CN203799878U - Triple-composite contact point - Google Patents
Triple-composite contact point Download PDFInfo
- Publication number
- CN203799878U CN203799878U CN201420006369.9U CN201420006369U CN203799878U CN 203799878 U CN203799878 U CN 203799878U CN 201420006369 U CN201420006369 U CN 201420006369U CN 203799878 U CN203799878 U CN 203799878U
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- groove
- composite bed
- silver compound
- foot
- compound composite
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Abstract
The utility model discloses a triple-composite contact point comprising a pour copper substrate, a silver compound composite layer and a connecting composite layer; the pour copper substrate is formed by a boss shaped head portion and a cylinder shaped foot portion arranged in one body; one side, back-facing the foot portion, of the head portion is provided with a first groove having the silver compound composite layer; the silver compound composite layer is embedded with the first groove; one side, back-facing the head portion, of the foot portion is provided with a second groove having the connecting composite layer; the connecting composite layer is embedded with the second groove; the triple-composite contact point is good in conductivity; the silver compound composite layer on the head portion is hard to deform, and cannot drop from the pour copper substrate.
Description
Technical field
The utility model relates to the contact that a kind of electronic devices and components are used, and relates in particular a kind of three composite contacts.
Background technology
Contact is element conventional in various electronic devices and components, although volume is very little, very high to the requirement of its performance, so the making material great majority of contact are all precious metal materials, especially silver occupies very large component therein.
Use is the composite contact of fine silver in the market, but this contact intensity is low, hardness is low, and consumption is large, expensive, production cost is high, so just there is human hair to understand a kind of three composite contacts, using copper as matrix, then silver compound is compound to the top of matrix, when having guaranteed contact energising performance, also increased the hardness of contact, but the composite surface of this three composite contact inside is plane, because contact needs constantly contact with separated when in use, under the effect of this power, silver compound will be extruded distortion, will make the electric conductivity of contact go wrong, and because composite surface is plane, there will be unavoidably the silver compound that is compounded in matrix top to occur situation about coming off, the electric conductivity of contact is declined.
Utility model content
The deficiency existing for prior art, the purpose of this utility model is to provide a kind of top silver compound composite bed not yielding, three composite contacts that can not come off.
For achieving the above object, the utility model provides following technical scheme: a kind of three composite contacts, comprise fine copper matrix, silver compound composite bed be connected composite bed, described fine copper matrix consists of round table-like head and cylindric foot, described round table-like head and cylindric foot are wholely set, described head dorsad foot's one side is provided with the first groove, described the first groove is provided with silver compound composite bed, described silver compound composite bed and the first groove phase embedding, described foot dorsad head one side is provided with the second groove, described the second groove is provided with connection composite bed, described connection composite bed and the second groove phase embedding.
By adopting technique scheme, when contact is in use time, due to outside effect, between contact, need constantly contact with separated, will produce an impulsive force to the silver compound composite bed on contact like this, due to head dorsad foot's one side be provided with the first groove, the first groove is provided with silver compound composite bed, silver compound composite bed and the first groove phase embedding, it is not writing board shape that this set makes silver compound composite bed, 1 stressed time so therein, just can better suffered power be evenly distributed on whole silver compound composite bed, just can avoid silver compound composite bed because single-point is stressed, to produce distortion, allow the electric conductivity variation of contact, and owing to there being the existence of the first groove, composite surface between silver compound composite bed and matrix is not just plane, problem with regard to there will not be silver compound composite bed to come off from matrix like this, the setting of the second groove simultaneously also can be placed and be connected the problem that composite bed comes off from matrix.
The utility model is further set to: described the first groove is hemispherical groove, and described the second groove is hemispherical groove.
By adopting technique scheme, the hemispheric everywhere that can allow the first groove and the suffered power of the second groove be distributed to more uniformly groove that arranges, the connection composite bed that makes to be arranged on silver compound composite bed on the first groove and be arranged on the second groove is not easy to produce distortion, and when making also fairly simple convenience.
The utility model is further set to: described silver compound composite bed is discoid, and described silver compound composite bed diameter is less than the first groove notch diameter, and described silver compound composite bed and the first groove coaxially arrange.
By adopting technique scheme, when contact contacts owing to being a contact, so the suffered power of whole silver compound composite bed is substantially all to concentrate on middle part, this discoid silver compound composite bed is that thick middle both sides are thin, the power can bear in the middle of is like this large more far away than both sides, and silver compound composite bed diameter is less than the first groove notch diameter, be the equal of that whole silver compound composite bed is mounted on matrix, when will producing deformation, silver compound composite bed just can effectively prop up by the first groove, prevent the distortion of silver compound composite bed.
The utility model is further set to: described connection composite bed is hemisphere, and described connection composite bed diameter is greater than the second groove notch diameter, and described connection composite bed dorsad foot is simultaneously provided with solder side, and described solder side area is greater than foot's area of section.
By adopting technique scheme, connection composite bed is hemisphere, the hemispheric everywhere that can allow suffered power on the second groove assign to uniformly the second groove that arranges, such the second groove just can bear larger power and be indeformable, and the setting of solder side, just can connection composite bed be welded on electric elements by solder side, convenient in the time of welding, and after having welded, connect also more firm.
Accompanying drawing explanation
Fig. 1 is the cutaway view of three composite contacts of the present utility model.
In figure: 1, matrix; 2, silver compound composite bed; 3, connect composite bed; 11, head; 12, foot; 111, the first groove; 121, the second groove; 31, solder side.
Embodiment
Shown in Fig. 1, a kind of three composite contacts of the present embodiment, comprise fine copper matrix 1, silver compound composite bed 2 be connected composite bed 3, described fine copper matrix 1 consists of round table-like head 11 and cylindric foot 12, described round table-like head 11 and cylindric foot 12 are wholely set, described head 11 dorsad foot's 12 1 sides is provided with the first groove 111, described the first groove 111 is provided with silver compound composite bed 2, described silver compound composite bed 2 and the first groove 111 phase embeddings, described foot 12 dorsad head 11 1 sides is provided with the second groove 121, described the second groove 121 is provided with and connects composite bed 3, described connection composite bed 3 and the second groove 121 phase embeddings.
By adopting technique scheme, when contact is in use time, due to outside effect, between contact, need constantly contact with separated, will produce an impulsive force to the silver compound composite bed 2 on contact like this, due to head 11 dorsad foot's 12 1 sides be provided with the first groove 111, the first groove 111 is provided with silver compound composite bed 2, silver compound composite bed 2 and the first groove 111 phase embeddings, it is not writing board shape that this set makes silver compound composite bed 2, 1 stressed time so therein, just can better suffered power be evenly distributed on whole silver compound composite bed 2, just can avoid silver compound composite bed 2 because single-point is stressed, to produce distortion, allow the electric conductivity variation of contact, and owing to there being the existence of the first groove 111, composite surface between silver compound composite bed 2 and matrix 1 is not just plane, problem with regard to there will not be silver compound composite bed 2 to come off from matrix 1 like this, the setting of the second groove 121 simultaneously also can be placed and be connected the problem that composite bed 3 comes off from matrix 1.
Described the first groove 111 is hemispherical groove, and described the second groove 121 is hemispherical groove.
By adopting technique scheme, the hemispheric everywhere that can allow the first groove 111 and the suffered power of the second groove 121 be distributed to more uniformly groove that arranges, the connection composite bed 3 that makes to be arranged on silver compound composite bed on the first groove 111 2 and be arranged on the second groove 121 is not easy to produce distortion, and when making also fairly simple convenience.
Described silver compound composite bed 2 is discoid, and described silver compound composite bed 2 diameters are less than the first groove 111 notch diameters, and described silver compound composite bed 2 and the first groove 111 coaxially arrange.
By adopting technique scheme, when contact contacts owing to being a contact, so the suffered power of whole silver compound composite bed 2 is substantially all to concentrate on middle part, this discoid silver compound composite bed is that thick middle both sides are thin, the power can bear in the middle of is like this large more far away than both sides, and silver compound composite bed 2 diameters are less than the first groove 111 notch diameters, be the equal of that whole silver compound composite bed 2 is mounted on matrix 1, when will producing deformation, silver compound composite bed 2 just can effectively prop up by the first groove 111, prevent 2 distortion of silver compound composite bed.
Described connection composite bed 3 is hemisphere, and described connection composite bed 3 diameters are greater than the second groove 121 notch diameters, and described connection composite bed 3 dorsad foot's 12 one sides is provided with solder side 31, and described solder side 31 areas are greater than foot's 12 areas of section.
By adopting technique scheme, connecting composite bed 3 is hemisphere, the hemispheric everywhere that can allow suffered power on the second groove 121 assign to uniformly the second groove 121 that arranges, such the second groove 121 just can bear larger power and be indeformable, and the setting of solder side 31, just can connection composite bed 3 be welded on electric elements by solder side 31, convenient in the time of welding, and after having welded, connect also more firm.
The utlity model has following advantage: conduct electricity very well, the silver compound composite bed 2 of head 11 is not easy distortion, can not come off from fine copper matrix 1, when contact is in use time, due to outside effect, between contact, need constantly contact with separated, will produce an impulsive force to the silver compound composite bed 2 on contact like this, due to head 11 dorsad foot's 12 1 sides be provided with the first groove 111, the first groove 111 is provided with silver compound composite bed 2, silver compound composite bed 2 and the first groove 111 phase embeddings, it is not writing board shape that this set makes silver compound composite bed 2, 1 stressed time so therein, just can better suffered power be evenly distributed on whole silver compound composite bed 2, just can avoid silver compound composite bed 2 because single-point is stressed, to produce distortion, allow the electric conductivity variation of contact, and owing to there being the existence of the first groove 111, composite surface between silver compound composite bed 2 and matrix 1 is not just plane, problem with regard to there will not be silver compound composite bed 2 to come off from matrix 1 like this, the setting of the second groove 121 simultaneously also can be placed and be connected the problem that composite bed 3 comes off from matrix 1.
The above is only preferred implementation of the present utility model, and protection range of the present utility model is also not only confined to above-described embodiment, and all technical schemes belonging under the utility model thinking all belong to protection range of the present utility model.It should be pointed out that for those skilled in the art, in the some improvements and modifications that do not depart under the utility model principle prerequisite, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (4)
1. a composite contact, comprise fine copper matrix, silver compound composite bed and be connected composite bed, described fine copper matrix consists of round table-like head and cylindric foot, described round table-like head and cylindric foot are wholely set, it is characterized in that: described head dorsad foot's one side is provided with the first groove, described the first groove is provided with silver compound composite bed, described silver compound composite bed and the first groove phase embedding, described foot dorsad head one side is provided with the second groove, described the second groove is provided with connection composite bed, described connection composite bed and the second groove phase embedding.
2. three composite contacts according to claim 1, is characterized in that: described the first groove is hemispherical groove, and described the second groove is hemispherical groove.
3. three composite contacts according to claim 2, is characterized in that: described silver compound composite bed is discoid, and silver compound composite bed diameter is less than the first groove notch diameter, and described silver compound composite bed and the first groove coaxially arrange.
4. three composite contacts according to claim 3, it is characterized in that: described connection composite bed is hemisphere, described connection composite bed diameter is greater than the second groove notch diameter, and described connection composite bed dorsad foot is simultaneously provided with solder side, and described solder side area is greater than foot's area of section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420006369.9U CN203799878U (en) | 2014-01-02 | 2014-01-02 | Triple-composite contact point |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420006369.9U CN203799878U (en) | 2014-01-02 | 2014-01-02 | Triple-composite contact point |
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CN203799878U true CN203799878U (en) | 2014-08-27 |
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CN201420006369.9U Expired - Fee Related CN203799878U (en) | 2014-01-02 | 2014-01-02 | Triple-composite contact point |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104766736A (en) * | 2015-03-29 | 2015-07-08 | 宁波金点电子有限公司 | Tri-composite contact manufacturing technique |
-
2014
- 2014-01-02 CN CN201420006369.9U patent/CN203799878U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104766736A (en) * | 2015-03-29 | 2015-07-08 | 宁波金点电子有限公司 | Tri-composite contact manufacturing technique |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140827 Termination date: 20180102 |
|
CF01 | Termination of patent right due to non-payment of annual fee |