CN203587741U - High voltage resistance testing device - Google Patents
High voltage resistance testing device Download PDFInfo
- Publication number
- CN203587741U CN203587741U CN201320602125.2U CN201320602125U CN203587741U CN 203587741 U CN203587741 U CN 203587741U CN 201320602125 U CN201320602125 U CN 201320602125U CN 203587741 U CN203587741 U CN 203587741U
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- testing device
- voltage testing
- high voltage
- plate
- withstand voltage
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Abstract
The utility model discloses a high voltage resistance testing device which comprises a high voltage testing instrument, a current-conducting plate set and an insulated clamp. The insulated clamp is composed of two clamp frames. The current-conducting plate set is embedded in the insulated clamp and is connected with a high voltage testing interment through leads. The insulated clamp is installed on a pneumatic testing device. A PCB (Printed Circuit Board) to be tested is driven by the pneumatic testing device to be firmly clamped in the insulated clamp. The high voltage resistance testing device can guarantee the effective area of the PCB is covered 100%, achieves high voltage test of a copper-clad plate large in dimension and area, and is particularly suitable for high voltage test of a thick copper PCB.
Description
Technical field
The utility model belongs to printed circuit board test field, particularly the high withstand voltage testing device of a kind of thick copper PCB.
Background technology
Voltage-withstand test is called again Hi-pot test or dielectric strength test, it is a kind of nondestructive test, whether the insulating capacity that it is used for detecting product under recurrent high voltage transient is qualified, and it is enough strong to guarantee the insulating property of equipment to tested equipment that it applies high pressure within a certain period of time.High pressure resistant main test event is the detection of voltage breakdown and leakage current.
Thick Copper Foil is generally thickness and is greater than 105 μ m(mass area ratio 915g/m
2or 3oz/ft
2) and above Copper Foil, PCB with thick Copper Foil and thick Copper Foil copper-clad plate thereof in the Substrate manufacture of more current high-power, large electric currents, high radiating requirements, bringing into play irreplaceable effect, the development of current PCB manufacturing technology, more focus on adopting thick Copper Foil to solve the problem of high-power PCB heat radiation function, the thick copper copper-clad plate of industry is at present more and more extensive in the application of secondary power supply product.But in the manufacture process of copper-clad plate, in fact the hair peak of copper-clad plate two sides Copper Foil has influence on the minimum thickness of interlayer actual insulation layer, affects layer insulation.If the peak value of Copper Foil uneven surface each point differs greatly, the position that profile peak value is large engages with Copper Foil at substrate, laminated into type after, this point just there will be the problem of the actual attenuate of insulation course.Because thick copper covers copper tooth and the thin bilayer impact of insulation course that copper is thick, in the manufacturing process of copper-clad plate, because of impurity and bubble, the High-Voltage Testing Process in safety easily produces defective insulation problem in detecting, affect the use of product, and in the manufacturing process of PCB, do not have perfect voltage test method to go all to detect the high voltage performance of copper-clad plate, and then bring hidden danger to the reliability of PCB.
Summary of the invention
For this reason, technical problem to be solved in the utility model is, a kind of high withstand voltage testing device is provided, and this device can guarantee the effective coverage of 100% covering PCB, realizes large scale, the high pressure resistant detection of large-area copper-clad plate.
For solving the problems of the technologies described above, a kind of high withstand voltage testing device of the present utility model, comprise high voltage testing device, current-carrying plate group, insulation fixture, described insulation fixture is by upper, lower two conduction plate holder frames form, described current-carrying plate group is embedded among described insulation fixture, and be connected to form loop by wire and described high voltage testing device, described high withstand voltage testing device also comprises a Pneumatic test device, described Pneumatic test device comprises the cylinder that position is fixing, the piston coordinating with described cylinder, and the upper end of described piston is connected with described upper conduction plate holder frame, and control the control device of gas compression in described cylinder.
Described upper and lower two conduction plate holder frames be arranged in parallel.
Described current-carrying plate group is two conductive copper plates.
Described two conductive copper plates are embedded into respectively in described upper conduction plate holder frame and described lower conducting plate folder frame.
