CN108135080A - A kind of steel disc tin filling ground connection technique - Google Patents
A kind of steel disc tin filling ground connection technique Download PDFInfo
- Publication number
- CN108135080A CN108135080A CN201810032771.7A CN201810032771A CN108135080A CN 108135080 A CN108135080 A CN 108135080A CN 201810032771 A CN201810032771 A CN 201810032771A CN 108135080 A CN108135080 A CN 108135080A
- Authority
- CN
- China
- Prior art keywords
- steel disc
- circuit board
- tin
- electronic component
- steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of steel disc tin filling ground connection technique, including steel disc, flexible PCB and the electronic component being arranged on the circuit board；The electronic component is located at the front of the circuit board, and the steel disc is located at the back side of the circuit board；The electronic component offers through-hole, and one end of the through-hole is communicated with electronic component on the position of the circuit board, and the other end is communicated with the steel disc；After tin is circulated into the through-hole, the electronic component is connected with the steel disc, the electronic component and steel disc secure bond, form tin layers, steel disc is combined closely by tin layers and the circuit board between the circuit board and the steel disc at this time after tin is cured on steel disc；The structure of FPC tin layers steel discs can be obtained by above-mentioned technique, the impedance ground of FPC steel discs can be greatly reduced, while electrostatic and overall performance are significantly increased, secondly conducting resinl adhesion technique can be saved, so as to reduce cost.
Description
Technical field
The present invention relates to a kind of steel disc tin filling ground connection techniques.
Background technology
At present, at present, in board design manufacturing field, the mode of steel disc ground connection is more and more, has and is led using pressure-sensitive
Electric glue+steel disc earthing mode with hot pressing conducting resinl+steel disc earthing mode, is embodied these traditional handicrafts, adopts in production
With pressure-sensitive conducting resinl+steel disc earthing mode, steel disc ground connection tends not to reach resistance value requirement, reaches 10 ohm hereinafter, easily holding
It easily causes and is detached with FPC, using hot pressing conducting resinl+steel disc earthing mode, because thermal setting conductive glue service life limits, is also easy to produce
Steel disc presses the situations such as unreal with FPC, and it is higher to manufacture cost.
Notification number be CN205912326U patent document this is further studied, and disclose " steel disc 10 and
Acrylic acid glue-line 12, insulating film layer 13 and layers of copper 14, and acrylic acid glue-line 12, insulation are sequentially laminated between IC11 from the bottom to top
The scolding tin hole 15 being adapted with via hole 111 is offered in film layer 13 and layers of copper 14；Tin in via hole 111 passes through scolding tin hole
15 flow on steel disc 10.Acrylate glue is two-component acrylate structural adhesive, and intensity is high, good toughness, and positioning time is at 3-5 points
Clock can quickly position steel disc and IC, and copper plays the role of conducting.Acrylic acid glue-line, insulating film layer and layers of copper three
Thickness is identical.”
" flexible PCB has been recorded in i.e. above-mentioned document（FPC）The structure of conducting resinl-steel disc ", however conductive glue bond is loosely
Gu conductive adhesive performance is bad will lead to itself and flexible PCB loose contact, the circuit so as to be formed with mainboard exist compared with
Big impedance.
Invention content
To overcome drawbacks described above, the invention discloses a kind of steel disc tin filling ground connection technique, including steel disc, flexible PCB and
The electronic component being arranged on the circuit board, the circuit board are provided with ESD-GND；
It is characterized in that,
The electronic component is located at the front of the circuit board, and the steel disc is located at the back side of the circuit board；The electronics
Component offers through-hole, and one end of the through-hole is communicated with electronic component on the position of the circuit board, another
One end is communicated with the steel disc；After tin is circulated into the through-hole, the electronic component is connected with the steel disc, by tin in steel
The electronic component and steel disc secure bond, form tin between the circuit board and the steel disc at this time after on piece curing
Layer, steel disc are combined closely by tin layers and the circuit board.
Further a diameter of 0.5-2 ㎜ of the through-hole.
Further the steel disc does not have trepanning.
A kind of steel disc tin filling ground connection technique of the present invention has following advantageous effect：
The structure of FPC- tin layers-steel disc can be obtained by above-mentioned technique, the impedance ground of FPC steel discs can be greatly reduced, together
When electrostatic and overall performance are significantly increased, secondly can save conducting resinl adhesion technique, so as to reduce cost.
Description of the drawings
Fig. 1 is existing circuit board steel disc tin filling structure diagram.
Fig. 2 is the circuit board steel disc tin filling structure diagram of the present invention.
Reference numeral in figure, 1 electronic component, 2 flexible PCBs（FPC）, 3 tin layers, 4 steel discs, 5 tin creams；10 steel
Piece；11IC；12 acrylic acid glue-lines；13 insulating film layers；14 layers of copper；15 scolding tin holes；111 via holes.
Specific embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to embodiment and attached drawing
Product of the present invention is described in further detail.
As shown in the figure, the invention discloses a kind of steel disc tin filling ground connection technique, including steel disc 4, flexible PCB 2 and setting
Electronic component 1 on the circuit board, the circuit board are provided with ESD-GND, ESD, that is, Electro-Static
discharge；
The electronic component is located at the front of the circuit board, and the steel disc is located at the back side of the circuit board；In electronics member
Device installation position on circuit boards carries out trepanning, and one end of through-hole is communicated with electronic component, the other end and
The steel disc communicates；After tin cream is circulated into the through-hole, then by the pressing of both the electronic component and the steel disc, pressing
The electronic component is connected with the steel disc afterwards, the electronic component and steel disc fixed knot after tin is cured on steel disc
It closing, forms tin layers between the circuit board and the steel disc at this time, steel disc is combined closely by tin layers and the circuit board, from
And the structure of FPC- tin layers-steel disc can be obtained.
Further a diameter of 0.5-2 ㎜ of the through-hole.
Further the steel disc does not have trepanning.
The impedance contrast of the steel disc tin filling structure that the steel disc tin filling technique of the present invention obtains and existing steel disc tin filling structure
Such as following table：
| Sample test | 1 | 2 | 3 | 4 | 5 |
| The impedance ground of the existing steel disc tin filling with conducting resinl | 2.5Ω | 1.5Ω | 1.8Ω | 1.7Ω | 3.4Ω |
| The impedance ground of the steel disc tin filling of the present invention | 0.3Ω | 0.2Ω | 0.3Ω | 0.3Ω | 0.4Ω |
By above table it is found that the impedance ground of steel disc tin filling structure that the steel disc tin filling technique of the present invention obtains is much smaller than now
Some steel disc tin filling structures, and impedance fluctuations are small, it is relatively stable.
A kind of steel disc tin filling ground connection technique of the present invention has following advantageous effect：
The structure of FPC- tin layers-steel disc can be obtained by above-mentioned technique, the impedance ground of FPC steel discs can be greatly reduced, together
When electrostatic and overall performance are significantly increased, secondly can save conducting resinl adhesion technique, so as to reduce cost.
The foregoing is only a preferred embodiment of the present invention, not makees limitation in any form to the present invention；It is all
The those of ordinary skill of the industry can be shown in by specification attached drawing and described above and swimmingly implement the present invention；It is but all
Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents
The equivalent variations of a little variation, modification and evolution made are the equivalent embodiment of the present invention；Meanwhile it is all according to the present invention
The variation, modification and evolution of any equivalent variations made to above example of substantial technological etc., still fall within the present invention's
Within the protection domain of technical solution.
Claims (3)
1. a kind of steel disc tin filling ground connection technique, including the steel disc, flexible PCB and the electronics being arranged on the circuit board
Component, the circuit board are provided with ESD-GND；
It is characterized in that,
The electronic component is located at the front of the circuit board, and the steel disc is located at the back side of the circuit board；The electronics
Component offers through-hole, and one end of the through-hole is communicated with electronic component on the position of the circuit board, another
One end is communicated with the steel disc；After tin is circulated into the through-hole, the electronic component is connected with the steel disc, by tin in steel
The electronic component and steel disc secure bond, form tin between the circuit board and the steel disc at this time after on piece curing
Layer, steel disc are combined closely by tin layers and the circuit board.
2. a kind of steel disc tin filling ground connection technique according to claim 1, it is characterised in that：A diameter of 0.5- of the through-hole
2㎜。
3. a kind of steel disc tin filling ground connection technique according to claim 2, it is characterised in that：The steel disc does not have trepanning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810032771.7A CN108135080A (en) | 2018-01-13 | 2018-01-13 | A kind of steel disc tin filling ground connection technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810032771.7A CN108135080A (en) | 2018-01-13 | 2018-01-13 | A kind of steel disc tin filling ground connection technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108135080A true CN108135080A (en) | 2018-06-08 |
Family
ID=62400575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810032771.7A Pending CN108135080A (en) | 2018-01-13 | 2018-01-13 | A kind of steel disc tin filling ground connection technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108135080A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702830A (en) * | 2019-10-22 | 2021-04-23 | 鹏鼎控股(深圳)股份有限公司 | Anti-pulling circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203814040U (en) * | 2014-04-10 | 2014-09-03 | 厦门源乾电子科技有限公司 | FPC tin filling grounding design structure |
| CN204335134U (en) * | 2014-07-09 | 2015-05-13 | 昆山圆裕电子科技有限公司 | For the printed circuit board (PCB) of mobile device |
| CN206024240U (en) * | 2016-08-31 | 2017-03-15 | 大连吉星电子股份有限公司 | A kind of flexible circuit panel element and ground connection steel disc attachment means |
-
2018
- 2018-01-13 CN CN201810032771.7A patent/CN108135080A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203814040U (en) * | 2014-04-10 | 2014-09-03 | 厦门源乾电子科技有限公司 | FPC tin filling grounding design structure |
| CN204335134U (en) * | 2014-07-09 | 2015-05-13 | 昆山圆裕电子科技有限公司 | For the printed circuit board (PCB) of mobile device |
| CN206024240U (en) * | 2016-08-31 | 2017-03-15 | 大连吉星电子股份有限公司 | A kind of flexible circuit panel element and ground connection steel disc attachment means |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112702830A (en) * | 2019-10-22 | 2021-04-23 | 鹏鼎控股(深圳)股份有限公司 | Anti-pulling circuit board and manufacturing method thereof |
| CN112702830B (en) * | 2019-10-22 | 2022-04-15 | 鹏鼎控股(深圳)股份有限公司 | Anti-pulling circuit board and manufacturing method thereof |
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Legal Events
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180608 |
|
| WD01 | Invention patent application deemed withdrawn after publication |