CN203733829U - Light emitting diode packaging structure and light emitting device - Google Patents

Light emitting diode packaging structure and light emitting device Download PDF

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Publication number
CN203733829U
CN203733829U CN201320835547.4U CN201320835547U CN203733829U CN 203733829 U CN203733829 U CN 203733829U CN 201320835547 U CN201320835547 U CN 201320835547U CN 203733829 U CN203733829 U CN 203733829U
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light
wavelength conversion
conversion layer
emitting diode
conducting strip
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CN201320835547.4U
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吴震
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Abstract

The utility model provides a light emitting diode packaging structure comprising a substrate and a light emitting diode fixedly disposed on the surface of the substrate. The light emitting surface of the light emitting diode is provided with a wavelength conversion layer in a covered manner, and the light emitted by the light emitting diode can be used to excite the wavelength conversion layer to emit the excitation light. A transparent heat conduction sheet is disposed on the wavelength conversion layer in a covered manner, and an air gap is disposed between the wavelength conversion layer and the transparent heat conduction sheet, and the thickness of the air gap is smaller than or equal to 100 micrometers. The light emitting diode packaging structure is advantageous in that the heat energy on the upper surface of the wavelength conversion layer can be conducted timely by the transparent heat conduction sheet, and then the light emitting diode packaging structure can bear the excitation light incoming from the upper surface of the wavelength conversion layer, and therefore the light emitting strength can be improved.

Description

Package structure for LED and light-emitting device
Technical field
The utility model relates to light source field, particularly relates to the projection display system of a kind of light-emitting device and this light-emitting device of use.
Background technology
Rapidly, wherein light-emitting diode (LED) light source is widely used as a kind of novel light source in projection display technique in projection display technique development at present.But current subject matter is the luminance shortage of LED light source.For example, for the light valve of certain size, its optical extend is definite, and the quantity of LED has been defined, and the luminance shortage of single LEDs just has directly caused being incident in the luminous flux deficiency of light valve.Especially green LED, the especially bottleneck of whole LED light source system.
Summary of the invention
For above-mentioned problem, the utility model proposes a kind of package structure for LED, comprise substrate and the light-emitting diode that is fixed on substrate surface, in the light-emitting area of light-emitting diode, be coated with wavelength conversion layer, the light that light-emitting diode sends can excite this wavelength conversion layer to make its stimulated emission Stimulated Light; Also comprise the transparent conducting strip covering on wavelength conversion layer, between wavelength conversion layer and this transparent conducting strip, have air-gap, and the thickness of air-gap is less than or equal to 100 microns.
The utility model also proposes a kind of light-emitting device, comprises above-mentioned package structure for LED, also comprises excitaton source, and the exciting light of this excitaton source transmitting sees through transparent conducting strip and is incident in wavelength conversion layer and makes its stimulated emission Stimulated Light.
In package structure for LED of the present utility model, led away in time by transparent conducting strip because the heat energy of the upper surface of wavelength conversion layer is enough, this package structure for LED can be born from the exciting light of the upper surface incident of wavelength conversion layer, thereby improved luminous intensity.
Brief description of the drawings
Fig. 1 is the structural representation of the first embodiment of light-emitting device of the present utility model;
Fig. 2 is the structural representation of another embodiment of light-emitting device of the present utility model;
Fig. 3 is the structural representation of another embodiment of light-emitting device of the present utility model;
Fig. 4 is the structural representation of another embodiment of light-emitting device of the present utility model;
Fig. 5 is the structural representation of another embodiment of light-emitting device of the present utility model;
Fig. 6 is the structural representation of another embodiment of light-emitting device of the present utility model;
Fig. 7 and Fig. 8 are the schematic diagrames that exciting light that laser diode light source sends is incident in the hot spot that wavelength conversion layer forms;
Fig. 9 and Figure 10 be two kinds of light-emitting diode chip for backlight unit, wavelength conversion layer and transparent conducting strips encapsulating structure for example;
Figure 11 is the schematic diagram that exciting light is incident in effective district of wavelength conversion layer.
Embodiment
Fig. 1 is the structural representation of the utility model the first embodiment.As shown in Figure 1, the utility model proposes a kind of light-emitting device, comprise light-emitting diode chip for backlight unit 101, these light-emitting diode chip for backlight unit 101 surface coverage have wavelength conversion layer 102, and the first light that light-emitting diode chip for backlight unit 101 sends can excite this wavelength conversion coating 102 to make its transmitting Stimulated Light 132.Specifically, in the present embodiment, the first light of light-emitting diode chip for backlight unit transmitting is blue light, includes yellow or yellow green or green wavelength transition material in wavelength conversion layer, and wavelength conversion layer just can absorb the first light and launch gold-tinted or green-yellow light or green glow like this.Preferably, in wavelength conversion layer, include the fluorescent material (for example fluorescent material) of YAG system.In actual applications, light-emitting diode chip for backlight unit also can emitting ultraviolet light or the light of purple light or other wavelength, and the color of the light of wavelength conversion layer stimulated emission does not also limit.
The light-emitting device of the present embodiment also comprises excitaton source 103, and the exciting light 133 that this excitaton source 103 is launched is incident in the wavelength conversion layer 102 on light-emitting diode chip for backlight unit surface and makes its transmitting Stimulated Light 132.In the present embodiment, excitaton source 103 is laser diode light source 103 specifically.Preferably, in order to improve the efficiency of the laser 133 that laser diode light source sends, the light-emitting device of the present embodiment also comprises collimating lens 113, for the laser of collecting and collimation laser diode light-source 103 sends.Excitaton source 103 uses the benefit of laser diode light source to be, the collimation of laser diode light source light beam is better, and optical beam ratio is easier to control, and collection efficiency is higher, and shortcoming is that the cost compare of laser diode is high.In actual applications, excitaton source 103 also can use light-emitting diode (LED) light source, now just need to use lens or other optical element that the light of LED source is collected and project wavelength conversion layer 102 surfaces, best mode is the picture that forms LED source light-emitting area on wavelength conversion layer surface.
In the light-emitting device of the present embodiment, also comprise the light collecting device that is positioned at light-emitting diode chip for backlight unit 101 light path rear ends, for collecting the Stimulated Light 132 of sending from the wavelength conversion layer 102 on light-emitting diode chip for backlight unit surface.In the present embodiment, light collecting device comprises first lens 111 and the second lens 112, common collection and the collimating effect of realizing the light 132 that wavelength conversion layer 102 is sent of set of lenses of two lens compositions, its benefit is to use two lens can revise preferably spherical aberration.The exciting light 133 that excitaton source sends is incident in the one side of wavelength conversion layer 102 back to light-emitting diode chip for backlight unit 101 through light collecting device 111 and 112.
Light-emitting device also comprises the light-dividing device 114 between excitaton source 103 and light collecting device 111 and 112 light paths, the light path of the Stimulated Light 132 of sending for the light path of exciting light 133 that excitaton source is sent and wavelength conversion layer is separated, and avoids Stimulated Light 132 to be incident in excitaton source 103.Specifically, in the present embodiment, light-dividing device 114 reflects the light splitting filter 114 of Stimulated Light 132 for transmission exciting light 133 simultaneously, after this light splitting filter 114 of exciting light 133 transmissions, be incident in wavelength conversion layer, and the Stimulated Light 132 that wavelength conversion layer sends after light collecting device 111 and 112 is collected along the reverse outgoing of the light path of exciting light 133, thereby and be reflected from the light path of exciting light 133 and spin off and avoided being incident in excitaton source 103 being incident in after light splitting filter 114.In actual applications, light splitting filter also can reflect exciting light transmission simultaneously Stimulated Light, as long as reset like this position of excitaton source 103, exciting light light path and Stimulated Light light path is exchanged, and can realize equally the effect that both light paths are separated.
In the present embodiment, due to the optical excitation that the both sides of wavelength conversion layer 102 are sent by light-emitting diode chip for backlight unit 101 and excitaton source 103 respectively, therefore excitation energy is higher, and therefore brightness is higher.Meanwhile, light-emitting diode chip for backlight unit 101 is hot good conductors, thereby it can also promote the luminous efficiency of wavelength conversion layer 102 for wavelength conversion layer 102 dispels the heat.
In the present embodiment, light collecting device 111 and 112 is in playing collection and collimation Stimulated Light 132, also play the effect that directs excitation light 133 is incident in wavelength conversion layer 102, also Just because of this, exciting light 133 and Stimulated Light 132 must overlap in the light path at light collecting device 111 and 112 places, therefore also just need light-dividing device 114 by the light path of the two separately.This is the most frequently used optical texture, and its benefit is that optical layout is regular simple and clear; But in actual applications, also can carry out directs excitation light 133 by impracticable light collecting device, for example make exciting light 133 directly be incident in wavelength conversion layer surface with larger angle, thereby same like this 102 two surfaces of wavelength conversion layer of can realizing are excited simultaneously and realize high-luminance light output, and now light-dividing device just can omit.
In the present embodiment, preferred, light-emitting diode chip for backlight unit surface is coated with filter coating, and this filter coating transmission first light reflects Stimulated Light simultaneously.The Stimulated Light of sending due to wavelength conversion layer is isotropic emission, therefore must have quite a few Stimulated Light to launch towards light-emitting diode chip for backlight unit.Thereby the arranging of filter coating can be reflected this part Stimulated Light, its another side outgoing from wavelength conversion layer is raised the efficiency.Certainly, even without filter coating, because light-emitting diode chip for backlight unit inside exists emission layer, the Stimulated Light major part that is therefore incident in light-emitting diode chip for backlight unit inside still can be reflected out, but its reflectivity is generally lower than the reflectivity of filter coating.
In the embodiment shown in fig. 1, light-dividing device adopts light splitting filter, in fact can also adopt the light-dividing device of other type to reach the object of identical differentiation light path, as shown in Figures 2 and 3.
In the light-emitting device shown in Fig. 2, different from the light-emitting device shown in Fig. 1, light-dividing device has become speculum with holes 214, in the middle of speculum, has aperture 214a.The exciting light transmission aperture 214a that excitaton source sends is also incident in wavelength conversion layer through light collecting device, and thereby major part in the Stimulated Light that wavelength conversion layer sends can separate with the light path of exciting light in the reflector space reflection around aperture 214a, only have little Stimulated Light to be incident on excitaton source through aperture 214.
In the light-emitting device shown in Fig. 3, different from the light-emitting device shown in Fig. 1 is, light-dividing device has become small reflector 314, the exciting light that excitaton source sends is incident on small reflector 314 and is reflected onto wavelength conversion layer, and thereby major part in the Stimulated Light 332 that wavelength conversion layer sends can, from small reflector space around through being separated with the light path of exciting light, only have little Stimulated Light 332 can be incident in small reflector and be reflexed to excitaton source by it.
The embodiment of Fig. 2 and Fig. 3 is two distortion of the embodiment of Fig. 1.In explanation below, do not do all further describing of specified otherwise on the embodiment basis shown in Fig. 1, but hereinafter described technical characterictic is equally applicable to the embodiment of Fig. 2 and Fig. 3.
Fig. 4 has represented the structural representation of another embodiment of the utility model.Different from the embodiment shown in Fig. 1 is, in the present embodiment, also comprise the reflection unit 415 between wavelength conversion layer and light collecting device light path, this reflection unit 415 is for being greater than the angle of sending from wavelength conversion layer the light 434(wide-angle light of the specific angle of emergence) be reflected back wavelength conversion layer.With respect to the embodiment shown in Fig. 1, the benefit of the present embodiment is, the wide-angle light 434 that can not be utilized or utilization ratio is very low can be reflected back to wavelength conversion layer, and go out to shoot out again through scattering and the reflection of wavelength conversion layer, wherein thereby part light becomes low-angle light through the collection of light collecting device and outgoing, all the other wide-angle light are reflected back toward wavelength conversion layer again, reciprocation cycle is until most of light all forms the Stimulated Light 432 of outgoing from low-angle outgoing, thereby improved efficiency.
In actual applications, the specific angle of emergence is often determined by following factors.The first, the efficiency that the light that is greater than 65 degree sending from wavelength conversion layer is collected utilization by light collecting device is very low; The second, the optical system of light-emitting device rear end has limited the optical extend of light-emitting device, thereby has limited the lighting angle of wavelength conversion layer.In general, the specific angle of emergence is greater than 60 degree, but this is not construed as limiting.
In the present embodiment, reflection unit 434 is the sphere taking wavelength conversion layer luminescence center as the center of circle, and it roughly can be reflected back wavelength conversion layer again by the light sending from wavelength conversion layer.The benefit of sphere is that easy processing, cost are low.Effect more preferably, the ellipsoid that reflection unit 434 is is focus taking two end points of light-emitting zone of wavelength conversion layer, can realize like this another focus that the light that sends from end points of light-emitting zone can be got back to wavelength conversion layer light-emitting zone after reflection unit 434 reflections, according to rim ray theory, farthest like this ensure that the light sending from each point of the light-emitting zone of wavelength conversion layer can both get back to the light-emitting zone of wavelength conversion layer.
In the embodiment shown in fig. 4, use the reflection unit 415 between wavelength conversion layer and light collecting device light path, in fact reflection unit can also be positioned at the light path rear end of light collecting device inside and light collecting device, is described in detail respectively below with Fig. 5 and Fig. 6.
Embodiment shown in Fig. 5 is different from the embodiment of Fig. 4, and reflection unit 515 is positioned at the inside of light collecting device, between the light path of lens 511 and 512.The Stimulated Light 534 of wide-angle is positioned at the periphery of light beam after the collection of lens 511, and reflection unit 515 is arranged at and covers the peripheral of this light beam and reflect back and make it to be again incident in wavelength conversion layer this part light.And the embodiment of the embodiment shown in Fig. 6 and Fig. 4 different be, reflection unit 615 is positioned at the light path rear end of light collecting device, the Stimulated Light 634 of wide-angle is positioned at the periphery of light beam after the collection of light collecting device, and reflection unit 615 is arranged at and covers the peripheral of this light beam and reflect back and make it to be again incident in wavelength conversion layer this part light.With respect to the embodiment of Fig. 4, the benefit of the embodiment of Fig. 5 and Fig. 6 is that reflection unit is relatively large, regulate more conveniently, but shortcoming is that the Stimulated Light that reflection unit 515 and 615 can reflect is fewer than the Stimulated Light that in the embodiment of Fig. 4, reflection unit 415 reflects.In the embodiment of Fig. 5 and Fig. 6, differ and be decided to be straight line in the cross section of reflection unit 515 and 615, may be also curve, and its design principle is to incide as far as possible many wavelength conversion layers that are reflected back of its surperficial Stimulated Light.This method for designing is prior art, does not need to repeat herein.
Be all to have used laser diode light source as excitaton source in the above-described embodiments, collect and collimate simultaneously the exciting light that it sends with collimating lens.The feature of laser diode light source is that luminous point is minimum, is only several to tens microns, if be therefore positioned over the focus place of collimating lens, necessarily can form in the light path rear end of collimating lens the light beam that the angle of divergence is very little.This light beam forms very little hot spot through light collecting device post-concentration Jiao in wavelength conversion layer, as shown in Figure 7.
In Fig. 7, represent the vertical view of light-emitting diode chip for backlight unit 701 and its surperficial wavelength conversion layer 702.In figure, solid line 701a has represented the gold thread on light-emitting diode chip for backlight unit 701, and this gold thread is used to light-emitting diode chip for backlight unit 701 to power.Gold thread may be one or more (having represented 4 in figure).Small circular region 733a in figure represented in the time that the luminous point of laser diode light source is positioned at the focus of collimating lens, and exciting light is incident in the hot spot that wavelength conversion layer forms.In this case, because the very little therefore excitation light power of the area density of hot spot 733a is very large, thereby this may cause the local overheating that is excited of wavelength conversion layer to cause the decline of efficiency.A simple solution is, the luminous point of laser diode light source and the focus of collimating lens are set and have a skew, make exciting light be incident in hot spot that wavelength conversion layer forms and be greater than exciting light in the time that the luminous point of laser diode light source is positioned at the focus of collimating lens and be incident in the hot spot that wavelength conversion layer forms.For example, in Fig. 7, when laser diode light source is during with respect to collimating lens out of focus, the hot spot of exciting light on wavelength conversion layer is roughly as shown in rectangular oval 733b, and 733b is longer for more this hot spots of out of focus.Certainly the magnitude range that the length that need to control this hot spot does not exceed wavelength conversion layer is efficiency the best.The hot spot that is incident in wavelength conversion layer when exciting light is as shown in 733b time, and its local light power density is much smaller compared to hot spot 733a, and therefore efficiency has obvious lifting.
In actual applications, want to expand hot spot that exciting light is incident in wavelength conversion layer surface and also have other way.For example, light-emitting device also comprises the shaping optical element that is positioned at collimating lens light path rear end, and for laser beam being carried out to shaping, to make it be incident in the hot spot that wavelength conversion layer surface forms be predetermined shape.Shaping optical element can be diffraction optical element (DOE), can be also fly eye lens array.For instance, in fly eye lens array, each little compound eye unit is the rectangle that length-width ratio is 16:9, exciting light also can form the rectangular light spots that a uniform length-width ratio is 16:9 after being incident in the surface of wavelength conversion layer like this, as shown in the hot spot 833 in Fig. 8.
Thereby core concept of the present utility model is that two faces of the wavelength conversion layer that makes light-emitting diode chip for backlight unit surface can be excited simultaneously realizes the light output of high brightness, and this can bring a problem.The one side that definition wavelength conversion layer is attached at light-emitting diode chip for backlight unit is first surface, and one side is corresponding thereto second.In the time of the first optical excitation that wavelength conversion layer is only sent by light-emitting diode chip for backlight unit, the first light is from the first surface incident of wavelength conversion layer, and be absorbed gradually in wavelength conversion layer inside, therefore the exciting light light intensity maximum that the first surface of wavelength conversion layer bears, second exciting light light intensity minimum of bearing, and then the heat that the first surface of wavelength conversion layer produces is maximum.This part heat can directly lose through light-emitting diode chip for backlight unit.And when the excitation that wavelength conversion layer is sent from excitaton source, contrary, second of wavelength conversion layer is the face of excitation light power maximum, the therefore heat maximum of second generation, and this part heat must could arrive light-emitting diode chip for backlight unit through the conduction of wavelength conversion layer self.Due to the general poor heat conduction of wavelength conversion layer, therefore the hot radiating effect of its second generation can be not fine, thereby heat easily reduces the luminous efficiency of wavelength conversion layer in second accumulation of wavelength conversion layer.
In order to address this problem, can on second of wavelength conversion layer, cover a transparent conducting strip.The utility model also proposes a kind of package structure for LED, as shown in Figure 9.This package structure for LED, comprise substrate 916 and the light-emitting diode 901 that is fixed on substrate 916 surfaces, in the light-emitting area of light-emitting diode 901, be coated with wavelength conversion layer 902, the light that light-emitting diode 901 sends can excite this wavelength conversion layer 902 to make its stimulated emission Stimulated Light.Package structure for LED also comprises the transparent conducting strip 917 covering on wavelength conversion layer 902, have air-gap, and the thickness of air-gap is less than or equal to 100 microns between wavelength conversion layer 902 and this transparent conducting strip 917.
In this package structure for LED, the surface that transparent conducting strip 917 covers wavelength conversion layer 902 is its heat radiation.Heat is delivered in air or by near the strutting piece 918 for supporting transparent conducting strip transparent conducting strip 917 edges and is delivered to substrate by transparent conducting strip 917, and transparent conducting strip 917 is fixedly connected with substrate 916 by strutting piece 918.Preferred strutting piece is highly heat-conductive material, the heat on transparent conducting strip can be passed to substrate 916 fast.
In the present embodiment, the upper surface of wavelength conversion layer is its second, exciting light is incident on this face, the heat that this face produces is maximum, and these heats can directly be led away by transparent conducting strip, so just avoid accumulation and the excess Temperature of heat, thereby improved the efficiency of wavelength conversion layer.
The effect of the air-gap between wavelength conversion layer 902 and transparent conducting strip 917 is, thereby avoids the light that wavelength conversion layer 902 sends to propagate in the inner transverse of transparent conducting strip 917 horizontal proliferation that causes light.Experiment showed, that through inventor the thickness of air-gap is greater than after 100 microns, the heat on wavelength conversion layer 902 is difficult to conduct through transparent conducting strip, and the effect of transparent conducting strip is lost.
Transparent conducting strip is sheet glass, sapphire sheet or other cellotone sheets, and wherein sheet glass cost is very low, and the heat conductivility of sapphire sheet is better, but price is higher.Preferably, two of transparent conducting strip faces are coated with anti-reflection film.
In Fig. 9, in actual applications, in the time that working temperature is higher, wavelength conversion layer meeting deliquescing, at this moment wavelength conversion layer just may cling with the transparent conducting strip on its surface, now air-gap between the two has not existed, and the light that wavelength conversion layer sends will directly be incident in the inside of transparent conducting strip and horizontal diffusion occurs, thereby has reduced luminosity.For fear of the appearance of this phenomenon, as shown in figure 10, in package structure for LED, also comprise the hard particles 1019 being distributed between wavelength conversion layer 1002 and transparent conducting strip 1017.These hard particles 1019 are the particles of inorganic material of extinction not, and for example metal oxide for example silica, the titanium oxide of white, may be also fluorescent powder grain, may be also transparent glass dust etc., has multiple choices.If hard particles is fluorescent material, the material of this fluorescent material is identical the most preferred with the wavelength converting material in wavelength conversion layer 1002.Hard particles 1019 can also be an entirety with wavelength conversion layer or transparent conducting strip, and for example hard particles is to be machined in transparent conducting strip surface molecule.Due to the existence of hard particles 1019, in the time of wavelength conversion layer deliquescing, thereby can playing the effect that wavelength conversion layer 1002 and transparent conducting strip 1017 are kept apart, the particle of the not extinction of this layer of hard avoid the two bonding.
In actual applications, except using hard particles, also have the another kind of method of avoiding wavelength conversion layer and transparent conducting strip mutually to adhere to, wavelength conversion layer is originally as hard material, and its hardness can not adhere to each other wavelength conversion layer and transparent conducting strip mutually.For example the most frequently used, the base material of wavelength conversion layer is pottery or glass.
The utility model also proposes a kind of light-emitting device, comprises above-mentioned package structure for LED, also comprises excitaton source, and the exciting light of this excitaton source transmitting sees through transparent conducting strip and is incident in wavelength conversion layer and makes its stimulated emission Stimulated Light.
The utility model also proposes a kind of projection display system, comprises light valve and above-mentioned light-emitting device, and wherein, light valve receives the light sending from light-emitting device and it is modulated and makes it carry image information.
In actual applications, because optical extend does not mate or the length-width ratio of light valve is not mated, the light that is not often the each position on the light-emitting diode chip for backlight unit in light-emitting device can both be collected by light valve, therefore the wavelength conversion layer on light-emitting diode chip for backlight unit surface is divided into effective district and dead space, and the Stimulated Light that wherein effectively district sends can be utilized by light valve and the Stimulated Light of dead space can not be utilized by light valve.For the maximization of implementation efficiency, the exciting light that in light-emitting device, excitaton source sends is incident in effective district of wavelength conversion layer.As shown in figure 11.The surface coverage of light-emitting diode chip for backlight unit 1101 has wavelength conversion layer 1102, effective district 1102a on wavelength conversion layer 1102 has occupied most of area of wavelength conversion layer 1102, and this effective district has substantially been full of the length of wavelength conversion layer but on width, has not been full of the width of wavelength conversion layer in length as seen.Exciting light forms hot spot 1133 in the effective inside of district 1102a on wavelength conversion layer, can ensure that like this Stimulated Light being produced by excitation can both effectively be utilized by light valve.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.

Claims (10)

1. a package structure for LED, it is characterized in that, comprise substrate and the light-emitting diode that is fixed on substrate surface, in the light-emitting area of light-emitting diode, be coated with wavelength conversion layer, the light that light-emitting diode sends can excite this wavelength conversion layer to make its stimulated emission Stimulated Light; Also comprise the transparent conducting strip covering on wavelength conversion layer, between described wavelength conversion layer and this transparent conducting strip, have air-gap, and the thickness of air-gap is less than or equal to 100 microns.
2. package structure for LED according to claim 1, is characterized in that, described transparent conducting strip is sapphire sheet.
3. package structure for LED according to claim 1, is characterized in that, the edge of described transparent conducting strip is fixedly connected with described substrate.
4. package structure for LED according to claim 1, is characterized in that, also comprises the hard particles being distributed between wavelength conversion layer and transparent conducting strip.
5. package structure for LED according to claim 4, is characterized in that, described hard particles is the particles of inorganic material of extinction not.
6. package structure for LED according to claim 5, is characterized in that, described hard particles is fluorescent material, and the material of this fluorescent material is identical with the wavelength converting material in wavelength conversion layer.
7. package structure for LED according to claim 4, is characterized in that, described hard particles and wavelength conversion layer or transparent conducting strip are an entirety.
8. package structure for LED according to claim 1, is characterized in that, described wavelength conversion layer is hard material, and its hardness can not adhere to each other wavelength conversion layer and transparent conducting strip mutually.
9. package structure for LED according to claim 8, is characterized in that, the base material of described wavelength conversion layer is pottery or glass.
10. a light-emitting device, is characterized in that, comprises according to the package structure for LED described in claim 1 to 9, also comprises excitaton source, and the exciting light of this excitaton source transmitting sees through transparent conducting strip and is incident in wavelength conversion layer and makes its stimulated emission Stimulated Light.
CN201320835547.4U 2013-12-18 2013-12-18 Light emitting diode packaging structure and light emitting device Withdrawn - After Issue CN203733829U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103647011A (en) * 2013-12-18 2014-03-19 吴震 Light-emitting diode encapsulation structure and light emitting device
CN110873319A (en) * 2018-09-03 2020-03-10 深圳光峰科技股份有限公司 Wavelength conversion device and light source system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103647011A (en) * 2013-12-18 2014-03-19 吴震 Light-emitting diode encapsulation structure and light emitting device
CN103647011B (en) * 2013-12-18 2018-09-21 杨毅 Light-emitting diode encapsulation structure and light-emitting device
CN110873319A (en) * 2018-09-03 2020-03-10 深圳光峰科技股份有限公司 Wavelength conversion device and light source system

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