CN203801087U - Pad structure of ceramic heating sheet with temperature control - Google Patents
Pad structure of ceramic heating sheet with temperature control Download PDFInfo
- Publication number
- CN203801087U CN203801087U CN201420142834.1U CN201420142834U CN203801087U CN 203801087 U CN203801087 U CN 203801087U CN 201420142834 U CN201420142834 U CN 201420142834U CN 203801087 U CN203801087 U CN 203801087U
- Authority
- CN
- China
- Prior art keywords
- pad
- potsherd
- temperature control
- heating resistor
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Landscapes
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
The utility model discloses a pad structure of a ceramic heating sheet with temperature control. The pad structure is a plate-shaped structure composed of an upper ceramic sheet 1, a middle ceramic sheet 2, a lower ceramic sheet 3, heating resistors 4, temperature control resistors 5, heating leads 6, temperature control leads 7, a heating resistor pad 8 and a temperature control resistor pad 9, wherein the ceramic sheets are successively laminated, the multiple heating resistors 4 and the multiple temperature control resistors 5 are correspondingly placed in different planes, the heating resistor pad 8 and the temperature control resistor pad 9 are respectively placed in different planes at the same side of the ceramic heating sheet, and a region where the heating resistor pad 8 is positioned is staggered from a region where the temperature control resistor pad 9 is placed in a trapezoid manner. Thus, the pad density and the wiring density are greatly reduced, operations of printing and lead welding are easy, the yield rate is ensured, and the manufacture cost is reduced.
Description
Technical field
The utility model relates to a kind of pad structure of ceramic heating plate, and the particularly pad structure of the ceramic heating plate with temperature control, belongs to electric-heating technology field.
Background technology
Ceramic heating plate is that a new generation is high-effect, the heater members of environmental protection, is widely used in the various heating element products such as industrial or agricultural technology, communication, medical treatment, daily life, for thermal source being provided to heat generating components or directly using as heat generating components.The ceramic heating plate with temperature control on domestic and international market has three layers of ceramics water type or double-layer ceramic chip at present, pad is positioned at the wherein end of one deck potsherd, because the number of leads of the ceramic heating plate with temperature control is more, the pad structure adopting is at present on the surface of same layer potsherd end arranges pad, therefore the surface pads of potsherd end is intensive, particularly in the time that a ceramic heating plate has multistage heating resistor, number of pads is just more, pad density is larger, printing difficulty is high, cause rate of finished products to reduce, corresponding number of leads is also more simultaneously, and equal dense distribution is in same plane, cause wire bonds operating difficulties, high to workman's technical requirement, further affect rate of finished products, cause manufacturing cost high.
Utility model content
The purpose of this utility model is just to provide the pad structure that a kind of pad density is low, lead-in wire is arranged the low density ceramic heating plate with temperature control.
For achieving the above object, the technical solution adopted in the utility model is: a kind of pad structure of the ceramic heating plate with temperature control, and it is by upper potsherd, middle potsherd, lower potsherd, heating resistor, temperature resistance, heating lead-in wire, temperature control lead-in wire, heating resistor pad, the platy structure of temperature resistance pad composition, upper potsherd, middle potsherd, lower potsherd stacks gradually, and heating resistor has multiple, the corresponding temperature resistance that also has same quantity, and heating resistor is printed on lower potsherd surface, after lamination, with the surface laminating of middle potsherd, heating resistor pad is printed on lower potsherd surface, and temperature resistance is printed on middle potsherd surface, after lamination, fit with upper potsherd surface, temperature resistance pad is printed on middle potsherd surface, heating resistor pad and temperature resistance pad are positioned at the same side of the ceramic heating plate with temperature control, heating resistor pad region becomes stepped with temperature resistance pad region and staggers, heating lead-in wire is welded to connect with heating resistor pad and is electrically connected with heating resistor, and temperature control lead-in wire is welded to connect with temperature resistance pad and is electrically connected with temperature resistance.
Adopt such structure, because heating resistor is printed on lower potsherd surface, between lower potsherd and middle potsherd, corresponding heating resistor pad is positioned at lower potsherd surface, temperature resistance is printed on middle potsherd surface, between middle potsherd and upper potsherd, corresponding temperature resistance pad is arranged in potsherd surface, heating resistor pad region is positioned in different planes from temperature resistance pad region, and heating resistor pad region becomes stepped with temperature resistance pad region and staggers, so significantly reduce pad density, printing difficulty is low, improve rate of finished products, lead-in wire is also arranged in heating resistor pad simultaneously, the plane at temperature resistance pad place, lead-in wire arranges that density is low, wire bonds processing ease, low to workman's technical requirement, further ensure rate of finished products, reduce manufacturing cost.
