CN203674264U - Low thermal resistance LED nail lamp structure - Google Patents
Low thermal resistance LED nail lamp structure Download PDFInfo
- Publication number
- CN203674264U CN203674264U CN201420052328.3U CN201420052328U CN203674264U CN 203674264 U CN203674264 U CN 203674264U CN 201420052328 U CN201420052328 U CN 201420052328U CN 203674264 U CN203674264 U CN 203674264U
- Authority
- CN
- China
- Prior art keywords
- led chip
- copper foil
- bonding
- glue
- thermal resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003292 glue Substances 0.000 claims abstract description 56
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000011889 copper foil Substances 0.000 claims abstract description 38
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- 230000004888 barrier function Effects 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000004411 aluminium Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 abstract 3
- 239000007787 solid Substances 0.000 abstract 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a low thermal resistance LED nail lamp structure, which comprises an LED chip, and also comprises an aluminum plate, an insulating layer and a copper foil which are laminated from bottom to top. A hollow part is formed by hollowing the middle of the copper foil. The LED chip is arranged on the hollow part. A bottom of the LED chip is bonded with solid crystal glue, and the solid crystal glue is bonded with the insulating layer. A positive pole of the LED chip is connected with a positive end of the copper foil, and a negative pole of the LED chip is connected with a negative end of the copper foil. The hollow part is also covered with fluorescent glue, and the LED chip and the solid crystal glue are arranged in the fluorescence glue. The low thermal resistance LED nail lamp structure can make the LED chip obtain good heat dissipation, and increase the service life.
Description
Technical field
The utility model relates to nail lamp, has the low thermal resistance LED of relating to nail modulated structure.
Background technology
As shown in Figure 1, traditional LED nail lamp adopts SMD LED lamp pearl, it mainly comprises: LED chip 1, crystal-bonding adhesive 2, brazing point, tin cream 3, Copper Foil 4, insulating barrier 5, aluminium sheet 6, fluorescent glue 7, lead frame 8, fluorescent glue 7 is gathered in the PPA plastics 9 at lead frame 8 middle parts, while using this kind of lamp pearl module, in the positive and negative terminal conducting constant current DC power supply of Copper Foil 4, excite LED chip 1 to produce ultraviolet light to being coated on the optic-solidified adhesive on nail face, carry out dry solidification.The problem that the utilization of this kind of LED nail lamp exists is that LED chip heat radiation is bad, the hot conduction sequence of LED chip is: LED chip 1, crystal-bonding adhesive 2, brazing point, tin cream 3, Copper Foil 4, insulating barrier 5, aluminium sheet 6, the heat energy of visible LED chip 1 will be transmitted to heat-dissipating aluminium plate need be via the interface of five layers, so high and difficult heat radiation of thermal resistance, the easy aged deterioration of LED chip of high heat, causes life-span, light efficiency, light decay and the colour temperature relaxation phenomenon of LED chip.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide low thermal resistance LED nail modulated structure, makes LED chip obtain good heat radiating, improves the life-span.
The purpose of this utility model adopts following technical scheme to realize:
Low thermal resistance LED nail modulated structure, comprise LED chip and stacked aluminium sheet, insulating barrier, Copper Foil from the bottom to top, the middle part hollow out of described Copper Foil forms hollow-out parts, and described LED chip is positioned at this hollow-out parts place, the bottom of LED chip is bonded with crystal-bonding adhesive, and crystal-bonding adhesive and insulating barrier are bonding; The positive pole of described LED chip is connected with the anode of Copper Foil, and the negative pole of LED chip is connected with the negative terminal of Copper Foil; Described hollow-out parts is also coated with fluorescent glue, and described LED chip, crystal-bonding adhesive are positioned at fluorescent glue.
On the basis of the above, the utility model also can do following improvement:
The utility model also comprises the first key zygonema and the second bonding line that are all positioned at fluorescent glue, and the positive pole of described LED chip is connected with the anode of Copper Foil by first key zygonema, and the negative pole of LED chip is connected with the negative terminal of Copper Foil by the second bonding line.
The anode welding of described first key zygonema and Copper Foil, and on this pad, be coated with the first protection glue, a side of this first protection glue is positioned at fluorescent glue and bonding with insulating barrier, and it is outer and bonding with Copper Foil that the opposite side of the first protection glue is positioned at fluorescent glue.
The negative terminal welding of described the second bonding line and Copper Foil, and on this pad, be coated with the second protection glue, a side of this second protection glue is positioned at fluorescent glue and bonding with insulating barrier, and it is outer and bonding with Copper Foil that the opposite side of the second protection glue is positioned at fluorescent glue.
