CN203810134U - LED unit and lighting appliance - Google Patents
LED unit and lighting appliance Download PDFInfo
- Publication number
- CN203810134U CN203810134U CN201420184507.2U CN201420184507U CN203810134U CN 203810134 U CN203810134 U CN 203810134U CN 201420184507 U CN201420184507 U CN 201420184507U CN 203810134 U CN203810134 U CN 203810134U
- Authority
- CN
- China
- Prior art keywords
- protuberance
- base plate
- installation base
- led
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009413 insulation Methods 0.000 claims abstract description 68
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000010292 electrical insulation Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 78
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 67
- 239000000758 substrate Substances 0.000 description 20
- 230000000994 depressogenic effect Effects 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 10
- 239000006071 cream Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses an LED unit which comprises a base and an insulation plate. The base is provided with a concave part and a protruding part. The concave part is formed on the front surface of the base. The protruding part protrudes from the center of the concave part. According to the insulation plate, materials with electrical insulation property are used for forming a plate shape, and a hole which allows the protruding part to penetrate through is formed in the insulation plate. The insulation plate is arranged in the concave part, so that the protruding part penetrates through the hole in an extending mode. The LED unit further comprises a mounting base plate which is provided with an LED arranged on the front surface of the mounting base plate. The mounting base plate is arranged on the insulation plate with the back surface of the mounting base plate facing the protruding part which penetrates through the hole in the extending mode and seals the whole hole. The utility model further discloses a lighting appliance with the LED unit.
Description
Technical field
The utility model relates to a kind of LED unit and a kind of ligthing paraphernalia.
Background technology
Traditionally, under known one, according to formula ligthing paraphernalia, wherein LED unit is attached to the lower surface (for example, referring to, Japanese Patent Application Publication document No.2012-182192) that is embedded in the framework in ceiling.
In Japanese Patent Application Publication document No.2012-182192, in disclosed LED unit, convex portion is installed in metal pedestal processed.The heat conductivity sheet material with electrical insulation capability is configured in convex portion.Optical transmitting set is arranged on described heat conductivity sheet material.LED chip is arranged on the front surface (realizing the surperficial opposed surface contacting with heat conductivity sheet material) of installation base plate with the portion of terminal that is used to LED chip power supply.
In this traditional LED unit, the whole rear surface of described installation base plate is towards described convex portion.Therefore, the appearance and size of described heat conductivity sheet material is made to such an extent that be greater than the size of described installation base plate to guarantee the electrical insulation capability between rear surface and the described convex portion of described installation base plate.This has caused LED unit size to become large problem.
Utility model content
Consider above-mentioned factor, the utility model aims to provide a kind of compact LED unit with high exothermicity and high electric insulation performance, and is equipped with the ligthing paraphernalia of this LED unit.
According to a kind of embodiment of the present utility model, a kind of LED unit is provided, comprising: pedestal, it comprises the recess that is formed on its front surface and the protuberance from the central projection of described recess; Insulation board, it is formed as plate shape by the material with electrical insulation capability and is equipped with the hole that allows described protuberance therefrom to pass, and described insulation board is configured in described recess, makes described protuberance extend through described hole; And installation base plate, it comprises the LED being arranged on its front surface; Wherein, described installation base plate with its rear surface facing to the state configuration of described protuberance that extends through described hole on described insulation board and seal whole hole.
Described protuberance can have side surface, and described side surface is oblique, wherein along with described side surface extends and outwards broadens to the basal surface of described recess from the front end facing to described installation base plate of described protuberance.
Can be arranged on described pedestal and described insulation board for limiting described insulation board with respect to the first location structure of described pedestal dislocation
Can be arranged on described pedestal and described insulation board for limiting described insulation board with respect to the first location structure of described pedestal dislocation
Be used to the lead-in wire of described LED power supply can be connected to described installation base plate, and can be arranged on described insulation board for the rib that keeps described lead-in wire.
The heat transfer layer with heat conductivity can be arranged between the rear surface and described protuberance of described installation base plate, and can be arranged between the side surface of described protuberance and the inner surface in described hole for the gap that discharges the material that forms described heat transfer layer.
A kind of ligthing paraphernalia can comprise previously described LED unit, as light source.
According to LED of the present utility model unit, pass the protuberance in the hole in insulation board facing to the rear surface of installation base plate.Therefore, the heat of LED can conduct to pedestal from protuberance.This makes it possible to strengthen exothermicity.In addition, the area surface that protuberance exposes from the hole of insulation board is facing to the rear surface of installation base plate.Therefore, the creeping discharge between current-carrying part and the protuberance of the front surface of installation base plate distance can be constructed to such an extent that be longer than the distance from the current-carrying part of the front surface of installation base plate to the end of installation base plate.Therefore the size that, does not need to increase installation base plate strengthens the electrical insulation capability between installation base plate and pedestal.Like this, can realize the compact LED unit that has high exothermicity and high electric insulation performance.