Brief description of the drawings
Fig. 1 is the perspective cut away view of the first embodiment of the pad structure of a kind of ceramic heating plate with temperature control of the utility model.
Fig. 2 is that the master of Fig. 1 looks cutaway view.
Fig. 3 is the cutaway view of Fig. 2 along A-A line.
Fig. 4 is the cutaway view of Fig. 2 along B-B line.
Fig. 5 is the stereogram of the second embodiment of the pad structure of a kind of ceramic heating plate with temperature control of the utility model.
Fig. 6 is the stereogram of the third embodiment of the pad structure of a kind of ceramic heating plate with temperature control of the utility model.
In accompanying drawing:
Potsherd on 1; Potsherd in 2; 3 times potsherds;
4 heating resistors; 5 temperature resistances; 6 heating lead-in wires;
7 temperature control lead-in wires; 8 heating resistor pads; 9 temperature resistance pads.
Embodiment
Fig. 1 to Fig. 4 has provided the first embodiment of the pad structure of a kind of ceramic heating plate with temperature control of the utility model, the platy structure that it is made up of upper potsherd 1, middle potsherd 2, lower potsherd 3, heating resistor 4, temperature resistance 5, heating lead-in wire 6, temperature control lead-in wire 7, heating resistor pad 8, temperature resistance pad 9, present embodiment is plane tabular structure, upper potsherd 1, middle potsherd 2, lower potsherd 3 stack gradually, heating resistor 4 has three, and correspondence also has three temperature resistances 5.Heating resistor 4 is fitted with middle potsherd 2 surfaces after being printed on lower potsherd 3 surfaces, lamination, heating resistor pad 8 is printed on lower potsherd 3 surfaces, temperature resistance 5 is fitted with upper potsherd 1 surface after being printed on middle potsherd 2 surfaces, lamination, temperature resistance pad 9 is printed on middle potsherd 2 surfaces, heating resistor pad 8 and temperature resistance pad 9 are positioned at the same side of the ceramic heating plate with temperature control, and heating resistor pad 8 regions become stepped with temperature resistance pad 9 regions and stagger.Upper potsherd 1 be shorter in length than middle potsherd 2 and lower potsherd 3, but be covered with temperature resistance pad 9 regions, the corresponding temperature resistance pad of upper potsherd 19 places have breach, temperature control lead-in wire 7 pad welding therewith, and each temperature resistance pad 9 is electrically connected with corresponding temperature resistance 5.The length of middle potsherd 2 equals lower potsherd 3, is covered with heating resistor pad 8 regions, and the corresponding heating resistor pad of middle potsherd 28 places have breach, heating lead-in wire 6 pad welding therewith, and each heating resistor pad 8 is electrically connected with corresponding heating resistor 4.Like this, heating resistor pad 8 regions are positioned in different planes from temperature resistance pad 9 regions, and heating resistor pad 8 regions become stepped with temperature resistance pad 9 regions and stagger, significantly reduce pad density, printing difficulty is low, lead-in wire is arranged in the plane at heating resistor pad 8, temperature resistance pad 9 places simultaneously, lead-in wire arranges that density is low, wire bonds processing ease, low to workman's technical requirement, further ensure rate of finished products, reduced manufacturing cost.
Fig. 5 has provided the second embodiment of the pad structure of a kind of ceramic heating plate with temperature control of the utility model, it is by upper potsherd 1, middle potsherd 2, lower potsherd 3, heating resistor 4, temperature resistance 5, heating lead-in wire 6, temperature control lead-in wire 7, heating resistor pad 8, the platy structure that temperature resistance pad 9 forms, present embodiment is curved surface platy structure, upper potsherd 1, middle potsherd 2, lower potsherd 3 stacks gradually, heating resistor 4 has three, correspondence also has three temperature resistances 5, in Fig. 5, heating resistor 4 and temperature resistance 5 are covered by potsherd, therefore do not draw in the drawings heating resistor 4 and temperature resistance 5, its structure is similar to aforementioned the first embodiment.Heating resistor 4 is fitted with middle potsherd 2 surfaces after being printed on lower potsherd 3 surfaces, lamination, heating resistor pad 8 is printed on lower potsherd 3 surfaces, temperature resistance 5 is fitted with upper potsherd 1 surface after being printed on middle potsherd 2 surfaces, lamination, temperature resistance pad 9 is printed on middle potsherd 2 surfaces, heating resistor pad 8 and temperature resistance pad 9 are positioned at the same side of the ceramic heating plate with temperature control, and heating resistor pad 8 regions become stepped with temperature resistance pad 9 regions and stagger.Upper potsherd 1 be shorter in length than middle potsherd 2 and lower potsherd 3, but be covered with temperature resistance pad 9 regions, the corresponding temperature resistance pad of upper potsherd 19 places have breach, temperature control lead-in wire 7 pad welding therewith, and each temperature resistance pad 9 is electrically connected with corresponding temperature resistance 5.The length of middle potsherd 2 equals lower potsherd 3, is covered with heating resistor pad 8 regions, and the corresponding heating resistor pad of middle potsherd 28 places have breach, heating lead-in wire 6 pad welding therewith, and each heating resistor pad 8 is electrically connected with corresponding heating resistor 4.
Fig. 6 has provided the third embodiment of the pad structure of a kind of ceramic heating plate with temperature control of the utility model, it is by upper potsherd 1, middle potsherd 2, lower potsherd 3, heating resistor 4, temperature resistance 5, heating lead-in wire 6, temperature control lead-in wire 7, heating resistor pad 8, the platy structure that temperature resistance pad 9 forms, present embodiment is annular plate-like structure, upper potsherd 1, middle potsherd 2, lower potsherd 3 stacks gradually, heating resistor 4 has three, correspondence also has three temperature resistances 5, in Fig. 6, heating resistor 4 and temperature resistance 5 are covered by potsherd, therefore do not draw in the drawings heating resistor 4 and temperature resistance 5, its structure is similar to aforementioned the first embodiment.Heating resistor 4 is fitted with middle potsherd 2 surfaces after being printed on lower potsherd 3 surfaces, lamination, heating resistor pad 8 is printed on lower potsherd 3 surfaces, temperature resistance 5 is fitted with upper potsherd 1 surface after being printed on middle potsherd 2 surfaces, lamination, temperature resistance pad 9 is printed on middle potsherd 2 surfaces, heating resistor pad 8 and temperature resistance pad 9 are positioned at the same side of the ceramic heating plate with temperature control, and heating resistor pad 8 regions become stepped with temperature resistance pad 9 regions and stagger.Upper potsherd 1 be shorter in length than middle potsherd 2 and lower potsherd 3, but be covered with temperature resistance pad 9 regions, the corresponding temperature resistance pad of upper potsherd 19 places have breach, temperature control lead-in wire 7 pad welding therewith, and each temperature resistance pad 9 is electrically connected with corresponding temperature resistance 5.The length of middle potsherd 2 equals lower potsherd 3, is covered with heating resistor pad 8 regions, and the corresponding heating resistor pad of middle potsherd 28 places have breach, heating lead-in wire 6 pad welding therewith, and each heating resistor pad 8 is electrically connected with corresponding heating resistor 4.
Platy structure described in the pad structure of the ceramic heating plate of the utility model band temperature control; can be the tabular framework of plane tabular structure, curved surface, the annular plate-like structure in above-mentioned execution mode; also can be the platy structure of other shape; solid bar is a special case of annular plate-like structure, also belongs to protection range of the present utility model.
Above-mentioned each embodiment is all respectively to have three heating resistors 4; in fact in the specific implementation; heating resistor 4 can be two or more; for example 6,10,20 are even more; the corresponding temperature resistance 5 that also has same quantity, this conversion also belongs to protection range of the present utility model.
Claims (7)
1. the pad structure of the ceramic heating plate with temperature control, it is by upper potsherd (1), middle potsherd (2), lower potsherd (3), heating resistor (4), temperature resistance (5), heating lead-in wire (6), temperature control lead-in wire (7), heating resistor pad (8), the platy structure of temperature resistance pad (9) composition, upper potsherd (1), middle potsherd (2), lower potsherd (3) stacks gradually, it is characterized in that: described heating resistor (4) has multiple, correspondence also has multiple temperature resistances (5), heating resistor (4) is printed on lower potsherd (3) surface, after lamination, fit with middle potsherd (2) surface, heating resistor pad (8) is printed on lower potsherd (3) surface, temperature resistance (5) is printed on middle potsherd (2) surface, after lamination, fit with upper potsherd (1) surface, temperature resistance pad (9) is printed on middle potsherd (2) surface, heating resistor pad (8) and temperature resistance pad (9) are positioned at the same side of the ceramic heating plate with temperature control, heating resistor pad (8) region becomes stepped with temperature resistance pad (9) region and staggers, heating lead-in wire (6) is welded to connect with heating resistor pad (8) and is electrically connected with heating resistor (4), temperature control lead-in wire (7) is welded to connect with temperature resistance pad (9) and is connected with temperature resistance electricity (5).
2. the pad structure of a kind of ceramic heating plate with temperature control according to claim 1, is characterized in that: the plane tabular structure that the described ceramic heating plate with temperature control is made up of upper potsherd (1), middle potsherd (2), lower potsherd (3), heating resistor (4), temperature resistance (5), heating lead-in wire (6), temperature control lead-in wire (7), heating resistor pad (8), temperature resistance pad (9).
3. the pad structure of a kind of ceramic heating plate with temperature control according to claim 1, is characterized in that: the curved surface platy structure that the described ceramic heating plate with temperature control is made up of upper potsherd (1), middle potsherd (2), lower potsherd (3), heating resistor (4), temperature resistance (5), heating lead-in wire (6), temperature control lead-in wire (7), heating resistor pad (8), temperature resistance pad (9).
4. the pad structure of a kind of ceramic heating plate with temperature control according to claim 1, is characterized in that: the annular plate-like structure that the described ceramic heating plate with temperature control is made up of upper potsherd (1), middle potsherd (2), lower potsherd (3), heating resistor (4), temperature resistance (5), heating lead-in wire (6), temperature control lead-in wire (7), heating resistor pad (8), temperature resistance pad (9).
5. according to the pad structure of a kind of ceramic heating plate with temperature control described in arbitrary claim in claim 1 to 4, it is characterized in that: described upper potsherd (1) be shorter in length than middle potsherd (2) and lower potsherd (3), be covered with temperature resistance pad (9) region, the corresponding temperature resistance pad of upper potsherd (1) (9) locates to have breach, temperature control lead-in wire (7) pad welding therewith, each temperature resistance pad (9) is electrically connected with corresponding temperature resistance (5), the length of middle potsherd (2) equals lower potsherd (3), be covered with heating resistor pad (8) region, the corresponding heating resistor pad of middle potsherd (2) (8) locates to have breach, heating lead-in wire (6) pad welding therewith, each heating resistor pad (8) is electrically connected with corresponding heating resistor (4).
6. according to the pad structure of a kind of ceramic heating plate with temperature control described in arbitrary claim in claim 1 to 4, it is characterized in that: described heating resistor (4) quantity is 2 to 20.
7. according to the pad structure of a kind of ceramic heating plate with temperature control described in arbitrary claim in claim 1 to 4, it is characterized in that: described heating resistor (4) quantity is 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420142834.1U CN203801087U (en) | 2014-03-27 | 2014-03-27 | Pad structure of ceramic heating sheet with temperature control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420142834.1U CN203801087U (en) | 2014-03-27 | 2014-03-27 | Pad structure of ceramic heating sheet with temperature control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203801087U true CN203801087U (en) | 2014-08-27 |
Family
ID=51383270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420142834.1U Withdrawn - After Issue CN203801087U (en) | 2014-03-27 | 2014-03-27 | Pad structure of ceramic heating sheet with temperature control |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203801087U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874245A (en) * | 2014-03-27 | 2014-06-18 | 福建闽航电子有限公司 | Bonding pad structure of ceramic heating piece with temperature control |
-
2014
- 2014-03-27 CN CN201420142834.1U patent/CN203801087U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103874245A (en) * | 2014-03-27 | 2014-06-18 | 福建闽航电子有限公司 | Bonding pad structure of ceramic heating piece with temperature control |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG163536A1 (en) | Smart layered heater surfaces | |
| CN102083246B (en) | Far-infrared electric heating film | |
| ATE542393T1 (en) | LAYERED HEATING SYSTEM WITH HONEYCOMB CORE STRUCTURE | |
| CN105554925B (en) | A kind of mica high temperature resistant Electric radiant Heating Film and preparation method thereof | |
| CN201585154U (en) | Low-temperature radiant electric heating film | |
| CN203801087U (en) | Pad structure of ceramic heating sheet with temperature control | |
| CN202231884U (en) | Ceramic heating body for straightening hair | |
| CN103874245B (en) | The pad structure of the ceramic heating plate of a kind of band temperature control | |
| CN103874244B (en) | A kind of ceramic heating plate | |
| CN107277950B (en) | Electric heating film and preparation method thereof | |
| CN203801085U (en) | Ceramic heating sheet | |
| CN201238397Y (en) | Mica electric heating plate | |
| CN203801084U (en) | Ceramic heating sheet with temperature control | |
| CN204991341U (en) | High melting metal film inductance coils | |
| CN203661309U (en) | Thick film heating plate | |
| CN204377168U (en) | Safety environment protecting energy saving electric heating system | |
| CN201323663Y (en) | Ceramic heating sheet | |
| CN207560365U (en) | A kind of graphene euthermic chip structure | |
| CN203933985U (en) | A kind of modified model epoxy resin heater | |
| CN206992111U (en) | Integrated protective circuit element | |
| CN211296973U (en) | Surface electric heater and circuit board thereof | |
| CN205385617U (en) | Electric heat membrane that mica is high temperature resistant | |
| CN103716922A (en) | Ptc heater heating core structure | |
| CN204425675U (en) | Integrate shaped type heater | |
| CN211184295U (en) | PI flexible heating sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140827 Effective date of abandoning: 20160608 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |