CN203773182U - FOG (FPC (flexible printed circuit) on glass) structure capable of increasing bonding particle number - Google Patents
FOG (FPC (flexible printed circuit) on glass) structure capable of increasing bonding particle number Download PDFInfo
- Publication number
- CN203773182U CN203773182U CN201320879755.4U CN201320879755U CN203773182U CN 203773182 U CN203773182 U CN 203773182U CN 201320879755 U CN201320879755 U CN 201320879755U CN 203773182 U CN203773182 U CN 203773182U
- Authority
- CN
- China
- Prior art keywords
- fpc
- fog
- molybdenum
- nation
- screen body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses an FOG (FPC (flexible printed circuit) on glass) structure capable of increasing the bonding particle number. The FOG structure comprises an FPC structure, wherein the surface of the FPC structure is provided with an FPC bonding end golden finger, the surface of a COG (chip on glass) structure is provided with a screen body I/O (in/out) port PAD, the screen body I/O port PAD comprises a molybdenum aluminum molybdenum alloy layer and an ITO (indium tin oxide) film, the molybdenum aluminum molybdenum alloy layer and the screen body I/O port PAD are in opposite arrangement, in addition, an anisotropic conductive film for bonding is arranged between the molybdenum aluminum molybdenum alloy layer and the screen body I/O port PAD, a plurality of grooves are formed in the surface of the molybdenum aluminum molybdenum alloy layer, and conductive particles of the anisotropic conductive film are accommodated in the grooves. The FOG structure has the advantages that through the grooves, the moving range of the conductive particles at the surface of the molybdenum aluminum molybdenum alloy layer can be limited in the grooves, so the conductive particle aggregation caused by the conductive particle sliding is avoided. Meanwhile, the conductive particles can be prevented from being extruded to the middle of a gap of the screen body I/O port PAD through the grooves, so the effect of improving the conductive particle catching capability is realized.
Description
Technical field
The utility model relates to a kind of FOG(FPC On Glass) structure, being specifically related to a kind ofly can increase the FOG structure that nation determines population.
Background technology
It is on glass that COG (Chip On Glass) structure 2 represents that chip is fixed on by direct nation, and this mounting means can reduce the volume of LCD module greatly, and is easy to produce in enormous quantities, is applicable to the LCD of consumer electronics product.FPC structure 1(Flexible Printed Circuit) claim again FPC, flexible printed circuit board or flex circuit application, have that distribution density is high, lightweight, the feature of thin thickness.The structure that adopts COG structure 2 and FPC structure 1 to carry out Bang Ding and obtain is FOG(FPC On Glass) structure, as shown in Figure 1, in nation, regularly need to use different side's conducting film 3(ACF, Anisotropic Conductive Film).The conductive characteristic of described different side's conducting film 3 depends primarily on the pack completeness of conducting particles 4, thereby the particle size of conducting particles 4 and distributing homogeneity all can affect to some extent on the conductive characteristic of different side's conducting film 3.Only have when conducting particles 4 seizure of different side's conducting film 3 reach some, the electrode of the electrode of FPC structure 1 and COG structure 2 is just understood conducting, the number of particles of each electrode of General Requirements when seizure quantity is very few, conductive effect can directly be affected, so must be greater than 5.At present along with technical development, the FPC nation fixed end golden finger 5 on FPC structure 1 top layer and the screen body I/O(IN/OUT on COG structure 2 top layers) mouthful PAD(golden finger and go out end) marginal dimension reduce, make the spacing between the two also more and more less, the particle relatively catching also can correspondingly reduce.The electrode that screen body I/O mouth PAD forms is ITO(tin-doped indium oxide) film 7 and molybdenum aluminium molybdenum alloys layer 6 structure, because the surface of screen body I/O mouth PAD is smooth, in FPC structure 1 nation regularly, and when stressed extruding is uneven, as shown in Figures 2 and 3, conducting particles 4 there will be slip, may cause conducting particles 4 to build up and affect distributing homogeneity, thereby affecting conductive effect; Also easily cause the particle at screen body I/O mouth PAD edge also can be extruded in the middle of the gap of adjacent two screen body I/O mouth PAD, cause the minimizing of the effective conducting particles 4 on screen body I/O mouth PAD.
Utility model content
The technical problems to be solved in the utility model is to provide the structure of a kind of COGHe of increasing FPG nation usual practice, employing is dug groove mode by MAM and is realized conducting particles and increase on COG PAD, has solved the problem that conducting particles is built up or quantity causes electric conductivity to decline less.
The utility model provides a kind of can increase the FOG structure that nation determines population, comprise FPC structure, COG structure and different side's conducting film, the surface of described FPC structure has FPC nation fixed end golden finger, the surface of described COG structure has screen body I/O mouth PAD, described screen body I/O mouth PAD comprises the ito thin film that is positioned at COG body structure surface and the molybdenum aluminium molybdenum alloys layer that is positioned at described ito thin film surface, described molybdenum aluminium molybdenum alloys layer and described FPC nation fixed end golden finger are oppositely arranged, and between the two, be provided with different side's conducting film that nation determines use, described molybdenum aluminium molybdenum alloys layer surface is formed with a plurality of opening directions towards the groove of described FPC nation fixed end golden finger, and in described groove, be installed with the conducting particles of described different side's conducting film.
The degree of depth of described groove equates with the thickness of described molybdenum aluminium molybdenum alloys layer.
The width of described groove is greater than the diameter of described conducting particles.
The diameter of described conducting particles is 3 μ m～5 μ m.
Described a plurality of groove is uniformly distributed on described molybdenum aluminium molybdenum alloys layer.
The thickness of described molybdenum aluminium molybdenum alloys layer is 0.05 μ m～0.5 μ m.
Being shaped as of described groove is circular or square.
The advantage the utlity model has is:
The utility model provides a kind of can increase the FOG structure that nation determines population, comprise FPC structure, COG structure and different side's conducting film, the molybdenum aluminium molybdenum alloys layer of described COG structure is formed with a plurality of grooves, utilize the plurality of groove can be so that the moving range of the coarse conducting particles in molybdenum aluminium molybdenum alloys layer surface is defined in groove, thereby avoid conducting particles to slide and the conducting particles that causes is assembled.Described COG structure is certainly as the discontinuity structure with a plurality of gaps simultaneously, described groove disperses to be formed in molybdenum aluminium molybdenum alloys layer, thereby can avoid conducting particles to be extruded in the middle of the gap of adjacent two COG structures, thereby reach the ability that catches conducting particles that improves.
Accompanying drawing explanation
Fig. 1: available technology adopting COG structure and FPC structure are carried out the schematic diagram that nation obtains FOG structure surely;
Fig. 2: the schematic diagram of conducting particles during not by pressing;
Fig. 3: the schematic diagram of conducting particles during by pressing;
Fig. 4: what the utility model provided can increase the structural representation that nation determines the FOG structure of population;
Fig. 5: the upper reeded Z direction of the tool front schematic view of the screen body I/O mouth PAD of COG structure in the utility model.
In figure: 1-FPC structure; 2-COG structure; The different side's conducting film of 3-; 4-conducting particles; 5-FPC nation fixed end golden finger; 6-molybdenum aluminium molybdenum alloys layer; 7-ITO film; 8-groove.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, so that those skilled in the art can better understand the utility model being implemented, but illustrated embodiment is not as to restriction of the present utility model.
The utility model provides a kind of can increase the FOG structure that nation determines population, as shown in Figure 4 and Figure 5, comprises FPC structure 1, COG structure 2 and different side's conducting film 3(ACF).The surface of described FPC structure 1 has FPC nation fixed end golden finger 5, the surface of described COG structure 2 has screen body I/O mouth PAD, described screen body I/O mouth PAD comprises molybdenum aluminium molybdenum alloys layer 6 and ito thin film 7 setting up and down, wherein molybdenum aluminium molybdenum alloys layer 6 is in ito thin film 7 tops, and be oppositely arranged with described FPC nation fixed end golden finger 5, and between the two, there is certain interval, different side's conducting film 3 that nation determines use is set in gap.Described molybdenum aluminium molybdenum alloys layer 6 surface are formed with a plurality of grooves 8, and in described groove 8, are installed with the conducting particles 4 of described different side's conducting film 3.Utilize the groove 8 in the utility model can be so that the moving range of the coarse conducting particles 4 on molybdenum aluminium molybdenum alloys layer 6 surface in screen body I/O mouth PAD is defined in groove 8, avoid conducting particles 4 to slide and the conducting particles 4 that causes is assembled.Described screen body I/O mouth PAD is certainly as the discontinuity structure with a plurality of gaps simultaneously, described groove 8 dispersion is formed in the molybdenum aluminium molybdenum alloys layer 6 of screen body I/O mouth PAD, thereby can avoid conducting particles 4 to be extruded in the middle of the gap of two adjacent screen body I/O mouth PAD, thereby reach the ability that catches conducting particles 4 that improves.
Preferably, described groove 8 can be realized by lithographic technique.
Preferably, the degree of depth of described groove 8 equates with the thickness of described molybdenum aluminium molybdenum alloys layer 6.
Preferably, the width of described groove 8 is greater than the diameter of described conducting particles 4.
Preferably, the diameter of described conducting particles 4 is 3 μ m～5 μ m.When preparation FOG structure, different side's conducting film 3 is subject to after hot pressing, and conducting particles 4 deforms, as shown in Figure 3, the conducting particles 4 of 4 μ m diameters of take is example, when being heated perpendicular to the Z direction on different side's conducting film 3 surfaces, pressing and deform, be compressed to 2 μ m, can reach best conducting effect.Therefore, the groove 8 forming in the molybdenum aluminium molybdenum alloys layer 6 in the utility model can't affect pressing process, and the number of concrete groove and shape can be set according to concrete effect.
Preferably, described a plurality of groove 8 is uniformly distributed on described molybdenum aluminium molybdenum alloys layer 6.
Preferably, the thickness of described molybdenum aluminium molybdenum alloys layer 6 is 0.05 μ m～0.5 μ m.
Preferably, described groove 8 be shaped as circular or square.
The above embodiment is only the preferred embodiment for absolutely proving that the utility model is lifted, and protection domain of the present utility model is not limited to this.Being equal to that those skilled in the art do on the utility model basis substitutes or conversion, all within protection domain of the present utility model.Protection domain of the present utility model is as the criterion with claims.
Claims (7)
1. one kind can increase the FOG structure that nation determines population, comprise FPC structure, COG structure and different side's conducting film, the surface of described FPC structure has FPC nation fixed end golden finger, the surface of described COG structure has screen body I/O mouth PAD, described screen body I/O mouth PAD comprises the ito thin film that is positioned at COG body structure surface and the molybdenum aluminium molybdenum alloys layer that is positioned at described ito thin film surface, described molybdenum aluminium molybdenum alloys layer and described FPC nation fixed end golden finger are oppositely arranged, and between the two, be provided with different side's conducting film that nation determines use, it is characterized in that, described molybdenum aluminium molybdenum alloys layer surface is formed with a plurality of opening directions towards the groove of described FPC nation fixed end golden finger, and in described groove, be installed with the conducting particles of described different side's conducting film.
2. according to claim 1ly can increase the FOG structure that nation determines population, it is characterized in that, the degree of depth of described groove equates with the thickness of described molybdenum aluminium molybdenum alloys layer.
3. according to claim 2ly can increase the FOG structure that nation determines population, it is characterized in that, the width of described groove is greater than the diameter of described conducting particles.
4. according to claim 3ly can increase the FOG structure that nation determines population, it is characterized in that, the diameter of described conducting particles is 3 μ m～5 μ m.
5. according to claim 4ly can increase the FOG structure that nation determines population, it is characterized in that, described a plurality of grooves are uniformly distributed on described molybdenum aluminium molybdenum alloys layer.
6. according to claim 5ly can increase the FOG structure that nation determines population, it is characterized in that, the thickness of described molybdenum aluminium molybdenum alloys layer is 0.05 μ m～0.5 μ m.
7. according to claim 6ly can increase the FOG structure that nation determines population, it is characterized in that, being shaped as of described groove is circular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320879755.4U CN203773182U (en) | 2013-12-30 | 2013-12-30 | FOG (FPC (flexible printed circuit) on glass) structure capable of increasing bonding particle number |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320879755.4U CN203773182U (en) | 2013-12-30 | 2013-12-30 | FOG (FPC (flexible printed circuit) on glass) structure capable of increasing bonding particle number |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203773182U true CN203773182U (en) | 2014-08-13 |
Family
ID=51290353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320879755.4U Expired - Fee Related CN203773182U (en) | 2013-12-30 | 2013-12-30 | FOG (FPC (flexible printed circuit) on glass) structure capable of increasing bonding particle number |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203773182U (en) |
-
2013
- 2013-12-30 CN CN201320879755.4U patent/CN203773182U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103187119B (en) | Conductive film, preparation method for conductive film and touch screen comprising conductive film | |
| CN103226414B (en) | Touch screen and preparation method thereof | |
| US9516754B2 (en) | Transparent conductive film | |
| CN103106953B (en) | Conducting film and preparation method thereof and touch screen comprising the same | |
| CN103165227B (en) | Transparent conductive film and connection method thereof | |
| TWI524361B (en) | Transparent conductive film | |
| US20140335290A1 (en) | Conductive sealant, display panel and manufacturing method thereof, and display device | |
| WO2014134897A1 (en) | Touch panel and manufacturing method therefor | |
| TWI506498B (en) | Gold finger and touch screen | |
| CN203250547U (en) | Transparent conductive film | |
| CN103426502A (en) | Patterned transparent conductive film | |
| CN113066604A (en) | Conductive film and preparation method thereof | |
| CN103425302A (en) | Touch panel and production method thereof | |
| JP2015197927A (en) | capacitive touch sensing device | |
| US9383837B2 (en) | Touch screen panel and method for manufacturing same | |
| CN203178979U (en) | Touch screen induction module and display with same | |
| US9538654B2 (en) | Conductive film, method for manufacturing the same, and touch screen including the same | |
| CN203179571U (en) | Transparent conducting film | |
| CN203773182U (en) | FOG (FPC (flexible printed circuit) on glass) structure capable of increasing bonding particle number | |
| WO2021017202A1 (en) | Electronic device and cover plate thereof | |
| CN106328252A (en) | Silver nanowire conducting transparent film and manufacture method thereof | |
| CN206639202U (en) | Contact panel and display device | |
| CN204131824U (en) | A kind of flexible PCB | |
| CN108845709B (en) | Interconnection structure of nano silver wire layer, forming method thereof and touch device | |
| CN104347154B (en) | A kind of nesa coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20151230 |
|
| EXPY | Termination of patent right or utility model |