Described fluorescent glue is the ball arcuation of evagination.
Compared to existing technology, the beneficial effects of the utility model are:
LED chip of the present utility model is directly bonded on insulating barrier by crystal-bonding adhesive at hollow-out parts place, the heat energy of the generation of this LED chip only needs just can arrive aluminium sheet through crystal-bonding adhesive and insulating barrier two layer medium, greatly improve radiating effect, extend useful life, and under the covering effect of fluorescent glue, can guarantee again fixedly securing of LED chip, avoid causing the phenomenon of LED chip light efficiency, light decay and colour temperature decay.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing LED nail lamp;
Fig. 2 is the structural representation of the utility model LED nail lamp.
In figure: 1, LED chip; 2, crystal-bonding adhesive; 3, tin cream; 4, Copper Foil; 41, hollow-out parts; 5, insulating barrier; 6, aluminium sheet; 7, fluorescent glue; 8, lead frame; 9, PPA plastics; 10, first key zygonema; 11, the second bonding line; 12, the first protection glue; 13, the second protection glue.
Embodiment
Low thermal resistance LED nail modulated structure as shown in Figure 2, comprise LED chip 1 and stacked aluminium sheet 6, insulating barrier 5, Copper Foil 4 from the bottom to top, the middle part hollow out of Copper Foil 4 forms hollow-out parts 41, LED chip 1 is positioned at this hollow-out parts 41 places, the bottom of LED chip 1 is bonded with crystal-bonding adhesive 2, crystal-bonding adhesive 2 is bonding with insulating barrier 5, and insulating barrier, for LED chip 1, Copper Foil 4 are isolated with aluminium sheet 6, prevents electric leakage.
The positive pole of LED chip 1 is connected with the anode of Copper Foil 4, and the negative pole of LED chip 1 is connected with the negative terminal of Copper Foil 4; Hollow-out parts 41 is also coated with fluorescent glue 7, and LED chip 1, crystal-bonding adhesive 2 are positioned at fluorescent glue 7.
LED chip 1 is directly bonded on insulating barrier 5 by crystal-bonding adhesive 2 at hollow-out parts 41 places, and LED chip 1 is protected and fixedly secured in fluorescent glue 7 simultaneously.The heat energy of the generation of this LED chip 1 only needs just can arrive aluminium sheet 6 through crystal-bonding adhesive 2 and insulating barrier 5 two layer medium, and radiating effect is good.Wherein, fluorescent glue 7 is the ball arcuation of evagination, and the ultraviolet light that polymerizable LED chip 1 sends is beneficial to dry solidification and is coated on the optic-solidified adhesive on nail face.
The increase of this example is provided with the first key zygonema 10 and the second bonding line 11 that are all positioned at fluorescent glue 7, and the positive pole of LED chip 1 is connected with the anode of Copper Foil 4 by first key zygonema 10, and the negative pole of LED chip 1 is connected with the negative terminal of Copper Foil 4 by the second bonding line 11.First key zygonema 10 is welded with the anode of Copper Foil 4; and on this pad, be coated with the first protection glue 12; one side of this first protection glue 12 is positioned at fluorescent glue 7 and bonding with insulating barrier 5, and it is outer and bonding with Copper Foil 4 that the opposite side of the first protection glue 12 is positioned at fluorescent glue 7.The second bonding line 11 welds with the negative terminal of Copper Foil 4; and on this pad, be coated with the second protection glue 13; one side of this second protection glue 13 is positioned at fluorescent glue 7 and bonding with insulating barrier 5, and it is outer and bonding with Copper Foil 4 that the opposite side of the second protection glue 13 is positioned at fluorescent glue 7.Due to the protected glue protection in pad place of above-mentioned bonding line and Copper Foil 4, both assistant reinforcement had been fixed fluorescent glue 7 and LED chip 1, made again bonding line obtain fixedly securing, and promoted shock-resistant ability, life-saving.
Above-mentioned execution mode is only preferred implementation of the present utility model; the scope that can not limit with this utility model protection, the variation of any unsubstantiality that those skilled in the art does on basis of the present utility model and replacement all belong to the utility model scope required for protection.
Claims (5)
1. low thermal resistance LED nail modulated structure, it is characterized in that: comprise LED chip and stacked aluminium sheet, insulating barrier, Copper Foil from the bottom to top, the middle part hollow out of described Copper Foil forms hollow-out parts, described LED chip is positioned at this hollow-out parts place, the bottom of LED chip is bonded with crystal-bonding adhesive, and crystal-bonding adhesive and insulating barrier are bonding; The positive pole of described LED chip is connected with the anode of Copper Foil, and the negative pole of LED chip is connected with the negative terminal of Copper Foil; Described hollow-out parts is also coated with fluorescent glue, and described LED chip, crystal-bonding adhesive are positioned at fluorescent glue.
2. low thermal resistance LED nail modulated structure according to claim 1, it is characterized in that: also comprise the first key zygonema and the second bonding line that are all positioned at fluorescent glue, the positive pole of described LED chip is connected with the anode of Copper Foil by first key zygonema, and the negative pole of LED chip is connected with the negative terminal of Copper Foil by the second bonding line.
3. low thermal resistance LED nail modulated structure according to claim 2; it is characterized in that: the anode welding of described first key zygonema and Copper Foil; and on this pad, be coated with the first protection glue; one side of this first protection glue is positioned at fluorescent glue and bonding with insulating barrier, and it is outer and bonding with Copper Foil that the opposite side of the first protection glue is positioned at fluorescent glue.
4. low thermal resistance LED nail modulated structure according to claim 3; it is characterized in that: the negative terminal welding of described the second bonding line and Copper Foil; and on this pad, be coated with the second protection glue; one side of this second protection glue is positioned at fluorescent glue and bonding with insulating barrier, and it is outer and bonding with Copper Foil that the opposite side of the second protection glue is positioned at fluorescent glue.
5. according to the low thermal resistance LED nail modulated structure described in claim 1 ~ 4 any one, it is characterized in that: described fluorescent glue is the ball arcuation of evagination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420052328.3U CN203674264U (en) | 2014-01-26 | 2014-01-26 | Low thermal resistance LED nail lamp structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420052328.3U CN203674264U (en) | 2014-01-26 | 2014-01-26 | Low thermal resistance LED nail lamp structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203674264U true CN203674264U (en) | 2014-06-25 |
Family
ID=50970528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420052328.3U Expired - Fee Related CN203674264U (en) | 2014-01-26 | 2014-01-26 | Low thermal resistance LED nail lamp structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203674264U (en) |
-
2014
- 2014-01-26 CN CN201420052328.3U patent/CN203674264U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101984510A (en) | Flexibly connected light-emitting diode (LED) device based on liquid metal base | |
| CN207637835U (en) | A kind of full-color COB display screens lamp bead encapsulation welding tray structure | |
| CN201232984Y (en) | Radiating module for LED lamp | |
| CN203836663U (en) | LED light source with novel package structure | |
| CN203674264U (en) | Low thermal resistance LED nail lamp structure | |
| CN201448618U (en) | Dispersed liquid heat emission LED lamp | |
| CN201363700Y (en) | Radiating structure of LED | |
| CN201780997U (en) | Heat radiating structure used in LED chip | |
| CN201416866Y (en) | Plate type radiator structure used for LEDs | |
| CN208028050U (en) | A kind of spliced uniform-temperature plate heat dissipating device | |
| CN202712234U (en) | Solar cell module having heat-dissipation packaging structure | |
| CN201570516U (en) | LED packaging structure | |
| CN201779608U (en) | Heat dissipating device for LED lamp | |
| CN101806439B (en) | Heat dissipation structure of LED | |
| CN202955502U (en) | Light emitting diode (LED) lamp with glass fiber board as heat conduction substrate | |
| CN201378598Y (en) | Encapsulation structure of high-power light emitting diode with high light emitting rate | |
| CN204834676U (en) | LED light source module based on mirror aluminum substrate | |
| CN202395031U (en) | High-power LED support structure | |
| CN204834684U (en) | Adopt COB light source of face down chip encapsulation | |
| CN203503693U (en) | Power type LED packaging structure | |
| CN202585415U (en) | Aluminum base row type integrated LED device | |
| CN204441282U (en) | A kind of COB light source technical field with excellent heat dispersion performance for outdoor lighting | |
| CN202708750U (en) | LED (light emitting diode) lamp bead | |
| CN216896850U (en) | LED light source of high-efficient heat conduction | |
| CN202561697U (en) | Novel LED street lamp radiating device with membrane circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170426 Address after: Water Tai Chong Industrial Zone Nanhai District 528200 Guangdong city of Foshan Province Patentee after: DONG TIAN YANG INDUSTRIAL CO., LTD. Address before: Water Tai Chong Industrial Zone Nanhai District 528200 Guangdong city of Foshan Province Patentee before: Liu Xuerong |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20190126 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |