CN203811280U - Temperature control structure of uncooled substrate-free optical readout infrared FPA detector - Google Patents
Temperature control structure of uncooled substrate-free optical readout infrared FPA detector Download PDFInfo
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- CN203811280U CN203811280U CN201420216132.3U CN201420216132U CN203811280U CN 203811280 U CN203811280 U CN 203811280U CN 201420216132 U CN201420216132 U CN 201420216132U CN 203811280 U CN203811280 U CN 203811280U
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- array
- support frame
- temperature control
- temperature
- infrared
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Abstract
The utility model discloses a temperature control structure of an uncooled substrate-free optical readout infrared FPA detector. The structure comprises an infrared focal plane array, an array braced frame used to support the infrared focal plane array, and a peripheral braced frame used to support the array braced frame. The infrared focal plane array is provided with a plurality of chip pixel structure. The array braced frame is provided with a frame resistor, and the peripheral braced frame is provided with a thermosensitivity resistor. The structure is also provided with a temperature control circuit module and a constant voltage source. Two ends of the thermosensitivity resistor are electrically connected with the temperature control circuit module. The frame resistor and the temperature control circuit module are connected with the constant voltage source in series. The temperature control structure of an uncooled substrate-free optical readout infrared FPA detector ensures constant of temperature, prevents thermal crosstalk among each pixel structure, and improves image resolution of the detector. The structure uses a simple technological structure to realize accurate constant temperature control, and has very good application value.
Description
Technical field
The utility model belongs to micro processing field, relates to specifically a kind of non-refrigeration and read without substrate light the structure of controlling temperature of infrared FPA detector.
Background technology
Non-refrigeration is read infrared focal plane array (FPA) detector without substrate light and, because having the advantages such as infrared absorption efficiency is high, thermal conductance is low, manufacture craft is simple, cost is low, is all had broad application prospects in civilian every field.And the thermal capacitance of support frame of reading infrared focal plane array without the light of substrate is less, and the original state of the pixel of detector environment temperature of living in it has direct relation, therefore, state how to realize pixel is not subject to the impact of extraneous environment temperature, is the important references that determines that can this device normally work.The mode of generally taking is at present to utilize TEC refrigerating ring structure to ensure that detector is operated under a constant environment temperature, the method is to utilize the heat exchange pattern of edge temperature control to realize, its temperature control effect is undesirable, thereby cause this array structure inside and outside still have certain temperature gradient to distribute, and change with the power of ambient temperature height and radiation.
Summary of the invention
In order to overcome above-mentioned defect, the structure of controlling temperature that the utility model provides a kind of non-refrigeration to read infrared FPA detector without substrate light, can utilize simple process structure to realize accurate thermostatic control, has good using value.
The utility model for the technical scheme that solves its technical matters and adopt is: a kind of non-refrigeration is read the structure of controlling temperature of infrared FPA detector without substrate light, comprise infrared focal plane array, peripheral and for supporting the peripheral support frame of this array support frame for supporting the array support frame of this infrared focal plane array and being positioned at this array support frame, described infrared focal plane array is provided with several chip pixel structures, on described array support frame, be formed with framework resistance, on described peripheral support frame, be formed with thermo-sensitive resistor, separately be provided with temperature-control circuit module and constant pressure source, described thermo-sensitive resistor two ends are electrically connected in described temperature-control circuit module, described framework resistance and temperature-control circuit module are serially connected with on described constant pressure source.
As further improvement of the utility model, described framework resistance forms by deposited metal on described array support frame.
As further improvement of the utility model, described thermo-sensitive resistor forms by deposit temperature sensing material on described peripheral support frame etching.
The beneficial effects of the utility model are: this non-refrigeration is read the structure of controlling temperature of infrared FPA detector without substrate light, realizing resistance by depositing metal on the array support frame at detector array architecture makes, it is deposit temperature sensing material realize the making of thermo-sensitive resistor on peripheral support frame in chip edge region, then utilize circuit module to realize the constant temperature of the framework of device, thereby ensure that it does not change with the variation of ambient temperature and radiation power, and avoid the heat between each pixel structure to crosstalk, improve the image resolution ratio of detector, in a word, utilize simple process structure to realize accurate thermostatic control, there is good using value.
Brief description of the drawings
Fig. 1 is the utility model structural representation;
Fig. 2 the utility model cuts open cross-sectional view;
Fig. 3 is the single dot structure schematic diagram of infrared focal plane array described in the utility model and chip;
Fig. 4 is a kind of structural representation of constant pressure source connecting frame resistance described in the utility model embodiment;
Fig. 5 is the another kind of structural representation of constant pressure source connecting frame resistance described in the utility model embodiment.
By reference to the accompanying drawings, make the following instructions:
1---array support frame 2---peripheral support frame
3---chip pixel structure 4---temperature-control circuit module
5---constant pressure source 11---framework resistance
12---thermo-sensitive resistor
Embodiment
By reference to the accompanying drawings; the utility model is elaborated; but protection domain of the present utility model is not limited to following embodiment, the simple equivalence of in every case being done with the utility model claim and description changes and modifies, within all still belonging to the utility model patent covering scope.
As shown in Figure 1, 2, a kind of non-refrigeration is read the structure of controlling temperature of infrared FPA detector without substrate light, comprise infrared focal plane array, peripheral and for supporting the peripheral support frame 2 of this array support frame for supporting the array support frame 1 of this infrared focal plane array and being positioned at this array support frame, infrared focal plane array is provided with several chip pixel structures 3, for clarity sake, only provide the structural representation of one single chip pixel structure 3 herein at center position, seen Fig. 3.
Array support frame 1 is made up of deielectric-coating and the metal illuvium of the infrared absorption layer of infrared focal plane array, and wherein, metal illuvium forms conductive resistance, i.e. framework resistance 11.In addition, at edge deposit one deck temperature sensing material of the array support frame 2 of infrared focal plane array and form thermo-sensitive resistor 21 by etching, separately establish temperature-control circuit module 4 and constant pressure source 5, thermo-sensitive resistor two ends are electrically connected in temperature-control circuit module, and framework resistance and temperature-control circuit module are serially connected with on constant pressure source.Determine that according to thermo-sensitive resistor 21 feedback signals power supply is applied to state on framework resistance 21, thus the temperature of implementation framework structure, and device is not subject to the variation of external environment or radiation and changes its original state, to ensure that it normally uses.
For ensureing the temperature homogeneity of infrared focal plane array chip, first to ensure the homogeneity of electric current, provide two kinds of syndetons below and realize the voltage applying mode of high uniformity.
As shown in Figure 4, adopt diagonal line output electrode, apply voltage as power connection points respectively by two diagonal line of framework resistance, to ensure that the resistance of current circuit is identical, thereby ensured the homogeneity of electric current.
As shown in Figure 5, adopt single direction to apply voltage, apply respectively voltage at horizontal or longitudinal two ends of framework resistance, thereby ensure that the resistance of current circuit is identical, to realize the homogeneity of electric current, the temperature of other direction is to rely on heat conduction between directions X heating resistor to realize.
Claims (3)
1. a non-refrigeration is read the structure of controlling temperature of infrared FPA detector without substrate light, comprise infrared focal plane array, peripheral and for supporting the peripheral support frame (2) of this array support frame for supporting the array support frame (1) of this infrared focal plane array and being positioned at this array support frame, described infrared focal plane array is provided with several chip pixel structures (3), it is characterized in that: on described array support frame, be formed with framework resistance (11), on described peripheral support frame, be formed with thermo-sensitive resistor (21), separately be provided with temperature-control circuit module (4) and constant pressure source (5), described thermo-sensitive resistor two ends are electrically connected in described temperature-control circuit module, described framework resistance and temperature-control circuit module are serially connected with on described constant pressure source.
2. non-refrigeration according to claim 1 is read the structure of controlling temperature of infrared FPA detector without substrate light, it is characterized in that: described framework resistance forms by deposited metal on described array support frame.
3. non-refrigeration according to claim 1 is read the structure of controlling temperature of infrared FPA detector without substrate light, it is characterized in that: described thermo-sensitive resistor forms by deposit temperature sensing material on described peripheral support frame etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420216132.3U CN203811280U (en) | 2014-04-29 | 2014-04-29 | Temperature control structure of uncooled substrate-free optical readout infrared FPA detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420216132.3U CN203811280U (en) | 2014-04-29 | 2014-04-29 | Temperature control structure of uncooled substrate-free optical readout infrared FPA detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203811280U true CN203811280U (en) | 2014-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420216132.3U Withdrawn - After Issue CN203811280U (en) | 2014-04-29 | 2014-04-29 | Temperature control structure of uncooled substrate-free optical readout infrared FPA detector |
Country Status (1)
| Country | Link |
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| CN (1) | CN203811280U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103913241A (en) * | 2014-04-29 | 2014-07-09 | 昆山光微电子有限公司 | Non refrigeration non base optical readout infrared FPA detector temperature control structure and method |
| CN110073185A (en) * | 2016-10-21 | 2019-07-30 | 瑞柏丽恩光子股份有限公司 | Mobile gas and chemicals image camera |
| CN113670452A (en) * | 2021-08-18 | 2021-11-19 | 深圳市汇顶科技股份有限公司 | Non-contact temperature measuring device, temperature measuring module therein and electronic equipment |
-
2014
- 2014-04-29 CN CN201420216132.3U patent/CN203811280U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103913241A (en) * | 2014-04-29 | 2014-07-09 | 昆山光微电子有限公司 | Non refrigeration non base optical readout infrared FPA detector temperature control structure and method |
| CN103913241B (en) * | 2014-04-29 | 2016-08-31 | 昆山光微电子有限公司 | Non-brake method reads structure of controlling temperature and the method for Infrared FPA detector without substrate light |
| CN110073185A (en) * | 2016-10-21 | 2019-07-30 | 瑞柏丽恩光子股份有限公司 | Mobile gas and chemicals image camera |
| US11044423B2 (en) | 2016-10-21 | 2021-06-22 | Rebellion Photonics, Inc. | Mobile gas and chemical imaging camera |
| CN110073185B (en) * | 2016-10-21 | 2022-02-18 | 瑞柏丽恩光子股份有限公司 | Mobile gas and chemical imaging camera |
| CN113670452A (en) * | 2021-08-18 | 2021-11-19 | 深圳市汇顶科技股份有限公司 | Non-contact temperature measuring device, temperature measuring module therein and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140903 Effective date of abandoning: 20160831 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |