CN203721768U - Multi-scale microstructure packaging substrate having fractal feature - Google Patents
Multi-scale microstructure packaging substrate having fractal feature Download PDFInfo
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- CN203721768U CN203721768U CN201320875971.1U CN201320875971U CN203721768U CN 203721768 U CN203721768 U CN 203721768U CN 201320875971 U CN201320875971 U CN 201320875971U CN 203721768 U CN203721768 U CN 203721768U
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- substrate
- base plate
- packaging
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- microstructured bodies
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Abstract
The utility model discloses a multi-scale microstructure packaging substrate having a fracture feature. The multi-scale microstructure packaging substrate includes a substrate with an integral structure. The substrate includes a bottom board part. A plurality of raised first-level microstructure bodies are arranged on the bottom board part, surrounding LED chip platforms, so that a light diffuse reflection area is formed. By making the multi-scale microstructure having the fractal feature on the surface of the substrate, light reflecting area and light reflecting rate are increased and light extraction efficiency is enhanced further. By adopting the substrate with the above structure, light emitted by LED chips disposed on the substrate or light that cannot be refracted to the external and is reflect back to a lens can be reflected to the external further. By utilizing the combination of total reflection and diffuse reflection, light energy can be output effectively, so that light extraction efficiency is improved and high-luminance illumination is realized. Besides, since the light energy can be output effectively, heat is prevented from being accumulated in a pedestal, so that requirements for heat dissipation of an LED are met. The multi-scale microstructure packaging substrate is simple and convenient to implement, low in cost and distinct in technical effect.
Description
[technical field]
The utility model relates to the substrate of LED lamp, particularly a kind of multiple dimensioned micro-structural base plate for packaging with fractal characteristic.
[background technology]
LED as a kind of by electric energy conversion, be directly the luminescent device of visible ray and radiant energy, be widely regarded as top quality light source of 21 century, there is the advantages such as volume is little, the life-span is long, electrical efficiency is high, energy-conserving and environment-protective.
Generally need encapsulate LED chip, its encapsulating structure comprises LED chip, carry the substrate of this LED chip, encapsulate the light transmission package (lens) of this LED chip.The refraction coefficient of chip material is conventionally more than 2.0, and air dielectric refraction coefficient is 1, owing to only having the transition of one deck light transmission package between them, cause the LED angle of total reflection little, make luminous energy greatly can not reflect lens but be reflected back in lens, and the material manufactures such as the common aluminium of substrate of carrying LED chip, pottery, intensity of light reflection is inadequate, the luminous energy that cannot make transmitting or be reflected back in lens further reflects away, thereby causes very large luminous energy waste; In addition, because luminous energy cannot effectively export to outside lens, in heat can accumulate in, cause LED chip to continue at high temperature operation, produce very large light decay.
In order to overcome above-mentioned defect, I have developed a kind of multiple dimensioned micro-structural base plate for packaging with fractal characteristic.
[utility model content]
The purpose of this utility model technical problem to be solved is that a kind of multiple dimensioned micro-structural base plate for packaging with fractal characteristic will be provided, substrate surface produces multiple dimensioned fractal characteristic micro-structural, increase reflective area and reflecting rate, further strengthened light emission rate.The substrate that adopts said structure, makes LED chip placed thereon launch or because reflecting away the luminous energy being reflected back in lens, further reflect away, utilize total reflection to combine with diffuse reflection, luminous energy is exported effectively, thereby improved light emission rate, realize highlight illumination; In addition, because luminous energy is exported effectively, prevent that heat from accumulating in pedestal in a large number, meet the requirement of LED self-radiating, simple and easy to do, with low cost, technique effect is outstanding, has feature simple to operate, safe and reliable, with low cost.
The utility model will solve the technical scheme that its technical problem adopts: a kind of multiple dimensioned micro-structural base plate for packaging with fractal characteristic, it comprises the substrate of integrative-structure, this substrate comprises base plate, be located at the first order microstructured bodies that is distributed with a plurality of projections in base plate around LED chip platform, to form light diffuse reflection district.
Described first order microstructured bodies is tetragonous cone table shape.
Described first order microstructured bodies comprises end face and four sides, and described end face and side are equipped with a plurality of second level microstructured bodies.
Described substrate is made by aluminum or aluminum alloy material.
Described first order microstructured bodies surface coverage has reflector layer.
Described first order microstructured bodies and second level microstructured bodies shape are identical or different.
Described LED chip platform quantity is a plurality of, and their intervals arrange.
Described reflector layer can be Gold plated Layer or silver coating.
The utility model is compared produced beneficial effect with background technology:
The utility model has adopted technique scheme, has overcome the deficiency of background technology, and this substrate surface produces multiple dimensioned fractal characteristic micro-structural, has increased reflective area and reflecting rate, has further strengthened light emission rate.The substrate that adopts said structure, makes LED chip placed thereon launch or because reflecting away the luminous energy being reflected back in lens, further reflect away, utilize total reflection to combine with diffuse reflection, luminous energy is exported effectively, thereby improved light emission rate, realize highlight illumination; In addition, because luminous energy is exported effectively, prevent that heat from accumulating in pedestal in a large number, meet the requirement of LED self-radiating, simple and easy to do, with low cost, technique effect is outstanding, has feature simple to operate, safe and reliable, with low cost.
[accompanying drawing explanation]
Fig. 1 is a kind of structural representation with the multiple dimensioned micro-structural base plate for packaging of fractal characteristic in the utility model embodiment;
Fig. 2 is the structural representation of the first order microstructured bodies in embodiment of the present utility model;
Fig. 3 is for the utlity model has in fractal characteristic microstructure substrate manufacture method, operation chart while making first order microstructured bodies first direction planing operation in step 2;
Fig. 4 is for the utlity model has in fractal characteristic microstructure substrate manufacture method, operation chart while making first order microstructured bodies second direction planing operation in step 2;
Fig. 5 is the cutter schematic diagram of the utility model planing first order fractal structure.
In figure, mark is as follows:
1--base plate;
2--first order microstructured bodies;
21--second level microstructured bodies;
3--LED chip platform;
4-cutter.
[embodiment]
Describe embodiment of the present utility model below in detail, described embodiment example is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by embodiment is described with reference to the drawings, be exemplary, be intended to explain the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, it should be noted that, for the noun of locality, if any term " " center ", " laterally ", " longitudinally ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " clockwise ", indicating positions such as " counterclockwise " and position relationship are based on orientation shown in the drawings or position relationship, only for the ease of narration the utility model and simplified characterization, rather than device or the element of indication or hint indication must have specific orientation, with particular orientation structure and operation, can not be interpreted as limiting concrete protection range of the present utility model.
In addition, if any term " first ", " second ", only for describing object, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates technical characterictic.Thus, be limited with " first ", " second " feature can be expressed or implicit one or more this feature that comprises, in the utility model is described, the implication of " a plurality of " is two or more, unless otherwise expressly limited specifically.
In the utility model, except as otherwise clearly stipulating and limiting, if any terms such as term " assembling ", " being connected ", " connection ", " fixing ", should go to understand as broad sense, for example, can be to be fixedly connected with, can be also to removably connect, or connect integratedly; Also can be mechanical connection, can be to be also electrically connected to; Can be to be directly connected, can be to be also connected by intermediary, can be that two element internals are connected.For those of ordinary skills, can understand as the case may be the concrete meaning of above-mentioned term in the utility model.
In utility model, unless otherwise prescribed and limit, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, also can comprise that the first and second features are not directly contacts but contact by the other feature between them.And, First Characteristic Second Characteristic " on ", " under " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only mean that First Characteristic level height is higher than the height of Second Characteristic.First Characteristic Second Characteristic " on ", " under " and " below " comprise First Characteristic under Second Characteristic or tiltedly, or only represent that First Characteristic level height is lower than Second Characteristic.
Below in conjunction with accompanying drawing, by embodiment of the present utility model is further described, make the technical solution of the utility model and beneficial effect thereof clearer, clear and definite.
Referring to accompanying drawing 1 to 2, it preferably provides embodiment for the utility model, its a kind of multiple dimensioned micro-structural base plate for packaging with fractal characteristic, it comprises the substrate of integrative-structure, this substrate comprises base plate 1, be located at the first order microstructured bodies 2 that is distributed with a plurality of projections in base plate around LED chip platform 3, to form light diffuse reflection district.
Preferably, described first order microstructured bodies 2 is tetragonous cone table shape.
Preferably, described first order microstructured bodies 2 comprises end face and four sides, and described end face and side are equipped with a plurality of second level microstructured bodies 21.
Preferably, described substrate is made by aluminum or aluminum alloy material.
Preferably, described first order microstructured bodies 2 surface coverage have reflector layer.Described reflector layer can be Gold plated Layer or silver coating.
Preferably, described first order microstructured bodies 2 is identical or different with second level microstructured bodies 21 shapes.
Preferably, described LED chip platform 3 quantity are a plurality of, and their intervals arrange.
Based on foregoing with in conjunction with Fig. 1, Fig. 2, further describe light efficiency principle:
Be located at the first order microstructured bodies 2 that is distributed with a plurality of projections in base plate 1 around LED chip platform 3, to form light diffuse reflection district, increased reflective area and light emission rate.Surface has the fractal characteristic micro-structural of a plurality of yardsticks, the LED chip that makes to be placed on it is launched or because reflecting away the luminous energy being reflected back in lens, further reflect away, utilize total reflection to combine with diffuse reflection, luminous energy is exported effectively, thereby raising light emission rate, realizes highlight illumination; In addition, because luminous energy is exported effectively, prevent that heat from accumulating in pedestal in a large number, meet the requirement of LED self-radiating.
Just can realize preferably the utility model as mentioned above, but be not limited only to manufacture tetragonous cone table, can be also conic tower type or other fractal structure.
Comprehensive above-mentioned content is in conjunction with shown in all accompanying drawing 1-5, and the manufacture method of the above-mentioned base plate for packaging with the multiple dimensioned micro-structural of fractal characteristic is further provided, and comprises the steps:
Step 1: prepare an aluminium base and to its preliminary treatment, preliminary treatment comprises cleaning, decontamination layer;
Step 2: a plurality of first order microstructured bodies and the second level microstructured bodies produced on substrate top layer;
Step 3: substrate top layer produces after fractal micro-structural, at substrate plating surface one deck reflectorized material, forms reflector layer.
Described making in above-mentioned step 2 is first to adopt cutter 4(cutter structure as shown in Figure 5) first order microstructured bodies of the protrusion of planing out on substrate top layer, then adopt dry etching, on first order microstructured bodies, reprocess out the second level fractal structure body that size is less.
At above-mentioned making first order microstructured bodies, adopt cutter 4 to come first direction that planer adds man-hour as shown in Figure 3.At aluminium base, process unidirectional whole emissions groove, adjust again afterwards after second direction (first direction and second direction are staggered, and angle can be 90 degree) planed and can obtain first order microstructured bodies.Process equipment can adopt automatic planer or other numer centre equipment.
Make second level fractal structure body and adopt dry etching method, it utilizes the active group in the plasma that etching gas forms under the effect of electric field, with the material generation chemical reaction that is corroded, form volatile material and take away with air-flow, dry etching method forms surface configuration second level fractal structure body by orientation on aluminium base and other substrates.Dry etching method operation concrete steps and parameter no longer describe in detail, for convenience of further clear and definite and understanding of those skilled in the art, and can be referring to the disclosed a kind of dry etching method of Chinese utility model patent (CN200910054407.1).
In the description of specification, the description of reference term " embodiment ", " preferably ", " example ", " concrete example " or " some examples " etc. means specific features, structure, material or the feature in conjunction with this embodiment or example description, be contained at least one embodiment of the present utility model or example, the schematic statement for above-mentioned term not necessarily refers to identical embodiment or example in this manual.And the specific features of description, structure, material or feature can be with suitable method combinations in any one or more embodiment or example.
By the description of above-mentioned structure and principle; person of ordinary skill in the field is to be understood that; the utility model is not limited to above-mentioned embodiment; on the utility model basis, adopt the improvement of techniques well known and substitute and all drop on protection range of the present utility model, should limit it by each claim.
Claims (8)
1. a multiple dimensioned micro-structural base plate for packaging with fractal characteristic, it is characterized in that: it comprises the substrate of integrative-structure, this substrate comprises base plate, is located at the first order microstructured bodies that is distributed with a plurality of projections in base plate around LED chip platform, to form light diffuse reflection district.
2. the multiple dimensioned micro-structural base plate for packaging with fractal characteristic according to claim 1, is characterized in that: described first order microstructured bodies is tetragonous cone table shape.
3. the multiple dimensioned micro-structural base plate for packaging with fractal characteristic according to claim 2, is characterized in that: described first order microstructured bodies comprises end face and four sides, and described end face and side are equipped with a plurality of second level microstructured bodies.
4. according to the multiple dimensioned micro-structural base plate for packaging with fractal characteristic described in any one in claim 1-3, it is characterized in that: described substrate is made by aluminum or aluminum alloy material.
5. the multiple dimensioned micro-structural base plate for packaging with fractal characteristic according to claim 4, is characterized in that: described first order microstructured bodies surface coverage has reflector layer.
6. the multiple dimensioned micro-structural base plate for packaging with fractal characteristic according to claim 2, is characterized in that: described first order microstructured bodies and second level microstructured bodies shape are identical or different.
7. the multiple dimensioned micro-structural base plate for packaging with fractal characteristic according to claim 2, is characterized in that: described LED chip platform quantity is a plurality of, and their intervals arrange.
8. the manufacture method of base plate for packaging according to claim 5, is characterized in that: described reflector layer is Gold plated Layer or silver coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320875971.1U CN203721768U (en) | 2013-12-27 | 2013-12-27 | Multi-scale microstructure packaging substrate having fractal feature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320875971.1U CN203721768U (en) | 2013-12-27 | 2013-12-27 | Multi-scale microstructure packaging substrate having fractal feature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203721768U true CN203721768U (en) | 2014-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320875971.1U Withdrawn - After Issue CN203721768U (en) | 2013-12-27 | 2013-12-27 | Multi-scale microstructure packaging substrate having fractal feature |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682062A (en) * | 2013-12-27 | 2014-03-26 | 中山职业技术学院 | Multi-scale microstructural packaging substrate with fractal feature and manufacturing method thereof |
-
2013
- 2013-12-27 CN CN201320875971.1U patent/CN203721768U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682062A (en) * | 2013-12-27 | 2014-03-26 | 中山职业技术学院 | Multi-scale microstructural packaging substrate with fractal feature and manufacturing method thereof |
| CN103682062B (en) * | 2013-12-27 | 2016-08-17 | 中山职业技术学院 | A kind of multiple dimensioned micro structure base plate for packaging with fractal characteristic and manufacture method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140716 Effective date of abandoning: 20160817 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |