CN203589016U - Chip capable of resisting invasive attacks - Google Patents
Chip capable of resisting invasive attacks Download PDFInfo
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- CN203589016U CN203589016U CN201320624199.6U CN201320624199U CN203589016U CN 203589016 U CN203589016 U CN 203589016U CN 201320624199 U CN201320624199 U CN 201320624199U CN 203589016 U CN203589016 U CN 203589016U
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- 238000004519 manufacturing process Methods 0.000 description 7
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- 238000005260 corrosion Methods 0.000 description 1
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Abstract
The utility model relates to a chip capable of resisting invasive attacks. The chip capable of resisting the invasive attacks comprises more than two contact points extending from the inside of the chip to an external surface of the chip; a conductive medium attached to the external surface of the chip; and a detection circuit, wherein the detection circuit is integrated in the chip and used for detecting interconnection information between at least two contact points among the more than two contact points to obtain reference data information, the reference data information is stored in a nonvolatile memory of the chip, when the chip is electrified, the interconnection information between the at least two contact points is detected again to obtain assessment data information, and whether the chip is exposed to the invasive attacks or not is judged according to the reference data information and the assessment data information. The chip capable of resisting the invasive attacks has the advantages that the process of chip self-detection for detecting whether a package is damaged or not can be realized and an attack resisting effect is reached.
Description
Technical field
The utility model relates to microelectronic, relates in particular to the chip that a kind of anti-intrusive mood is attacked.
Background technology
In the information age, information security is one of problem of paying attention to most of people.By chip package, in suitable shell, be the steps necessary of using chip.For chip is implemented, intrusive mood is attacked or half intrusive mood is attacked, and first step is exactly decapsulation, that is, chip nude film is disassembled out from its package casing.Then, assailant implements follow-up attack step to chip again, for example, corrosion chip surface passivation layer is to expose metal wire, then by some technological means, for example, focused ion beam (Focused Ion beam, be called for short FIB) or the technology such as microprobe, carry out some information in the analysis chip course of work.Hence one can see that, and the encapsulation of protection chip can increase to a certain extent assailant and implement the difficulty of attacking, and makes chip safer.
In prior art, US5030796 provides a kind of method that chip antagonism intrusive mood is attacked, and makes chip destroyed in the process of decapsulation, thus the information security of protection chip.But said method has significant limitation, it only uses the de-encapsulation method of particular etch solvent effective to those, and invalid to other de-encapsulation method, make assailant be easy to evade above-mentioned this method, and use additive method instead, destroy encapsulation, obtain chip nude film, then implement to attack.
Utility model content
The chip that the utility model provides a kind of anti-intrusive mood to attack, in order to realize chip from detecting whether destroyed process of encapsulation, thereby plays the effect of anti-attack.
The chip that the utility model provides a kind of anti-intrusive mood to attack, comprising:
More than two contact point, extends to the outer surface of described chip from the inside of described chip;
Conducting medium, is attached to the outer surface of described chip;
Testing circuit, be integrated in described chip internal, for detection of described more than two interconnected information between at least two contact points in contact point, obtain reference data information, described reference data information is stored in the nonvolatile memory of described chip, when after described chip power, again the interconnected information described in detecting between at least two contact points, obtain assessment data information, according to described reference data information and described assessment data information, judge whether described chip is subject to intrusive mood and attacks.
In the utility model, more than two contact point extends to the outer surface of chip from the inside of chip, conducting medium is attached to the outer surface of chip, testing circuit is integrated in chip internal, for detection of the interconnected information between at least two contact points, obtain reference data information, with reference to data information memory in the nonvolatile memory of chip, when after chip power, again the interconnected information described in detecting between at least two contact points, obtain assessment data information, according to reference data information and assessment data information, judge whether chip is subject to intrusive mood and attacks.Like this, once conducting medium is destroyed, interconnected information between described at least two contact points will be destroyed, chip again detects the assessment data information obtaining when powering on will be different with reference data information, so can certainly detect chip conducting medium is destroyed, chip will send alarm signal to system, thereby can defend any attack section of having that encapsulation could be implemented that needs to destroy.In addition, in the utility model, for different chips, the characteristic of conducting medium, dosage, shape, position, quantity can be different, cause the inner data difference of preserving of different device chips, so, even if assailant uses certain attack means to obtain the internal data of a chip, assailant is attacked to another one chip also without any helping, so just improved and implemented the difficulty of attack, thereby ensured the high security of chip.
Accompanying drawing explanation
Fig. 1-Fig. 2 is the structural representation of chip first embodiment of the anti-intrusive mood attack of the utility model;
Fig. 3 is the structural representation of chip second embodiment of the anti-intrusive mood attack of the utility model;
Fig. 4 is the work schematic diagram of the testing circuit shown in Fig. 1 in chip the first embodiment of attacking of the anti-intrusive mood of the utility model;
Fig. 5 is the structural representation of chip the 3rd embodiment of the anti-intrusive mood attack of the utility model;
Fig. 6 is the structural representation of chip the 4th embodiment of the anti-intrusive mood attack of the utility model;
Fig. 7 is the schematic flow sheet of the manufacture method embodiment of the chip of the anti-intrusive mood attack of the utility model;
Fig. 8-Fig. 9 is the structural representation that in the manufacture method embodiment of the chip attacked of the anti-intrusive mood of the utility model, the contact point shown in Fig. 7 is positioned at chip side surface;
Figure 10-Figure 13 is the shape schematic diagram of the conducting medium shown in Fig. 7 in the manufacture method embodiment of the chip attacked of the anti-intrusive mood of the utility model;
Figure 14 is the schematic flow sheet that the chip of the anti-intrusive mood attack of the utility model carries out the embodiment of the method for intrusive mood attack detecting;
Figure 15-Figure 17 is the explanation schematic diagram that chip that the anti-intrusive mood of the utility model is attacked carries out the chip in the schematic flow sheet shown in Figure 14 in the embodiment of the method for intrusive mood attack detecting and whether be subject to the determination methods that intrusive mood attacks.
Embodiment
Below in conjunction with specification drawings and specific embodiments, the utility model will be further described.
As Figure 1-Figure 2, the structural representation of chip the first embodiment attacking for the anti-intrusive mood of the utility model, the chip 11 that this anti-intrusive mood is attacked can comprise: more than two contact point, conducting medium 12 and testing circuit 111, and testing circuit 111 is integrated in chip 11 inside; More than two contact point extends to the outer surface of chip 11 from the inside of chip 11; More than two contact point comprises: contact point 201,202,203,204 ... 20n, n is more than or equal to 2 natural number.Conducting medium 12 is attached to the outer surface of chip 11; Testing circuit 111 is for detection of the interconnected information between at least two contact points in more than two contact point, obtain reference data information, with reference to data information memory in the nonvolatile memory of chip 11, after chip 11 powers on, again detect the interconnected information between at least two contact points, obtain assessment data information, according to reference data information and assessment data information, judge whether chip 11 is subject to intrusive mood and attacks.Alternatively, the interconnected information between at least two contact points can comprise at least one in following: whether current value, the signal between resistance value, at least two contact points between at least two contact points flowed through has electrical connection between delay value between at least two contact points and at least two contact points.Alternatively, nonvolatile memory can include but not limited to: read-only memory (Read-Only Memory, hereinafter to be referred as: ROM), flash memory (Flash Memory, hereinafter to be referred as: FLASH), EEPROM (Electrically Erasable Programmable Read Only Memo) (Electrically Erasable Programmable Read-Only Memory, hereinafter to be referred as: EEPROM) and disposable programmable memory (One Time Programmable Read-Only Memory, hereinafter to be referred as, OTPROM).
In the present embodiment, more than two contact point extends to the outer surface of chip 11 from the inside of chip 11, conducting medium 12 is attached to the outer surface of chip 11, testing circuit 111 is integrated in chip 11 inside, for detection of the interconnected information between at least two contact points, obtain reference data information, with reference to data information memory in the nonvolatile memory of chip 11, after chip 11 powers on, again the interconnected information described in detecting between at least two contact points, obtain assessment data information, according to reference data information and assessment data information, judge whether chip 11 is subject to intrusive mood and attacks, like this, once conducting medium is destroyed, interconnected information between described at least two contact points will be changed, after chip discovery is under attack, meeting automatic alarm, thereby improved the enforcement difficulty that intrusive mood is attacked, ensured the high security of chip.
Alternatively, conducting medium is specifically as follows conducting resinl, conductive paint etc. and can be attached to the conducting medium of chip surface.
Alternatively, conducting medium 12 covers all or part of contact point.Conducting medium 12 also can not cover any contact point, and the contact point that conducting medium covers should be more than or equal to zero.For example, structural representation as shown in Figure 1 represents that conducting medium part covers contact point, comprise: contact point 201,202,203,204 ... 20n, conducting medium 12 is attached on the front surface of chip 11, wherein, the contact point being covered by conducting medium 12 is also divided into the contact point of whole coverings and the contact point that part covers, and the contact point all covering has point of contact 202, the contact point that part covers has point of contact 201, and the contact point that has covering or not has point of contact 203; Figure 2 shows that the structural representation of A-A position cross section in the structural representation shown in Fig. 1.Due to the existence of conducting medium 12, the contact point being covered by conducting medium 12 is electrically connected, what is called is electrically connected and refers to the state linking together between interiors of products difference on electrology characteristic, for example, between contact point 201 and contact point 202, exist and be electrically connected, between the two, can have electric current to flow through.Conducting medium 12 does not have between chlamydate contact point and is not electrically connected, and for example, contact point 203 and contact point 204, do not have electric current and flow through between the two.Conducting medium 12 do not have chlamydate contact point and the contact point that covered by conducting medium 12 between be not also electrically connected, for example, between contact point 203 and contact point 204 and contact point 201, do not exist and be electrically connected, between contact point 203 and contact point 204 and contact point 202, also do not exist and be electrically connected.
Alternatively, as shown in Figure 3, the structural representation of chip the second embodiment attacking for the anti-intrusive mood of the utility model, the chip 11 that this anti-intrusive mood is attacked can comprise: more than two contact point, conducting medium 12, testing circuit 111 and dielectric 15, and testing circuit 111 is integrated in chip 11 inside; More than two contact point extends to the outer surface of chip 11 from the inside of chip 11; More than two contact point comprises: contact point 201,202,203,204 ... 20n.Conducting medium 12 is attached to the outer surface of chip 11; Testing circuit 111 is for detection of the interconnected information between at least two contact points, obtain reference data information, with reference to data information memory in the nonvolatile memory of chip 11, after chip 11 powers on, again the interconnected information described in detecting between at least two contact points, obtain assessment data information, according to reference data information and assessment data information, judge whether chip 11 is subject to intrusive mood and attacks; Dielectric 15 is for covering conducting medium 12.The object that covers again one deck dielectric 15 on conducting medium 12 is that dielectric can be obscured conducting medium, can improve like this barrier of attack, increases the difficulty of implementing attack.Alternatively, dielectric can be insulating cement.
Alternatively, testing circuit is also for detection of the interconnected information between at least two contact points that reselect, obtain new reference data information, new reference data information is stored in the nonvolatile memory of chip, when after chip power, again detect the interconnected information between at least two contact points that reselect, obtain new assessment data information, according to new reference data information and new assessment data information, judge whether chip receives intrusive mood attack.The above this Dynamic Selection function that testing circuit has can be passed through hardware circuit, central processing unit (Central Processing Unit, hereinafter to be referred as: CPU) or micro-control unit (Micro Control Unit, hereinafter to be referred as: MCU) realize.As shown in Figure 4, the work schematic diagram of the testing circuit shown in Fig. 1 in chip the first embodiment attacking for the anti-intrusive mood of the utility model.The interconnected information that testing circuit detects between at least two contact points that reselect should be after default detection number of times or reselect at least two contact points after scheduled duration or under privileged mode, and detect the interconnected information between these contact points; Can select two contact points, three contact points or more until select institute to have point of contact; The default number of times that detects can be more than or equal to 1 time.For example, when the outer surface of chip 11 has while exceeding two contact points, first, testing circuit 111 is set and detects the interconnected information between contact point 201 and contact point 202 and preserve; Selecting default detection number of times is 10 times; So, detect after 10 times, testing circuit 111 can reselect at least two contact points, can select contact point 203 and contact point 204 and detect contact point 203 and contact point 204 between interconnected information, more after new data and preserve.Chip enters after privileged mode, for example: administrator right, also can reselect contact point.When chip 11 powers on, testing circuit 111 detects the interconnected information between contact point 203 and contact point 204 again, obtains assessment data information; Finally, according to reference data information and assessment data information, judge whether chip 11 is subject to intrusive mood and attacks; When reference data information and assessment data information mutually unison is less than 80%, can judge chip and be subject to intrusive mood and attack, at this moment chip will send alarm signal to system, shows that chip has suffered intrusive mood attack.
Alternatively, as shown in Figure 5, the structural representation of chip the 3rd embodiment attacking for the anti-intrusive mood of the utility model, the chip that this anti-intrusive mood is attacked can comprise: more than two contact point, conducting medium 12, testing circuit 111 and chip carrier 13, and testing circuit 111 is integrated in chip 11 inside; More than two contact point extends to the outer surface of chip 11 from the inside of chip 11; More than two contact point comprises: contact point 201,202,203,204 ... 20n.Conducting medium 12 is attached to the outer surface of chip 11; Testing circuit 111 is for detection of the interconnected information between at least two contact points, obtain reference data information, with reference to data information memory in the nonvolatile memory of chip 11, after chip 11 powers on, again detect the interconnected information between at least two contact points, obtain assessment data information, according to reference data information and assessment data information, judge whether chip 11 is subject to intrusive mood and attacks; Chip carrier 13 is for fixed chip 11 when the packaged chip 11.Alternatively, chip carrier is specially: printed circuit board (PCB) (Printed circuit board, hereinafter to be referred as, pcb board).If conducting medium 12 is attached to the lower surface of chip 11, that should carry out before chip 11 is not also fixed on chip carrier 13.
Alternatively, as shown in Figure 6, the structural representation of chip the 4th embodiment attacking for the anti-intrusive mood of the utility model, the chip that this anti-intrusive mood is attacked can comprise: more than two contact point, conducting medium 12, testing circuit 111, chip carrier 13 and package casing material 14, and testing circuit 111 is integrated in chip 11 inside; More than two contact point extends to the outer surface of chip 11 from the inside of chip 11; More than two contact point comprises: contact point 201,202,203,204 ... 20n.Conducting medium 12 is attached to the outer surface of chip 11; Testing circuit 111 is for detection of the interconnected information between at least two contact points in more than two contact point, obtain reference data information, with reference to data information memory in the nonvolatile memory of chip 11, after chip 11 powers on, again detect the interconnected information between at least two contact points, obtain assessment data information, according to reference data information and assessment data information, judge whether chip 11 is subject to intrusive mood and attacks; Chip carrier 13 is for fixed chip 11 when the packaged chip 11; Package casing material 14 is for packaged chip 11.Package casing material 14 and chip carrier 13 are wrapped in chip 11 in the shell of the two composition jointly, and protection chip avoids physics and chemistry injury.
As shown in Figure 7, the schematic flow sheet of the manufacture method embodiment of the chip of attacking for the anti-intrusive mood of the utility model, the manufacture method of the chip that this anti-intrusive mood is attacked can comprise the steps:
Step 62, at least two contact points are set, from chip internal, extend to the outer surface of chip;
Alternatively, contact point can be positioned at front surface, side surface or front surface and the side surface of chip, as shown in Fig. 8-Fig. 9, in the manufacture method embodiment of the chip of attacking for the anti-intrusive mood of the utility model, the contact point shown in Fig. 7 is positioned at the structural representation on chip side surface, Figure 8 shows that the front surface of chip and side surface have the front surface schematic diagram of the embodiment of contact point simultaneously, chip 11 front surfaces have point of contact 201,202,203 ..., 20n.Fig. 9 is the side surface schematic diagram of A-A position embodiment illustrated in fig. 8, and chip 11 side surfaces have point of contact 301,302 ..., 30n.Conducting medium 12 has covered part front surface and the part side surface of chip 11 simultaneously.Due to the existence of conducting medium 12, the contact point being covered by conducting medium 12 is electrically connected, and for example, between contact point 202 and contact point 302, is electrically connected.Conducting medium 12 does not have between chlamydate contact point and is not electrically connected, and for example, between contact point 201, contact point 203 and contact point 301, does not exist and is electrically connected.Conducting medium 12 do not have chlamydate contact point and the contact point that covered by conducting medium 12 between be not also electrically connected, for example, between contact point 203 and contact point 302, do not exist and be electrically connected.
Alternatively, the outer surface that conducting medium is attached to chip is specially: the combination in any that conducting medium is attached to upper surface, side surface, lower surface or upper surface, side surface and the lower surface of chip.The combination in any of upper surface, side surface and lower surface can comprise four kinds of situations, is respectively: upper surface and side surface combination, upper surface and lower surface combination, side surface and lower surface combination, and the combination of upper surface, side surface and lower surface.
Alternatively, the outer surface that conducting medium is attached to chip is specially: the outer surface that difform conducting medium is attached to chip.
Alternatively, the outer surface that conducting medium is attached to chip is specially: the outer surface that the conducting medium of various dose is attached to chip.
Alternatively, the outer surface that conducting medium is attached to chip is specially: the outer surface that at least one conducting medium is attached to chip.
As shown in Figure 10-Figure 13, the shape schematic diagram of the conducting medium shown in Fig. 7 in the manufacture method embodiment of the chip of attacking for the anti-intrusive mood of the utility model, conducting medium 12 is diverse in shape, quantity, dosage and the position on chip 11 surfaces, be conducting medium 12 cover part contact points as shown in Figure 10 and Figure 11, Figure 12 shows that conducting medium 12 covers whole contact points, shape, position and the dosage of the conducting medium 12 as shown in Figure 10, Figure 11 and Figure 12 is all different; Figure 13 shows that two conducting mediums, 12 cover part contact points; Certainly, conducting medium also can exceed two, can be three even more, do not repeat them here.In batch production, the mould of chip is changeless, so with all chips that same mould is produced be all the same, like this, assailant obtains the confidential information in a slice chip operation process, that is just equivalent to know the confidential information of this collection of chip, this has just caused great threat to the fail safe of chip, in the utility model, utilize conducting medium shape, quantity, the difference of dosage and position, the combination that makes each chip and conducting medium is a unique combination, even if one of them chip is subjected to attack like this, also can not affect the fail safe of other chips, improved the barrier of implementing attack, increase the difficulty of implementing attack.
Alternatively, conducting medium is specially anisotropy conductiving glue or isotropic conductive adhesive.Wherein, anisotropy conductiving glue has: YC-01 type conducting resinl (of a specified duration seven), SONY conducting resinl (SONY) etc.; Isotropic conductive adhesive has: E-005CS type conducting resinl (long first chemical industry), Treebond3301F type conducting resinl (Japanese triple bond company), Easiman3885 type conducting resinl (U.S.'s Eastman Chemical) etc.
Alternatively, conducting medium is specially: transparent conductive medium or opaque conducting medium.Transparent conductive medium has: HC-77 type conducting resinl (China's wound), 4342 type conducting resinls (positive quantity new material) etc.; Opaque conducting medium has: XG6166 type conducting resinl (prosperous hat rubber) etc.
Alternatively, the conductivity difference of conducting medium.
Alternatively, for different chips, the characteristic of the conducting medium using is not identical yet, for example: conductivity, anisotropy, isotropism and transparent and opaque, the otherness of these factors has brought up the unique property of the combination of each chip and conducting medium simultaneously.
In the present embodiment, testing circuit is integrated in to chip internal, at least two contact points are set, from chip internal, extend to the outer surface of chip, conducting medium is attached to the outer surface of chip, like this, once conducting medium is destroyed, the interconnected information between at least two contact points will be changed, after chip discovery is under attack, meeting automatic alarm, the chip that the anti-intrusive mood of the utility model is attacked can improve the difficulty that intrusive mood is attacked, thereby ensures the high security of chip.
Alternatively, after step 63, can also comprise step 64:
The object that dielectric is covered on conducting medium is that dielectric can be obscured conducting medium, can improve like this barrier of attack, increases the difficulty of implementing attack.
Alternatively, after step 63 or after step 64, can also comprise: chip is fixed on and on chip carrier, carries out pressure welding;
Alternatively, chip carrier is specially: pcb board.
Alternatively, chip carrier is specially: the lead frame of encapsulation.
Alternatively, after step 63, can also comprise: with package casing material package chip.
Package casing material and chip carrier are wrapped in chip in the shell of the two composition jointly, and protection chip avoids physics and chemistry injury.
Alternatively, after step 64, can also comprise: with package casing material package chip.
As shown in figure 14, the chip of attacking for the anti-intrusive mood of the utility model carries out the schematic flow sheet of the embodiment of the method for intrusive mood attack detecting, and the method can comprise the steps:
Alternatively, the interconnected information between at least two contact points comprises at least one in following: whether current value, the signal between resistance value, at least two contact points between at least two contact points flowed through has electrical connection between delay value between at least two contact points and at least two contact points.
Alternatively, nonvolatile memory includes but not limited to ROM, FLASH, EEPROM and OTPROM.
Step 92, when chip power, the interconnected information described in testing circuit detects again between at least two contact points, obtains assessment data information;
Step 93, testing circuit, according to reference data information and assessment data information, judge whether chip is subject to intrusive mood and attacks.
Alternatively, testing circuit is according to reference data information and assessment data information, judge whether chip is subject to intrusive mood attack and is specially: according to the comparing result of the resistance value between at least two contact points described in the resistance value between at least two contact points in reference data information and assessment data information, judge whether chip is subject to intrusive mood and attacks; According to the comparing result of the current value between at least two contact points described in the current value between at least two contact points in reference data information and assessment data information, judge whether chip is subject to intrusive mood and attacks; According to signal in reference data information flow through signal in delay value between at least two contact points and assessment data information flow through described in the comparing result of delay value between at least two contact points, judge whether chip is subject to intrusive mood and attacks; According in reference data information, between at least two contact points, whether be electrically connected and assessment data information described in the comparing result that whether is electrically connected between at least two contact points, judge whether chip is subject to intrusive mood and attacks.
Alternatively, judge whether chip is subject to intrusive mood and attacks and can comprise: when assessment data information and reference data information mutually unison is less than predetermined threshold, judge that chip is subject to intrusive mood attack.For example, predetermined threshold is 80%, that is to say, when reference data information and assessment data information mutually unison is less than 80%, can judge chip and be subject to intrusive mood attack, at this moment chip will send alarm signal to system, shows that chip has suffered intrusive mood attack.
Alternatively, testing circuit detects the interconnected information between at least two contact points that reselect, obtain new reference data information, new reference data information is stored in the nonvolatile memory of chip, when after chip power, the interconnected information between at least two contact points that reselect described in again detecting, obtains new assessment data information, according to new reference data information and new assessment data information, judge whether chip receives intrusive mood attack.The above-mentioned this Dynamic Selection function that testing circuit has can be passed through hardware circuit, CPU or MCU and realize.Interconnected information between at least two contact points that reselect described in testing circuit detects should be after default detection number of times or reselect at least two contact points after scheduled duration or under privileged mode, and detect the interconnected information between these contact points; Can select two contact points, three contact points or more until select institute to have point of contact; The default number of times that detects can be more than or equal to 1 time.Privileged mode, for example: can be administrator right.
As shown in Figure 15-Figure 17, the chip of attacking for the anti-intrusive mood of the utility model carries out the chip in the schematic flow sheet shown in Figure 14 in the embodiment of the method for intrusive mood attack detecting and whether is subject to the explanation schematic diagram of the determination methods that intrusive mood attacks, the chip of attacking take the anti-intrusive mood shown in Fig. 1 describes as example, between contact point 201 and contact point 202, be electrically connected, between contact point 203 and contact point 204, be not electrically connected.Between contact point 201 and contact point 203 and contact point 201 and contact point 204, be not electrically connected, between contact point 202 and contact point 203 and contact point 202 and contact point 204, be not also electrically connected.Be electrically connected and represent with 1, be not electrically connected and represent with 0.First, testing circuit 111 detects the interconnected information between at least two contact points of the outer surface of chip 11, obtains reference data information, is kept in the nonvolatile memory of chip 11.For example, measuring the valuation functions value between contact point 201 and contact point 202, is respectively that resistance value is 1 Ω, current value 1A, delay value 1S and be electrically connected 1; Measuring the valuation functions value between contact point 203 and contact point 204, is respectively that resistance value is ∞ Ω, current value 0A, delay value ∞ S and be not electrically connected 0; Reference data information is preserved and obtained to above-mentioned valuation functions value, as shown in figure 15.Then, when chip power, the interconnected information described in testing circuit detects again between at least two contact points, obtains assessment data information.When chip normally works on power, testing circuit detects the assessment data between these contact points again, obtains assessment data information.Assessment data information and the reference data information being stored in nonvolatile memory are contrasted, resistance value and resistance value contrast, current value and current value contrast, delay value and delay value contrast, between whether being electrically connected, contrast, can find whether conducting medium has been removed, thereby judge whether chip is subject to intrusive mood and attacks.Assessment data information as shown in figure 16, current value between contact point 201 and contact point 202 in assessment data information is 0.5A, and current value in the reference data information shown in Figure 15 is 1A, this current value is different from the current value shown in Figure 15, other Data Comparison results are identical, a pair of current value comparing result difference only in eight pairs of data comparing results, that is to say, assessment data information is 87.5% with the mutually unison of reference data information, at this moment judges chip and is not subject to intrusive mood attack.Assessment data information as shown in figure 17, resistance value in assessment data information between contact point 201 and contact point 202, current value, delay value and whether be electrically connected and Figure 15 shown in reference data information in contact point 201 and the data between contact point 202 be diverse, resistance value in assessment data information shown in Figure 17 between contact point 201 and contact point 202 becomes ∞ Ω, current value becomes 0A, delay value becomes 0S, be electrically connected and 1 become and be not electrically connected 0, in eight pairs of data comparing results, there are four pairs of data comparing result differences, that is to say, assessment data information is 50% with the mutually unison of reference data information, at this moment judge chip and be subject to intrusive mood attack, chip will send alarm signal to system.Because once assailant is disassembling chip package or removing chip passivation layer time shift except conducting medium, the contact point 201 and the contact point 202 that are so originally electrically connected have just disconnected connection.Now, the comparing result of assessment data information and reference data information will be different, as long as the mutually unison predetermined threshold that is less than of assessment data information and reference data information, for example, predetermined threshold is 80%, will judge the encapsulation of chip and suffer destruction, chip has been subject to intrusive mood attack, so chip sends alarm signal to system.
