on the one hand, is beneficial on the other hand the material usage that reduces by the first insulating base 11.
Particularly, as shown in Figure 1, Figure 4 and Figure 5, the first insulating base 11 comprises substrate 111 and is convexly set in the plate 112 on substrate 111, above-mentioned stepped groove 110 is located at the pars intermedia office of substrate 111, plate 112 is located between stepped groove 110 and the side margins of substrate 111, the main part 21 of conducting terminal 2 is embedded in plate 112, contact site 22 and leg portion 23 extend respectively the both sides of substrate 111, and contact site 22 and plate 112 are positioned at the same side of substrate 111, contact site 22 arranges towards stepped groove 110 place lateral bucklings along one end of main part 21.The second insulating base 12 is provided with the installing hole 122 being communicated with earphone jack 121, and plate 112 and contact site 22 cards insert in installing hole 122.Main part 21 is embedded in plate 112, can realize the installation of conducting terminal 2 on the first insulating base 11 on the one hand and fix, on the other hand can be by plate 112 protection main parts 21, to prevent the distortion of bending easily of main part 21 or to fracture.Because the contact site that extends into earphone jack 121 inwalls 22 of conducting terminal 2 and the leg portion 23 outside insulated receptacle 1 of extending are divided into the both sides of substrate 111, and the insert-molding of conducting terminal 2 on the first insulating base 11 can not make to form said minuscule hole on substrate 111, therefore, although plate 112 and contact site 22 form said minuscule hole with the card inserting credit union of installing hole 122, but, stretching out of substrate 111 said minuscule hole capable of blocking, like this, even dust, the introduced contaminantses such as moisture can be when entering said minuscule hole in earphone jack 121, dust, the introduced contaminantses such as moisture can not enter in electronic equipment in said minuscule hole yet, and then effectively guaranteed the waterproof of electronic equipment, dust-proof effect.The magnitude setting of plate 112 is identical with the magnitude setting of conducting terminal 2, and the magnitude setting of conducting terminal 2 mates setting according to the structure of headset plug, the present embodiment, conducting terminal 2 is specifically provided with six, plate 112 quantity that are convexly equipped with on substrate 111 correspond to six, six plates 112 are divided into the both sides of stepped groove 110, and installing hole 122 correspondences that arrange on the second insulating base 12 are provided with six, and six installing holes 122 and six plate 112 contraposition settings.
Further, as shown in Figure 1, Figure 4 and Figure 5, the first insulating base 11 also comprises stiffener 113, stiffener 113 be convexly set in plate 112 on the sidewall of substrate 111 lateral edges, be stiffener 113 be convexly set in plate 112 on the sidewall of stepped groove 110, the second insulating base 12 is provided with the open slot 123 being equipped with stiffener 113, and stiffener 113 cards insert in open slot 123.The setting of stiffener 113 can strengthen rigidity and the intensity of plate 112, thereby be beneficial to, prevents plate 112 bending distortion or fracture easily.The magnitude setting of stiffener 113 is identical with the magnitude setting of plate 112.
Particularly, as shown in Figure 1, Figure 4 and Figure 5, substrate 111 is " several " font, it comprises intermediate board body 1111 and the two L shaped flaps 1112 that arrange along 1111 liang of lateral bucklings of intermediate board body respectively, L shaped flap 1112 comprises vertical plate 11121 and plate 11122 anyhow, the two ends of vertical plate 11121 connect respectively intermediate board body 1111 and plate 11122 anyhow, and plate 112 is convexly set in anyhow on plate 11122.Intermediate board body 1111 is stepped plate, the thickness of slab that is intermediate board body 1111 is inconsistent, particularly, the thickness ratio near earphone jack 121 openends 1211 of intermediate board body 1111 is little near the thickness of slab of earphone jack 121 blind ends, thereby can make intermediate board body 1111 and vertical plate 11121 form above-mentioned stepped groove 110.
Particularly, as shown in Figure 1, Figure 2 and Figure 3, the 3rd insulating base 13 is a U-shaped tabular component, it comprises rear portion plate body 131 and the sidepiece plate body 132 arranging along the 131 two ends bendings of rear portion plate body respectively, the rear wall setting near earphone jack 121 blind ends of rear portion plate body 131 laminating the second assemblies 102, fit the respectively two side of the second assembly 102 of both sides plate body 132 arranges.Rear portion plate body 131 is resisted against on the rear wall of the first insulating base 11 and the second insulating base 12; Both sides plate body 132 is resisted against respectively on the sidewall of the first insulating base 11 and the second insulating base 12, and stiffener 113 can be compressed.The setting of rear portion plate body 131 and sidepiece plate body 132, can be fixed on the first insulating base 11 encapsulation on the second insulating base 12 on the one hand, can strengthen on the other hand the wall thickness intensity of earphone jack 121.
Further, as shown in Figure 1, Figure 2 and Figure 7, the end of sidepiece plate body 132 also bends towards the inner side of U-shaped tabular component and is provided with clamping boss 133, the second insulating bases 12 and is provided with the draw-in groove 128 being equipped with clamping boss 133, and clamping boss 133 is contained in draw-in groove 128.The setting of clamping boss 133 and draw-in groove 128, can improve the steadiness that the 3rd insulating base 13 coordinates with the second assembly 102; Meanwhile, the setting of draw-in groove 128, can be beneficial to the fast demoulding after the second insulating base 12 moulding, thereby is beneficial to the machine-shaping that guarantees the second insulating base 12.
The utility model embodiment also provides a kind of electronic equipment, and it comprises body, and body is provided with above-mentioned headset connector.This electronic equipment specifically can be the electronic product that mobile phone, MP3, MP4, computer etc. have audio-frequency function.It is owing to having adopted above-mentioned headset connector, therefore, effectively realizing under the prerequisite of electronic equipment audio-frequency function, also improved the dust and water protection performance of electronic equipment, stability and the useful life of electronic equipment internal components and parts have been guaranteed, thereby guaranteed the combination property of electronic equipment, improved the market competitiveness of electronic equipment.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace or improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a headset connector, comprise insulated receptacle and be embedded at the conducting terminal in described insulated receptacle, described insulated receptacle is provided with the earphone jack of inserting for headset plug, described conducting terminal comprises the main part being embedded in described insulated receptacle, along described main part, extend the contact site being convexly set on described earphone jack inwall and extend along described main part the leg portion outside described insulated receptacle that is convexly set in, it is characterized in that: described insulated receptacle comprises the first insulating base, the second insulating base and the 3rd insulating base, described earphone jack is located on described the second insulating base, described conducting terminal employing insert injection moulding mode takes shape on described the first insulating base and with described the first insulating base and forms the first assembly, described the first assembly card is inserted to be installed on described the second insulating base and with described the second insulating base and is formed the second assembly, described the 3rd insulating base is injected and molded on described the second assembly and described the first component package is fixed on described the second insulating base.
2. headset connector as claimed in claim 1, it is characterized in that: described the first insulating base comprises substrate and is convexly set in the plate on described substrate, the described main part of described conducting terminal is embedded in described plate, described contact site and described leg portion extend respectively the both sides of described substrate, described the second insulating base is provided with the installing hole being communicated with described earphone jack, and described plate and described contact site card insert in described installing hole.
3. headset connector as claimed in claim 2, it is characterized in that: described the first insulating base also comprises stiffener, described stiffener be convexly set in described plate on the sidewall at described substrate-side edge, described the second insulating base is provided with the open slot being equipped with described stiffener, and described reinforcement board inserts in described open slot.
4. headset connector as claimed in claim 2 or claim 3, it is characterized in that: described substrate comprises intermediate board body and the two L shaped flaps that arrange along described intermediate board body two lateral bucklings respectively, described L shaped flap comprises vertical plate and plate anyhow, the two ends of described vertical plate connect respectively described intermediate board body and described plate anyhow, described in described plate is convexly set in anyhow on plate.
5. the headset connector as described in claims 1 to 3 any one, is characterized in that: described earphone jack is the blind hole of being located on described the second insulating base, and it has openend and blind end, and the aperture of described openend is greater than the aperture of described blind end.
6. headset connector as claimed in claim 5, it is characterized in that: the stepped setting of bottom profile of described the second insulating base, the bottom profile of described the second insulating base comprises that, near the first ladder bottom surface of described openend setting and the second ladder bottom surface of close described blind end, described the first ladder bottom surface is greater than described the second ladder bottom surface to the distance at described earphone jack center to the distance at described earphone jack center.
7. headset connector as claimed in claim 6, it is characterized in that: described the first assembly card is inserted the bottom that is installed on the second insulating base, described the first insulating base is provided with the stepped groove with the bottom profile adaptation of described the second insulating base, and the bottom profile card inserting of this stepped groove and described the second insulating base is closed.
8. headset connector as claimed in claim 5, it is characterized in that: described the 3rd insulating base is a U-shaped tabular component, it comprises rear portion plate body and the sidepiece plate body arranging along the bending of plate body two ends, described rear portion respectively, described back panel is shown consideration for the rear wall setting near described earphone jack blind end of closing described the second assembly, and described in two, fit the respectively two side of described the second assembly of sidepiece plate body arranges.
9. headset connector as claimed in claim 8, it is characterized in that: the end of described sidepiece plate body also bends and is provided with clamping boss towards the inner side of described U-shaped tabular component, described the second insulating base is provided with the draw-in groove being equipped with described clamping boss, and described clamping boss is contained in described draw-in groove.
10. an electronic equipment, comprises body, it is characterized in that: described body is provided with the headset connector described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420074454.9U CN203826637U (en) | 2014-02-20 | 2014-02-20 | Earphone connector and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420074454.9U CN203826637U (en) | 2014-02-20 | 2014-02-20 | Earphone connector and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203826637U true CN203826637U (en) | 2014-09-10 |
Family
ID=51482104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420074454.9U Expired - Fee Related CN203826637U (en) | 2014-02-20 | 2014-02-20 | Earphone connector and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203826637U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105958263A (en) * | 2016-06-15 | 2016-09-21 | 昆山捷皇电子精密科技有限公司 | Waterproof headset base and preparation technology thereof |
| CN106803625A (en) * | 2015-11-26 | 2017-06-06 | 深圳君泽电子有限公司 | Earphone connector, preparation method thereof and mobile terminal with earphone connector |
| CN107196111A (en) * | 2017-05-10 | 2017-09-22 | 深圳君泽电子有限公司 | Connector and manufacturing method thereof |
-
2014
- 2014-02-20 CN CN201420074454.9U patent/CN203826637U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106803625A (en) * | 2015-11-26 | 2017-06-06 | 深圳君泽电子有限公司 | Earphone connector, preparation method thereof and mobile terminal with earphone connector |
| CN106803625B (en) * | 2015-11-26 | 2019-04-12 | 深圳君泽电子有限公司 | Earphone connector, preparation method thereof and mobile terminal with earphone connector |
| CN105958263A (en) * | 2016-06-15 | 2016-09-21 | 昆山捷皇电子精密科技有限公司 | Waterproof headset base and preparation technology thereof |
| CN107196111A (en) * | 2017-05-10 | 2017-09-22 | 深圳君泽电子有限公司 | Connector and manufacturing method thereof |
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