CN203774276U - Quartz clamp used for film-formation substrate liquid-phase cleaning - Google Patents
Quartz clamp used for film-formation substrate liquid-phase cleaning Download PDFInfo
- Publication number
- CN203774276U CN203774276U CN201320779537.3U CN201320779537U CN203774276U CN 203774276 U CN203774276 U CN 203774276U CN 201320779537 U CN201320779537 U CN 201320779537U CN 203774276 U CN203774276 U CN 203774276U
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- China
- Prior art keywords
- substrate
- film deposition
- film
- cleaning
- quartzy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 title claims abstract description 74
- 239000007791 liquid phase Substances 0.000 title claims abstract description 18
- 238000004140 cleaning Methods 0.000 title abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title abstract description 11
- 239000010453 quartz Substances 0.000 title abstract 9
- 230000008021 deposition Effects 0.000 claims description 54
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 4
- 230000007547 defect Effects 0.000 description 6
- 238000010998 test method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cleaning In General (AREA)
Abstract
The utility model discloses a quartz clamp used for film-formation substrate liquid-phase cleaning. With the quartz clamp of the utility model adopted, a film-formation substrate can be clamped effectively, and will not be damaged in a cleaning process, and a cleaning effect is excellent. The quartz clamp used for film-formation substrate liquid-phase cleaning of the utility model comprises a U-shaped handle and a base, wherein the handle is welded on the base; the base is divided into two layers, namely a quartz flat plate and a positioning plate which are arranged sequentially from bottom to top; middle portions of the quartz flat plate and the positioning plate are provided with hollow grooves; two sides of the hollow groove on the positioning plate are symmetrically provided with fixing slots; and the width of the fixing slots is larger than the thickness of the film-formation substrate. The quartz clamp of the utility model can be applied to the cleaning of film-formation substrates of variety of sizes, and therefore, the applicability of the clamp is improved; and the quartz clamp is simple in structure, and easy to process and convenient to use. With the quartz clamp adopted, the film-formation substrates will not be damaged in the cleaning process, and the cleaning qualified rate of the film-formation substrates can be 100%.
Description
Technical field
The present invention relates to substrate for film deposition cleaning technique, be specifically related to the quartzy fixture of a kind of substrate for film deposition liquid phase cleaning.
Background technology
Clean substrate for film deposition is the basic demand that hybrid integrated circuit is produced, although substrate for film deposition has strict Process control measures in manufacture process, but in laser resistor trimming, test evaluation and internal forwarding process, inevitably can be infected with some pollutants, and these pollutants are very large (being easy to cause the de-key of the bad or bonding of bonding) on the impact of later process, therefore, substrate for film deposition must be carried out liquid phase cleaning before encapsulation, with the cleanliness factor of guaranteeing that it is surperficial.Conventional substrate for film deposition liquid phase cleaning is substrate to be laid in to beaker bottom pouring soln carry out ultrasonic cleaning, then substrate for film deposition is put in baking oven and is dried.But in the process of pouring soln, substrate for film deposition inevitably can mutually superpose, collide, thereby cause substrate property at parts of edges and corners to produce rigid contact with the surface circuit figure of other substrates, cause the defects such as scuffing, breakage, and stack after substrate for film deposition under ultrasonic effect, can make the defects such as scuffing more serious.These scratch defect and can cause film adhesion to decline, and very easily occur the problems such as rete comes off in later stage process of the test, therefore for this type of substrate, generally all do and scrap processing, and this qualification rate that substrate for film deposition liquid phase is cleaned is very low.If substrate for film deposition is fixed with fixture etc., although substrate for film deposition does not produce and collides with in cleaning process, but circuitous pattern only has the distance of 300 μ m apart from substrate edges, fixture can not clip on circuitous pattern, also must reserve substrate simultaneously and insert safe clearance enough while extracting, realize difficulty larger.Meanwhile, fixture retaining part surface smoothness requires very high, otherwise under the effect of burr stress, substrate surface there will be the defects such as scuffing, crackle, breakage; In addition, due to fixture and substrate close contact, cleaning fluid cannot infiltrate, so the cleaning degree of retaining part cannot guarantee.
Summary of the invention
In view of this, the invention provides a kind of substrate for film deposition liquid phase cleaning and use quartzy fixture, can effectively clamp substrate for film deposition, and in cleaning process, not damage substrate for film deposition, cleaning performance is good.
Substrate for film deposition liquid phase of the present invention is cleaned and is comprised U-shaped handle and base with quartzy fixture, and wherein, handle is welded on base; Base is divided into two-layer, is followed successively by from lower to upper quartzy flat board and location-plate; Quartzy mid portion dull and stereotyped and location-plate is provided with dead slot; On location-plate, be provided with to dead slot bilateral symmetry holddown groove; The width of holddown groove is larger than the thickness of substrate for film deposition.
Wherein, the spacing between quartzy flat board and location-plate is 1/3～1/2 of substrate for film deposition length.
The width of dead slot is greater than 1/2 of substrate for film deposition width dimensions.
The width of holddown groove is than the large 0.2～0.4mm of the thickness of substrate for film deposition.
The length of holddown groove is 4～8mm.
Between holddown groove, interval is greater than 1/4 of substrate for film deposition length.
Beneficial effect:
Adopt quartzy fixture of the present invention, can effectively clamp substrate for film deposition and not clean substrate for film deposition is caused damage, the cleaning qualification rate of substrate for film deposition is 100%.
Quartzy fixture of the present invention can be applied to the cleaning of the substrate for film deposition of sizes, has improved the applicability of fixture, and easy processing simple in structure, easy to use.
Accompanying drawing explanation
Fig. 1 is quartzy fixture schematic diagram.
Fig. 2 is quartzy fixture location-plate schematic diagram
Fig. 3 is quartzy fixture overall perspective view.
Fig. 4 is the quartzy fixture that accompanies substrate for film deposition.
Wherein, 1-handle, 2-is quartzy dull and stereotyped, 3-location-plate, 4-holddown groove, 5-dead slot.
Embodiment
Below in conjunction with the accompanying drawing embodiment that develops simultaneously, describe the present invention.
The invention provides the quartzy fixture of a kind of substrate for film deposition liquid phase cleaning, as shown in Figure 1, described clamp material is quartz glass, quartz glass has good surface cleanliness, hardness is moderate, and smooth surface, in liquid phase cleaning process, even contact with substrate surface, can not produce the defects such as scuffing yet.
Described fixture comprises U-shaped handle 1 and base, and wherein, two of handle 1 is welded on base, can guarantee like this fastness of fixture when putting forward.The length of handle 1 is a little more than the height of beaker, and with handled easily, personnel carry fixture.
The base of described fixture is one-body molded, is divided into two-layerly, is followed successively by from lower to upper quartzy dull and stereotyped 2 and location-plate 3.Quartzy dull and stereotyped 2 substrate for film deposition that are used for support fixture and insertion, location-plate 3 is used for fixing substrate for film deposition, prevents that substrate for film deposition from colliding with mutually.Spacing between quartzy flat board 2 and location-plate 3 is 1/3～1/2 of substrate for film deposition length, and substrate for film deposition can be lived in fixture neutrality.
In the middle of quartzy flat board 2 and location-plate 3, the width of dead slots 5 should be slightly larger than 1/2 of substrate for film deposition width dimensions, and after substrate for film deposition is inserted, substrate edge part can be fixed by holddown groove 4, as shown in Figure 4, meanwhile, can reduce hyperacoustic energy loss, improve cleaning performance.
On location-plate 3, the width of holddown groove 4 is than the large 0.2～0.4mm of the thickness of substrate for film deposition, with guarantee substrate for film deposition can be in holddown groove 4 among a small circle activity do not depart from again holddown groove 4, can guarantee that like this substrate can successfully insert and extract, surperficial circuitous pattern can not fray again simultaneously; In addition, this holddown groove 4 designs can make cleaning fluid realize and farthest contacting with substrate surface, guarantee cleaning performance.The length of holddown groove 4 is generally designed to 4～8mm, and object is to improve the versatility of fixture.Between holddown groove 4, interval should be greater than 1/4 of substrate for film deposition length, to guarantee that substrate for film deposition inserts after fixture, can not produce and collide with each other.
For example, for washed substrate for film deposition, be of a size of 22 * 16 * 0.635mm, quartzy grip size is as follows:
The length of handle 1 is 165mm, spacing between quartzy flat board 2 and location-plate 3 is 8mm, in location-plate 3, between holddown groove 4, is spaced apart 6mm, and in the middle of quartzy flat board 2 and location-plate 3, the width of dead slots 5 is 13mm, the width of holddown groove 4 is 1mm, and the length of holddown groove 4 is 6mm.
In the fixture course of processing, use and burn the glass burr that technique is removed fixture notch inwall, to guarantee the smooth smooth of notch inwall, use polishing high temperature firelock to carry out polishing throwing to quartzy fixture integral body bright, improve aesthetic property.Fixture production overall process is all cleaned by high purity deionized water, to guarantee the high-cleanness, high of quartzy fixture.The pictorial diagram of quartzy fixture as shown in Figure 3, Figure 4.
Adopt fixture of the present invention to clean substrate for film deposition, carry out visual inspection after cleaning, respond well, substrate for film deposition surface-brightening, cleaning, without defects such as fifth wheel and scuffings, clean 100, and qualification rate is 100%.The substrate for film deposition that cleaning is completed, has carried out device package by the requirement of technical papers, has carried out electric performance test after having encapsulated, and indices is all normal, meets design requirement.The qualified sample of normal temperature electric performance test has been carried out to temperature cycles, mechanical shock, the multinomial screening test such as seasoned by the related request of GJB548B-2005 < < microelectronic component Test Methods And Procedures > >, all passed through smoothly.The qualified sample of screening has been carried out to stricter inspecton of quality conformity by the related request of GJB548B-2005 < < microelectronic component Test Methods And Procedures > >, and property indices all meets the demands.
In sum, these are only preferred embodiment of the present invention, be not intended to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (6)
1. substrate for film deposition liquid phase is cleaned and is used a quartzy fixture, it is characterized in that, comprise U-shaped handle (1) and base, wherein, handle (1) is welded on base; Base is divided into two-layer, is followed successively by from lower to upper quartzy dull and stereotyped (2) and location-plate (3); The mid portion of quartzy dull and stereotyped (2) and location-plate (3) is provided with dead slot (5); Be provided with to the upper dead slot bilateral symmetry of location-plate (3) holddown groove (4); The width of holddown groove (4) is larger than the thickness of substrate for film deposition.
2. substrate for film deposition liquid phase as claimed in claim 1 is cleaned and is used quartzy fixture, it is characterized in that, the spacing between described quartzy dull and stereotyped (2) and described location-plate (3) is 1/3～1/2 of substrate for film deposition length.
3. substrate for film deposition liquid phase as claimed in claim 1 is cleaned and is used quartzy fixture, it is characterized in that, the width of described dead slot (5) is greater than 1/2 of substrate for film deposition width dimensions.
4. substrate for film deposition liquid phase as claimed in claim 1 is cleaned and is used quartzy fixture, it is characterized in that, the width of described holddown groove (4) is than the large 0.2～0.4mm of the thickness of substrate for film deposition.
5. substrate for film deposition liquid phase as claimed in claim 1 is cleaned and is used quartzy fixture, it is characterized in that, the length of described holddown groove (4) is 4～8mm.
6. substrate for film deposition liquid phase as claimed in claim 1 is cleaned and is used quartzy fixture, it is characterized in that, between described holddown groove (4), interval is greater than 1/4 of substrate for film deposition length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320779537.3U CN203774276U (en) | 2013-11-29 | 2013-11-29 | Quartz clamp used for film-formation substrate liquid-phase cleaning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320779537.3U CN203774276U (en) | 2013-11-29 | 2013-11-29 | Quartz clamp used for film-formation substrate liquid-phase cleaning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203774276U true CN203774276U (en) | 2014-08-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320779537.3U Expired - Lifetime CN203774276U (en) | 2013-11-29 | 2013-11-29 | Quartz clamp used for film-formation substrate liquid-phase cleaning |
Country Status (1)
| Country | Link |
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| CN (1) | CN203774276U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106241728A (en) * | 2015-06-15 | 2016-12-21 | 武汉理工大学 | A kind of Teflon device for the processing of micro-nano device wet method and process technique |
| CN109647785A (en) * | 2019-01-29 | 2019-04-19 | 广州晶优电子科技有限公司 | The cleaning method and cleaning device of quartz wafer |
| CN110660677A (en) * | 2019-09-25 | 2020-01-07 | 中国电子科技集团公司第十一研究所 | Indium column remelting ball shrinking system and method |
-
2013
- 2013-11-29 CN CN201320779537.3U patent/CN203774276U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106241728A (en) * | 2015-06-15 | 2016-12-21 | 武汉理工大学 | A kind of Teflon device for the processing of micro-nano device wet method and process technique |
| CN109647785A (en) * | 2019-01-29 | 2019-04-19 | 广州晶优电子科技有限公司 | The cleaning method and cleaning device of quartz wafer |
| CN110660677A (en) * | 2019-09-25 | 2020-01-07 | 中国电子科技集团公司第十一研究所 | Indium column remelting ball shrinking system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140813 |