According to ligthing paraphernalia of the present utility model, can realize the ligthing paraphernalia that has been equipped with the compact LED unit that has high exothermicity and high electric insulation performance.
Brief description of the drawings
It is more clear that the description of the various embodiments that the purpose of this utility model and feature can provide below in conjunction with accompanying drawing becomes.
Fig. 1 is according to the decomposition diagram of the LED unit of an embodiment;
Fig. 2 A is the front view of LED unit, and Fig. 2 B is the side view of LED unit, and Fig. 2 C is the rearview of LED unit;
Fig. 3 is the outward appearance perspective view of LED unit;
Fig. 4 is the decomposition diagram of LED unit after a part is removed;
Fig. 5 A and 5B show that insulation board and installation base plate are configured in front view and the perspective view of the state on the pedestal of LED unit;
Fig. 6 is the cutaway view of LED unit;
Fig. 7 A and 7B are the backside perspective view of having shown the lens cover of LED unit;
Fig. 8 is the rear side outward appearance perspective view of lens cover;
Fig. 9 has shown that insulation board is configured in the perspective view of the state in the pedestal of LED unit;
Figure 10 is the local amplification view of LED unit;
Figure 11 is the key diagram of explaining the installment state of the ligthing paraphernalia that has used LED unit.
Detailed description of the invention
Below with reference to Fig. 1 to 11 description that forms a description part according to the embodiment of LED of the present utility model unit and ligthing paraphernalia.
Fig. 1 is according to the decomposition diagram of the LED unit 1 of present embodiment.Fig. 2 A to 2C is respectively front view, side view and the rearview of LED unit 1.Fig. 3 is the outward appearance perspective view of LED unit 1.Fig. 6 is the cutaway view of LED unit 1.In the following description, unless mention in addition specially, above-below direction (fore-and-aft direction) is defined as the above-below direction shown in Fig. 6, and left and right directions is defined as the left and right directions shown in Fig. 5 A.But the definition of these directions is only used to the convenience of describing, and be not intended to limit the installation direction of LED unit 1.
The LED unit 1 of present embodiment comprises pedestal 2, insulation board 3 and optical transmitting set 4.The LED unit 1 of present embodiment also comprises substrate holder 5, reflecting element 6, lens 7 and lens cover 8.
Optical transmitting set 4 comprises installation base plate 40, and it is made up of for example Metal Substrate printing distributing board.As being shown in Fig. 4 to 5B, installation base plate 40 is formed rectangular plate shape.On the surface of installation base plate 40, be provided with and comprise LED(light emitting diode) illuminating part 41 and 42 of chip (not shown), the connector 43 that is used to illuminating part 41 to power, and the connector 44 that is used to illuminating part 42 to power.The connector that is positioned at lead-in wire 46a one end is connecting connector 43 removably.The connector that is positioned at lead-in wire 46b one end is connecting connector 44 removably.The connector 45 that is connected to power circuit (not shown) is being connected to lead-in wire 46a and 46b.By connector 45 is connected to power circuit, can be from power circuit to illuminating part 41 and 42 power supplies.
Illuminating part 41 forms (referring to Fig. 4) by seal the multiple LED chip (not shown) that are arranged on installation base plate 40 with the 41a of sealing portion.Similarly, illuminating part 42 forms by seal the multiple LED chip (not shown) that are arranged on installation base plate 40 with the 42a of sealing portion.The LED chip of illuminating part 41 and 42 is for example blue led chip.The LED chip of illuminating part 41 and 42 both can be connected in series, also can be connected in parallel.
The 41a of sealing portion and 42a are respectively by for example, mixing with light transmission encapsulant (silicones, epoxy resin, glass or like that) fluorescent material that sends the light of regulation colour temperature in the time that the blue light being sent by blue led chip encourages form.In the 41a of sealing portion and 42a, use different fluorescent materials to make illuminating part 41 and 42 can send the light of different-colour.In the present embodiment, the colour temperature of the light sending from illuminating part 41 is set to about 6000K, and this represents coloured light in daytime.The colour temperature of the light sending from illuminating part 42 is set to about 2600K, and this represents bulb look.The electric energy that is fed to these two kinds of illuminating parts 41 and 42 is controlled separately respectively by power circuit.By changing independently of one another the light quantity of illuminating part 41 and 42, the color of light that can mixed luminescence portion 41 and 42 and obtain the white light of expecting colour temperature.
