CN203761679U - Multilayer PCB - Google Patents
Multilayer PCB Download PDFInfo
- Publication number
- CN203761679U CN203761679U CN201420132025.2U CN201420132025U CN203761679U CN 203761679 U CN203761679 U CN 203761679U CN 201420132025 U CN201420132025 U CN 201420132025U CN 203761679 U CN203761679 U CN 203761679U
- Authority
- CN
- China
- Prior art keywords
- hole
- multilayer board
- welding resistance
- optical alignment
- windowed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 57
- 238000003466 welding Methods 0.000 claims description 44
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 8
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- RPUCXGXPWYXBOD-UHFFFAOYSA-N Maytine Natural products CC(=O)OCC12C(CC3C(OC(C)=O)C1(OC3(C)C)C(C)(O)CC(OC(C)=O)C2OC(C)=O)OC(=O)c1cccnc1 RPUCXGXPWYXBOD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to the technical field of PCB (Printed Circuit Board), and discloses a multilayer PCB. The multilayer PCB comprises a plurality of first optical positioning units, wherein the each first optical positioning unit comprises a first through hole arranged at a top plate and a first solder resist window arranged at the periphery of the first through hole. In the technical scheme of the multilayer PCB of the utility model, an optical positioning unit can consist of a through hole arranged at the top plate and a solder resist window arranged at the periphery of the through hole, thereby taking full advantage of the top plate, saving materials for further manufacturing a pad, and greatly reducing production cost.
Description
Technical field
The utility model relates to printed-board technology field, particularly relates to a kind of multilayer board.
Background technology
Printed circuit board (PCB), claims again printed circuit board (Printed circuit board is called for short PCB), is the supplier of electronic devices and components electrical connection.The major advantage that adopts printed circuit board (PCB) is the mistake that greatly reduces wiring and assembling, has improved the gentle production efficiency of Automated water.
According to the number of plies of wiring board, printed circuit board (PCB) can be divided into single sided board, double sided board, four laminates, six laminates and other multilayer printed circuit boards.Because circuit trace becomes increasingly complex, in order to increase the area that can connect up, preferably adopt multilayer board, multilayer board has several single sided boards and double sided board, replaces together and conductive pattern interconnects by designing requirement by adhesive material.On the top plate of multilayer board, need wall-attached surface to mount device (Surface Mounted Devices, be called for short SMD), the second laminate of multilayer board is generally ground connection (Ground, write a Chinese character in simplified form GND) layer, in order to ensure that SMD mounts accurately, therefore on the top plate of existing printed circuit board (PCB), need to make optical alignment unit (Mark unit, also referred to as optical locating point).
As depicted in figs. 1 and 2, Fig. 1 is the plan structure schematic diagram of the printed circuit board (PCB) of prior art, Fig. 2 is the cross-sectional view of the printed circuit board (PCB) of prior art, this printed circuit board (PCB) comprises multiple optical locating points 1, each optical locating point 1 comprises solder mask window 12, solder mask window 12 centers are manufactured with pad 11, the general Copper Foil that adopts of pad 11, also may tin coating on it metal, cost is higher, and while making, need to first spread one deck Copper Foil and carry out again Copper Foil corrosion and etch the shape of multiple circular pad, complex process, big for environment pollution.
Utility model content
The purpose of this utility model is to provide a kind of multilayer board, in order to reduce the cost of printed circuit board (PCB).
First the utility model embodiment provides a kind of multilayer board, comprises multiple the first optical alignment unit, and each described the first optical alignment unit comprises the first through hole that is positioned at top plate, and the first welding resistance that is positioned at described the first through hole periphery is windowed.
In technical solutions of the utility model, optical alignment unit can, by the welding resistance that is positioned at the through hole of top plate and the be positioned at through hole periphery formation of windowing, utilize top plate fully, has saved the material of other making pad, greatly reduces production cost.And the first through hole can form by the mode of machine drilling, operation is simple, reduces the pollution to environment.
Preferably, described multilayer board, also comprise the second optical alignment unit that corresponding each the first optical alignment unit arranges, each described the second optical alignment unit comprises the second through hole that is positioned at bottom plate, and the second welding resistance that is positioned at described the second through hole periphery is windowed.
In the time that the bottom plate of multilayer circuit board also needs paster is installed, also need on bottom plate, make optical alignment unit.The structure of the second optical alignment unit is identical with the structure of the first optical alignment unit.
Preferably, the aperture of described the second through hole and corresponding described the first through hole is identical and coaxially arrange.
In order to improve better the locating effect of optical alignment unit, preferred, described the first welding resistance is windowed and is windowed for cylindric, and coaxially arranges with described the first through hole; Described the second welding resistance is windowed and is windowed for cylindric, and coaxially arranges with described the second through hole.
Welding resistance is windowed and is coaxially arranged with through hole, is the conventional demand in order to meet optical alignment unit.Coaxial setting, is more conducive to identify optical locating point, improves the accuracy of identification.
Preferably, to above-mentioned multilayer board, also comprise and be positioned at window at least three soldier holes of periphery of described the first welding resistance, each described soldier hole is the through hole that penetrates described multilayer board.
The some of them at least three soldier holes can connect digitally, and some can connect in analog, ensure the Electro Magnetic Compatibility of printed circuit board (PCB).
In order further to improve the Electro Magnetic Compatibility of multilayer board, preferred, be positioned at window described at least three soldier holes of periphery of described the first welding resistance and be uniformly distributed.
The quantity in soldier hole can design according to Electro Magnetic Compatibility, and preferred, the quantity in described soldier hole is eight.
To above-mentioned any multilayer board, preferred, the degree of depth of windowing that described the first welding resistance is windowed is less than the thickness of described top plate; The degree of depth of windowing that described the second welding resistance is windowed is less than the thickness of described bottom plate.The first welding resistance is windowed and is equivalent to be positioned at the blind hole of top plate, the second welding resistance is windowed and is equivalent to be positioned at the blind hole of bottom plate, the first welding resistance is windowed and is positioned at the periphery of the first through hole, and its degree of depth is less than the degree of depth of the first through hole, has improved the identification degree of the first optical alignment unit.In like manner, also improved the identification degree of the second optical alignment unit.
To above-mentioned any multilayer board, also comprise at least one fixed via that is positioned at described multilayer board intermediate layer, the aperture of each described fixed via and described the first through hole is identical and coaxially arrange.
Intermediate layer is other layers of multilayer board except top plate and bottom plate, owing to adopting above-mentioned design, the first through hole and the second through hole and fixed via form a through hole, because the folded highdensity multilayer board of multilayer is high to space requirement, therefore, the first through hole and the second through hole can directly be got through multilayer board after completing its optical alignment effect in the position, hole of the first through hole, as screw hole, do not need to increase in addition again screw hole position, the space layout of greatly having saved multilayer board.
Preferably, the number of plies of described multilayer board is six layers or eight layers.
The technical solution of the utility model is suitable for any multilayer board, especially has significant effect for the multilayer board of many laminations, high density and layout difficulty.
Brief description of the drawings
Fig. 1 is the plan structure schematic diagram of the printed circuit board (PCB) of prior art;
Fig. 2 is the cross-sectional view of the printed circuit board (PCB) of prior art;
Fig. 3 is the structural representation of the utility model one embodiment multilayer board;
Fig. 4 is the cross-sectional view of the utility model one embodiment multilayer board;
Fig. 5 is the plan structure schematic diagram of the utility model one embodiment multilayer board;
Fig. 6 is the cross-sectional view of the multilayer board of another embodiment of the utility model.
Reference numeral:
1-optical locating point 11-pad 12-solder mask window 10-top plate 20-the second laminate
21-first through hole 22-the first welding resistance 23-second through hole 24-the second welding resistance of windowing is windowed
25-fixing hole 30-bottom plate 40-laminate 51-soldier second from the bottom hole
Embodiment
In order to reduce the cost of printed circuit board (PCB), the utility model provides a kind of multilayer board.In this technical scheme, because optical alignment unit can, by the welding resistance that is positioned at the through hole of top layer and the be positioned at through hole periphery formation of windowing, utilize top plate fully, save the material of other making pad, greatly reduce production cost.For making the purpose of this utility model, technical scheme and advantage clearer, below lift specific embodiment the utility model is described in further detail.
First the utility model embodiment provides a kind of multilayer board, as shown in Figures 3 to 5, Fig. 3 is the structural representation of the utility model one embodiment multilayer board, Fig. 4 is the cross-sectional view of the utility model one embodiment multilayer board, Fig. 5 is the plan structure schematic diagram of the utility model one embodiment multilayer board, described multilayer board, comprise multiple the first optical alignment unit, each the first optical alignment unit comprises the first through hole 21 that is positioned at top plate 10, and the first welding resistance that is positioned at the first through hole 21 peripheries windows 22.
In technical solutions of the utility model, optical alignment unit can, by the welding resistance that is positioned at the through hole of top plate 10 and the be positioned at through hole periphery formation of windowing, utilize top plate 10 fully, has saved the material of other making pad, greatly reduces production cost.And the first through hole 21 can form by the mode of machine drilling, operation is simple, reduces the pollution to environment.In the present embodiment, the first welding resistance is windowed and 22 can be adopted welding resistance green oil to window.
Shown in Fig. 4, because second laminate 20 adjacent with top plate 10 is generally as ground plane, form by spreading large-area Copper Foil, see through the first through hole 21 and can see the copper metal of the second laminate 20, the color distinction of copper metal and top plate 10 is larger, has increased the first positioning unit and the contrast of material around, in the time of follow-up location, can be used as good optical locating point, can make paster flow process capture exactly the first optical alignment unit, improve the accuracy of optical alignment.In the first through hole 21, can spray tin processing, make the first through hole 21 there is good evenness, the smooth of the edge and neat.
Shown in Fig. 4, preferably, described multilayer board, also comprise the second optical alignment unit that corresponding each the first optical alignment unit arranges, each the second optical alignment unit comprises the second through hole 23 that is positioned at bottom plate 30, and the second welding resistance that is positioned at the second through hole 23 peripheries windows 24.
In the time that the bottom plate 30 of multilayer circuit board also needs paster is installed, also need on bottom plate 30, make optical alignment unit.The structure of the second optical alignment unit is identical with the structure of the first optical alignment unit, also can adopt the above-mentioned treatment process to the first positioning unit to obtain.In addition, laminate second from the bottom is also generally ground plane or ground connection reference layer, can see the copper metal of laminate 40 second from the bottom through the second through hole 23, and therefore, raising the second optical alignment unit and the around contrast of material, improve the accuracy of location.
Shown in Fig. 4, preferred, the identical and coaxially setting in the aperture of the second through hole 23 and corresponding the first through hole 21.
Shown in Fig. 4, in order to improve better the locating effect of optical alignment unit, preferred, the first welding resistance windows 22 for cylindric windowing, and coaxially arranges with the first through hole 21; The second welding resistance windows 24 for cylindric windowing, and coaxially arranges with the second through hole 23.
Welding resistance is windowed and is coaxially arranged with through hole, is the conventional demand in order to meet optical alignment unit.Coaxial setting, is more conducive to identify optical locating point, improves the accuracy of identification.
Shown in Fig. 3, preferred, to above-mentioned multilayer board, also comprise and be positioned at window at least three soldier holes 51 of 22 peripheries of the first welding resistance, each soldier hole 51 is for penetrating the through hole of multilayer board.
The some of them at least three soldier holes 51 can connect digitally, and some can connect in analog, have improved the Electro Magnetic Compatibility of multilayer board.
Preferably, being positioned at window at least three soldier holes 51 of 22 peripheries of the first welding resistance is uniformly distributed.Equally distributed soldier hole 51, can further improve the Electro Magnetic Compatibility of multilayer board.
The quantity in soldier hole 51 can design according to Electro Magnetic Compatibility, and preferred, the quantity in soldier hole 51 is eight.
Shown in Fig. 4, to above-mentioned any multilayer board, preferred, window 22 the degree of depth of windowing of the first welding resistance is less than the thickness of top plate 10; Window 24 the degree of depth of windowing of the second welding resistance is less than the thickness of bottom plate 30.I.e. the first welding resistance 22 blind holes that are equivalent to be positioned at top plate 10 of windowing, the second welding resistance 24 blind holes that are equivalent to be positioned at bottom plate 30 of windowing, the first welding resistance 22 peripheries that are positioned at the first through hole 21 of windowing, and window 22 the degree of depth of the first welding resistance is less than the degree of depth of the first through hole 21, improve the identification degree of the first optical alignment unit, in like manner, also improved the identification degree of the second optical alignment unit.
As shown in Figure 6, Fig. 6 is the cross-sectional view of the multilayer board of another embodiment of the utility model, to above-mentioned any multilayer board, also comprise at least one fixed via that is positioned at multilayer board intermediate layer, the aperture of each fixed via and the first through hole is identical and coaxially arrange.
Intermediate layer is other layers except top plate 10 and bottom plate 30 multilayer boards, owing to adopting above-mentioned design, the first through hole and the second through hole and fixed via form a through hole, it is the fixing hole 25 shown in Fig. 6, this fixing hole 25 is used as screw hole, because the folded highdensity multilayer board of multilayer is high to space requirement, therefore, the first through hole and the second through hole can directly be got through multilayer board after completing its optical alignment effect in the position, hole of the first through hole, as screw hole, do not need to increase in addition again screw hole position, greatly save the space layout of multilayer board.In addition, this screw hole is connected with ground plane, thereby contact casing accesses the earth, has ensured the earthing effect of multilayer board, has ensured the Electro Magnetic Compatibility of multilayer board.The technical solution of the utility model is suitable for any multilayer board, especially has significant effect for the multilayer board of many laminations, high density and layout difficulty.
Multilayer board of the present utility model can be for mobile phone wiring board, computer main board, and printed circuit board (PCB) etc. for military project, the density requirements that these printed circuit board (PCB)s all mount SMD is very high, walk line density also larger, layout is also very difficult, but also the size that will accomplish screw hole and optical alignment unit is enough large, therefore, the technical solution of the utility model is more suitable for being applied to these fields.
Preferably, the number of plies of described multilayer board is six layers or eight layers.
The second laminate of six-layer printed circuit board or eight layer printed circuit boards and laminate second from the bottom generally adopt large area Copper Foil to be paved into, as ground plane or ground connection reference layer, both met the requirement of optical alignment unit, also meet the requirement as screw hole ground connection, therefore, the technical solution of the utility model is applicable to six-layer printed circuit board or eight layer printed circuit boards.
Taking preferably eight layer printed circuit boards shown in Fig. 4 as example, the manufacture craft of multilayer board of the present utility model is described, described manufacture craft comprises:
Step 1, multilayer board is carried out to one step press, and on top layer (TOP layer) plate 10, make the first through hole 21 in the position of the first optical alignment unit designing, be equivalent to make the first blind hole on whole multilayer board, the making of through hole adopts boring processing mode, the second laminate 20 is generally ground connection (Ground, guide number D) layer, the size of the first blind hole is according to the making that needs of conventional optical alignment cell size; And on bottom (BOT layer) plate 30, make the second through hole 23 in the position of the second optical alignment unit designing, be equivalent to make the second blind hole on whole multilayer board, the making of through hole adopts boring processing mode, laminate 40 second from the bottom is generally ground connection (Ground, guide number D) reference layer, the size of the second blind hole is according to the making that needs of conventional optical alignment cell size, at this, make the measure-alike and coaxial of the first through hole 21 and the second through hole 23, the coordinate of the first through hole 21 and the second through hole 23 is completely relative.Above-mentioned two holes adopt the treatment process of blind hole, can ensure that this hole has the electrical equipment of ground connection.This eight layer printed circuit board adopts the simplest stacked pressing mode, and the first blind hole and the second blind hole all use machine drilling, and cost is lower, and operation is simple.In addition, can, at the copper metallic face spray tin of the first blind hole and the second blind hole, make these two blind holes have good evenness, the smooth of the edge and neat;
Step 2, eight layer printed circuit boards of completing steps one are done to the welding resistance processing of windowing; The general welding resistance green oil that adopts, it is 22 preferably coaxial with the first through hole 21 that the first welding resistance is windowed, it is 24 preferably coaxial with the second through hole 23 that the second welding resistance is windowed, it is the conventional demand in order to meet optical locating point and developing herein, for obviously distinguishing with material around revealing copper metal part after step 1 boring, increase the contrast of Mark point and substrate.In the time of follow-up Mark point identification location, can make paster flow process capture accurately optical locating point;
Step 3, eight layer printed circuit boards are carried out to second pressing, and carry out the through hole boring in soldier hole 51, this step directly forms later stage screw hole soldier hole 51 around;
Step 4, above-mentioned several steps have completed the making in optical alignment unit and soldier hole, these steps are plastic in the making sheet process of conventional printed circuit board (PCB), carry out again the SMD paster Reflow Soldering of eight layer printed circuit boards, mounted SMD at top plate 10 and the bottom plate 30 of eight layer printed circuit boards;
Step 5, after completing steps four, also need to drill through through hole at the optical alignment unit place that screw hole is installed as need do complete machine assembling, make screw hole, general available drill drills through, and drills through aperture identical with the aperture of the first through hole.In the equal copper facing in the surface of the first through hole 21 and the second through hole 23, be connected to ground hole with the second laminate 20 and laminate second from the bottom 40 respectively, therefore, can directly receive host machine casing as screw hole, ensure Electro Magnetic Compatibility.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if these amendments of the present utility model and within modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (10)
1. a multilayer board, is characterized in that, comprises multiple the first optical alignment unit, and each described the first optical alignment unit comprises the first through hole that is positioned at top plate, and the first welding resistance that is positioned at described the first through hole periphery is windowed.
2. multilayer board as claimed in claim 1, it is characterized in that, also comprise the second optical alignment unit that corresponding each the first optical alignment unit arranges, each described the second optical alignment unit comprises the second through hole that is positioned at bottom plate, and the second welding resistance that is positioned at described the second through hole periphery is windowed.
3. multilayer board as claimed in claim 2, is characterized in that, the aperture of described the second through hole and corresponding described the first through hole is identical and coaxially arrange.
4. multilayer board as claimed in claim 2, is characterized in that, described the first welding resistance is windowed and windowed for cylindric, and coaxially arranges with described the first through hole; Described the second welding resistance is windowed and is windowed for cylindric, and coaxially arranges with described the second through hole.
5. multilayer board as claimed in claim 4, is characterized in that, also comprises and is positioned at window at least three soldier holes of periphery of described the first welding resistance, and each described soldier hole is the through hole that penetrates described multilayer board.
6. multilayer board as claimed in claim 5, is characterized in that, is positioned at window described at least three soldier holes of periphery of described the first welding resistance and is uniformly distributed.
7. multilayer board as claimed in claim 6, is characterized in that, the quantity in described soldier hole is eight.
8. multilayer board as claimed in claim 2, is characterized in that, the degree of depth of windowing that described the first welding resistance is windowed is less than the thickness of described top plate; The degree of depth of windowing that described the second welding resistance is windowed is less than the thickness of described bottom plate.
9. the multilayer board as described in claim 2～8 any one, is characterized in that, also comprises at least one fixed via that is positioned at described multilayer board intermediate layer, and the aperture of each described fixed via and described the first through hole is identical and coaxially arrange.
10. the multilayer board as described in claim 2～8 any one, is characterized in that, the number of plies of described multilayer board is six layers or eight layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420132025.2U CN203761679U (en) | 2014-03-21 | 2014-03-21 | Multilayer PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420132025.2U CN203761679U (en) | 2014-03-21 | 2014-03-21 | Multilayer PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203761679U true CN203761679U (en) | 2014-08-06 |
Family
ID=51256906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420132025.2U Expired - Lifetime CN203761679U (en) | 2014-03-21 | 2014-03-21 | Multilayer PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203761679U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333390A (en) * | 2017-08-31 | 2017-11-07 | 郑州云海信息技术有限公司 | A kind of packing forms of screw hole |
-
2014
- 2014-03-21 CN CN201420132025.2U patent/CN203761679U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333390A (en) * | 2017-08-31 | 2017-11-07 | 郑州云海信息技术有限公司 | A kind of packing forms of screw hole |
| CN107333390B (en) * | 2017-08-31 | 2020-09-22 | 苏州浪潮智能科技有限公司 | Screw hole packaging form |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140806 |
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| CX01 | Expiry of patent term |