In the present embodiment, testing circuit detects the interconnected information between at least two contact points, obtain reference data information, be kept in the nonvolatile memory of chip, when chip power, interconnected information described in testing circuit detects again between at least two contact points, obtain assessment data information, testing circuit is according to reference data information and assessment data information, judge whether chip is subject to intrusive mood and attacks, like this, whether chip can be destroyed from detecting chip package in the course of the work, thereby can defend any attack section of having that encapsulation could be implemented that needs to destroy.In addition, use method of the present utility model, the reference data table difference that different chip internals is preserved, so, even if assailant uses certain attack means to obtain the internal data of a chip, assailant is attacked to another one chip also without any helping, so just improved and implemented the difficulty of attack, thereby ensured the high security of chip.
Finally it should be noted that: above embodiment is only unrestricted in order to the technical solution of the utility model to be described, although the utility model is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can modify or be equal to replacement the technical solution of the utility model, and not depart from the spirit and scope of technical solutions of the utility model.
Claims (7)
1. the chip that anti-intrusive mood is attacked, is characterized in that, comprising:
More than two contact point, extends to the outer surface of described chip from the inside of described chip;
Conducting medium, is attached to the outer surface of described chip;
Testing circuit, be integrated in described chip internal, for detection of described more than two interconnected information between at least two contact points in contact point, obtain reference data information, described reference data information is stored in the nonvolatile memory of described chip, when after described chip power, again the interconnected information described in detecting between at least two contact points, obtain assessment data information, according to described reference data information and described assessment data information, judge whether described chip is subject to intrusive mood and attacks.
2. chip according to claim 1, is characterized in that, described conducting medium covers all or part of contact point.
3. chip according to claim 1, is characterized in that, also comprises:
Dielectric, covers on described conducting medium.
4. chip according to claim 1, it is characterized in that, described testing circuit is also for detection of the interconnected information between at least two contact points that reselect, obtain new reference data information, described new reference data information is stored in the nonvolatile memory of described chip, when after described chip power, again the interconnected information between at least two contact points that reselect described in detecting, obtain new assessment data information, according to described new reference data information and described new assessment data information, judge whether described chip is subject to intrusive mood and attacks.
5. chip according to claim 1, is characterized in that, described conducting medium is conducting resinl.
6. chip according to claim 5, is characterized in that, the chip described in described conduction 5 is characterized in that, described conducting resinl is isotropic conductive adhesive.
7. chip according to claim 5, is characterized in that, the chip described in described conduction 5 is characterized in that, described conducting resinl is anisotropy conductiving glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320624199.6U CN203589016U (en) | 2013-10-10 | 2013-10-10 | Chip capable of resisting invasive attacks |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320624199.6U CN203589016U (en) | 2013-10-10 | 2013-10-10 | Chip capable of resisting invasive attacks |
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| Publication Number | Publication Date |
|---|---|
| CN203589016U true CN203589016U (en) | 2014-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320624199.6U Expired - Lifetime CN203589016U (en) | 2013-10-10 | 2013-10-10 | Chip capable of resisting invasive attacks |
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| Country | Link |
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| CN (1) | CN203589016U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500740A (en) * | 2013-10-10 | 2014-01-08 | 北京昆腾微电子有限公司 | Chip capable of resisting invasive attack, manufacturing method thereof and attack detection method |
| WO2022027535A1 (en) * | 2020-08-07 | 2022-02-10 | 深圳市汇顶科技股份有限公司 | Security chip and electronic device |
-
2013
- 2013-10-10 CN CN201320624199.6U patent/CN203589016U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103500740A (en) * | 2013-10-10 | 2014-01-08 | 北京昆腾微电子有限公司 | Chip capable of resisting invasive attack, manufacturing method thereof and attack detection method |
| CN103500740B (en) * | 2013-10-10 | 2017-01-11 | 昆腾微电子股份有限公司 | Chip capable of resisting invasive attack, manufacturing method thereof and attack detection method |
| WO2022027535A1 (en) * | 2020-08-07 | 2022-02-10 | 深圳市汇顶科技股份有限公司 | Security chip and electronic device |
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