Although Metal Substrate printing distributing board is used as installation base plate 40, the utility model is not limited to this.Installation base plate 40 can be both organic insulation substrate, can be also inorganic insulation substrate.The example of organic insulation baseplate material comprises glass epoxy resin, polyimide resin, phenol resin and liquid crystal polymer.The example of inorganic insulation baseplate material comprises aluminium oxide, aluminium nitride and carborundum.
Pedestal 2 for example, is formed higher than the die casting of the metal (aluminium) of resin by heat conductivity.As be shown in Fig. 1,4,5A, 5B and 9, and pedestal 2 is formed disc, and its thickness is less than diameter.
Recess 21 with circle hole shape depression is formed in the upper surface of pedestal 2.In the form of a truncated cone and from the basal surface of recess 21 upwards the protuberance 22 of projection be formed on the central authorities of recess 21.The height of protuberance 22 on above-below direction is substantially equal to round the height of the upper surface of the annulus portion 23 of recess 21.The side surface 22a of protuberance 22 is oblique, makes along with side surface 22a extends and outwards broadens to the basal surface of recess 21 from the front end facing to installation base plate 40 of protuberance 22.Be arranged in the front end face periphery of protuberance 22 being parallel in the longitudinal direction of installation base plate 40 towards two outstanding projection 22b of opposite directions.The front end face of projection 22b is concordant with the front end face of protuberance 22.In addition, the substantially centre position of the groove 22c of basal surface that extends to recess 21 from the front end face of protuberance 22 between two projection 22b is formed on the side surface 22a of protuberance 22.
Cylindrical projection 24a and 24b are arranged to the upwards projection of basal surface from recess 21.Projection 24a and 24b arrange in symmetrical mode with respect to protuberance 22.Screwed hole is formed in projection 24a and 24b, is screwed together in described screwed hole for the screw 91 of fixing base retainer 5.
In annulus portion 23, depression until the groove 23a of the basal surface vicinity of recess 21 be formed on the straight line that extends towards projection 24a from the central authorities of conical butt protuberance 22 region crossing with annulus portion 23.In the outer peripheral face of annulus portion 23, cave in to such an extent that more depressed part 23b is arranged in the region that forms groove 23a than other position.In marginal portion between upper surface and the outer peripheral face of annulus portion 23, depressed part 23c is formed on the straight line that extends towards projection 24b from the central authorities of protuberance 22 region crossing with annulus portion 23.
In annulus portion 2, semicircular in shape is formed on through the central authorities of protuberance 22 and the region crossing with projection 24a and the orthogonal straight line of 24b and annulus portion 23 from the depressed part 25 of outer peripheral face depression.The U-shaped recess hole 25a that extends to the basal surface of pedestal 2 from the basal surface of each depressed part 25 is formed on the bottom of each depressed part 25.Near the lug 25b circumferentially relatively both sides of recess hole 25a are radially outward projected into the outer peripheral face of lens cover 8 is formed on the outer peripheral face of annulus portion 23.Lug 25b is sized to make lug 25b not stretch out to exceed the outer peripheral face of lens cover 8.
In annulus portion 23, through-thickness (above-below direction) extends through four through holes, 26 edges of pedestal 2 circumferentially with regular spaces formation substantially.Four through holes 26 are formed and make the angle of intersection with about 45 degree around the interconnected line segment between symmetrical two through holes 26 of protuberance 22 and the interconnected line segment between projection 24a and 24b.Two through holes 26 that are arranged in projection 24a mono-side with respect to protuberance 22 are formed as line of rabbet joint shape and open in the outer peripheral face of annulus portion 23.On the rear surface of pedestal 2, depressed part 26a forms around corresponding through hole 26.
In annulus portion 23, the hole 27 that through-thickness (above-below direction) extends through annulus portion 23 is formed on the circumferentially both sides relatively of groove 23a.As being shown in Fig. 8, hole 27 being formed the hole with countersunk seat in the time that the rear side of pedestal 2 is seen.The head of the screw 92 from rear side patchhole 27 is placed in countersunk seat.
As being shown in Fig. 4,5A, 5B and 9, insulation board 3 is formed as disc by the resin material with electrical insulation capability.The external diameter of insulation board 3 is set to the diameter of the inner peripheral surface that is slightly less than recess 21.In insulation board 3, be formed with the circular hole 31 that allows protuberance 22 therefrom to pass, the wide groove 32 that projection 24a is therefrom extended past, and the U-shaped groove 33 that projection 24b is therefrom extended past.Groove 32 is formed in the position corresponding to groove 23a.Hole 31 is formed as being slightly larger than protuberance 22, to make between all marginal pores 31 that gap 12 is present in and the side surface 22a of protuberance 22 (referring to Fig. 5 A, 5B and 9).In the periphery in hole 31, be formed with groove 31a that the projection 22b for being highlighted portion 22 correspondingly inserts and for inserting the protuberance 31b of groove 22c of protuberance 22.