Described high withstand voltage testing device also comprises a test pedestal, and described lower conducting plate folder frame and described cylinder are all fixed on test pedestal.
The thickness of described conductive copper plate is 0.8cm-1.2cm.
Technique scheme of the present utility model has the following advantages compared to existing technology:
(1) the utility model is exerted pressure to described insulation fixture by described Pneumatic test device, thereby has guaranteed that the PCB between lower plate fully contacts with described current-carrying plate on described, and this proving installation can guarantee the effective coverage of 100% covering PCB;
(2) the utility model adopts copper coin as current-carrying plate, thickness is 0.8-1.2cm, there is very strong rigidity simultaneously, thereby make described current-carrying plate group keep smooth, be difficult for occurring deformation, further guaranteed that described conductive copper plate fully contacts with pcb board when described Pneumatic test device is exerted pressure for described current-carrying plate group;
(3) this high-voltage testing device is applicable to large scale, large-area copper-clad plate, reasonable in design, operates simple and easyly, and production efficiency is high, can detect in process of production bad product, avoids production capacity waste, reduces the output of defective products.
Accompanying drawing explanation
For content of the present utility model is more likely to be clearly understood, according to specific embodiment of the utility model also by reference to the accompanying drawings, the utility model is described in further detail, wherein below
Fig. 1 is high withstand voltage testing device schematic diagram of the present utility model;
In figure, Reference numeral is expressed as: 1-conductive copper plate, the upper conductive copper plate of 1A-, conductive copper plate under 1B-, 2-wire, 3-high voltage testing device, the 4-fixture that insulate, the upper conduction of 4A-plate holder frame, 4B-lower conducting plate folder frame, 5-air measuring device.
Embodiment
Below in conjunction with specific embodiment, the utility model is described in further detail.
In the present embodiment, described current-carrying plate group is conductive copper plate.
As shown in Figures 1 and 2, a kind of high withstand voltage testing device of the present embodiment, comprise conductive copper plate 1, high voltage testing device 3, insulation fixture 4, described insulation fixture 4 consists of upper conduction plate holder frame 4A and lower conducting plate folder frame 4B, described conductive copper plate 1 comprises conductive copper plate 1A and lower conductive copper plate 1B, and the thickness of described conductive copper plate is 0.8-1.2cm, in the present embodiment, the thickness of described conductive copper plate is preferably 1cm, has very strong rigidity simultaneously.Described conductive copper plate 1A and 1B are embedded into respectively in the described upper conduction plate holder frame 4A and described lower conducting plate folder frame 4B of described insulation fixture 4, and be connected with described high voltage testing device 3 by wire, described high withstand voltage testing device also comprises a Pneumatic test device 5, described Pneumatic test device 5 comprises the fixing cylinder in position 51, the piston 52 coordinating with described cylinder, and the upper end of described piston 52 is connected with described upper conduction plate holder frame 4A, and control the control device of gas compression in described cylinder.
Described high withstand voltage testing device 5 also comprises a test pedestal 53, and described lower conducting plate folder frame 4B and described cylinder 51 are all fixed on test pedestal 53, and described upper conduction plate holder frame 4A to press from both sides frame 4B with described lower conducting plate be just right in position.Described conductive copper plate 1A and described conductive copper plate 1B connect into loop by described wire 2 with described high voltage testing device 3, described wire 2 is connected by the mode of welding with described conductive copper plate 1A and described conductive copper plate 1B, and described wire 2 is connected by fixed orifice with described high voltage testing device 3.
Test process of the present utility model:
When carrying out high pressure resistant test operation, the switch of lower described Pneumatic test device 5 tramps with one's feet, the promotion that described piston 52 is subject to described cylinder 51 interior gaseous tensions moves up, drive described upper conduction plate holder frame 4A upwards to rise, pcb board to be tested is lain against on described conductive copper plate 1B, described upper conduction plate holder frame 4A moves down, described insulation fixture 4 closures, now, described conductive copper plate 1, described pcb board, described wire 2 and described high voltage testing device 3 form the loop of a sealing, by described Pneumatic pressure testing device 5, described insulation fixture 4 is exerted pressure, described pcb board and described conductive copper plate 1A and described conductive copper plate 1B are fitted tightly, thereby guarantee that 100% covers the effective coverage of PCB, simultaneously, described conductive copper plate 1A and described conductive copper plate 1B rigidity are very strong, make described current-carrying plate group maintain smooth state, be difficult for deforming.Then regulate described high-tension electricity tester 3, upper voltage records the proof voltage time, and adopt judgment criteria as follows: alternating current pressure as far as possible evenly boosts to 1500V(from 0V with 150V/S can require to adjust high pressure according to difference), under maximum high-voltage 1500V, leakage current is no more than 0.1 milliampere, can maintain minimum time and need reach 30 seconds.After having tested, step on the switch of described Pneumatic pressure testing device 5, described upper current-carrying plate fixture 4A moves up, and described pcb board is taken out.In addition, this proving installation is external all insulation protection, and non-test mode its in non-power status, be also provided with electromotion pilot lamp, for test provides safe test environment simultaneously.
Obviously, above-described embodiment is only for example is clearly described, and the not restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also giving exhaustive to all embodiments.And the apparent variation of being extended out thus or variation are still among the protection domain in the invention.
Claims (6)
1. a high withstand voltage testing device, comprise high voltage testing device, current-carrying plate group, insulation fixture, described insulation fixture consists of upper and lower two conduction plate holder frames, described current-carrying plate group is embedded among described insulation fixture, and be connected to form loop by wire and described high voltage testing device, it is characterized in that: also comprise a Pneumatic test device, described Pneumatic test device comprises the cylinder that position is fixing, the piston coordinating with described cylinder, and the upper end of described piston is connected with described upper conduction plate holder frame, and control the control device of gas compression in described cylinder.
2. high withstand voltage testing device according to claim 1, is characterized in that: described upper and lower two conduction plate holder frames be arranged in parallel.
3. high withstand voltage testing device according to claim 2, is characterized in that: described current-carrying plate group is two conductive copper plates.
4. high withstand voltage testing device according to claim 3, is characterized in that: described two conductive copper plates are embedded into respectively in described upper conduction plate holder frame and described lower conducting plate folder frame.
5. high withstand voltage testing device according to claim 4, is characterized in that: also comprise a test pedestal, described lower conducting plate folder frame and described cylinder are all fixed on test pedestal.
6. high withstand voltage testing device according to claim 3, is characterized in that: the thickness of described conductive copper plate is 0.8cm-1.2cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320602125.2U CN203587741U (en) | 2013-09-27 | 2013-09-27 | High voltage resistance testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320602125.2U CN203587741U (en) | 2013-09-27 | 2013-09-27 | High voltage resistance testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203587741U true CN203587741U (en) | 2014-05-07 |
Family
ID=50585641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320602125.2U Expired - Lifetime CN203587741U (en) | 2013-09-27 | 2013-09-27 | High voltage resistance testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203587741U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181446A (en) * | 2014-08-29 | 2014-12-03 | 苏州市吴中区胥口广博模具加工厂 | Ten-station small power panel tester |
| CN104237752A (en) * | 2014-09-25 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Test method, test fixture and test device for thin core board layer short risks |
| CN107390098A (en) * | 2017-07-27 | 2017-11-24 | 深圳崇达多层线路板有限公司 | A kind of high pressure resistant test device of PCB and method of testing |
-
2013
- 2013-09-27 CN CN201320602125.2U patent/CN203587741U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104181446A (en) * | 2014-08-29 | 2014-12-03 | 苏州市吴中区胥口广博模具加工厂 | Ten-station small power panel tester |
| CN104237752A (en) * | 2014-09-25 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Test method, test fixture and test device for thin core board layer short risks |
| CN107390098A (en) * | 2017-07-27 | 2017-11-24 | 深圳崇达多层线路板有限公司 | A kind of high pressure resistant test device of PCB and method of testing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220629 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: Floor 9, founder building, No. 298, Chengfu Road, Haidian District, Beijing 100871 Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140507 |