CN203814040U - FPC tin filling grounding design structure - Google Patents
FPC tin filling grounding design structure Download PDFInfo
- Publication number
- CN203814040U CN203814040U CN201420169237.8U CN201420169237U CN203814040U CN 203814040 U CN203814040 U CN 203814040U CN 201420169237 U CN201420169237 U CN 201420169237U CN 203814040 U CN203814040 U CN 203814040U
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- China
- Prior art keywords
- fpc
- tin filling
- design structure
- grounding
- fpcs
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses an FPC tin filling grounding design structure. According to the prior art, an FPC is in bonding conduction with a steel sheet through a thermosetting conductive adhesive, as a result, problems of high cost and low efficiency may be brought about, while, with the FPC tin filling grounding design structure adopted, the above problems can be solved. The FPC tin filling grounding design structure includes an IC board and FPCs connected onto the IC board; the IC board and the FPCs are provided with grounding pads; paired through holes are drilled in the grounding pads and the FPCs; the IC board is provided with a steel sheet contacting with the grounding pads; and the FPCs, the grounding pads and the steel sheet are connected with one another through SMT tin filling. According to the FPC tin filling grounding design structure of the utility model, the FPC, the grounding pads and the steel sheet are connected with one another through SMT tin filling, and therefore, the problems of high cost and low efficiency brought about by a situation in which the FPCs are in bonding conduction with the steel sheet through the thermosetting conductive adhesive can be solved. The FPC tin filling grounding design structure has the advantages of low cost, simplified and shortened process, little of influence of personal operation factors, high stability, capability of performing rework on unqualified products, and the like.
Description
Technical field
The utility model relates to printing circuit board structure, and especially a kind of to have cost low, and operation can be simplified and shorten, and the impact of personnel's operation factors is low, good stability, the defective products FPC tin filling grounding design structure of feature such as can do over again.
Background technology
At present conventional FPC grounding design structure is to adopt heat curing-type conducting resinl the conducting that bonds of the ground wire of FPC and steel disc, in this, way is limited to the buying of heat curing-type conducting resinl, and this way cost is high, efficiency is low, conducting resinl will refrigerate and have quality guarantee period restriction, be unfavorable for large-scale production, and conducting resistance is unstable, yield is low, the defective products processing of can not doing over again.
Utility model content
Technical problem to be solved in the utility model is: provide that a kind of to have cost low, operation can be simplified and shorten, and the impact of personnel's operation factors is low, good stability, the defective products FPC tin filling grounding design structure of feature such as can do over again.
The utility model solves the technical scheme that its technical problem adopts: FPC tin filling grounding design structure, comprise IC plate and be connected to the FPC plate on this IC plate, at this IC plate and FPC plate, be provided with ground pad, on this ground pad and FPC plate, be drilled with the via of pairing; On IC plate, be provided with the steel disc contacting with ground pad, described FPC plate, ground pad and steel disc connect by SMT tin filling.
The beneficial effects of the utility model are: FPC tin filling grounding design structure of the present utility model, because FPC plate, ground pad and steel disc connect by SMT tin filling, solved employing heat curing-type conducting resinl the conducting that bonds of FPC plate and steel disc, high, the inefficient problem of cost, have cost low, operation can be simplified and shorten, and the impact of personnel's operation factors is low, good stability, the defective products feature such as can do over again.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is structural representation of the present utility model;
In figure, 1-IC plate, 2-FPC plate, 3-via, 4-steel disc.
Embodiment
Below in conjunction with accompanying drawing, the utility model will be further described, but protection range of the present utility model is not limited to the following stated.
As shown in Figure 1, FPC tin filling grounding design structure of the present utility model, comprises IC plate 1 and is connected to the FPC plate 2 on this IC plate 1, at this IC plate 1, is provided with ground pad with FPC plate 2, is drilled with the via 3 of pairing on this ground pad and FPC plate 2; On IC plate 1, be provided with the steel disc 4 contacting with ground pad, described FPC plate 2, ground pad and steel disc 4 connect by SMT tin filling.FPC tin filling grounding design structure of the present utility model, because FPC plate 2, ground pad and steel disc 4 connect by SMT tin filling, solved employing heat curing-type conducting resinl the conducting that bonds of FPC plate 2 and steel disc 4, high, the inefficient problem of cost, have cost low, operation can be simplified and shorten, and the impact of personnel's operation factors is low, good stability, the defective products feature such as can do over again.
Finally it should be noted that: above embodiment only, in order to the technical solution of the utility model to be described, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: the technical scheme that its in specification still can be recorded aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement, does not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (1)
1.FPC tin filling grounding design structure, it is characterized in that: comprise IC plate (1) and be connected to the FPC plate (2) on this IC plate (1), at this IC plate (1) and FPC plate (2), be provided with ground pad, on this ground pad and FPC plate (2), be drilled with the via (3) of pairing; On IC plate (1), be provided with the steel disc (4) contacting with ground pad, described FPC plate (2), ground pad and steel disc (4) connect by SMT tin filling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420169237.8U CN203814040U (en) | 2014-04-10 | 2014-04-10 | FPC tin filling grounding design structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420169237.8U CN203814040U (en) | 2014-04-10 | 2014-04-10 | FPC tin filling grounding design structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203814040U true CN203814040U (en) | 2014-09-03 |
Family
ID=51452727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420169237.8U Expired - Fee Related CN203814040U (en) | 2014-04-10 | 2014-04-10 | FPC tin filling grounding design structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203814040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135080A (en) * | 2018-01-13 | 2018-06-08 | 蚌埠华特科技有限公司 | A kind of steel disc tin filling ground connection technique |
-
2014
- 2014-04-10 CN CN201420169237.8U patent/CN203814040U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108135080A (en) * | 2018-01-13 | 2018-06-08 | 蚌埠华特科技有限公司 | A kind of steel disc tin filling ground connection technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140903 Termination date: 20150410 |
|
| EXPY | Termination of patent right or utility model |