Embed under the state in recess 21 at insulation board 3, each projection 22b and corresponding groove 31a are locked to each other, and groove 22c and protuberance 31b be locked to each other, and have upwards determined by this position of insulation board 3 in the week of protuberance 22.Embed under the state in recess 21 at insulation board 3, the upper surface of protuberance 22 slightly upwards projection exceeds the upper surface of insulation board 3 and comes in contact with the rear surface that is placed in the installation base plate 40 on insulation board 3.
On the front surface of insulation board 3, projection 34 and 34a are around the region division that installation base plate 40 is installed.Projection 34 and 34a extend along the each side that is arranged on installation base plate 40 on insulation board 3, and with the EDGE CONTACT of installation base plate 40 so that location and installation substrate 40.The teat 34a that is present in that side (being groove 32 place one sides) that lead-in wire 46a that the installation base plate 40 from being placed in insulation board 3 draws and 46b stretch to has inclined-plane, the incline direction (downward direction) on described inclined-plane makes, along with it extends towards groove 32 from hole 31, become the basal surface that more approaches recess 21.Connecting the lead-in wire 46a of connector 43 and 44 of optical transmitting set 4 and 46b are directed to pedestal 2 groove 23a along the inclined-plane of teat 34a.Therefore, the covering of lead-in wire 46a and 46b is difficult to contact the edge of installation base plate 40 and thereby not easily damaged.
In the position of the skew of the neighboring towards the front surface of insulation board 3 from teat 34a, hook-type rib 35a and 35b are arranged on the two opposite sides of groove 32, and groove 32 is clipped between them.Rib 35a and 35b in the time that their side is seen, be formed L shaped.The front end of rib 35a and 35b is towards teat 34a projection.Rib 35a is configured to keep the covering of the lead-in wire 46a extending along the inclined-plane of teat 34a, and rib 35b is configured to keep the covering (referring to Fig. 5 A and 5B) of the lead-in wire 46b extending along the inclined-plane of teat 34a.
Substrate holder 5 is formed by synthetic resin moulded parts, and is stacked and placed on insulation board 3 to cover installation base plate 40(referring to Fig. 6).As being shown in Fig. 1, substrate holder 5 comprises disc antetheca 51 and the periphery outstanding sidewall 52 downwards from antetheca 51.Opening 53 is formed in antetheca 51, illuminating part 41 and 42 and connector 43 and 44 expose by opening 53.Be respectively formed at the region corresponding to projection 24a and 24b of antetheca 51 for the jack 54 being passed by screw 91.Jack 54 is the holes with countersunk seat.Therefore, the head of screw 91 can be placed in jack 54, to make their not outside projections exceed antetheca 51.In antetheca 51, the hole 55 that extends through antetheca 51 is formed on the left and right sides of opening 53.
Reflecting element 6 is formed by synthetic resin moulded parts and is formed as in top view (while seeing from top) is annular.Reflecting element 6 is stacked and placed on (referring to Fig. 6) on substrate holder 5.Be formed on the central authorities of reflecting element 6 for the circular hole 61 that exposes illuminating part 41 and 42 through it.Around circular hole 61, be formed with inclined-plane, described inclined-plane downwards (towards the basal surface of recess 21) tilts and becomes the central authorities closer to circular hole 61.Inclined-plane forms reflecting surface, and the light laterally irradiating from illuminating part 41 and 42 is upwards reflected by this reflecting surface and incides lens 7.Be used for the brace 62 in the hole 55 of inserting substrate holder 5 from the downward projection in neighboring of reflecting element 6.Outwards outstanding pawl 63 is formed on the front end of brace 62.
Lens 7 for example, are made up of translucent material (silicones, acrylic resin, glass or like that).As being shown in Fig. 1, lens 7 comprise the flange 72 that is formed as the body 71 of arch and radially outward gives prominence to from the neighboring of body 71.Lens 7 are arranged on reflecting element 6 to control luminous intensity distribution.
Lens cover 8 is formed by synthetic resin moulded parts.As being shown in Fig. 1 to 2C, 7A and 7B, lens cover 8 comprises cylinder side wall 81 and the inside outstanding inward flange 82 radially from one end of sidewall 81.Lens cover 8 attachings in pedestal 2 with cover lens 7.The centre bore 83 that arch body 71 sees through inward flange 82 exposes.Be arranged on four some places on the rear surface of inward flange 82 for inserting the projection 84 of through hole 26 of pedestal 2.Be formed on the front end of projection 84 for being locked in pawl 84a on the Later Zhou Dynasty, one of the Five Dynasties edge of through hole 26.
Lens cover 8 is so shaped that the lower end of projection 84 is positioned at the top, lower end of sidewall 81.Therefore, when on the circumference that is formed on the pawl 84a of projection 84 front ends and is locked to through hole 26, the leading section stretching out through through hole 26 backward of projection 84 is placed in the depressed part 26a forming around through hole 26.Therefore, the not downward projection of the front end of projection 84 exceeds the lower surface of pedestal 2.
In lens cover 8, the recessed depressed part 85 of semicircular in shape is formed in the region corresponding to the depressed part 25 of pedestal 2.In the bottom of the inner surface of depressed part 85, crescent rib 88 is formed in the depressed part 25 that is overlapped in pedestal 2.In sidewall 81, downward unlimited groove 86 is formed in the region corresponding to the groove 23a of pedestal 2.Lead-in wire 46a and 46b are drawn by groove 86.Groove 86 be used as the going between fairlead of 46a and 46b.On the inner surface of sidewall 81, ribs 86a is formed along the vertical direction and extends.On the rear surface of inward flange 82, cylindrical projection 87 is arranged on the two opposite sides of groove 86.In projection 87, be formed with screwed hole 87a, be screwed on screwed hole 87a through the screw 92 in the hole 27 of pedestal 2 from rear side.
LED unit 1 can be assembled in the following manner.
First the recess 21(that, insulation board 3 is inserted pedestal 2 by the workman of execution assembly operation is referring to Fig. 9).Insert under the state in recess 21 at insulation board 3, the protuberance 22 of pedestal 2 extends through hole 31.And the upper surface of protuberance 22 sees through hole 31 and exposes.The projection 22b of protuberance 22 is engaged in corresponding recesses 31a.Protuberance 31b is engaged in the groove 22c of protuberance 22.Like this, insulation board 3 is located with respect to pedestal 2.The projection 24a of pedestal 2 upwards projection through the groove 32 of insulation board 3.Projection 24b upwards projection passes groove 33.
Workman is coated on seeing through on the front end face that exposes of hole 31 (in the hatched area in Fig. 9) of protuberance 22 by ormal weight such as cream 11.Then, installation base plate 40 is installed in (referring to Fig. 5 A and 5B) on insulation board 3.Be placed in the attachment positions that installation base plate 40 on insulation board 3 is located in regulation, the outward flange of installation base plate 40 and projection 34 and 34a are come in contact.By pressing installation base plate 40, the cream 11 being coated on the front end face of protuberance 22 expands on the whole front end face of protuberance 22.Therefore the heat transfer layer, being made up of cream 11 is formed between the front end face and installation base plate 40 of protuberance 22.If gap is present between protuberance 22 and installation base plate 40, the heat-conductive characteristic between them can variation.In the present embodiment, the heat transfer layer being made up of cream 11 is formed between protuberance 22 and installation base plate 40.This has strengthened the heat-conductive characteristic between protuberance 22 and installation base plate 40.Unnecessary cream 11 is discharged in the gap 12 producing between protuberance 22 and hole 31 (referring to Figure 10).
Next, workman is the connector 43 of connector attaching installation base plate 40 of lead-in wire 46a, and the connector of lead-in wire 46b is attached to the connector 44 of installation base plate 40.In addition, the lead-in wire 46a that is connecting connector 43 is captured by rib 35a, and the lead-in wire 46b that is connecting connector 44 is captured by rib 35b.Then, lead-in wire 46a and 46b draw through groove 23a.
Then, workman is installed to substrate holder 5 on insulation board 3.Screw 91 through through hole 54 is screwed in the screwed hole of projection 24a and 24b, and substrate holder 5 is fixed in pedestal 2 by this.If substrate holder 5 is fixed in pedestal 2 by screw 91, insulation board 3 and installation base plate 40 are maintained between substrate holder 5 and pedestal 2.Be fixed at substrate holder 5 under the state of pedestal 2, illuminating part 41 and 42 and connector 43 and 44 opening 53 that sees through substrate holder 5 be exposed to the external world.Connect the lead-in wire 46a of connector 43 and 44 and gap that 46b produces through the basal surface of recess 21 and the sidewall 52 of substrate holder 5 and be introduced into middle groove 23a.Therefore, lead-in wire 46a and 46b are secured in place.
Workman is installed to reflecting element 6 on substrate holder 5, and the brace of reflecting element 6 62 is inserted in respective aperture 55.The pawl 63 of brace 62 is locked into the Later Zhou Dynasty, one of the Five Dynasties edge in hole 55.Like this, reflecting element 6 attachings are in substrate holder 5.
Then, workman is covered lens 7 and lens cover 8 on reflecting element 6, and the projection of lens cover 8 84 is inserted in respective through hole 26.The pawl 84a of projection 84 is locked on the Later Zhou Dynasty, one of the Five Dynasties edge of respective through hole 26.Like this, lens cover 8 by attaching in pedestal 2.Be screwed to the respective screw hole 87a of projection 87 through the screw 92 in the hole 27 of pedestal 2 from rear side, lens cover 8 utilizations are positioned near the screw 92 of outlet of lead-in wire 46a and 46b and are firmly fixed at pedestal 2 by this.Be fixed at lens cover 8 under the state of pedestal 2, lens 7 are maintained between lens cover 8 and pedestal 2.The hole 83 that the arch body 71 of lens 7 sees through lens cover 8 exposes.When lens cover 8 attachings are during in pedestal 2, the sidewall 81 of lens cover 8 covers the whole outer peripheral face substantially of pedestal 2.Because pedestal 2 is made of metal, easily in its surface oxidisation.But because the whole outer peripheral face substantially of pedestal 2 is covered by lens cover 8, the lip-deep rust that is therefore positioned at pedestal 2 is invisible.Therefore, need on the surface of pedestal 2, not apply and prevent the paint that gets rusty.This contributes to cost-saving.Owing to not having paint film to be formed on the surface of pedestal 2, therefore in the time LED unit 1 being attached to the body of ligthing paraphernalia, pedestal 2 can reach with ligthing paraphernalia and directly contacts.This has strengthened the heat-conductive characteristic between pedestal 2 and ligthing paraphernalia body.Therefore the heat, producing in installation base plate 40 is conducted to the body of ligthing paraphernalia efficiently through pedestal 2.This contributes to strengthen exothermicity.
Complete by the way the assembly working of LED unit 1.Insert the body that screw (not shown) in the recess hole 25a of pedestal 2 is driven into for example ligthing paraphernalia through the depressed part 85 of lens cover 8, be grasped between the head of each screw and the body of ligthing paraphernalia at the lug 25b of the two opposite sides of each recess hole 25a by this.Like this, the pedestal 2 of LED unit 1 is fixed in the body of ligthing paraphernalia.In this state, the rib 88 being arranged on the inner surface of depressed part 85 is sandwiched between the head and pedestal 2 of screw.For this reason, even if the pawl 84a of lens cover 8 is removed by the through hole 26 from pedestal 2, lens cover 8 can not be removed.
Be connected to power circuit (not shown) if connecting the connector 45 of go between 46a and 46b, electric energy is supplied to LED unit 1 by going between 46a and 46b from power circuit.Illuminating part 41 and 42 receive from power circuit is fed to electric energy luminous.Light scioptics 7 are irradiated to outside.
As described previously, comprise according to the LED unit 1 of present embodiment: pedestal 2, it comprises the recess 21 that is formed on its front surface and the protuberance 22 from the central projection of recess 21; Insulation board 3, it is formed as plate shape by the material with electrical insulation capability and is equipped with the hole 31 that allows protuberance 22 therefrom to pass, and insulation board 3 is configured in recess 21, makes protuberance 22 extend through hole 31; With installation base plate 40, it comprises the illuminating part 41 and the 42(LED that are arranged on its front surface), wherein, in the rear surface of installation base plate 40, facing to extending through under the state of protuberance 22 in hole 31, installation base plate 40 is configured on insulation board 3 to seal whole hole 31.
As previously proposed, the rear surface of installation base plate 40 is facing to the protuberance 22 that extends through hole 31.Therefore, the heat producing in each LED can be conducted to protuberance 22, and this has strengthened exothermicity.The hole 31 that sees through insulation board 3 due to protuberance 22 expose and the recess 21 of pedestal 2 in region except protuberance 22 be insulated plate 3 and cover, therefore insulating properties are enhanced.The hole 31 of insulation board 3 is mounted substrate 40 and covers.Therefore, exceed with protuberance 22 situation that installation base plate 40 overhangs compared with, the creeping discharge distance between the current-carrying part of installation base plate 40 and the protuberance 22 of pedestal 2 is elongated.Therefore, the inner side that does not need to increase the size of installation base plate 40 or current-carrying part is arranged in to installation base plate 40, just can guarantee the creeping discharge distance between pedestal 2 and installation base plate 40 or increase insulating properties.Therefore, there is the exothermicity of enhancing and the LED unit 1 of high insulating property can be realized with small size.In the LED unit 1 of present embodiment, preferably, the protuberance 22 of pedestal 2 is brought to the rear surface part in the region that LED is housed on installation base plate 40 and contacts.In this case, the heat producing in LED can be conducted to pedestal 2 efficiently.
In the present embodiment, preferably, the side surface 22a of protuberance 22 is oblique, makes along with side surface 22a extends and outwards broadens to the basal surface of recess 21 from the front end facing to installation base plate 40 of protuberance 22.If side surface 22a is oblique to outwards broaden, compared with the situation of substantially extending straight up from the bottom of recess 21 with side surface 22a, more easily insulation board 3 is inserted in recess 21.In addition, if side surface 22a is oblique to outwards broaden, the heat of installation base plate 40 easily conducts by protuberance 22.This contributes to strengthen exothermicity.The angle of inclination of side surface 22a, side surface 22a, with respect to the angle of cut of the central axis of protuberance 22, is preferably set to be equal to or greater than 45 degree, to do not hinder heat conduction.In the present embodiment, if each LED is arranged in the border circular areas of installation base plate 40, protuberance 22 is preferably formed as protuberance 22 is extended from the downside of border circular areas that each LED is housed with the shape of frustum of a cone.
In the present embodiment, preferably, be arranged on pedestal 2 and insulation board 3 for limiting the first location structure (combination of the combination of projection 22b and groove 31a and groove 22c and protuberance 31b) that insulation board 3 misplaces with respect to pedestal 2.In the present embodiment, the projection 22b of pedestal 2 is bonded in the corresponding recesses 31a of insulation board 3.The protuberance 31b of insulation board 3 is bonded in the groove 22c of pedestal 2.So just having limited insulation board 3 misplaces with respect to pedestal 2.The first location structure can only comprise the combination of projection 22b and groove 31a or only comprise groove 22c and the combination of protuberance 31b.
In the present embodiment, protuberance 22 is formed frusto-conical.Like this, installation base plate 40 easily rotates around protuberance 22.But projection 22b is bonded in corresponding recesses 31a, wherein protuberance 31b is bonded in groove 22c.This almost can not rotate installation base plate 40.In the present embodiment, projection 22b is arranged in the rear side of connector 43 and 44.Therefore,, in the time that the connector of lead-in wire 46a and 46b is connected to connector 43 and 44, projection 22b can bear the load that puts on installation base plate 40.
In the present embodiment, preferably, be arranged on insulation board 3 for second location structure (projection 34 and 34a) of the attachment positions that determine installation base plate 40.Like this, just can determine the attachment positions of installation base plate 40 with respect to insulation board 3.This makes it possible to reduce the dislocation that is arranged on the LED on installation base plate 40.
In the present embodiment, preferably, being used to illuminating part 41 and 42(LED) the lead-in wire 46a of power supply is being connected installation base plate 40 with 46b, and further preferably, be arranged on insulation board 3 for rib 35a and the 35b of keep going between 46a and 46b.Therefore, lead-in wire 46a and 46b are drawn under the guiding of rib 35a and 35b.Because the position of lead-in wire 46a and 46b is determined as previously mentioned, therefore in assembling process, go between 46a and 46b are difficult to interfere with other parts.This contributes to improve the convenience of assembly working.
In the present embodiment, preferably, the heat transfer layer (one deck cream 11) with heat conductivity is distributed between the rear surface and protuberance 22 of installation base plate 40, and further preferably, be arranged between the side surface of protuberance 22 and the inner surface in hole 31 for the gap 12 that discharges the material (cream 11) that forms heat transfer layer.Gap between installation base plate 40 and protuberance 22 may hinder the heat conduction between installation base plate 40 and protuberance 22.But, by forming the heat transfer layer between installation base plate 40 and protuberance 22, can strengthen the heat-conductive characteristic between installation base plate 40 and protuberance 22.In addition, be distributed in too much on protuberance 22 even if form the material of heat transfer layer, the material of unnecessary amount can be discharged in the gap 12 between protuberance 22 and hole 31.Therefore, the material of Sq is retained on the upper surface of protuberance 22.Like this, can on the whole upper surface of protuberance 22, form heat transfer layer.This contributes to strengthen heat-conductive characteristic.
Figure 11 has shown a kind of ligthing paraphernalia, and it is equipped with the LED unit 1 of present embodiment as light source.Ligthing paraphernalia comprises the lamp body 101 being embedded in ceiling 200 and the supply unit 102 that is arranged on ceiling 200 rear sides.Lamp body 101 is formed tubular, has unlimited lower surface and the bottom surface of sealing.LED unit 1 attaching is in the basal surface of lamp body 101, and wherein lens 7 are directed downwards.The connector 104 that is connecting the cable 103 extending from supply unit 102 be connected the lead-in wire 46a of LED unit 1 and the connector 45 of 46b is connected.Electric energy is supplied to LED unit 1 from supply unit 102, thereby connects LED unit 1.
Because ligthing paraphernalia is equipped with above-described LED unit 1 as light source, therefore can provide the ligthing paraphernalia that comprises the compact LED unit 1 with high exothermicity and high electric insulation performance.
Although show and described the utility model for some embodiments, it will be understood by those skilled in the art that under the prerequisite of the utility model scope limiting in not departing from claims, can make a variety of changes and revise.
Claims (7)
1. a LED unit, comprising:
Pedestal, it comprises the recess that is formed on its front surface and the protuberance from the central projection of described recess;
Insulation board, it is formed as plate shape by the material with electrical insulation capability and is equipped with the hole that allows described protuberance therefrom to pass, and described insulation board is configured in described recess, makes described protuberance extend through described hole; With
Installation base plate, it comprises the LED being arranged on its front surface;
It is characterized in that, described installation base plate with its rear surface facing to the state configuration of described protuberance that extends through described hole on described insulation board and seal whole hole.
2. LED as claimed in claim 1 unit, it is characterized in that, described protuberance has side surface, and described side surface is oblique, wherein along with described side surface extends and outwards broadens to the basal surface of described recess from the front end facing to described installation base plate of described protuberance.
3. LED as claimed in claim 1 unit, is characterized in that, is arranged on described pedestal and described insulation board for limiting described insulation board with respect to the first location structure of described pedestal dislocation.
4. LED as claimed in claim 1 unit, is characterized in that, is arranged on described insulation board for the second location structure of the attachment positions that determine described installation base plate.
5. LED as claimed in claim 1 unit, is characterized in that, is used to the lead-in wire of described LED power supply connecting described installation base plate, and for keeping the rib of described lead-in wire to be arranged on described insulation board.
6. LED as claimed in claim 1 unit, it is characterized in that, the heat transfer layer with heat conductivity is arranged between the rear surface and described protuberance of described installation base plate, and is arranged between the side surface of described protuberance and the inner surface in described hole for the gap that discharges the material that forms described heat transfer layer.
7. a ligthing paraphernalia, is characterized in that, comprises the LED unit as described in any one in claim 1 to 6, as light source.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-086871 | 2013-04-17 | ||
| JP2013086871A JP6168449B2 (en) | 2013-04-17 | 2013-04-17 | LED unit and lighting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203810134U true CN203810134U (en) | 2014-09-03 |
Family
ID=51448879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420184507.2U Expired - Lifetime CN203810134U (en) | 2013-04-17 | 2014-04-16 | LED unit and lighting appliance |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6168449B2 (en) |
| CN (1) | CN203810134U (en) |
| DE (1) | DE102014005579A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328796A (en) * | 2015-06-29 | 2017-01-11 | 光宝光电(常州)有限公司 | Light-emitting diode packaging structure and wafer supporting seat |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6781553B2 (en) * | 2015-03-25 | 2020-11-04 | エルジー イノテック カンパニー リミテッド | Holder and lighting device equipped with it |
| JP7527192B2 (en) | 2020-12-22 | 2024-08-02 | 三菱電機株式会社 | Light source unit and lighting fixture |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8979337B2 (en) * | 2010-05-11 | 2015-03-17 | Koninklijke Philips N.V. | Lighting module |
| JP5799217B2 (en) * | 2011-02-28 | 2015-10-21 | パナソニックＩｐマネジメント株式会社 | LED unit and lighting apparatus using the same |
| JP5732612B2 (en) | 2011-02-28 | 2015-06-10 | パナソニックＩｐマネジメント株式会社 | LED unit and lighting apparatus using the same |
| JP2012208205A (en) * | 2011-03-29 | 2012-10-25 | Casio Comput Co Ltd | Semiconductor light source device and projector |
| JP5746930B2 (en) * | 2011-08-24 | 2015-07-08 | 株式会社小糸製作所 | Vehicle lighting |
| JP5879558B2 (en) * | 2011-09-22 | 2016-03-08 | パナソニックＩｐマネジメント株式会社 | Light emitting device |
-
2013
- 2013-04-17 JP JP2013086871A patent/JP6168449B2/en active Active
-
2014
- 2014-04-15 DE DE102014005579.5A patent/DE102014005579A1/en not_active Withdrawn
- 2014-04-16 CN CN201420184507.2U patent/CN203810134U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328796A (en) * | 2015-06-29 | 2017-01-11 | 光宝光电(常州)有限公司 | Light-emitting diode packaging structure and wafer supporting seat |
| CN106328796B (en) * | 2015-06-29 | 2018-09-14 | 光宝光电(常州)有限公司 | Light-emitting diode encapsulating structure and crystal chip bearing seat |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6168449B2 (en) | 2017-07-26 |
| DE102014005579A1 (en) | 2014-10-23 |
| JP2014211986A (en) | 2014-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140903 |