CN203787457U - LED bracket - Google Patents

LED bracket Download PDF

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Publication number
CN203787457U
CN203787457U CN201420123751.8U CN201420123751U CN203787457U CN 203787457 U CN203787457 U CN 203787457U CN 201420123751 U CN201420123751 U CN 201420123751U CN 203787457 U CN203787457 U CN 203787457U
Authority
CN
China
Prior art keywords
heat conduction
heat
led
conducting unit
conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420123751.8U
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Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Mei Mei Electronic Technology Co., Ltd.
Original Assignee
冯红梅
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 冯红梅 filed Critical 冯红梅
Priority to CN201420123751.8U priority Critical patent/CN203787457U/en
Application granted granted Critical
Publication of CN203787457U publication Critical patent/CN203787457U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides an LED bracket. The LED bracket with a heat conduction frame is characterized by comprising a plurality of regularly arranged heat conduction units, wherein the heat conduction units are connected with each other through first connecting pieces so as to form a heat conduction module; the external part of the heat conduction module is connected inside the heat conduction frame through a second connecting piece; and the heat conduction units, the first connecting pieces, the second connecting pieces and the heat conduction frame are integrally molded. According to the utility model, a plurality of independent LED surface mounted device units are adopted to share the same heat conduction frame, thereby saving a heat conduction material, and reducing the cost; batch operations can be carried out in electroplating, thereby improving the electroplating efficiency; and across corners of each of the LED surface mounted device units are provided with positive and negative electrode ports respectively, thereby being convenient and efficient to embed a power supply.

Description

A kind of LED support
Technical field
The utility model relates to LED field, refers to especially a kind of LED support.
Background technology
Existing LED support as shown in Figure 1, comprises pedestal 1, die bond face 3, wire welding area 4 and wire 2, and the positive middle part of pedestal 1 is recessed to form die bond face 3 downwards, to place LED luminescent wafer.In die bond face 3 external rings, be wound with wire welding area 4.When LED luminescent wafer is fixed on die bond face 3, by wire 2, the both positive and negative polarity of wire welding area 4 is communicated with the both positive and negative polarity of LED luminescent wafer.Outside the back side of die bond face 3, be exposed at the outside of pedestal 1, form thermal conductive surface, so that be connected with fin.
In existing volume production manufacture craft, generally wire 2 is arranged in to multiple lines and multiple rows, then by die bond face 3, wire welding area 4 and wire 2 on same section bar after punch forming, then encapsulating forms pedestal 1, make positive being just in time arranged in the sunk area at pedestal 1 center, then stick fin 5.
This manufacture craft need to be established independent heat conduction frame on each LED paster, and a LED paster will be wasted a lot of Heat Conduction Materials, and the whole shared area of LED support is large.In addition, because each LED paster is joined separately a heat conduction housing, so when LED paster is electroplated, what must take time and effort carries out separately careful operation, the operating procedure that single led like this paster is electroplated is complicated, and both waste of manpower and time, operating efficiency was also very low.
Utility model content
The utility model proposes a kind of LED support, heat carrier is carried out to the arrangement of multiple lines and multiple rows, the outer gimbal support during as volume production, has solved Heat Conduction Material waste and the not high problem of production efficiency in prior art.
The technical solution of the utility model is achieved in that
A LED support, it comprises a plurality of regularly arranged heat-conducting units, described in each, between heat-conducting unit, by the first connector, connects, and forms heat conducting module; It is inner that described heat conducting module outside is connected to heat conduction frame by the second connector; Described heat-conducting unit, the first connector, the second connector and heat conduction frame are one-body molded.
Preferably, described heat-conducting unit is conductor.
Preferably, described heat-conducting unit, the first connector, the second connector and heat conduction frame are one-body molded by copper.
Described heat-conducting unit also can be insulator; Preferably, described heat-conducting unit is pottery.
Preferably, on described each heat-conducting unit, be provided with combined hole, to increase the adhesion in subsequent technique.
Heat conduction housing LED support of the present utility model has following beneficial effect:
(1) save material: a plurality of independently LED chip units share a heat conduction housing, and more existing independent heat conduction frame has been saved a large amount of Heat Conduction Materials, greatly reduces the material cost of product;
(2) processing technology of carrier unit is simplified, improved production efficiency: a plurality of independently LED chip units are directly connected, do not have independent heat conduction housing and other structure to intercept, when LED paster is electroplated, can batch operation, disposable a plurality of LED chip units to be electroplated, operating procedure is simple, can save greatly artificial and time, greatly improve the efficiency of the work of electroplating;
(3) enhance productivity: due to not conducting mutually between the heat-conducting unit in each carrier unit, therefore can directly test between both positive and negative polarity, improved testing efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is existing LED support structure;
Fig. 2 is the perspective view of the utility model heat conduction housing LED support preferred embodiment;
Fig. 3 is the Facad structure schematic diagram of the heat conduction housing in preferred embodiment shown in Fig. 2;
Fig. 4 is the Facad structure schematic diagram of preferred embodiment shown in Fig. 2;
Fig. 5 is the structure for amplifying schematic diagram of A part in Fig. 4;
Wherein, in Fig. 4 and Fig. 5, dotted line is internal structure, for convenience of describing, therefore adopt dotted line to show position and the shape of its internal part.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Heat conduction housing LED support as shown in Figures 2 to 5, it comprises a plurality of regularly arranged heat-conducting units 1, between each heat-conducting unit 1, by the first connector 2, connects, and forms heat conducting module; Described heat conducting module outside is connected to heat conduction frame 3 inside by the second connector 4; Described heat-conducting unit 1, the first connector 2, the second connector 4 and heat conduction frame 3 are one-body molded.
During production, as protection and the plastic cement insulating barrier of insulating effect, directly injection moulding is to heat conduction housing LED support, and employing heat-conducting unit, as the fin of LED support, greatly provides production efficiency, and saved the material of fin and support.And because the thickness of fin is thicker, hardness is stronger, therefore aborning, the deflection of whole support is less, has also improved making precision and yield.
In the utility model, described heat-conducting unit can be conductor, can be also insulator.When it is conductor, described heat-conducting unit 1, the first connector 2, the second connector 4 and heat conduction frame 3 are preferably one-body molded by copper.Certainly also can be other conductor material, as long as can reach the object of the LED crystal heat radiation making in LED product.
Heat-conducting unit 1 of the present utility model can be applicable on carrier unit, each heat-conducting unit 1 on the heat conduction housing LED support that this carrier unit comprises is connected with plastic cement insulating barrier 5 by the conductor layer of two one side insulation, and the insulating surfaces of described conductor layer contacts with described heat-conducting unit 1, another side exposes in described insulated plastic glue-line 5, so that form two mutual not conductings, for welding anodal port 51 and the negative pole port 52 of both positive and negative polarity, or both positive and negative polarity port vice versa.
This carrier unit can be made by the following method:
Step 1: the conductor layer of described a plurality of one sides insulation is attached on heat-conducting unit 1, and the insulating surfaces of described conductor layer contacts with heat-conducting unit 1, prevent this conductor layer and heat-conducting unit 1 conducting before;
Step 2: by injection mo(u)lding by 5 injection mouldings of plastic cement insulating barrier to heat-conducting unit 1, and be positioned at the one side that is attached with described conductor layer, to form protective layer, and take into account insulation and effect attractive in appearance.
When heat-conducting unit 1 is insulator, preferably can be adopted as pottery wait can heat conduction insulating material.Adopt the carrier unit of this heat-conducting unit 1, due to can conducting between conductor layer, therefore without the conductor layer adopting with one side insulation, can directly adopt the conductor layer of two-sided conduction, be to be connected with plastic cement insulating barrier 5 on each heat-conducting unit 1, heat-conducting unit 1 is connected with conductor layer before with plastic cement insulating barrier 5, and the conducting surface of described conductor layer exposes in the plastic layer 5 that insulate.Certainly, adopt the conductor layer of one side insulation, and the heat-conducting unit 1 that insulating barrier is attached to insulator also can, but adopt the conductor layer of two-sided conduction without identification insulating surfaces, can improve working (machining) efficiency.
In the utility model, plastic cement insulating barrier 5 can be covered on conductive layer completely, only exposes the anodal port 51 in middle part or negative pole port 52, also can expose the other parts of conductive layer, can design according to real needs.
Simultaneously, on each heat-conducting unit 1, be also provided with combined hole 11, when 5 injection mo(u)lding of plastic cement insulating barrier, can increase the adhesion between plastic cement insulating barrier 5 and heat-conducting unit 1, while preventing that later stage plastic cement insulating barrier 5 is heated or deforms in other cases, peel off with heat-conducting unit 1, thereby affect life of product.
In shown preferred embodiment, each heat-conducting unit 1 is quadrangle, and is provided with fixed hole position 53 at its place, a pair of diagonal angle, and when mounted LED lamp, the fixtures such as screw are fixing, flexible by this fixed hole position 53.This fixed hole position 53 can be for being opened in the open groove at place, diagonal angle, to facilitate processing; Can certainly be the forms such as other fixing hole, and be not limited to illustrated Open architecture.
As shown in Figure 2, the middle part of plastic cement insulating barrier 5 is provided with cloth crystalline region, and diagonal place is provided with electrode connection hole, and described anodal port 51 and negative pole port 52 expose respectively in described electrode connection hole, and are electrically connected to described conductive layer.When LED crystal is fixed on cloth crystalline region, in conductive layer and anodal port 51 and negative pole port 52 places in circuit, therefore the both positive and negative polarity port organization in the utility model can exempt from again to embed the step of positive and negative power supply during use, convenient to use; And do not have electrode to expose, can prevent the damage that electrion causes.
On heat conduction frame 3 of the present utility model, be provided with groove line positioning track, when production and processing, can in process equipment, position more accurately, the groove line design on positioning track simultaneously, during more convenient production and processing, equipment carries out the conveying of material.The design parameter of the design of this groove line and groove line positioning track, can be according to the concrete condition adjustment of equipment or production, and is not limited to the structure of illustrated preferred embodiment.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.

Claims (6)

1. a LED support, is characterized in that, it comprises a plurality of regularly arranged heat-conducting units, described in each, between heat-conducting unit, by the first connector, connects, and forms heat conducting module; It is inner that described heat conducting module outside is connected to heat conduction frame by the second connector; Described heat-conducting unit, the first connector, the second connector and heat conduction frame are one-body molded.
2. LED support as claimed in claim 1, is characterized in that, described heat-conducting unit is conductor.
3. LED support as claimed in claim 2, is characterized in that, described heat-conducting unit, the first connector, the second connector and heat conduction frame are one-body molded by copper.
4. LED support as claimed in claim 1, is characterized in that, described heat-conducting unit is insulator.
5. LED support as claimed in claim 4, is characterized in that, described heat-conducting unit is pottery.
6. LED support as claimed in claim 1, is characterized in that, on described each heat-conducting unit, is provided with combined hole.
CN201420123751.8U 2014-03-18 2014-03-18 LED bracket Expired - Fee Related CN203787457U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420123751.8U CN203787457U (en) 2014-03-18 2014-03-18 LED bracket

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420123751.8U CN203787457U (en) 2014-03-18 2014-03-18 LED bracket

Publications (1)

Publication Number Publication Date
CN203787457U true CN203787457U (en) 2014-08-20

Family

ID=51323612

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420123751.8U Expired - Fee Related CN203787457U (en) 2014-03-18 2014-03-18 LED bracket

Country Status (1)

Country Link
CN (1) CN203787457U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
CB03 Change of inventor or designer information

Inventor after: Liu Hongjun

Inventor before: The inventor has waived the right to be mentioned

COR Change of bibliographic data
TR01 Transfer of patent right

Effective date of registration: 20151221

Address after: 528478 Guangdong city of Zhongshan Province town Henglan Maohui Industrial Zone eight Le Feng Road No. 8 second floor of first to 3 cards

Patentee after: ZHONGSHAN PINMEI ELECTRONICS TECHNOLOGY CO., LTD.

Address before: 529444, 7, lane two, seven village, village committee, Malone village, Jiangmen Town, Enping City, Guangdong Province

Patentee before: Feng Hongmei

C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 528478 Guangdong city of Zhongshan Province town Henglan Maohui Industrial Zone eight Le Feng Road No. 8 second floor of first to 3 cards

Patentee after: Guangdong Mei Mei Electronic Technology Co., Ltd.

Address before: 528478 Guangdong city of Zhongshan Province town Henglan Maohui Industrial Zone eight Le Feng Road No. 8 second floor of first to 3 cards

Patentee before: ZHONGSHAN PINMEI ELECTRONICS TECHNOLOGY CO., LTD.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140820

Termination date: 20180318